Datasheet ISL97519 Datasheet (intersil)

Page 1
®
ISL97519
Data Sheet September 10, 2009
1% Output Accuracy 600kHz/1.2MHz PWM Step-Up Regulator
The ISL97519 is a high frequency, high efficiency step-up voltage regulator operated at constant frequency PWM mode. With an internal 2.0A, 200mΩ MOSFET, it can deliver up to 1A output current at over 90% efficiency. The selectable 600kHz and 1.2MHz allows smaller inductors and faster transient response. An external compensation pin gives the user greater flexibility in setting frequency compensation allowing the use of low ESR ceramic output capacitors.
When shut down, it draws <1µA of current and can operate down to 2.3V input supply. These features along with
1.2MHz switching frequency makes it an ideal device for portable equipment and TFT-LCD displays.
The ISL97519 is available in an 8 Ld MSOP package with a maximum height of 1.1mm. The device is specified for operation over the full -40°C to +105°C temperature range.
FN6454.3
Features
• 1% Output Accuracy
• >90% Efficiency
• 2.0A, 200mΩ Power MOSFET
• 2.3V to 5.5V Input
• Up to 25V Output
• 600kHz/1.2MHz Switching Frequency Selection
• Adjustable Soft-Start
• Internal Thermal Protection
• 1.1mm Max Height 8 Ld MSOP Package
• Pb-Free (RoHS compliant)
• Halogen Free
Applications
• TFT-LCD displays
Pinout
ISL97519
(8 LD MSOP)
TOP VIEW
COMP SS
1
FB FSEL
2
EN VDD
3
GND LX
4
8
7
6
5
• DSL modems
• PCMCIA cards
• Digital cameras
• GSM/CDMA phones
• Portable equipment
• Handheld devices
Ordering Information
PART
NUMBER
(Note)
ISL97519IUZ 7519Z 8 Ld MSOP M8.118A ISL97519IUZ-T* 7519Z 8 Ld MSOP M8.118A ISL97519IUZ-TK* 7519Z 8 Ld MSOP M8.118A *Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
PART
MARKING
PACKAGE
(Pb-free)
PKG.
DWG. #
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
All other trademarks mentioned are the property of their respective owners.
Copyright Intersil Americas Inc. 2007-2009. All Rights Reserved
Page 2
ISL97519
Absolute Maximum Ratings (T
LX to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27V
V
to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5V
DD
COMP, FB, EN, SS, FSEL to GND . . . . . . . . .-0.3V to (V
= +25°C) Thermal Information
A
Thermal Resistance (Typical, Note 1) θ
DD
+ 0.3V)
8 Lead MSOP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
(°C/W)
JA
Operating Ambient Temperature . . . . . . . . . . . . . . .-40°C to +105°C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +135°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty.
NOTE:
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
1. θ
JA
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: T
Electrical Specifications V
= 3.3V, V
IN
OUT
= TC = T
J
= 12V, I
A
= 0mA, FSEL = GND, TA = -40°C to +105°C Unless Otherwise Specified.
OUT
Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested.
PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT
I
Q1
I
Q2
I
Q3
V
FB
I
B-FB
V
DD
D
- 600kHz Maximum Duty Cycle FSEL = 0V 85 92 %
MAX
D
- 1.2MHz Maximum Duty Cycle FSEL = V
MAX
I
LIM
I
EN
r
DS(ON)
I
LX-LEAK
ΔV
/ΔVINLine Regulation 3V < VIN < 5.5V, V
OUT
ΔV
/ΔI
OUT
f
OSC1
f
OSC2
V
IL
V
IH
G
M
V
DD-ON
HYS V
I
SS
Quiescent Current - Shutdown EN = 0V 1 5 µA Quiescent Current - Not Switching EN = VDD, FB = 1.3V 0.7 mA Quiescent Current - Switching EN = VDD, FB = 1.0V 3 4 mA Feedback Voltage TA = -40°C to +85°C 1.281 1.294 1.307 V
T
= -40°C to +105°C 1.276 1.294 1.307 V
A
Feedback Input Bias Current 0.01 0.5 µA Input Voltage Range 2.3 5.5 V
DD
85 90 % Current Limit - Max Peak Input Current 1.5 2.0 A Shutdown Input Bias Current EN = 0V 0.01 0.5 µA Switch ON-Resistance VDD = 2.7V, ILX = 1A 0.2 Ω Switch Leakage Current VSW = 27V 0.01 3 µA
= 12V 0.2 %
OUT
Load Regulation VIN = 3.3V , V
OUT
= 12V , IO = 30mA to 200mA 0.3 %
OUT
Switching Frequency Accuracy FSEL = 0V 500 620 740 kHz Switching Frequency Accuracy FSEL = V
DD
1000 1250 1500 kHz EN, FSEL Input Low Level 0.5 V EN, FSEL Input High Level 1.5 V Error Amp Tranconductance ΔI = 5µA 70 130 150 1µ/Ω VDD UVLO On Threshold 2.1 2.2 2.3 V
UVLO Hysteresis 100 mV
DD
Soft-Start Charge Current 4 6 8 µA
OTP Over-Temperature Protection 150 °C
2
FN6454.3
September 10, 2009
Page 3
Block Diagram
ISL97519
EN SS
SHUTDOWN
AND START -UP
CONTROL
VDD
REFERENCE GENERATOR
COMPARATOR
COMP
FSEL
OSCILLATOR
CURRENT
SENSE
GM
AMPLIFIER
PWM LOGIC
CONTROLLER
Pin Descriptions
PIN NUMBER PIN NAME DESCRIPTION
FET
DRIVER
LX
GND
FB
1 COMP Compensation pin. Output of the internal error amplifier. Capacitor and resistor from COMP pin to ground. 2 FB Voltage feedback pin. Internal reference is 1.294V nominal. Connect a resistor divider from V
V 3 EN Shut-down control pin. Pull EN low to turn off the device. 4 GND Analog and power ground. 5 LX Power switch pin. Connected to the drain of the internal power MOSFET. 6 VDD Analog power supply input pin. 7 FSEL Frequency select pin. When FSEL is set low, switching frequency is set to 620kHz. When connected to
high or V 8 SS Soft-start control pin. Connect a capacitor to control the converter start-up.
Typical Application Circuit
R
3
3.9kΩ C
5
4.7nF
= 1.294V (1 + R1/R2). See “Typical Application Circuit” on page 3.
OUT
, switching frequency is set to 1.25MHz.
DD
1
85.2kΩR R
10kΩ
1
COMP
FB
2
2
S1
EN
3
GND
4
SS
FSEL
VDD
LX
8
7
6
5
C
3
27nF
C
4
0.1µF
+
C
1
22µF
10µH
D
1
2.3V TO 5.5V
C
+
2
22µF
12V
OUT
.
3
FN6454.3
September 10, 2009
Page 4
Typical Performance Curves
95
90
85
80
VIN = 5V, VO = 12V, fs = 620kHz
75
EFFICIENCY (%)
VIN = 5V, VO = 9V, fs = 620kHz
70
65
60
0 200 400 600 800 1000
FIGURE 1. BOOST EFFICIENCY vs I
VIN = 5V, VO = 12V, fs = 1.25MHz
VIN = 5V, VO = 9V, fs = 1.25MHz
(mA)
I
OUT
OUT
ISL97519
92 90 88 86 84 82
VIN = 3.3V, VO = 12V,
= 620kHz
f
80
EFFICIENCY (%)
78 76 74
s
0 100 200 300 400 500
VIN = 3.3V, VO = 12V,
fs = 1.25MHz
I
OUT
VIN = 3.3V, VO = 9V, f
= 620kHz
s
VIN = 3.3V, VO = 9V,
= 1.25MHz
f
s
(mA)
FIGURE 2. BOOST EFFICIENCY vs I
OUT
0.9 VIN = 5V, VO = 12V,
0.8 f
= 1.25MHz
s
0.7
0.6
0.5
0.4
0.3
LOAD REGULATION (%)
0.2
0.1
0
0 200 400 600 800 1000
VIN = 5V, VO = 12V,
= 620kHz
f
s
I
OUT
VIN = 5V, VO = 9V,
= 1.25MHz
f
s
VIN = 5V, VO = 9V,
= 620kHz
f
s
(mA)
FIGURE 3. LOAD REGULATION vs I
0.6
0.5
0.4
VO = 9V, IO = 80mA
0.3 VO = 12V, IO = 80mA
f
= 1.25MHz
0.2
s
= 1.25MHz
f
s
VO = 9V, IO = 100mA
= 620kHz
f
s
OUT
0.7 VIN = 3.3V, VO = 12V,
= 1.25MHz
f
LOAD REGULATION (%)
0.6
0.5
0.4
0.3
0.2
0.1
s
0
0 100 200 300 400 500
I
OUT
FIGURE 4. LOAD REGULATION vs I
VO = 12V
VIN = 3.3V
f
VIN = 3.3V , VO = 9V ,
fs = 1.25MHz
VIN = 3.3, VO = 9V,
fs = 1.25MHz
VIN = 3.3, VO = 12V,
= 620kHz
f
s
(mA)
I
= 50mA TO 300mA
O
= 600kHz
s
OUT
0.1
LINE REGULATION (%)
0
-0.1 2
FIGURE 5. LINE REGULATION vs V
VO = 12V, IO = 80mA
= 620kHz
f
s
3 4 5 6
(V)
V
IN
IN
4
FIGURE 6. TRANSIENT RESPONSE
FN6454.3
September 10, 2009
Page 5
Typical Performance Curves (Continued)
ISL97519
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD
1.0
0.9 870mW
0.8
0.7
0.6
0.5
0.4
0.3
0.2
POWER DISSIPATION (W)
0.1
0
0 25 50 75 100 125
AMBIENT TEMPERATURE (°C)
M
θ
S
J
O
A
=
P
+
8
1
6
0
°
C
/
W
85
VIN = 3.3V
VO = 12V
f
s
= 1.2MHz
I
= 50mA TO 300mA
O
FIGURE 7. TRANSIENT RESPONSE FIGURE 8. PACKAGE POWER DISSIPA TION vs AMBIENT
TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD
0.6
0.5 486mW
0.4
0.3
0.2
M
θ
S
J
O
A
=
P
8
+
2
0
6
°
C
/
W
0.1
POWER DISSIPATION (W)
0.0
0 255075100125
AMBIENT TEMPERATURE (°C)
FIGURE 9. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
Applications Information
The ISL97519 is a high frequency, high efficiency boost regulator operated at constant frequency PWM mode. The boost converter stores energy from an input voltage source and deliver it to a higher output voltage. The input voltage range is 2.3V to 5.5V and output voltage range is 5V to 25V. The switching frequency is selectable between 600kHz and
1.2MHz allowing smaller inductors and faster transient response. An external compensation pin gives the user greater flexibility in setting output transient response and tighter load regulation. The converter soft-start characteristic can also be controlled by external C allows the user to completely shut-down the device.
Boost Converter Operations
Figure 10 shows a boost converter with all the key components. In steady-state operating and continuous conduction mode where the inductor current is continuous,
capacitor. The EN pin
SS
85
the boost converter operates in two cycles. During the first cycle, as shown in Figure 11, the internal power FET turns on and the Schottky diode is reverse biased and cuts off the current flow to the output. The output current is supplied from the output capacitor. The voltage across the inductor is V
and the inductor current ramps up in a rate of VIN/L, L is
IN
the inductance. The inductance is magnetized and energy is stored in the inductor. The change in inductor current is shown in Equation 1:
V
IN
Δt1
D
----------
f
SW
I
OUT
----------------
C
OUT
---------
×=
L
×=
Δt
1
(EQ. 1)
ΔI
Δt1
D Duty Cycle=
ΔV
L1
=
O
5
FN6454.3
September 10, 2009
Page 6
ISL97519
During the second cycle, the power FET turns off and the Schottky diode is forward biased, (see Figure 12). The energy stored in the inductor is pumped to the output supplying output current and charging the output capacitor. The Schottky diode side of the inductor is clamp to a Schottky diode above the output voltage. So the voltage drop across the inductor is V
IN
- V
OUT
. The change in inductor current during the second cycle is shown in Equation 2:
–
V
INVOUT
=
1D–
-------------
f
SW
------------------------------- -
×=
L
(EQ. 2)
ΔILΔt2
Δt2
For stable operation, the same amount of energy stored in the inductor must be taken out. The change in inductor current during the two cycles must be the same.
ΔI1 ΔI2+ 0=
D
----------
f
SW
V
OUT
--------------- -
V
IN
V
IN
---------
L
1
-------------
=
1D–
V
IN
C
IN
V
IN
C
IN
V
1D–
-------------
f
SW
–
INVOUT
------------------------------- -
×+× 0=
L
LD
ISL97519
FIGURE 10. BOOST CONVERTER
L
ISL97519
C
C
OUT
OUT
(EQ. 3)
V
OUT
V
OUT
LD
V
IN
ΔV
C
OUT
O
C
IN
ISL97519
I
ΔI
L2
L
Δt
2
V
OUT
FIGURE 12. BOOST CONVERTER - CYCLE 2, POWER
SWITCH OPEN
Output Voltage
An external feedback resistor divider is required to divide the output voltage down to the nominal 1.294V reference voltage. The current drawn by the resistor network should be limited to maintain the overall converter efficiency. The maximum value of the resistor network is limited by the feedback input bias current and the potential for noise being coupled into the feedback pin. A resistor network less than 100k is recommended. The boost converter output voltage is determined by the relationship in Equation 4:
V
OUTVFB
1
-------
1
+
×=
⎜⎟
R
⎝⎠
2
(EQ. 4)
R
⎛⎞
The nominal VFB voltage is 1.294V.
Inductor Selection
The inductor selection determines the output ripple voltage, transient response, output current capability, and efficiency. Its selection depends on the input voltage, output voltage, switching frequency, and maximum output current. For most applications, the inductance should be in the range of 2µH to 33µH. The inductor maximum DC current specification must be greater than the peak inductor current required by the regulator. The peak inductor current can be calculated using Equation 5:
I
I
L PEAK()
×
OUTVOUT
------------------------------------
V
IN
V
INVOUTVIN
-----------------------------------------------------
12⁄
×+=
LV
OUT
–()×
FREQ××
(EQ. 5)
I
ΔV
L
O
ΔI
L1
Δt
1
FIGURE 11. BOOST CONVERTER - CYCLE 1, POWER
SWITCH CLOSED
6
Output Capacitor
Low ESR capacitors should be used to minimize the output voltage ripple. Multilayer ceramic capacitors (X5R and X7R) are preferred for the output capacitors because of their lower ESR and small packages. Tantalum capacitors with higher ESR can also be used. The output ripple can be calculated in Equation 6:
I
D×
ΔV
O
-------------------------
×
f
SWCO
I
OUT
ESR×+=
OUT
For noise sensitive applications, a 0.1µF placed in parallel with the larger output capacitor is recommended to reduce the switching noise coupled from the LX switching node.
(EQ. 6)
FN6454.3
September 10, 2009
Page 7
ISL97519
Schottky Diode
In selecting the Schottky diode, the reverse break down voltage, forward current and forward voltage drop must be considered for optimum converter performance. The diode must be rated to handle 2.0A, the current limit of the ISL97519. The breakdown voltage must exceed the maximum output voltage. Low forward voltage drop, low leakage current, and fast reverse recovery will help the converter to achieve the maximum efficiency.
Input Capacitor
The value of the input capacitor depends upon the input and output voltages, the maximum output current, the inductor value and the noise allowed to put back on the input line. For most applications, a minimum 10µF is required. For applications that run close to the maximum output current limit, an input capacitor in the range of 22µF to 47µF is recommended.
The ISL97519 is powered from the VIN. A High frequency
0.1µF bypass cap is recommended to be close to the VIN pin to reduce supply line noise and ensure stable operation.
Loop Compensation
The ISL97519 incorporates a transconductance amplifier in its feedback path to allow the user some adjustment on the transient response and better regulation. The ISL97519 uses current mode control architecture, which has a fast current sense loop and a slow voltage feedback loop. The fast current feedback loop does not require any compensation. The slow voltage loop must be compensated for stable operation. The compensation network is a series RC network from COMP pin to ground. The resistor sets the high frequency integrator gain for fast transient response and the capacitor sets the integrator zero to ensure loop stability. For most applications, the compensation resistor in the range of 2k to 7.5k and the compensation capacitor in the range of 3nF to 10nF.
Soft-Start
The soft-start is provided by an internal 6µA current source which charges the external C
; the peak MOSFET current
SS
is limited by the voltage on the capacitor. This in turn controls the rising rate of the output voltage. The regulator goes through the start-up sequence as well, after the EN pin is pulled to HI.
Frequency Selection
The ISL97519 switching frequency can be user selected to operate at either constant 620kH z or 1.25MHz. Connecting FSEL pin to ground sets the PWM switching frequency to 620kHz. When connecting FSEL high or VDD, the switching frequency is set to 1.25MHz.
Maximum Output Current
The MOSFET current limit is nominally 2.0A and guaranteed
1.7A. This restricts the maximum output current, I
OMAX
,
based on Equation 7:
ILI
L-AVG
12⁄ΔIL×()+=
(EQ. 7)
where:
IL = MOSFET current limit I
= average inductor current
L-AVG
ΔIL = inductor ripple current
V
INVOVDIODE
------------------------------------------------------------------------------
=
ΔI
L
LV
V
= Schottky diode forward voltage, typically, 0.6V
DIODE
+()VIN–[]×
( V
O
DIODE
) fS×+×
(EQ. 8)
fS = switching frequency, 600kHz or 1.2MHz
I
L-AVG
=
OUT
-------------
1D–
(EQ. 9)
I
D = MOSFET turn-on ratio:
V
D1
V
+
OUTVDIODE
IN
--------------------------------------------
–=
Table 1 gives typical maximum I
values for 1.2MHz
OUT
(EQ. 10)
switching frequency and 10µH inductor.
TABLE 1. MAXIMUM I
V
(V) V
IN
2.5 5 870
2.5 9 500
2.5 12 380
3.3 5 1150
3.3 9 655
3.3 12 500 5 9 990 5 12 750
OUT
VALUES
OUT
(V) I
OMAX
(mA)
Cascaded MOSFET Application
An 25V N-Channel MOSFET is integrated in the boost regulator. For the applications where the output voltage is greater than 25V, an external cascaded MOSFET is needed as shown in Figure 13. The voltage rating of the external MOSFET should be greater than A
VDD
.
Shut-down Control
When the EN pin is pulled down, the ISL97519 is shut down reducing the supply current to <1µA.
7
FN6454.3
September 10, 2009
Page 8
ISL97519
V
IN
LX
INTERSIL
ISL97519
FB
A
FIGURE 13. CASCADED MOSFET TOPOLOGY FOR HIGH
OUTPUT VOLTAGE APPLICATIONS
VDD
DC Path Block Application
Note that there is a DC path in the boost converter from the input to the output through the inductor and diode, hence the input voltage will be seen at output with a forward voltage drop of diode before the part is enabled. If this voltage is not desired, the following circuit can be inserted between input and inductor to disconnect the DC path when the part is disabled.
TO INDUCTOR
EN
FIGURE 14. CIRCUIT TO DISCONNECT THE DC PA TH OF
BOOST CONVERTER
INPUT
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implicat ion or oth erwise u nde r any p a tent or p at ent r ights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
8
FN6454.3
September 10, 2009
Page 9
Package Outline Drawing
M8.118A
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE (MSOP) Rev 0, 9/09
3.0±0.1
A
ISL97519
PIN# 1 ID
H
0.33 +0.07/ -0.08
0.08 C A B
8
1
2
TOP VIEW
SIDE VIEW 1
0.25 CAB
3.0±0.1
0.65 BSC
0.10 ± 0.05
4.9±0.15
B
0.86±0.09
SEATING PLANE
0.10 C
DETAIL "X"
1.10 Max
GAUGE
PLANE
0.18 ± 0.05
0.25
3°±3°
SIDE VIEW 2
0.95 BSC
C
0.55 ± 0.15
DETAIL "X"
5.80
4.40
3.00
0.65
TYPICAL RECOMMENDED LAND PATTERN
9
1.40
0.40
NOTES:
Dimensions are in millimeters.1.
Dimensioning and tolerancing conform to JEDEC MO-187-AA
2. and AMSE Y14.5m-1994.
3.
Plastic or metal protrusions of 0.15mm max per side are not included.
Plastic interlead protrusions of 0.25mm max per side are not
4. included.
Dimensions “D” and “E1” are measured at Datum Plane “H”.
5.
This replaces existing drawing # MDP0043 MSOP 8L.
6.
FN6454.3
September 10, 2009
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