Datasheet ISL83220E Datasheet (intersil)

Page 1

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ISL83220E

Data Sheet April 27, 2006

±15kV ESD Protected, +3V to +5.5V, 1Microamp, 250kbps, RS-232 Transmitters/Receivers

The Intersil ISL83220E is a 3.0V to 5.5V powered RS-232 transmitter/receiver which meets ElA/TIA-232 and V.28/V.24 specifications, even at V

±15kV ESD protection (IEC61000-4-2 Air Gap and Human

Body Model) on transmitter outputs and receiver inputs (RS-232 pins). Targeted applications are PDAs, Palmtops, and notebook and laptop computers where the low operational, and even lower standby, power consumption is critical. Efficient on-chip charge pumps, coupled with a manual powerdown function, reduce the standby supply current to a 1μA trickle. Small footprint packaging, and the use of small, low value capacitors ensure board space savings as well. Data rates greater than 250kbps are guaranteed at worst case load conditions. This family is fully compatible with 3.3V only systems, mixed 3.3V and 5.0V systems, and 5.0V only systems.

Table 1 summarizes the features of the ISL83320E, while Application Note AN9863 summarizes the features of each device comprising the ICL32XXE 3V family.

= 3.0V. Additionally, it provides

FN6011.5

Features

• Pb-Free Plus Anneal Available (RoHS Compliant)

• ESD Protection for RS-232 I/O Pins to

• Drop in Replacement for SP3220E

• Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V

• RS-232 Compatible Outputs at 2.7V

• Latch-Up Free

• On-Chip Voltage Converters Require Only Four External

0.1μF Capacitors

• Manual Powerdown Feature with Receivers Active

• Separate Receiver Enable Pin and TX Hysteresis For Improved Noise Immunity

•R

• Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps

• Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/μs

• Wide Power Supply Range . . . . . . . Single +3V to +5.5V

• Low Supply Current in Powerdown State. . . . . . . . . . .1μA

±15kV (IEC61000)

Applications

• Any System Requiring RS-232 Communication Ports

- Battery Powered, Hand-Held, and Portable Equipment

- Laptop Computers, Notebooks, Palmtops

- Modems, Printers and other Peripherals

- Digital Cameras

- Cellular/Mobile Phones

Related Literature

• Technical Brief TB363 “Guidelines for Handling and

Processing Moisture Sensitive Surface Mount Devices (SMDs)”

TABLE 1. SUMMARY OF FEATURES

NO. OF

PART NUMBER

NO. OF

ISL83220E 1 1 0 250 Yes No Yes No

Tx.

NO. OF

Rx.

MONITOR Rx.

)

OUTB

DATA RATE

(kbps)

Rx. ENABLE FUNCTION?

READY

OUTPUT?

MANUAL

POWER-

DOWN?

AUTOMATIC

POWERDOWN

FUNCTION?

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or 1-888-468-3774

| Intersil (and design) is a registered trademark of Intersil Americas Inc.

All other trademarks mentioned are the property of their respective owners.

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ISL83220E

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Pinout

C1+

C2+

ISL83220E (TSSOP)

1 2 3

V+

C1-

C2-

V-

7 8

TOP VIEW

Ordering Information

TEMP.

PART

GND

OUT

N.C.

OUT

ISL83220ECV 83220ECV 0 to 70 16 Ld TSSOP M16.173 ISL83220ECV-T 83220ECV 0 to 70 16 Ld TSSOP

ISL83220ECVZ (See Note)

ISL83220ECVZ-T (See Note)

SHDN

PART NUMBER

MARKING

83220ECVZ 0 to 70 16 Ld TSSOP

ISL83220EIV 83220EIV -40 to 85 16 Ld TSSOP M16.173 ISL83220EIV-T 83220EIV -40 to 85 16 Ld TSSOP

ISL83220EIVZ

83220EIVZ -40 to 85 16 Ld TSSOP

(See Note) ISL83220EIVZ-T

83220EIVZ -40 to 85 16 Ld TSSOP

(See Note)

NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

RANGE

(°C) PACKAGE

Tape and Reel

(Pb-Free)

(Pb-Free) Tape and Reel

Tape and Reel

(Pb-Free)

(Pb-Free) Tape and Reel

PKG.

DWG. #

M16.173

Pin Descriptions

PIN FUNCTION

V+ Internally generated positive transmitter supply (+5.5V).

V- Internally generated negative transmitter supply (-5.5V).

GND Ground connection.

C1+ External capacitor (voltage doubler) is connected to this lead.

C1- External capacitor (voltage doubler) is connected to this lead.

C2+ External capacitor (voltage inverter) is connected to this lead.

C2- External capacitor (voltage inverter) is connected to this lead. T

OUT

SHDN

N.C. No internal connection.

System power supply input (3.0V to 5.5V).

TTL/CMOS compatible transmitter Inputs.

±15kV ESD Protected, RS-232 level (nominally ±5.5V) transmitter outputs. ±15kV ESD Protected, RS-232 compatible receiver inputs.

TTL/CMOS level receiver outputs. Active low receiver enable control; doesn’t disable R Active low input shuts down transmitters and on-board power supply, to place device in low power mode.

OUTB

outputs.

Page 3

Typical Operating Circuit

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ISL83220E

TTL/CMOS

LOGIC LEVELS

+3.3V

0.1μF

OUT

0.1μF 2

C1+

C1-

C2+

C2-

GND

V+

V-

5kΩ

SHDN

0.1μF

OUTT1

RS-232 LEVELS

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ISL83220E

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Absolute Maximum Ratings Thermal Information

VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V

V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V

V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V

V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V

Input Voltages

, EN, SHDN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V

Output Voltages

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V

OUT

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V

OUT

Short Circuit Duration

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous

OUT

ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:

is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

1. θ

Thermal Resistance (Typical, Note 1)

16 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . . 145

Maximum Junction Temperature (Plastic Package) . . . . . . . 150°C

Maximum Storage Temperature Range. . . . . . . . . . .-65°C to 150°C

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C

(Lead Tips Only)

(°C/W)

Operating Conditions

Temperature Range

ISL83220ECV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C

Electrical Specifications Test Conditions: V

Typicals are at T

PARAMETER TEST CONDITIONS

DC CHARACTERISTICS

Supply Current All Outputs Unloaded,

Supply Current, Powerdown SHDN

LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS

Input Logic Threshold Low T Input Logic Threshold High T

Transmitter Input Hysteresis 25 - 0.3 V Input Leakage Current T Output Leakage Current EN Output Voltage Low I Output Voltage High I

TRANSMITTER OUTPUTS

Output Voltage Swing All Transmitter Outputs Loaded with 3kΩ to Ground Full ±5.0 ±5.4 - V Output Resistance V Output Short-Circuit Current V Output Leakage Current V

RECEIVER INPUTS

Input Voltage Range Full -25 - 25 V Input Threshold Low V

Input Threshold High V

Input Hysteresis 25 - 0.3 - V Input Resistance Full 3 5 7 kΩ

SHDN

= V

= GND 25 - 1.0 10 μA

, EN, SHDN Full - - 0.8 V

, EN, SHDN VCC = 3.3V Full 2.0 - - V

, EN, SHDN Full - ±0.01 ±1.0 μA

= V

= 1.6mA Full - - 0.4 V

OUT

= -1.0mA Full V

OUT

= V+ = V- = 0V, Transmitter Output = ±2V Full 300 10M - Ω

= 0V Full - ±35 ±60 mA

OUT

= ±12V, VCC = 0V or 3V to 5.5V, SHDN = GND Full - - ±25 μA

OUT

= 3.3V Full 0.6 1.2 - V

= 5.0V Full 0.8 1.5 - V

= 3.3V Full - 1.5 2.4 V

= 5.0V Full - 1.8 2.4 V

= 3V to 5.5V, C1 - C4 = 0.1μF; Unless Otherwise Specified.

= 25°C

TEMP

(°C) MIN TYP MAX UNITS

VCC = 3.15V 25 - 0.3 1.0 mA

= 5.0V Full 2.4 - - V

Full - ±0.05 ±10 μA

-0.6 V

-0.1 - V

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ISL83220E

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Electrical Specifications Test Conditions: V

Typicals are at T

PARAMETER TEST CONDITIONS

TIMING CHARACTERISTICS

Maximum Data Rate R Transmitter Propagation Delay Transmitter Input to

Receiver Propagation Delay Receiver Input to Receiver

Receiver Output Enable Time Normal Operation 25 - 200 - ns Receiver Output Disable Time Normal Operation 25 - 200 - ns Transmitter Skew t Receiver Skew t Transition Region Slew Rate V

ESD PERFORMANCE

RS-232 Pins (T

All Other Pins Human Body Model 25 - ±3-kV

NOTE:

2. Transmitter skew is measured at the transmitter zero crossing points.

, RIN) Human Body Model 25 - ±15 - kV

OUT

= 3kΩ, CL = 1000pF, One Transmitter Switching Full 250 500 - kbps

Transmitter Output,

= 3kΩ, CL = 1000pF

Output, C

PHL PHL

= 3kΩ to 7kΩ,

Measured From 3V to -3V or

-3V to 3V

IEC61000-4-2 Contact Discharge 25 - ±8-kV IEC61000-4-2 Air Gap Discharge 25 - ±15 - kV

= 150pF

- t

(Note 2) 25 - 100 500 ns

PLH

- t

PLH

= 3.3V,

= 3V to 5.5V, C1 - C4 = 0.1μF; Unless Otherwise Specified.

= 25°C (Continued)

TEMP

(°C) MIN TYP MAX UNITS

PHL

PLH

PHL

PLH

= 150pF to 2500pF 25 4 - 30 V/μs

= 150pF to 1000pF 25 6 - 30 V/μs

25 - 1.0 - μs 25 - 1.0 - μs

25 - 0.20 - μs 25 - 0.30 - μs

Full - 100 1000 ns

Detailed Description

The ISL83220E operates from a single +3V to +5.5V supply, guarantees a 250kbps minimum data rate, requires only four small external 0.1μF capacitors, features low power consumption, and meets all ElA RS-232C and V.28 specifications. The circuit is divided into three sections: The charge pump, the transmitter, and the receiver.

Charge-Pump

Intersil’s new 3.3V family utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate ±5.5V transmitter supplies from a V low as 3.0V . This allows these device s to maint ai n RS-232 compliant output levels over the ±10% tolerance range of

3.3V powered systems. The efficient on-chip power supplies require only four small, external 0.1μF capacitors for the voltage doubler and inverter functions, even at V The charg e pump s operate discontinuously (i.e., they turn off as soon as the V+ and V- supplies are pumped up to the nominal values), resulting in significant power savings.

Transmitters

The transmitters are proprietary, low dropout, inverting drivers that translate TTL/CMOS inputs to EIA/TIA-232 output levels. Coupled with the on-chip ±5.5V supplies,

supply as

= 3.3V.

these transmitters deliver true RS-232 levels over a wide range of single supply system voltages.

The transmitter output disables and assumes a high impedance state when the device enters the powerdown mode (see T able 2). This output may be driven to ±12V when disabled.

All devices guarantee a 250kbps data rate for full load conditions (3kΩ and 1000pF), V typical conditions of V

≥ 3.3V, RL = 3kΩ, and CL = 250pF,

≥ 3.0V. Under more

the ISL83220E easily operates at 900kbps. Transmitter inputs float if left unconnected, and may cause

increases.

Receivers

The ISL83220E device contains a standard inverting receiver that three-states via the EN convert RS-232 signals to CMOS output levels and accept inputs up to ±25V while presenting the required 3kΩ to 7kΩ input impedance (see Figure 1) even if the power is off (V

= 0V). The receiver’s Schmitt trigger input stage uses

hysteresis to increase noise immunity and decrease errors due to slow input signal transitions.

control line. Receivers

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ISL83220E

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The ISL83220E receiver disables only when EN is driven high. (see Table 2). This allows the receiver to monitor external devices, like a modem, even when the ISL83220E is in its 1

μA powerdown state.

Standard receivers driving powered down peripherals must be disabled to prevent current flow through the peripheral’s protection diodes (see Figure 2). This renders them useless for wake up functions.

1IN

-25V ≤ V

FIGURE 1. INVERTING RECEIVER CONNECTIONS

RIN

≤ +25V

GND

5kΩ

GND ≤ V

1OUT

ROUT

≤ V

Operation Down to 2.7V

ISL83220E transmitter outputs meet RS-562 levels (±3.7V), at the full data rate, with V

as low as 2.7V. RS-562 levels

typically ensure interoperability with RS-232 devices.

Powerdown Functionality

This 3V family of RS-232 interface devices requires a nominal supply current of 0.3mA during normal operation (not in powerdown mode), which is considerably less than the 5mA to 11mA current required of 5V RS-232 devices. The already low current requirement drops significantly when the device enters powerdown mode. In powerdown, supply current drops to 1μA, because the on-chip charge pump turns off (V+ collapses to V and the transmitter outputs three-state. This micro-power mode makes these devices ideal for battery powered and portable applications.

Software Controlled (Manual) Powerdown

On the ISL83220E, the powerdown control is via a simple shutdown (SHDN operation, while driving it low forces the IC into it’s powerdown state. Connect SHDN function isn’t needed. Note that the receiver output remains enabled during shutdown (see Table 2). For the lowest power consumption during powerdown, the receiver should also be disabled by driving the EN section). The time to recover from manual powerdown mode is typically 100μs.

) pin. Driving this pin high enables normal

, V- collapses to GND),

to VCC if the powerdown

input high (see next

TABLE 2. POWERDOWN AND ENABLE LOGIC TRUTH TABLE

INPUT

DOWN

UART

GND

PERIPHERAL

TRANSMITTER

OUTPUT

SHDN

SHDN INPUT

L L High-Z Active Manual Powerdown L H High-Z High-Z Manual Powerdown

H L Active Active Normal Operation H H Active High-Z Normal Operation

POWERED

FIGURE 2. POWER DRAIN THROUGH POWERED DOWN

OUT = VCC

= GND

RECEIVER

OUTPUT

RS-232 CHIP

MODE OF

OPERATION

w/Rcvr. Disabled

CURRENT FLOW

OLD

Receiver ENABLE Control

The ISL83220E also features an EN input to control the receiver output. Driving EN

high disables the receiver output placing it in a high impedance state. This is useful to eliminate supply current, due to a receiver output forward biasing the protection diode, when driving the input of a powered down (V

= GND) peripheral (see Figure 2).

Capacitor Selection

The charge pumps require 0.1μF capacitors for 3.3V operation. Do not use values smaller than 0.1 the capacitor values (by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. When using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor’s equivalent series resistance (ESR) usually rises at low temperatures and it influences the amount of ripple on V+ and V

μF. Increasing

Power Supply Decoupling

In most circumstances a 0.1μF bypass capacitor is adequate. In applications that are particularly sensitive to power supply noise, decouple V capacitor of the same value as the charge-pump cap acitor C Connect the bypass capacitor as close as possible to the IC.

to ground with a

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Transmitter Output when Exiting Powerdown

Figure 3 shows the response of the transmitter output when exiting powerdown mode. As it activates, the transmitter output properly goes to RS-232 levels, with no glitching, ringing, nor undesirable transients. The transmitter is loaded with 3kΩ in parallel with 2500pF. Note that the transmitter enables only when the magnitude of the supplies exceed approximately 3V.

5V/DIV

2V/DIV

FIGURE 3. TRANSMITTER OUTPUT WHEN EXITING

SHDN

TIN = LOW

TIN = HIGH

VCC = +3.3V C1 - C4 = 0.1µF

TIME (20µs/DIV)

POWERDOWN

5V/DIV

OUT

5V/DIV

OUT

VCC = +3.3V C1 - C4 = 0.1µF

5µs/DIV

FIGURE 5. LOOPBACK TEST AT 120kbps

High Data Rates

The ISL83220E maintains the RS-232 ±5V minimum transmitter output voltages even at high data rates. Figure 4 details a transmitter loopback test circuit, and Figure 5 illustrates the loopback test result at 120kbps. For this test, the transmitter is driving an RS-232 load in parallel with 1000pF, at 120kbps. Figure 6 shows the loopback results for the transmitter driving 1000pF and an RS-232 load at 250kbps.

0.1μF

C1+

C1-

C2+

C2-

OUT

ISL83220E

OUT

V+

V-

1000pF

OUT

VCC = +3.3V C1 - C4 = 0.1µF

2µs/DIV

FIGURE 6. LOOPBACK TEST AT 250kbps

Interconnection with 3V and 5V Logic

The ISL83220E directly interfaces with 5V CMOS and TTL logic families. Nevertheless, with the device at 3.3V, and the logic supply at 5V, AC, HC, and CD4000 outputs can drive ISL83220E inputs, but ISL83220E outputs do not reach the minimum V information.

for these logic families. See Table 4 for more

SHDN

FIGURE 4. TRANSMITTER LOOPBACK TEST CIRCUIT

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ISL83220E

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TABLE 3. LOGIC FA MILY COMP ATIBILITY WITH V ARIOUS

SUPPLY VOLTAGES

SYSTEM

POWER-SUPPLY

VOLTAGE

(V)

3.3 3.3 Compatible with all CMOS

5 5 Compatible with all TTL and

5 3.3 Compatible with ACT and HCT

SUPPLY

VOLTAGE

(V) COMPATIBILITY

families.

CMOS logic families.

CMOS, and with TTL.

ISL83220E outputs are

incompatible with AC, HC, and CD4000 CMOS inputs.

±15kV ESD Protection

All pins on ISL8XXX devices include ESD protecti on structures, but the ISL8XXXE family incorporates advanced structures which allow the RS-232 pins (transmitter outputs and receiver inputs) to survive ESD events up to ±15kV. The RS-232 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powe re d up , protect without allowing any latchup mechanism to activate, and don’t interfere with RS-232 signals as large as ±25V.

Human Body Model (HBM) Testing

As the name implies, this test method emulates the ESD event delivered to an IC during human handling. The tester delivers the charge through a 1.5kΩ current limiting resistor, making the test less severe than the IEC61000 test which utilizes a 330Ω limiting resistor. The HBM method

determines an IC’s ability to withstand the ESD transients typically present during handling and manufacturing. Due to the random nature of these events, each pin is tested with respect to all other pins. The RS-232 pins on “E” family devices can withstand HBM ESD events to ±15kV.

IEC61000-4-2 Testing

The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-232 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device’s RS-232 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-232 port.

AIR-GAP DISCHARGE TEST METHOD

For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results. The “E” device RS-232 pins withstand ±15kV air-gap discharges.

CONTACT DISCHARGE TEST METHOD

During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than ±8kV . All “E” family devices survive ±8kV contact discharges on the RS-232 pins.

Typical Performance Curves V

TRANSMITTER AT 250kbps

-2

-4

TRANSMITTER OUTPUT VOLTAGE (V)

-6

FIGURE 7. TRANSMITTER OUTPUT VOLTAGE vs LOAD

1000 2000 3000 4000 50000

LOAD CAPACITANCE (pF)

CAPACITANCE

= 3.3V, TA = 25°C

OUT

SLEW RATE (V/µs)

0 1000 2000 3000 4000 5000

FIGURE 8. SLEW RATE vs LOAD CAPACITANCE

-SLEW

+SLEW

LOAD CAPACITANCE (pF)

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ISL83220E

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Typical Performance Curves V

45 40 35 30 25 20 15

SUPPLY CURRENT (mA)

5 0

0 1000 2000 3000 4000 5000

LOAD CAPACITANCE (pF)

FIGURE 9. SUPPLY CURRENT vs LOAD CAP ACITANCE

WHEN TRANSMITTING DATA

= 3.3V, TA = 25°C (Continued)

250kbps

120kbps

20kbps

Die Characteristics

SUBSTRATE POTENTIAL (POWERED UP):

GND

3.5

3.0

2.5

2.0

1.5

1.0

SUPPLY CURRENT (mA)

0.5

2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 SUPPLY VOLTAGE (V)

FIGURE 10. SUPPLY CURRENT vs SUPPLY VOLTAGE

NO LOAD ALL OUTPUTS STATIC

TRANSISTOR COUNT:

286

PROCESS:

Si Gate CMOS

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Thin Shrink Small Outline Plastic Packages (TSSOP)

INDEX AREA

123

0.05(0.002)

-AD

0.10(0.004) C AM BS

NOTES:

1. These package dimensions are within allowable dimensions of JEDEC MO-153-AB, Issue E.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed

0.15mm (0.006 inch) per side.

4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch).

10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees)

-B-

SEATING PLANE

-C-

0.25(0.010) BM M

0.10(0.004)

GAUGE PLANE

0.25

0.010

M16.173

16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE

INCHES MILLIMETERS

SYMBOL

A - 0.043 - 1.10 -

A1 0.002 0.006 0.05 0.15 -

A2 0.033 0.037 0.85 0.95 -

b 0.0075 0.012 0.19 0.30 9

c 0.0035 0.008 0.09 0.20 -

D 0.193 0.201 4.90 5.10 3

E1 0.169 0.177 4.30 4.50 4

e 0.026 BSC 0.65 BSC -

E 0.246 0.256 6.25 6.50 -

L 0.020 0.028 0.50 0.70 6

N16 167

NOTESMIN MAX MIN MAX

Rev. 1 2/02

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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implic atio n or other wise u nde r any p a tent or patent rights of Intersil or it s subs idi aries.

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