Datasheet ISL83387E Datasheet (intersil)

Page 1
®
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ISL83387E
Data Sheet July 8, 2005
+/-15kV ESD Protected, +3V to +5.5V, 1Microamp, 250kbps, RS-232 Transceivers with Enhanced Automatic Powerdown and a Separate Logic Supply
±15kV ESD protection (IEC61000-4-2 Air Gap and Human
Body Model) on transmitter outputs and receiver inputs (RS-232 pins). Targeted applications are PDAs, Palmtops, and notebook and laptop computers where the low operational, and even lower standby power consumption is critical. Efficient on-chip charge pumps, coupled with manual and enhanced automatic powerdown functions, reduce the standby supply current to a 1µA trickle. TSSOP packaging, and the use of small, low value capacitors ensure board space savings as well. Data rates greater than 250kbps are guaranteed at worst case load conditions.
The ISL83387E features a V output levels and input thresholds to values compatible with the V
This device includes an enhanced automatic powerdown function which powers down the on-chip power-supply and driver circuits. This occurs when all receiver and transmitter inputs detect no signal transitions for a period of 30 seconds. It power back up, automatically, whenever it senses a transition on any transmitter or receiver input.
powering the external logic (e.g., a UART).
CC
= 3.0V. Additionally, it provides
CC
pin that adjusts the logic pin
L
FN6040.1
Features
•VL Supply Pin for Compatibility with Mixed Voltage Systems
• ESD Protection for RS-232 I/O Pins to
• Low Power, Pin Compatible Upgrade for MAX3387E
• Manual and Enhanced Automatic Powerdown Features
• Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V
• On-Chip Charge Pumps Require Only Four External
0.1µF Capacitors
• Receivers Stay Active in Powerdown
• Very Low Supply Current . . . . . . . . . . . . . . . . . . . . 300µA
• Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps
• Wide Power Supply Range . . . . . . . Single +3V to +5.5V
• Low Supply Current in Powerdown State. . . . . . . . . < 1µA
• Pb-Free Plus Anneal Available (RoHS Compliant)
±15kV (IEC61000)
Applications
• Any System Requiring RS-232 Communication Ports
- Battery Powered, Hand-Held, and Portable Equipment
- Laptop Computers, Notebooks, Palmtops
- Digital Cameras
- PDA’s and PDA Cradles
- Cellular/Mobile Phones
Table 1 summarizes the features of the ISL83387E, while Application Note AN9863 summarizes the features of each device comprising the 3V RS-232 family.
Ordering Information
PAR T N O.
(BRAND)
ISL83387EIV (83387EIV)
ISL83387EIV-T (83387EIV)
ISL83387EIVZ (Note) (83387EIVZ)
ISL83387EIVZ-T (Note) (83387EIVZ)
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
TEMP.
RANGE (°C) PACKAGE
-40 to 85 24 Ld TSSOP M24.173
-40 to 85 Tape and Reel M24.173
-40 to 85 24 Ld TSSOP (Pb-free)
-40 to 85 Tape and Reel (Pb-free)
1
DWG. #.
M24.173
M24.173
PKG.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2003, 2005. All Rights Reserved
Page 2
ISL83387E
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TABLE 1. SUMMARY OF FEATURES
PART NUMBER
NO. OF
Tx.
NO. OF
Rx.
DATA RATE
(kbps)
Rx. ENABLE
FUNCTION?
LOGIC
V
L
SUPPLY PIN?
MANUAL
POWER- DOWN?
ENHANCED AUTOMATIC
POWERDOWN FUNCTION?
ISL83387E 3 3 250 NO YES YES YES
Pinout
ISL83387E (TSSOP)
TOP VIEW
24
C1+
V+ C1­C2+
C2-
T1 T2
INVALID
T3
FORCEON
R3
OUT
1 2 3 4 5
V-
6 7
IN
8
IN
9
10
IN
11 12
FORCEOFF V
23
CC
GND
22 21
T1 T2
20
T3
19
R1
18
R2
17 16
R3 V
15
L
R1
14
R2
13
OUT OUT OUT
IN IN IN
OUT OUT
Pin Descriptions
PIN FUNCTION
V
CC
V+ Internally generated positive transmitter supply (+5.5V).
V- Internally generated negative transmitter supply (-5.5V).
GND Ground connection.
C1+ External capacitor (voltage doubler) is connected to this lead.
C1- External capacitor (voltage doubler) is connected to this lead.
C2+ External capacitor (voltage inverter) is connected to this lead.
C2- External capacitor (voltage inverter) is connected to this lead.
T
T
OUT
R
R
OUT
V
INVALID
FORCEOFF
FORCEON Active high input to override automatic powerdown circuitry thereby keeping transmitters active. (FORCEOFF
System power supply input (3.0V to 5.5V).
TTL/CMOS compatible transmitter Inputs. The switching point is a function of the VL voltage.
IN
±15kV ESD Protected, RS-232 level (nominally ±5.5V) transmitter outputs.
±15kV ESD Protected, RS-232 compatible receiver inputs.
IN
TTL/CMOS level receiver outputs. Swings between GND and VL.
Logic-Level Supply. All TTL/CMOS inputs and outputs are powered by this supply.
L
Active low output that indicates if no valid RS-232 levels are present on any receiver input. Swings between GND and VL.
Active low to shut down transmitters and on-chip power supply. This overrides any automatic circuitry and FORCEON (see Table 2). The switching point is a function of the V
switching point is a function of the V
L
voltage.
L
voltage.
must be high). The
2
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July 8, 2005
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Typical Operating Circuit
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ISL83387E
TTL/CMOS
LOGIC LEVELS
+3.3V
0.1µF
0.1µF
R1
R2
R3
C
C
T1
T2
T3
OUT
OUT
OUT
+
0.1µF 1
1
2
IN
IN
IN
C1+
+
3
C1-
4
C2+
+
5
C2-
7
8
10
14
13
12
23
V
CC
T
1
T
2
T
3
R
1
R
2
R
3
V+
V-
5kΩ
5kΩ
5kΩ
2
C
3
+
0.1µF
6
C
4
0.1µF
+
21
T1
OUT
20
T2
19
T3
18
R1
17
R2
16
R3
OUT
OUT
IN
IN
IN
RS-232 LEVELS
RS-232 LEVELS
LOGIC V
CC
0.1µF
TO POWER
CONTROL LOGIC
V
15
11
FORCEON
24
FORCEOFF
9
INVALID
L
GND
22
+
V
CC
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ISL83387E
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Absolute Maximum Ratings Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
V
to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
L
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V
Input Voltages
, FORCEON, FORCEOFF . . . . . . . . . . . . . . . . . . -0.3V to 6V
T
IN
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V
IN
Output Voltages
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V
T
OUT
R
, INVALID. . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VL +0.3V)
OUT
Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
T
OUT
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θ
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
Thermal Resistance (Typical, Note 1)
24 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . . 140
Moisture Sensitivity (see Technical Brief TB363)
TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Junction Temperature (Plastic Package) . . . . . . . 150
Maximum Storage Temperature Range . . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
(Lead Tips Only)
θ
(oC/W)
JA
o
C to 150oC
Operating Conditions
Temperature Range
ISL83387EIV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40
o
C to 85oC
o
o
C
C
Electrical Specifications Test Conditions: V
Typicals are at T
PARAMETER TEST CONDITIONS
DC CHARACTERISTICS
Supply Current, Automatic Powerdown
Supply Current, Powerdown FORCEOFF
Supply Current, Automatic Powerdown Disabled
LOGIC AND TRANSMITTER INPUTS
Input Logic Threshold Low T
Input Logic Threshold High T
Transmitter Input Hysteresis 25 - 0.5 - V
Input Leakage Current T
RECEIVER OUTPUTS
Output Voltage Low I
Output Voltage High I
RECEIVER INPUTS
Input Voltage Range Full -25 - 25 V
Input Threshold Low V
Input Threshold High V
Input Hysteresis 25 - 0.5 - V
Input Resistance 25357kΩ
TRANSMITTER OUTPUTS
Output Voltage Swing All Transmitter Outputs Loaded with 3kΩ to Ground Full ±5.0 ±5.4 - V
Open, FORCEON = GND, FORCEOFF =V
All R
IN
All Outputs Unloaded, FORCEON = FORCEOFF
= 3.15V
V
CC
, FORCEON, FORCEOFF VL = 3.3V or 5V Full - - 0.8 V
IN
, FORCEON, FORCEOFF VL = 5V Full 2.4 - - V
IN
, FORCEON, FORCEOFF Full - ±0.01 ±1.0 µA
IN
= 1.6mA Full - - 0.4 V
OUT
= -1.0mA Full VL - 0.6 VL - 0.1 - V
OUT
= VL = 5.0V 25 0.8 1.5 - V
CC
V
= VL = 3.3V 25 0.6 1.2 - V
CC
= VL = 5.0V 25 - 1.8 2.4 V
CC
= VL = 3.3V 25 - 1.5 2.4 V
V
CC
= 3V to 5.5V, C1 - C4 = 0.1µF, VL = VCC; Unless Otherwise Specified.
CC
= 25oC, VCC = VL = 3.3V
A
TEMP
o
(
C) MIN TYP MAX UNITS
CC
= GND 25 - 1 10 µA
=VCC,
V
= 2.5V Full - - 0.6 V
L
V
= 3.3V Full 2.0 - - V
L
V
= 2.5V Full 1.4 - - V
L
= 1.8V 25 - 0.9 - V
V
L
25 - 1 10 µA
25 - 0.3 1 mA
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ISL83387E
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Electrical Specifications Test Conditions: V
Typicals are at T
PARAMETER TEST CONDITIONS
Output Resistance VCC= V+ = V- = 0V, Transmitter Output = ±2V Full 300 10M - Ω
Output Short-Circuit Current V
Output Leakage Current V
ENHANCED AUTOMATIC POWERDOWN (FORCEON = GND, FORCEOFF
Receiver Input Thresholds to
High
INVALID
Receiver Input Thresholds to
Low
INVALID
INVALID
Output Voltage Low I
INVALID
Output Voltage High I
Receiver Positive or Negative Threshold to INVALID
)
(t
INVH
Receiver Positive or Negative Threshold to INVALID
)
(t
INVL
Receiver or Transmitter Edge to Transmitters Enabled Delay (t
Receiver or Transmitter Edge to Transmitters Disabled Delay (t
AUTOPWDN
TIMING CHARACTERISTICS
Maximum Data Rate R
Receiver Propagation Delay Receiver Input to Receiver
Time to Exit Powerdown T
Transmitter Skew t
Receiver Skew t
Transition Region Slew Rate V
ESD PERFORMANCE
RS-232 Pins (T
NOTE:
2. An “edge” is defined as a transition through the transmitter or receiver input thresholds.
)
High Delay
Low Delay
WU
, RIN) Human Body Model 25 - ±15 - kV
OUT
= 0V Full - ±35 ±60 mA
OUT
= ±12V, VCC= 0V or 3V to 5.5V
OUT
Automatic Powerdown or FORCEOFF
See Figure 4 Full -2.7 - 2.7 V
See Figure 4 Full -0.3 - 0.3 V
= 1.6mA Full - - 0.4 V
OUT
= -1.0mA Full VL - 0.6 - - V
OUT
See Figure 7 25 - 1 - µs
See Figure 7 25 - 30 - µs
Note 2, See Figure 7 25 - 100 - µs
)
Note 2, See Figure 7 Full 15 30 60 sec
=3kΩ, CL= 1000pF, One Transmitter Switching Full 250 500 - kbps
L
Output, C
| V
X
PHL
PHL
CC
R
L
Measured From 3V to -3V or -3V to 3V
IEC61000-4-2 Air Gap Discharge 25 - ±15 - kV
IEC61000-4-2 Contact Discharge 25 - ±8-kV
= 150pF
L
| ≥ 3.7V 25 - 100 - µs
OUT
- t
PLH
- t
PLH
=3.3V,
=3kΩ to 7kΩ,
= 3V to 5.5V, C1 - C4 = 0.1µF, VL = VCC; Unless Otherwise Specified.
CC
= 25oC, VCC = VL = 3.3V (Continued)
A
TEMP
o
(
C) MIN TYP MAX UNITS
=GND
= VCC)
t
PHL
t
PLH
= 150pF to 1000pF 25 6 18 30 V/µs
C
L
C
= 150pF to 2500pF 25 4 13 30 V/µs
L
Full - - ±25 µA
25 - 0.15 - µs
25 - 0.15 - µs
25 - 100 - ns
25 - 50 - ns
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FN6040.1
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ISL83387E
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Detailed Description
The ISL83387E operates from a single +3V to +5.5V supply, guarantees a 250kbps minimum data rate, requires only four small external 0.1µF capacitors, features low power consumption, and meets all ElA RS-232C and V.28 specifications. The circuit is divided into three sections: The charge pump, the transmitters, and the receivers.
Charge-Pump
Intersil’s new ISL83387E utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate ±5.5V transmitter supplies from a V low as 3.0V. This allows these devices to maintain RS-232 compliant output levels over the ±10% tolerance range of
3.3V powered systems. The efficient on-chip power supplies require only four small, external 0.1µF capacitors for the voltage doubler and inverter functions over the full V range; other capacitor combinations can be used as shown in Table 3. The charge pumps operate discontinuously (i.e., they turn off as soon as the V+ and V- supplies are pumped up to the nominal values), resulting in significant power savings.
Transmitters
The transmitters are proprietary, low dropout, inverting drivers that translate TTL/CMOS inputs to EIA/TIA-232 output levels. Coupled with the on-chip ±5.5V supplies, these transmitters deliver true RS-232 levels over a wide range of single supply system voltages.
All transmitter outputs disable and assume a high impedance state when the device enters the powerdown mode (see Table 2). These outputs may be driven to ±12V when disabled.
All devices guarantee a 250kbps data rate for full load conditions (3kΩ and 1000pF), V
≥ 3.0V, with one
CC
transmitter operating at full speed. Under more typical conditions of V
≥ 3.3V, RL=3kΩ, and CL= 250pF, one
CC
transmitter easily operates at 1.25Mbps.
The transmitter input threshold is set by the voltage applied to the V
supply pin. Transmitter inputs float if left
L
unconnected (there are no pull-up resistors), and may cause I
increases. Connect unused inputs to GND for the best
CC
performance.
Receivers
The ISL83387E contains standard inverting receivers that convert RS-232 signals to CMOS output levels and accept inputs up to ±25V while presenting the required 3kΩ to 7kΩ input impedance (see Figure 1) even if the power is off (V
= 0V). The receivers’ Schmitt trigger input stage uses
CC
hysteresis to increase noise immunity and decrease errors due to slow input signal transitions. Receiver outputs swing
supply as
CC
CC
from GND to V
, and do not tristate in powerdown (see
L
Table 2).
V
L
R
XIN
-25V ≤ V
≤ +25V
RIN
GND
FIGURE 1. RECEIVER CONNECTIONS
5kΩ
R
XOUT
GND ≤ V
ROUT
≤ V
L
Low Power Operation
This 3V device requires a nominal supply current of 0.3mA, even at V
= 5.5V, during normal operation (not in
CC
powerdown mode). This is considerably less than the 11mA current required by comparable 5V RS-232 devices, allowing users to reduce system power simply by replacing the old style device with the ISL83387E in new designs.
Powerdown Functionality
The already low current requirement drops significantly when the device enters powerdown mode. In powerdown, supply current drops to 1µA, because the on-chip charge pump turns off (V+ collapses to V and the transmitter outputs tristate. This micro-power mode makes these devices ideal for battery powered and portable applications.
Software Controlled (Manual) Powerdown
This device allows the user to force the IC into the low power, standby state, and utilizes a two pin approach where the FORCEON and FORCEOFF mode. For always enabled operation, FORCEON and FORCEOFF active and powerdown modes, under logic or software control, only the FORCEOFF FORCEON state isn’t critical, as FORCEOFF over FORCEON. Nevertheless, if strictly manual control over powerdown is desired, the user must strap FORCEON high to disable the enhanced automatic powerdown circuitry.
Connecting FORCEOFF the enhanced automatic powerdown feature, enabling them to function as a manual SHUTDOWN
With any of the above control schemes, the time required to exit powerdown, and resume transmission is only 100µs.
When using both manual and enhanced automatic powerdown (FORCEON = 0), the ISL83387E won’t power up from manual powerdown until both FORCEOFF FORCEON are driven high, or until a transition occurs on a receiver or transmitter input. Figure 3 illustrates a circuit for ensuring that the ISL83387E powers up as soon as FORCEOFF Powerdown signal forces the device to power up, and the ISL83387E returns to enhanced automatic powerdown
are both strapped high. To switch between
and FORCEON together disables
switches high. The rising edge of the Master
, V- collapses to GND),
CC
inputs determine the IC’s
input need be driven. The
dominates
input (see Figure 2).
and
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ISL83387E
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TABLE 2. POWERDOWN LOGIC TRUTH TABLE
RCVR OR XMTR
EDGE WITHIN 30
SEC?
NO H H Active Active NO L Normal Operation (Enhanced
NO H H Active Active YES H
YES H L Active Active NO L Normal Operation (Enhanced
YES H L Active Active YES H
NO H L High-Z Active NO L Powerdown Due to Enhanced
NO H L High-Z Active YES H
X L X High-Z Active NO L Manual Powerdown
X L X High-Z Active YES H
INVALID
NOTES:
DRIVING FORCEON AND FORCEOFF (EMULATES AUTOMATIC POWERDOWN)
X NOTE 3 NOTE 3 Active Active YES H Normal Operation
X NOTE 3 NOTE 3 High-Z Active NO L Forced Auto Powerdown
3. Input is connected to INVALID
FORCEOFF
INPUT
FORCEON
INPUT
Output.
TRANSMITTER
OUTPUTS
RECEIVER
OUTPUTS
RS-232 LEVEL
PRESENT AT
RECEIVER INPUT?
INVALID
OUTPUT MODE OF OPERATION
Auto Powerdown Disabled)
Auto Powerdown Enabled)
Auto Powerdown Logic
FORCEOFF
PWR MGT
LOGIC
CPU
FIGURE 2. CONNECTIONS FOR MANUAL POWERDOWN
INVALID
I/O CHIP POWER SUPPLY
V
CC
I/O
UART
, FORCEON
V
ISL83387E
L
mode an RC time constant after this rising edge. The time constant isn’t critical, because the ISL83387E remains powered up for 30 seconds after the FORCEON falling edge, even if there are no signal transitions. This gives slow-to­wake systems (e.g., a mouse) plenty of time to start transmitting, and as long as it starts transmitting within 30 seconds both systems remain enabled.
POWER
MANAGEMENT
UNIT
FIGURE 3. CIRCUIT TO ENSURE IMMEDIATE POWER UP
WHEN EXITING FORCED POWERDOWN
MASTER POWERDOWN LINE
0.1µF
FORCEOFF FORCEON
ISL83387E
1MΩ
VL Logic Supply Input
Unlike other RS-232 interface devices where the CMOS outputs swing between 0 and V a separate logic supply input (V V
) that sets VOH for the receiver and INVALID outputs.
CC
Connecting V
to a host logic supply lower than VCC,
L
prevents the ISL83387E outputs from forward biasing the input diodes of a logic device powered by that lower supply. Connecting V
to a logic supply greater than VCC ensures
L
that the receiver and INVALID even with the CMOS input V devices. Note that the V with V
= 5V and VCC= 3.3V (see Figure 16). VL also
L
supply current increases to 100µA
L
powers the transmitter and logic inputs, thereby setting their switching thresholds to levels compatible with the logic supply. This separate logic supply pin allows a great deal of flexibility in interfacing to systems with different logic supplies. If logic translation isn’t required, connect V ISL83387E V
CC
.
INVALID Output
The INVALID output always indicates (see Table 2) whether or not 30µs have elapsed with invalid RS-232 signals (see
, the ISL83387E features
CC
; 1.8V to 5V, regardless of
L
output levels are compatible
of AC, HC, and CD4000
IH
to the
L
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ISL83387E
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Figures 4 and 7) persisting on all of the receiver inputs, giving the user an easy way to determine when the interface block should power down. Invalid receiver levels occur whenever the driving peripheral’s outputs are shut off (powered down) or when the RS-232 interface cable is disconnected. In the case of a disconnected interface cable where all the receiver inputs are floating (but pulled to GND by the internal receiver pull down resistors), the INVALID logic detects the invalid levels and drives the output low. The power management logic then uses this indicator to power down the interface block. Reconnecting the cable restores valid levels at the receiver inputs, INVALID
switches high, and the power management logic wakes up the interface block. INVALID
can also be used to indicate the DTR or RING INDICATOR signal, as long as the other receiver inputs are floating, or driven to GND (as in the case of a powered down driver).
INVALID level on a receiver input. INVALID
switches high 1µs after detecting a valid RS-232
operates in all modes (forced or automatic powerdown, or forced on), so it is also useful for systems employing manual powerdown circuitry.
2.7V
0.3V
-0.3V
-2.7V
FIGURE 4. DEFINITION OF VALID RS-232 RECEIVER LEVELS
VALID RS-232 LEVEL - INVALID
INDETERMINATE
INVALID LEVEL - INVALID
INDETERMINATE
VALID RS-232 LEVEL - INVALID
= 0
= 1
= 1
Figure 5 illustrates the enhanced powerdown control logic. Note that once the ISL83387E enters powerdown (manually or automatically), the 30 second timer remains timed out (set), keeping the ISL83387E powered down until FORCEON transitions high, or until a transition occurs on a receiver or transmitter input.
As stated previously, the INVALID
output switches low whenever invalid levels have persisted on all of the receiver inputs for more than 30µs (see Figure 7), but this has no direct effect on the state of the ISL83387E (see the next sections for methods of utilizing INVALID
to power down the
device).
The time to recover from automatic powerdown mode is typically 100µs.
FORCEOFF
T_IN
R_IN
FIGURE 5. ENHANCED AUTOMATIC POWERDOWN LOGIC
EDGE
DETECT
EDGE
DETECT
FORCEON
S
30s
TIMER
R
AUTOPWDN
Emulating Standard Automatic Powerdown
If enhanced automatic powerdown isn’t desired, the user can implement the standard automatic powerdown feature (mimics the function on the ICL3221E/23E/43E) by connecting the INVALID FORCEOFF
inputs, as shown in Figure 6. After 30µs of
output to the FORCEON and
Enhanced Automatic Powerdown
Even greater power savings is available by using the enhanced automatic powerdown function. When the enhanced powerdown logic determines that no transitions have occurred on any of the transmitter nor receiver inputs for 30 seconds, the charge pump and transmitters powerdown, thereby reducing supply current to 1µA. The ISL83387E automatically powers back up whenever it detects a transition on one of these inputs. This automatic
CPU
powerdown feature provides additional system power savings without changes to the existing operating system.
Enhanced automatic powerdown operates when the FORCEON input is low, and the FORCEOFF
input is high.
FIGURE 6. CONNECTIONS FOR AUTOMATIC POWERDOWN
Tying FORCEON high disables automatic powerdown, but manual powerdown is always available via the overriding FORCEOFF automatic powerdown functionality.
input. Table 2 summarizes the enhanced
invalid receiver levels, INVALID ISL83387E into a forced powerdown condition. INVALID switches high as soon as a receiver input senses a valid
8
INVALID
ISL83387E
I/O
UART
WHEN NO VALID RECEIVER SIGNALS ARE PRESENT
FORCEOFF
FORCEON
switches low and drives the
July 8, 2005
FN6040.1
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ISL83387E
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RECEIVER
INPUTS
TRANSMITTER
INPUTS
TRANSMITTER
OUTPUTS
INVALID
OUTPUT
V+
V
CC
t
INVL
0
V-
FIGURE 7. ENHANCED AUTOMATIC POWERDOWN AND INVALID TIMING DIAGRAMS
t
INVH
t
AUTOPWDN
RS-232 level, forcing the ISL83387E to power on. See the “INVALID
DRIVING FORCEON AND FORCEOFF” section of Table 2 for an operational summary. This operational mode is perfect for handheld devices that communicate with another computer via a detachable cable. Detaching the cable allows the internal receiver pull-down resistors to pull the inputs to GND (an invalid RS-232 level), causing the 30µs timer to time-out and drive the IC into powerdown. Reconnecting the cable restores valid levels, causing the IC to power back up.
Hybrid Automatic Powerdown Options
For devices which communicate only through a detachable cable, connecting INVALID
to FORCEOFF (with FORCEON = 0) may be a desirable configuration. While the cable is attached INVALID
and FORCEOFF remain high, so the enhanced automatic powerdown logic powers down the RS-232 device whenever there is 30 seconds of inactivity on the receiver and transmitter inputs. Detaching the cable allows the receiver inputs to drop to an invalid level (GND), so INVALID
switches low and forces the RS-232 device to power down. The ISL83387E remains powered down until the cable is reconnected (INVALID
= FORCEOFF = 1) and a transition occurs on a receiver or transmitter input (see Figure 5). For immediate power up when the cable is reattached, connect FORCEON to FORCEOFF
through a
network similar to that shown in Figure 3.
Capacitor Selection
The ISL83387E charge pumps require only 0.1µF capacitors for the full operational voltage range. Table 3 lists other acceptable capacitor values for various supply voltage ranges. Do not use values smaller than those listed in Table 3. Increasing the capacitor values (by a factor of 2)
INVALID
}
REGION
t
t
WU
AUTOPWDN
t
WU
reduces ripple on the transmitter outputs and slightly reduces power consumption.
TABLE 3. REQUIRED CAPACITOR VALUES
V
CC
(V)
3.0 to 3.6 0.1 0.1
4.5 to 5.5 0.047 0.33
3.0 to 5.5 0.22 1
C
(µF)
1
C
, C3, C
2
(µF)
4
When using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor’s equivalent series resistance (ESR) usually rises at low temperatures and it influences the amount of ripple on V+ and V-.
Power Supply Decoupling
In most circumstances a 0.1µF bypass capacitor is adequate. In applications that are particularly sensitive to power supply noise, decouple V capacitor of the same value as the charge-pump capacitor C
to ground with a
CC
1
Connect the bypass capacitor as close as possible to the IC.
Transmitter Outputs when Exiting Powerdown
Figure 8 shows the response of two transmitter outputs when exiting powerdown mode. As they activate, the two transmitter outputs properly go to opposite RS-232 levels, with no glitching, ringing, nor undesirable transients. Each transmitter is loaded with 3kΩ in parallel with 2500pF. Note that the transmitters enable only when the magnitude of the supplies exceed approximately 3V.
.
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5V/DIV
2V/DIV
FORCEOFF
T1
T2
VCC = +3.3V C1 - C4 = 0.1µF
TIME (20µs/DIV.)
FIGURE 8. TRANSMITTER OUTPUTS WHEN EXITING
POWERDOWN
High Data Rates
The ISL83387E maintains the RS-232 ±5V minimum transmitter output voltages even at high data rates. Figure 9 details a transmitter loopback test circuit, and Figure 10 illustrates the loopback test result at 120kbps. For this test, all transmitters were simultaneously driving RS-232 loads in parallel with 1000pF, at 120kbps. Figure 11 shows the loopback results for a single transmitter driving 1000pF and an RS-232 load at 250kbps. The static transmitters were also loaded with an RS-232 receiver.
V
CC
0.1µF
+
5V/DIV.
T1
T1
OUT
R1
OUT
5V/DIV.
T1
T1
OUT
R1
OUT
IN
VCC = +3.3V C1 - C4 = 0.1µF
5µs/DIV.
FIGURE 10. LOOPBACK TEST AT 120kbps
IN
VCC = +3.3V C1 - C4 = 0.1µF
2µs/DIV.
V
V
CC
T
L
OUT
V+
V-
R
IN
5K
+
C
3
C
4
+
1000pF
+
C
1
+
C
2
V
CC
C1+
C1-
C2+
C2-
T
IN
R
OUT
FORCEON
FORCEOFF
ISL83387E
FIGURE 9. TRANSMITTER LOOPBACK TEST CIRCUIT
FIGURE 11. LOOPBACK TEST AT 250kbps
Interconnection with 3V and 5V Logic
Standard 3.3V powered RS-232 devices interface well with 3V and 5V powered TTL compatible logic families (e.g., ACT and HCT), but the logic outputs (e.g., R the V
level of 5V powered CMOS families like HC, AC, and
IH
CD4000. The ISL83387E V By connecting V
to the same supply (1.8V to 5V) powering
L
supply pin solves this problem.
L
) fail to reach
OUTS
the logic device, the ISL83387E logic outputs will swing from GND to the logic V
CC
.
±15kV ESD Protection
All pins on the 3V interface devices include ESD protection structures, but the ISL83387E incorporates advanced structures which allow the RS-232 pins (transmitter outputs and receiver inputs) to survive ESD events up to ±15kV. The RS-232 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, protect
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without allowing any latchup mechanism to activate, and don’t interfere with RS-232 signals as large as ±25V.
Human Body Model (HBM) Testing
As the name implies, this test method emulates the ESD event delivered to an IC during human handling. The tester delivers the charge through a 1.5kΩ current limiting resistor, making the test less severe than the IEC61000 test which utilizes a 330Ω limiting resistor. The HBM method determines an ICs ability to withstand the ESD transients typically present during handling and manufacturing. Due to the random nature of these events, each pin is tested with respect to all other pins. The RS-232 pins on “E” family devices can withstand HBM ESD events to ±15kV.
IEC61000-4-2 Testing
The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-232 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The lower current limiting
Typical Performance Curves V
= VL = 3.3V, TA = 25oC
CC
resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device’s RS-232 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-232 port.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results. The “E” device RS-232 pins withstand ±15kV air-gap discharges.
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than ±8kV. All “E” family devices survive ±8kV contact discharges on the RS-232 pins.
6.0 V
+
V
OUT
OUT
-
4.0
2.0
1 TRANSMITTER AT 250kbps OTHER TRANSMITTERS AT 30kbps
0
-2.0
-4.0
TRANSMITTER OUTPUT VOLTAGE (V)
-6.0
FIGURE 12. TRANSMITTER OUTPUT VOLTAGE vs LOAD
1000 2000 3000 4000 50000
LOAD CAPACITANCE (pF)
CAPACITANCE
30
25
20
15
SLEW RATE (V/µs)
10
5
0 1000 2000 3000 4000 5000
FIGURE 13. SLEW RATE vs LOAD CAPACITANCE
+SLEW
-SLEW
LOAD CAPACITANCE (pF)
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Typical Performance Curves V
45
40
250kbps
35
30
25
20
SUPPLY CURRENT (mA)
15
10
0
1000
2000
LOAD CAPACITANCE (pF)
3000
= VL = 3.3V, TA = 25oC (Continued)
CC
120kbps
20kbps
4000
FIGURE 14. SUPPLY CURRENT vs LOAD CAPACITANCE
WHEN TRANSMITTING DATA
10m
NO LOAD ALL OUTPUTS STATIC
1m
V
= 3.3V
CC
5000
3.5
3.0
2.5
2.0
1.5
1.0
SUPPLY CURRENT (mA)
0.5
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 SUPPLY VOLTAGE (V)
NO LOAD ALL OUTPUTS STATIC
FIGURE 15. SUPPLY CURRENT vs SUPPLY VOLTAGE
100µ
10µ
(A)
L
I
1µ
100n
10n
1n
FIGURE 16. V
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP)
GND
TRANSISTOR COUNT
ISL83387E: 1063
PROCESS
Si Gate CMOS
VL ≤ V
CCVL
2.0 3.0 3.5 4.0 4.5 5.0 5.5 6.02.5 6.5 7.0
> V
CC
VL (V)
SUPPLY CURRENT vs VL VO LTA GE
L
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Thin Shrink Small Outline Plastic Packages (TSSOP)
N
INDEX AREA
123
0.05(0.002)
-A­D
e
b
0.10(0.004) C AM BS
NOTES:
1. These package dimensions are within allowable dimensions of JEDEC MO-153-AD, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter­lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen­sion at maximum material condition. Minimum space between protru­sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees)
E1
-B-
SEATING PLANE
A
-C-
M
0.25(0.010) BM M
E
α
A1
0.10(0.004)
GAUGE
PLANE
0.25
0.010
A2
L
c
M24.173
24 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A-0.047 - 1.20 - A1 0.002 0.006 0.05 0.15 ­A2 0.031 0.051 0.80 1.05 -
b 0.0075 0.0118 0.19 0.30 9 c 0.0035 0.0079 0.09 0.20 -
D 0.303 0.311 7.70 7.90 3 E1 0.169 0.177 4.30 4.50 4
e 0.026 BSC 0.65 BSC -
E 0.246 0.256 6.25 6.50 -
L 0.0177 0.0295 0.45 0.75 6
N24 247
o
α
0
o
8
o
0
o
8
Rev. 0 6/98
NOTESMIN MAX MIN MAX
-
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
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