Datasheet ISL6423 Datasheet (intersil)

Page 1
®
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ISL6423
Data Sheet
Single Output LNB Supply and Control Voltage Regulator with I2C Interface for Advanced Satellite Set-Top Box Designs DiSEqC 2.0 Compatible
The ISL6423 is a highly integrated voltage regulator and interface IC, specifically designed for supplying power and control signals from advanced satellite set-top box (STB) modules to the low noise blocks (LNBs) of single antenna ports. The device consists of a current-mode boost PWM and a low-noise linear regulator along with the circuitry required for 22kHz tone generation, modulation and I device interface. The device makes the total LNB supply design simple, efficient and compact with low external component count.
The current mode boost converter provides the linear regulator with input voltage that is set to the final output voltages, plus typically 0.8V to insure minimum power dissipation across the linear regulator. This maintains constant voltage drop across the linear pass element while permitting adequate voltage range for tone injection.
The final regulated output voltage is available at output terminals to support the operation of an antenna port for single tuners. The outputs for each PWM can be controlled in two ways, full control from I bits or set the I switch to higher range (i.e., 18.3V/19.3V) with the SELVT OP pin. All the functions on this IC are controlled via the I by writing 8 bits words onto the System Registers (SR). The same register can be read back, and five I the diagnostic status. Separate enable command sent on the
2
I
C bus provides for standby mode control for the PWM and linear combination, disabling the output and forcing a shutdown mode. The output channel is capable of providing 750mA of continuous current. The overcurrent limit can be digitally programmed to four levels.
The External modulation input EXTM can accept a modulated DiSEqC command and transfer it symmetrically to the output. Alternatively the EXTM pin can be used to modulate the continuous internal tone.
The FLT an over temperature fault condition is detected by the LNB controller. The nature of the fault can be read of the I registers.
2
C to the lower range (i.e., 13.3V/14.3V) and
pin serves as an interrupt for the processor when
2
C using the VTOP and VBOT
2
C bits will report
2
C
2
C bus
2
C
April 10, 2007
FN9191.1
Features
• Single Chip Power solution
- Operation for 1-Tuner/1-Dish Applications
- Integrated DC/DC Converter and I
• Switch-Mode Power Converter for Lowest Dissipation
- Boost PWM with > 92% Efficiency
- Selectable 13.3V or 18.3V Outputs
- Digital Cable Length Compensation (1V)
2
-I
C and Pin Controllable Output
• Output Back Bias Capability of 28V
2
C Compatible Interface for Remote Device Control
•I
• Registered Slave Address 0001 00XX
• 2.5V/3.3V/5V Logic Compatible
• External Pin to Toggle between V & H Polarization
• Built-In Tone Oscillator Factory Trimmed to 22kHz
- Facilitates DiSEqC (EUTELSAT) Encoding
- External Modulation Input
• Internal Over-Temperature Protection and Diagnostics
• Internal OV, UV, Overload and Overtemp Flags (Visible on I
signal
•FLT
• LNB Short-Circuit Protection and Diagnostics
• QFN, HTSSOP Packages
• Pb-Free Plus Anneal Available (RoHS Compliant)
2
C)
2
C Interface
Applications
• LNB Power Supply and Control for Satellite Set-Top Box
Ordering Information
TEMP.
PART NUMBER
(Note)
ISL6423ERZ 6423ERZ -20 to +85 24 Ld 4x4 QFN L24.4x4D ISL6423ERZ-T 6423ERZ -20 to +85 24 Ld 4x4 QFN
ISL6423EVEZ ISL6423EVEZ -20 to +85 28 Ld HTSSOP M28.173B ISL6423EVEZ-T ISL6423EVEZ -20 to +85 28 Ld HTSSOP
NOTE: Inter sil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
PART
MARKING
RANGE
(°C)
PACKAGE
(Pb-Free)
(T ape & Reel)
(T ape & Reel)
PKG.
DWG. #
L24.4x4D
M28.173B
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
All other trademarks mentioned are the property of their respective owners.
Copyright Intersil Americas Inc. 2006, 2007. All Rights Reserved
Page 2
Pinouts
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VCC
NC
FLT
NC
SGND
TCAP ADDR0 ADDR1
BYPASS
PGND
GATE
VSW
NC CS
ISL6423
ISL6423 (HTSSOP)
TOP VIEW
1 2 3 4 5 6 7 8
9 10 11 12 13 14
28
CPSWIN CPSWOUT
27
CPVOUT
26
EXTM
25
SDA
24
SCL
23
TDOUT
22
TDIN
21 20
VO NC
19
NC
18
AGND
17 16
SELVTOP TXT
15
SGND
TCAP
ADDR0
ADDR1
BYPASS
PGND
ISL6423 (QFN)
TOP VIEW
NC
FLT
VCC
CS
CPSWIN
TXT
24 23 22 21 20 19
1
2
3
4
5
6
789101112
GATE
VSW
CPSWOUT
SELVTOP
CPVOUT
18
17
16
15
14
13
AGND
EXTM
SDA
SCL
TDOUT
TDIN
VO
2
FN9191.1
April 10, 2007
Page 3
Block Diagram
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11
17
16
4
3
23
CLK1
OLF/BCF
DCL
OC1
+
-
-
+
VREF1
SCL
SDA
SELVTOP
SDA
SCL
BAND GAP
REF VOLTAGE
REF
VOLTAGE
ADJ1
ISELL&H EN ENT
VTOP
BGV
TONE
INJ
CKT
VBOT
CLK1
OLF/BCF
I2C
INTERFACE
OSC.
DIV &
WAVE SHAPING
INT
TONE
ADDR0
ADDR0
ADDR1
OUVF
OUVF
ADDR1
OTF
TTH DCL
FLT
THERMAL
SHUTDOWN
ISL6423
COUNTER
GATE
7
3
PGND
6
CS
9
TDOUT
15
TONE
DECODER
TDIN
14
VSW
8
OVERCURRENT
PROTECTION
LOGIC SCHEME 1
ILIM1
CS AMP
PWM
LOGIC Q
S
∑
SLOPE
COMPENSATION
TXT
TTH
VO
13
AGND
12
VCC
22
SGND
1
April 10, 2007
FN9191.1
NOTE:
ON CHIP
LINEAR
UVLO
POR
SOFT-START
BYPASS
5
INT 5V SOFT-START
EN1/EN2
TXT
10
+
-
1. Pinouts shown are for the QFN package.
TCAP
2
MSEL1
EXTM
18
EXT TONE CKT
ENT1
CPSWOUT
CPSWIN
20 21
CHARGE PUMP
CPVOUT
19
Page 4
Typical Application Schematic QFN
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VIN
RTN
0
4
2
L5 15µH
1
C23 56µF
0
1234
5
6
TPC6002 Q2
R10
18
0
R8
0.1
0
R9 470
C21
100pF
0
C27
C26
0.22µF
1µF
C29 1n
23
VSW
8CS9
22
FLT
U2
C25 47n
19
20
21
VCC
CPSWIN
CPSWOUT
TXT10AGND
SELVTOP
11
12
CPVOUT
EXTM
SDA
SCL
TDOUT
TDIN
VO
D7
0
18 17 16 15 14 13
C16
10n
CMS06
C24 1µF
0
24
1
SGND
2
TCAP
3
ADDR0
4
ADDR1
5
BYPASS
6
PGND
0
SGND
ISL6423ER
GATE
7
C28
0.1µF
R11 100
R12
D6
CMS06
R13 4.7k
R22 47k
100
R23
10k
R24
4.7k
L4
220µH
1 2
C15
0.22µF
R7
NDS356AP
Q4 2N2222A
15
M6
FLT BAR
EXTM
SDA SCL
VLNB
ISL6423
D8
1.5KE24
RTN
TXT
TDOUT
SELVTOP
D5
CMS06
April 10, 2007
FN9191.1
C22 56µF
0
C18 10µF
0
L6
4.7µH
1 2
C19 10µF
0
C20 10µF
0
NOTE : SDA and SCL require pull up to the required logic level.
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ISL6423
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Absolute Maximum Ratings Thermal Information
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . 8.0V to 18.0V
Logic Input Voltage Range
(SDA, SCL, ENT, DSQIN 1 and 2, SEL18V 1 and 2). .-0.5V to 7V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. θ
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
JA
Tech Brief TB379.
3. For θ
4. The device junction temperature should be kept below +150°C. Thermal shut-down circuitry turns off the device if junction temperature exceeds
, the "case temp" location is the center of the exposed metal pad on the package underside.
JC
+150°C typically.
Thermal Resistance (Typical, Notes 2, 3) θJA (°C/W) θJC (°C/W)
QFN Package. . . . . . . . . . . . . . . . . . . . 38 4.5
TSSOP Package . . . . . . . . . . . . . . . . . 35 2.5
Maximum Junction Temperature (Note 4) . . . . . . . . . . . . . . .+150°C
Maximum Storage Temperature Range. . . . . . . . . .-40°C to +150°C
Operating Temperature Range . . . . . . . . . . . . . . . . .-20°C to +85°C
Electrical Specifications V
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Operating Supply Voltage Range 81214 V Standby Supply Current EN = L - 1.5 3.0 mA Supply Current I
UNDERVOLTAGE LOCKOUT
Start Threshold 7.5 - 7.95 V Stop Threshold 7.0 - 7.6 V Start to Stop Hysteresis 350 400 500 mV
SOFT-START
COMP Rise Time (Note 5) (Note 5) - 8196 - Cycles Output Voltage (Note 5) V
Line Regulation DV
Load Regulation DV
Dynamic Output Current Limiting I
Dynamic Overload Protection Off Time TOFF DCL = 0, Output Shorted (Note 8) - 900 - ms Dynamic Overload Protection On Time TON - 20 - ms Static Output Current Limiting I Cable Fault CABF Threshold I
= 12V, TA = -20°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C. EN = H, VTOP
CC
VBOT = L, ENT = L, DCL = L, Iout = 12mA, unless otherwise noted. See software description section for I access to the system.
EN = VTOP = VBOT = ENT = H, No Load - 4.0 8.0 mA
(Refer to Table 1) 13.04 13.3 13.56 V (Refer to Table 1) 14.02 14.3 14.58 V (Refer to Table 1) 17.94 18.3 18.66 V (Refer to Table 1) 19.00 19.3 19.68 V VIN = 8V to 14V; VO = 13.3V - 4.0 40.0 mV
O1,
O2
O1,
O2
= 8V to 14V; VO = 18.3V - 4.0 60.0 mV
V
IN
IO = 0mA to 350mA - 50 80 mV
= 0mA to 750mA - 100 200 mV
I
O
DCL = 0, ISEL H = 0, ISEL L = 0 (Note 8) 275 305 345 mA DCL = 0, ISEL H = 0, ISEL L = 1 (Note 8) 515 570 630 mA DCL = 0, ISEL H = 1, ISEL L = 0 (Note 8) 635 705 775 mA DCL = 0, ISEL H = 1, ISEL L = 1 (Note 8) 800 890 980 mA
DCL = 1 (Note 8) - 990 - mA EN = 1, VO = 19V, No Tone 2 10 20 mA
V V V
DV
DV
IN
O1 O1 O1 O1
MAX
MAX CAB
2
C
5
FN9191.1
April 10, 2007
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ISL6423
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Electrical Specifications V
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
TONE OSCILLATOR
Tone Frequency f Tone Amplitude V Tone Duty Cycle dc Tone Rise or Fall Time T
TONE DECODER
Input Amplitude Vtdin 200 - 1000 mV Frequency Capture Range Ftdin 17.5 - 26.5 kHz Input Impedance Zdet - 8.6 - kΩ Detector Output Voltage Vtdout_L Tone Present, Iload = 3mA - - 0.4 V Detector Output Leakage Itdout_H Tone absent, V Tone Decoder Rx Threshold V Tone Decoder Tx Threshold V
LINEAR REGULATOR
Drop-out Voltage Iout = 750mA - 0.80 1.05 V Output Backward Leakage Current I Output Backward Leakage Current I Output Backward Current Threshold I Output Backward Voltage I Output Undervoltage
(Asserted high during soft-start) Output Overvoltage
(Asserted high during soft-start)
TXT, EXTM, SELVTOP AND ADDR 0/1 INPUT PINs (Note 8)
Asserted LOW --0.8V Asserted HIGH 1.7 - - V Input Current -25- μA
CURRENT SENSE (CS pin)
Input Bias Current I Overcurrent Threshold V
ERROR AMPLIFIER
Open Loop Voltage Gain A Gain Bandwidth Product
PWM
Maximum Duty Cycle 90 93 - % Minimum Pulse Width -20- ns
OSCILLATOR
Oscillator Frequency f
= 12V, TA = -20°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C. EN = H, VTOP
CC
VBOT = L, ENT = L, DCL = L, Iout = 12mA, unless otherwise noted. See software description section for I access to the system. (Continued)
tone
tone
tone
, T
r
RXth
TXth
OBK OBK
OBKTH
OBK
BIAS
CS
OL
GBP
ENT = H 20.0 22.0 24.0 kHz ENT = H, IO = 5mA 500 680 800 mV ENT = H 405060 % ENT = H 5 10 14 μs
f
= 6V - - 10 μA
O
TXT = L & TTH = 0 (Note 9) 100 150 200 mV TXT = H & TTH = 0 (Note 9) 400 450 500 mV
EN = 0; V EN = 0; V EN = 1; V EN = 0 - - 27 V OUVF bit is asserted high, Measured from
the typical output set value OUVF bit is asserted high, Measured from
the typical output set value
Static current mode, DCL = H 325 450 500 mV
Fixed at (20)(f
o
= 27V - 2.0 3.0 mA
OBK
= 28V - 15 17 mA
OBK
= 19V (Note 7) - 125 - mA
OFAULT
-6 - -2 %
+2 - +6 %
- 700 - nA
-88- dB
-14-MHz
) 396 440 484 kHz
tone
2
C
6
FN9191.1
April 10, 2007
Page 7
ISL6423
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Electrical Specifications V
= 12V, TA = -20°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C. EN = H, VTOP
CC
VBOT = L, ENT = L, DCL = L, Iout = 12mA, unless otherwise noted. See software description section for I access to the system. (Continued)
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
THERMAL SHUTDOWN
Temperature Shutdown Threshold - 150 - °C Temperature Shutdown Hysteresis - 20 - °C
FLT
FLT (released) VO = 6V - - 10 μA
(asserted) I
FLT
= 3.2mA - - 0.4 V
SINK
NOTES:
5. Internal digital soft-start.
6. EXTM, TXT and SELVTOP and addr 0/1 pins have 200k internal pulldown resistors.
2
7. On exceeding this backward current limit threshold for a period of 100µs, the device enters the dynamic current limit mode and the BCF I
C bit
is set. The dynamic current limit duty ratio during a back current fault is ON = 100µs/OFF = 5ms.
8. In the Dynamic current limit mode the output is ON for 20ms and OFF for 900ms, but remains continuously ON in the Static mode. When tone is ON, the minimum current limit is 50mA lower than the values indicated in the table. While in the dynamic mode of current limit the overload trip level is momentarily increased to 990mA during the 20ms ON time to facilitate recovery from overload conditions.
Tone Waveform
ENT
I
2
C
2
C
MSEL
2
C
I
EXTM
PIN
VOUT
PIN
22kHz 22kHz 22kHz 22kHz22kHz 22kHz
Internal Tone Tr = 10µs typ
External Tone Tr = 10µs typ
Returns to nominal V after the last EXTM rising edge T > 55µs;
OUT
Internal Tone
~1 period
NOTES:
9. The signal pin TXT changes the decoder threshold during tone transmit and receive. TTH allows threshold control through I
10. The tone rise and fall times are not shown due to resolution of graphics. It is 10µs typical for 22kHz.
11. The EXTM pins have input thresholds of Vil(max) = 0.8V and Vih(min) = 1.7V
FIGURE 1. TONE WAVEFORM
2
C.
7
FN9191.1
April 10, 2007
Page 8
Typical Performance Curves
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ISL6423
0.90
0.80
0.70
0.60
0.50
_max (A)
0.40
OUT
I
0.30
0.20
0.10
0.00 020406080
TEMPERATURE (°C)
I
OUT
_max
0.90
0.80
0.70
0.60
0.50
_max (A)
0.40
OUT
I
0.30
0.20
0.10
0.00 020406080
TEMPERATURE (°C)
FIGURE 2. OUTPUT CURRENT DERATING (HTSSOP) FIGURE 3. OUTPUT CURRENT DERATING (4x4 QFN)
Functional Pin Description
SYMBOL FUNCTION
2
SDA Bidirectional data from/to I
2
SCL Clock from I
C bus.
VSW Input of the linear post-regulator.
PGND Dedicated ground for the output gate driver of respective PWM.
CS Current sense input; connect the sense resistor Rsc at this pin for desired peak overcurrent value for the boost FET. The
set peak limit is effective in the static mode current limit only (i.e., DCL = HIGH).
SGND Small signal ground for the IC.
TCAP Capacitor for setting rise and fall time of the output voltage. Typical value is 0.1µF.
BYPASS Bypass capacitor for internal 5V.
TXT TXT is the Tone Transmit signal input used to change the Tone Decoder Threshold from TXT = 0, 200mV maximum during
Receive to TXT = 1, 400mV minimum during transmit.
VCC Main power supply to the chip.
GATE This output drives the boost FET gate. The output is held low when VCC is below the UVLO threshold.
VO Output voltage for the LNB is available at VO pin.
ADDR0 and ADDR1 Logic combination at the ADDR0 and 1 can select four different chip select addresses.
EXTM This pin can be used in two ways:
1) As an input for externally modulated Diseqc tone signal which is transferred to the symmetrically onto Vout
2) Alternatively apply a Diseqc modulation envelope which modulates an internal tone and then transfers it symmetrically onto Vout.
FLT
This is an open drain output from the controller. when the flt goes low it indicates that an over temperature, over load fault, back current fault, UVLO, or an I the actual cause of the error. A high on the FLT
CPVOUT, CPSWIN
CPSWOUT
A 47n charge pump decoupling capacitor is to be connected to CPVOUT. Connect a 1.5n capacitor between CPSWIN and CPSWOUT.
SELVTOP When this pin is low the Vout is in the 13V/14V range selected by the I
When this pin is high the 18V/19V range selected by the I be set low for the SELVTOP pins to be active. Setting VSPEN high disables this pins and voltage selection will be done using the I
2
C bits VBOT and VTOP only.
TDIN, TDOUT TDIN is the tone decoder input and TDOUT is the tone detector output. TDOUT is an open drain output.
C bus.
2
C reset condition has occurred. The processor should then look at the I2C register to get
indicates that the device is functioning normally.
2
2
C bit VTOP. The Voltage select pin enable VSPEN I2C bit must
C bit VBOT.
I
OUT
_max
8
FN9191.1
April 10, 2007
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ISL6423
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Functional Description
The ISL6423 single output voltage regulator makes an ideal choice for advanced satellite set-top box and personal video recorder applications. The device utilizes built-in DC/DC step up converters that, operates from a single supply source ranging from 8V to 14V, and generates the voltage needed to enable the linear post-regulator to work with a minimum of dissipated power. An undervoltage lockout circuit disables the device when VCC drops below a fixed threshold (7.5V typical).
DiSEqC Encoding
The internal oscillator is factory-trimmed to provide a tone of 22kHz in accordance with DiSEqC (EUTELSAT) standards. No further adjustment is required. The tone oscillator can be controlled either by the I dedicated pin (EXTM) that allows immediate DiSEqC data encoding separately for each LNB. All the functions of this IC are controlled via the I registers. The same registers can be read back, and four bits will report the diagnostic status. The internal oscillator operates the converters at twenty times the 22k tone frequency . The device offers full I supports 2.5V, 3.3V or 5V logic, up to an operation al speed o f 400kHz.
If the Tone Enable (ENT) bit is set LOW and the MSEL bits set LOW through I internal tone signal, modulating the DC output with a 680mV of this signal usually provides the LNB with information about the band to be received.
Burst coding of the tone can be accomplished due to the fast response of the EXTM input and rapid tone response. This allows implementation of the DiSEqC (EUTELSAT) protocols.
When the ENT bit is set HIGH, a continuous 22kHz tone is generated regardless of the EXTM pin logic status for the regulator channel LNB-A. The ENT bit must be set LOW when the EXTM pin is used for DiSEqC encoding.
The EXTM accepts an externally modulated tone command when the MSEL I
typical symmetrical tone waveform. The presence
PP
DiSEqC Decoder
TDIN is the input to the tone decoder. It accepts the tone signal derived from the Vout thru the 10nF decoupling capacitor. The detector threshold can be set to 200mV maximum in the receive mode and to 400mV minimum in the transmit mode by means of the logic presented to the TXT pin. If tone is detected the open drain pin TDOUT is asserted low. This enables the tone diagnostics to be performed, apart from the normal tone detection function.
2
C interface (ENT bit) or by a
2
C bus by writing to the system
2
C compatibility, and
2
C, then the EXTM terminal activates the
2
C bit is set HIGH and ENT is set LOW.
Linear Regulator
The output linear regulator will sink and source current. This feature allows full modulation capability into capacitive l oads as high as 0.75μF. In order to minimize the power dissipa tion, the output voltage of the internal step-up converter is adjusted to allow the linear regulator to work at minimum dropout.
When the device is put in the shutdown mode (EN =LOW), the PWM power block is disabled. When the regulator blocks are active (EN = HIGH and VSPEN = LOW), the output can be controlled via I (typical) by means of the VTOP and VBOT bits (voltage select) for remote controlling of non-DiSEqC LNBs.
When the regulator blocks are active (EN = HIGH and VSPEN = HIGH), the VBOT and SELVTOP pin will control the output between 13V and 14V and the VTOP and SELVTOP pin will control the output between 18V and 19V.
2
C logic to be 13V/14V or 18V/19V
Output Timing
The output voltage rise and fall times can be set by an the external capacitor on the TCAP pin. The output voltage slew rate for the rise is given by the equation:
V
270
--------
SlewRatein
Where C is the TCAP value in nF. For example, a 150nF TCAP will provide for a slew rate of 1.8V/ms and thus a rise time of 3.3ms for a 6V transition. The output fall time is faster by a factor of 3.5.
The maximum value for TCAP would be based on the maximum transition time allowed in the system application. Too small a value of the TCAP can cause high peak currents in the boost circuit. For example, a 10V/ms slew on a 80µF VSW capacitor with an inductor of 15µH can cause a peak inductor current of approximately 2.3A.
ms
--------- -
=
C
(EQ. 1)
Current Limiting
Dynamic current limiting block has four thresholds that can be selected by the ISEL H and ISEL L bits of the SR. Refer to Table 8 and Table 9 for threshold selection using these bits. The DCL bit has to be set to low for this mode of operation. In this mode the overcurrent protection circuit works dynamically: 23 output is shutdown for a time t Simultaneously, the OLF bit of the system register is set to HIGH. After this time has elapsed, the output is resumed for a time t current limited to 990mA. At the end of t per that set by ISELL and ISELH bits is still detected, the protection circuit will again cycle through t the end of a full t operation is resumed and the OLF bit is reset to LOW. Typical t internal timer. This dynamic operation greatly reduces the power dissipation in a short circuit condition, while still ensuring excellent power-on start-up in most conditions.
= 20ms. During tON, the device output will be
ON
+ t
ON
OFF
μs after an overload is detected, the
, typically 900ms.
OFF
, if the overload
ON
and tON. At
in which no overload is detected, normal
ON
time is 920ms as determined by an
OFF
9
FN9191.1
April 10, 2007
Page 10
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However, there could be some cases in which a highly capacitive load on the output may cause a difficult start-up when the dynamic protection is selected. This can be solved by initiating any power start-up in static mode (DCL = HIGH) and then switching to the dynamic mode (DCL = LOW) after a predetermined interval. When in static mode, the OLF bit goes HIGH when the current clamp limit is reached and returns LOW when the overload condition is cleared. The OLF/BCF bit will be LOW at the end of initial power-on soft­start. In the static mode the output current through the linears is limited to a 990mA typical.
When a 19.3V line is connected onto a VOUT1 or 2 that has been set to 13.3V the linear will then enter a back current limited state. When a back current of greater than 125mA typical is sensed at the lower FET of the linear for a period greater that 100µs, the output is disabled for a period of 5ms and the BCF bit is set. If the 19.3V remains connected, the output will cycle through the ON = 100µs/OFF = 5ms. The output will recover when the fault is removed.
Thermal Protection
This IC is protected against overheating. When the junction temperature exceeds 150°C (typical), the step-up converter and the linear regulator are shut off and the OTF bit of the SR is set HIGH. When the junction is cooled down to +130°C (typical), normal operation is resumed and the OTF bit is reset LOW.
I2C Bus Interface for ISL6423
(Refer to Philips I2C Specification, Rev. 2.1) Data transmission from main microprocessor to the ISL6423
and vice versa takes place through the two wire I interface, consisting of the two lines SDA and SCL. Both SDA and SCL are bidirectional lines, connected to a positive supply voltage via a pull up resistor. (Pull-up resistors to positive supply voltage must be externally connected). When the bus is free, both lines are HIGH. The output stages of ISL6423 will have an open drain/open collector in order to perform the wired-AND function. Data on the I transferred up to 100kbps in the standard-mode or up to 400kbps in the fast-mode. The level of logic “0” and logic “1” is dependent of associated value of V
as per electrical
DD
specification table. One clock pulse is generated for each data bit transferred.
Data Validity
The data on the SDA line must be stable during the HIGH period of the clock. The HIGH or LOW state of the data line can only change when the clock signal on the SCL line is LOW. Refer to Figure 4.
SDA
2
C bus
2
C bus can be
In over temperature conditions, the OTF flag goes HIGH and
2
the I
C data will be cleared. The user may need to monitor
2
the I
C enable bits and OTF flag continuously and enable
the chip, if I
2
C data is cleared. OTF conditions may also make the OLF flags go HIGH, when high capacitive loads are present or self-heating conditions occur at higher loads.
External Output Voltage Selection
When the I2C bit VSPEN is set high the output voltage can be selected by the I the pin SELVTOP for independent 13V thru 19V output voltage selection, when the VSPEN bit is set low. A summary of the voltage control is given in the Table 1. For further details refer to the individual registers SR1 and SR3
VSPEN VTOP VBOT SELVTOP VOUT (V)
0 x 0 0 13.3 0 x 1 0 14.3 0 0 x 1 18.3 0 1 x 1 19.3 100x13.3 101x14.3 110x18.3 111x19.3
2
C bus. Additionally, the package offers
TABLE 1.
SCL
DATA LINE
STABLE
DATA VALID
FIGURE 4. DATA VALIDITY
CHANGE OF DATA
ALLOWED
START and STOP Conditions
As shown in Figure 5, START condition is a HIGH to LOW transition of the SDA line while SCL is HIGH.
The STOP condition is a LOW to HIGH transition on the SDA line while SCL is HIGH. A STOP condition must be sent before each START condition.
SDA
SCL
SP
START
CONDITION
FIGURE 5. START AND STOP WAVEFORMS
STOP
CONDITION
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Byte Format
Every byte put on the SDA line must be eight bits long. The number of bytes that can be transmitted per transfer is unrestricted. Each byte has to be followed by an acknowledge bit. Data is transferred with the most significant bit first (MSB).
Acknowledge
The master (microprocessor) puts a resistive HIGH level on the SDA line during the acknowledge clock pulse (Figure 6). The peripheral that acknowledges has to pull-down (LOW) the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during this clock pulse. (Of course, set-up and hold times must also be taken into account.)
The peripheral which has been addressed has to generate an acknowledge after the reception of each byte, otherwise the SDA line remains at the HIGH level during the ninth clock pulse time. In this case, the master transmitter can generate the STOP information in order to abort the transfer. The ISL6423 will not generate the acknowledge if the POWER OK signal from the UVLO is LOW.
SCL
8
9
ACKNOWLEDGE
FROM SLAVE
SDA
START
1
MSB
FIGURE 6. ACKNOWLEDGE ON THE I2C BUS
2
Transmission Without Acknowledge
Avoiding detection of the acknowledgement, the microprocessor can use a simpler transmission; it waits one clock without checking the slave acknowledging, and sends the new data.
This approach, though, is less protected from error and decreases the noise immunity.
ISL6423 Software Description
Interface Protocol
The interface protocol is comprised of the following, as shown below in Table 2:
• A start condition (S)
• A chip address byte (MSB on left; the LSB bit determines read (1) or write (0) transmission) (the assigned I address for the ISL6423 is 0001 0XXX)
• A sequence of data (1 byte + Acknowledge)
• A stop condition (P)
TABLE 2. INTERFACE PROTOCOL
S00010A1A0R/WACKData (8 bits)ACKP
System Register Format
• R, W = Read and Write bit
• R = Read-only bit
All bits reset to 0 at Power-On
TABLE 3. STATUS REGISTER (SR1)
R, WR, WR, WRRRRR
SR1H SR1M SR1L OTF CABF OUVF OLF BCF
TABLE 4. TONE REGISTER (SR2)
R, W R, W R, W R, W R, W R, W R, W R, W
SR2H SR2M SR2L ENT MSEL TTH X X
TABLE 5. COMMAND REGISTER (SR3)
R, W R, W R, W R, W R, W R, W R, W R, W
SR3H SR3M SR3L DCL VSPEN X ISELH ISELL
TABLE 6. CONTROL REGISTER (SR4)
R, W R, W R, W R, W R, W R, W R, W R, W
SR4H SR4M SR4L EN VTOP VBOT
Transmitted Data (I
When the R/W bit in the chip is set to 0, the main microprocessor can write on the system registers (SR2 thru SR4) of the ISL6423 via I microprocessor as shown below. The spare bits of registers can be used for other functions.
2
C bus WRITE mode)
2
C bus. These will be written by the
2
C slave
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TABLE 7. STATUS REGISTER SR1 CONFIGURATION
SR1H SR1M SR1L OTF CABF OUVF OLF BCF FUNCTION
0 0 0 X X X X X SR1 is selected 000XXX0XIout ≤ set limit, normal operation 0 0 0 X X X 1 X Iout > static/dynamic limiting mode/power blocks disabled 000XXXX0Iobck ≤ set limit, normal operation 0 0 0 X X X X 1 Iobck > dynamic limiting mode/power blocks disabled 0 0 0 X X 0 X X Vin/Vout within specified range 0 0 0 X X 1 X X Vin/Vout is not within specified range 0 0 0 X 0 X X X Cable is connected, Io is > 20mA 0 0 0 X 1 X X X Cable is open, Io < 2mA 0000XXXXT 0001XXXXT
TABLE 8. TONE REGISTER SR2 CONFIGURATION
SR2H SR2M SR2L ENT MSEL TTH X X FUNCTION
0 0 1 X X X X X SR2 is selected 0 0 1 0 0 X X X Int Tone = 22kHz, modulated by EXTM, T 0 0 1 0 1 X X X Ext 22k modulated input, T 0 0 1 1 0 X X X Int Tone = 22kHz, modulated by ENT bit, Tr, Tf = 10µs typical 0 0 1 X X 0 X X TXT = 0; Decoder Rx threshold is set at 200mV maximum 0 0 1 X X 1 X X TXT = 0; Decoder Tx threshold is set at 400mV mininum
NOTE: X indicates “Read Only” and is a “Don’t Care” for the Write mode.
≤ +130°C, normal operation
J
> +150°C, power blocks disabled
J
, Tf = 10µs typical
r
, Tf = 10µs typical
r
TABLE 9. COMMAND REGISTER SR3 CONFIGURATION
SR3H SR3M SR3L DCL VSPEN X ISELH ISELL FUNCTION
0 1 0 X X X X X SR3 is selected 0 1 0 0 X X 0 0 Iout1 = 275mA maximum 0 1 0 0 X X 0 1 Iout1 = 515mA maximum 0 1 0 0 X X 1 0 Iout1 = 635mA maximum 0 1 0 0 X X 1 1 Iout1 = 800mA maximum 0 1 0 1 X X X X Dynamic current limit NOT selected 0 1 0 0 X X X Dynamic current limit selected 0 1 0 X 0 X X X SELVTOP H/W pin enabled 0 1 0 X 1 X X X SELVTOP H/W pin disabled
NOTE: X indicates “Read Only” and is a “Don’t Care” for the Write mode.
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TABLE 10. CONTROL REGISTER SR4 CONFIGURATION
SR4H SR4M SR4L EN X X VTOP VBOT FUNCTION
0111XX00SR4 is selected 0 1 1 1 X X 0 0 VSPEN = SELVTOP = 0, Vout1 = 13V, Vboost1 = 13V + Vdrop 0 1 1 1 X X 0 1 VSPEN = SELVTOP = 0, Vout1 = 14V, Vboost1 = 14V + Vdrop 0 1 1 1 X X 1 0 VSPEN = SELVTOP = 0, Vout1 = 13V, Vboost1 = 13V + Vdrop 0 1 1 1 X X 1 1 VSPEN = SELVTOP = 0, Vout1 = 14V, Vboost1 = 14V + Vdrop 0 1 1 1 X X 0 0 VSPEN = 0, SELVTOP = 1, Vout1 = 18V, Vboost1 = 18V + Vdrop 0 1 1 1 X X 0 1 VSPEN = 0, SELVTOP = 1, Vout1 = 18V, Vboost1 = 18V + Vdrop 0 1 1 1 X X 1 0 VSPEN = 0, SELVTOP = 1, Vout1 = 19V, Vboost1 = 19V + Vdrop 0 1 1 1 X X 1 1 VSPEN = 0, SELVTOP = 1, Vout1 = 19V, Vboost1 = 19V + Vdrop 0 1 1 1 X X 0 0 VSPEN = 1, SELVTOP = X Vout1 = 13V, Vboost1 = 13V + Vdrop 0 1 1 1 X X 0 1 VSPEN = 1, SELVTOP = X Vout1 = 14V, Vboost1 = 14V + Vdrop 0 1 1 1 X X 1 0 VSPEN = 1, SELVTOP = X Vout1 = 18V, Vboost1 = 18V + Vdrop 0 1 1 1 X X 1 1 VSPEN = 1, SELVTOP = X Vout1 = 19V, Vboost1 = 19V + Vdrop 0 1 1 0 X X X X PWM and Linear for channel 1 disabled
NOTE: X indicates “Read Only” and is a “Don’t Care” for the Write mode.
Received Data (I
2
C bus READ MODE)
The ISL6423 can provide to the master a copy of the system register information via the I
2
C bus in read mode. The read mode is Master activated by sending the chip address with R/W bit set to 1. At the following Master generated clock bits, the ISL6423 issues a byte on the SDA data bus line (MSB transmitted first).
At the ninth clock bit the MCU master can:
• Acknowledge the reception, starting in this way the
transmission of another byte from the ISL6423.
• Not acknowledge, stopping the read mode
communication.
The read only bits of the register SR1 convey diagnostic information about the ISL6423, as indicated in the Table 7.
Power–On I2C Interface Reset
The I2C interface built into the ISL6423 is automatically reset at power-on. The I logic signal from the UVLO circuit. This signal will go HIGH when chip power is OK. As long as this signal is LOW, the interface will not respond to any I system register SR1 thru SR4 are all initialized to zero, thus keeping the power blocks disabled. Once the VCC rises above UVLO, the POWER OK signal to the I high, and the I can be configured by the main microprocessor. About 400mV of hysteresis is provided in the UVLO threshold to avoid false triggering of the power-on reset circuit. (I comes up with EN = 0; EN goes HIGH at the same time as (or later than) all other I valid).
2
C interface block will receive a power OK
2
C commands and the
2
2
C interface becomes operative and the SR’s
2
C data for that PWM becomes
C is asserted
2
C
ADDR0 and ADDR1 Pins
Connecting these pin to GND the chip I2C interface address is 0001000, but, it is possible to choose between four different addresses by setting these pins to the logic levels indicated in Table 11.
TABLE 11. ADDRESS PIN CHARACTERISTICS
V
ADDR
-1 “0001000” 0 0
V
ADDR
-2 “0001001” 0 1
V
ADDR
V
-3 “0001010” 1 0
ADDR
-4 “0001011” 1 1
V
ADDR
ADDR1 ADDR0
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I2C Bit Description I2C Electrical Characteristics
BIT NAME DESCRIPTION
EN ENable Output for channels 1 and 2 VTOP Voltage TOP Select i.e., 18V/19V for channels 1 and 2 VBOT Voltage BOTtom Select i.e., 13V/14V for channels 1
and 2 ENT ENable Tone MSEL Modulation SELect DCL Dynamic Current Limit select VSPEN Voltage Select Pin ENable ISELH and
ISELL OTF Over Temperature Fault bit CABF CABle Fault or open status bit. OUVF Over and Under Voltage Fault status bit OLF Over Load Fault status bit BCF Backward Current Fault bit TTH Tone THreshold is the OR of the signal pin TXT
Current limit “I” SELect High and Low bit
PARAMETER
Input Logic High, VIH
Input Logic Low, VIL
Input Logic Current, IIL
Input Logic Current IOL
Input Hysteresis
SCL Clock Frequency
Input Filter Spike reject
TABLE 12.
TEST
CONDITION MIN TYP MAX
SDA, SCL 2.0V
SDA, SCL 0.8V
SDA, SCL;
0.4V < V VOL = 0.4V 3mA
SDA, SCL 165mV 200mV 235mV
DD
< 3.3V
0 100kHz 400kHz
50ns
10μA
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Package Outline Drawing
www.BDTIC.com/Intersil
L24.4x4D
24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 2, 10/06
4.00
A
B
ISL6423
4X
2.5
20X
19
0.50 24
PIN #1 CORNER
(C 0 . 25)
INDEX AREA
(4X)
( 3 . 8 TYP )
( 2 . 50 )
PIN 1
0.15
TOP VIEW
4.00
0 . 90 ± 0 . 1
( 20X 0 . 5 )
712
1
0.10 M C A B
24X 0 . 23
SEE DETAIL "X"
BASE PLANE
2 . 50 ± 0 . 15
+ 0 . 07
4
- 0 . 05
C
0.10
SEATING PLANE
0.08 C
C
18
13
24X 0 . 4 ± 0 . 1
BOTTOM VIEW
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
15
( 24X 0 . 25 )
( 24X 0 . 6 )
C
0 . 2 REF
0 . 00 MIN. 0 . 05 MAX.
DETAIL "X"
5
NOTES:
Dimensions are in millimeters.1. Dimensions in ( ) for Reference Only.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
2.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
Tiebar shown (if present) is a non-functional feature.
5.
The configuration of the pin #1 identifier is optional, but must be
6. located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
FN9191.1
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ISL6423
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Thin Shrink Small Outline Exposed Pad Plastic Packages (EPTSSOP)
N
INDEX AREA
123
TOP VIEW
0.05(0.002)
-A­D
e
b
0.10(0.004) C AM BS
123
N
P
BOTTOM VIEW
E1
E
-B-
SEATING PLANE
A
-C-
A1
M
P1
0.25(0.010) BM M
GAUGE
PLANE
0.25
0.010
α
0.10(0.004)
A2
M28.173B
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A - 0.047 - 1.20 -
A1 0.002 0.006 0.05 0.15 -
L
c
A2 0.031 0.051 0.80 1.05 -
b 0.0075 0.0118 0.19 0.30 9 c 0.0035 0.0079 0.09 0.20 -
D 0.378 0.386 9.60 9.80 3
E1 0.169 0.177 4.30 4.50 4
e 0.026 BSC 0.65 BSC ­E 0.246 0.256 6.25 6.50 ­L 0.0177 0.0295 0.45 0.75 6
N28 287
α
P - 0.138 - 5.50 11
P1 -0.118-3.0 11
NOTES:
1. These package dimensions are within allowable dimensions of JEDEC MO-153-AET, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimen­sions are not necessarily exact. (Angles in degrees)
11. Dimensions “P” and “P1” are thermal and/or electrical enhanced variations. Values shown are maximum size of exposed pad within lead count and body size.
0° 8° 0° 8° -
NOTESMIN MAX MIN MAX
Rev. 0 6/05
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implic atio n or other wise u nde r any p a tent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
16
FN9191.1
April 10, 2007
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