Datasheet ISD1616BPY Specification

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Page 1

ISD1600 SERIES

SINGLE-MESSAGE

SINGLE-CHIP

6.6- TO 40-SECOND DURATION

VOICE RECORD/PLAYBACK DEVICE

Publication Release Date: November 4, 2004

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ISD1600 SERIES

1. GENERAL DESCRIPTION

Winbond’s ISD1600 Series ChipCorder® is a single-message, single chip, record/playback solution with selectable durations from 6.6 to 40 seconds. The CMOS device includes an on-chip oscillator (via external control), microphone preamplifier, automatic gain control, anti-aliasing filter, Multi-Level Storage (MLS) array, smoothing filter, PWM Class D speaker amplifier for standard 8Ω speaker or buzzer, plus an extra current output. Recording is stored into the embedded Flash memory cells, providing zero-power message storage. This unique single-chip solution ultilizes Winbond’s patented MLS technology. Therefore, voice or audio data are stored directly into the memory in their natural form without any compressions alike digital approach, providing high-quality, solid-state audio reproduction. The device enters into standby mode automatically once an operation is completed for power saving purposes.

Moreover, a minimum record/playback subsystem can be configured with a microphone, a speaker or buzzer, several passive components, two push buttons, and a power source.

2. FEATURES

• User-friendly single-chip, single-message voice record/playback solution

• Wide operating voltage range: 2.4V to 5.5V

• Push-button interface

o Playback is either edge- or level-triggered o Record is level-triggered

• Variable duration selected by external oscillator resistor

Sample Rate 12 KHz 8 KHz 6.4 KHz 5.3 KHz 4 HKz Rosc

ISD1610 6.6 secs 10 secs 12.5 secs 15 secs 20 secs ISD1612 8 secs 12 secs 15 secs 18 secs 24 secs ISD1616 10.6 secs 16 secs 20 secs 24 secs 32 secs ISD1620 13.3 secs 20 secs 25 secs 30 secs 40 secs

• Automatic power-down mode

o Enters standby mode immediately after a record or playback cycle o 1µA standby current (maximum) at room temperature

• PWM Class D speaker amplifier and AUD output driver simultaneously

o Direct drive an 8 speaker or typical buzzer o AUD current output to drive external power transistor

• High-quality, natural voice/audio reproduction

• Zero-power message storage

o Eliminates battery backup circuits

• 100-year message retention (typical)

• 10,000 record cycles (typical)

• On-chip oscillator

• Available in die, 16L 150mil SOIC and 16L 300mil PDIP

• Temperature options:

o Commercial: 0°C to +50°C (Die); 0°C to +70°C (Packaged) o Industrial: -40°C to +85°C (Packaged)

60 kΩ 80 kΩ 100 kΩ 120 kΩ 160 kΩ

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3. BLOCK DIAGRAM

ISD1600 SERIES

OSC

MIC+

MIC-

AGC

AGC Amp

Power Conditioning

CCAVSSA

Internal

Clock

Antialiasing Filter

Auto mati c

Gain Control

(AGC)

SSD

SSAD

Acti ve

CCD

Timing

Sampling Clock

Analog Transceivers

Multilevel Storage

Decoders

Nonvolatile

Arra y

Device Control

PLAYEREC

Acti ve

Smoothing Filter

LEDPLAYL

Amp

AUD

SP+

SP-

Publication Release Date: November 4, 2004

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ISD1600 SERIES

4. TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 2

2. FEATURES ......................................................................................................................................... 2

3. BLOCK DIAGRAM .............................................................................................................................. 3

4. TABLE OF CONTENTS ...................................................................................................................... 4

5. PIN CONFIGURATION ....................................................................................................................... 5

6. PIN DESCRIPTION............................................................................................................................. 6

7. FUNCTIONAL DESCRIPTION............................................................................................................ 8

7.1. Detailed Description.................................................................................................................. 8

8. TIMING DIAGRAMS.......................................................................................................................... 10

9. ABSOLUTE MAXIMUM RATINGS

[1]

................................................................................................ 12

9.1 Operating Conditions ............................................................................................................... 13

10. ELECTRICAL CHARACTERISTICS ............................................................................................... 14

10.1. DC Parameters...................................................................................................................... 14

10.2. AC Parameters...................................................................................................................... 15

11. TYPICAL APPLICATION CIRCUIT.................................................................................................16

12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 17

12.1. 16-Lead 150mil Small Outline IC (SOIC) Package.......................................................... 17

12.2. 16-Lead 300mil Plastic Dual Inline Package (PDIP) ....................................................... 18

12.3. Die Physical Layout .............................................................................................................. 19

13. ORDERING INFORMATION........................................................................................................... 20

14. VERSION HISTORY ....................................................................................................................... 21

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5. PIN CONFIGURATION

ISD1600 SERIES

SSD

REC

PLAYE

PLAYL

SSA

MIC+

MIC-

SP-

I1600

LED

CCD

OSC

AUD

AGC

Sp+

CCA

SSAD

SOIC / PDIP

Publication Release Date: November 4, 2004

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6. PIN DESCRIPTION

ISD1600 SERIES

SOIC / PDIP PIN NAME

PIN NO.

, V

SSD

SSAD

REC

PLAYE

PLAYL

SSA

[1]

1, 5, 9

MIC+ 6

FUNCTIONS

Ground: V

is the ground for digital circuits. V

SSD

ground for analog circuits, whereas V

is the ground for

SSAD

is the

SSA

PWM speaker driver. They should be separate ground paths connecting to ground of power supply to minimize noises.

Record: The device starts recording whenever REC transits from HIGH to LOW and stays at LOW. Recording stops when the signal returns to HIGH. This pin has an internal pull-up device

[2]

Edge-trigger Playback: A playback operation starts when this input detects a LOW going signal exceeding the specified debounced time. This pin has an internal pull-up

[2]

device

Level-trigger Playback: A playback operation begins when this input detects a LOW going signal and remains at LOW. Playback stops when the signal returns to HIGH. This pin has an internal pull-up device

[2]

Microphone Positive Input: The input transfers the signals to the preamplifier. The internal Automatic Gain Control (AGC) circuit controls the gain of the preamplifier. An external microphone should be AC coupled to this pin via a series capacitor. The capacitor value, together with an internal 10 K resistance on this pin, determines the lowfrequency cutoff for the ISD1600 passband.

MIC- 7

SP- 8

, V

CCA

10, 15

CCD

SP+ 11

Microphone Negative Input: This is the inverting input to the microphone preamplifier. It provides input noisecancellation, or common-mode rejection, when the microphone is connected differentially to the device.

Speaker Negative : The SP-, Class D PWM output, provide a differential output with SP+ pin to drive 8 speaker or buzzer. During power down or recording, this pin is tristated.

Supply Voltages: Internal analog and digital circuits use separate power busses to minimize noises inside the chip. These power busses are brought out to separate pads and should be tied together as close to the power supply as possible. It is important that the power supplies are decoupled as close as possible to the device.

Speaker Positive : The SP+, Class D PWM output, provide a differential output with SP- pin to drive an 8 speaker or buzzer directly. During power down or recording, this pin is tri-stated.

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ISD1600 SERIES

Note:

SOIC / PDIP PIN NAME

FUNCTIONS

PIN NO.

AGC 12

Automatic Gain Control: The AGC dynamically adjusts the gain of the preamplifier to compensate the wide range of microphone input levels. The AGC allows the full range of signal to be recorded with minimal distortion. Nominal values of 4.7 µF give satisfactory results in most cases.

Connecting this pin to ground provides maximum gain to the preamplifier circuitry. Conversely, connecting this pin to power supply provides minimum gain to the preamplifier circuitry.

AUD 13

AUD: The AUD provides a single-ended current output to drive an external amplifier. During standby or recording, this pin is tri-stated.

OSC

Oscillator Resistor: This enables the user to vary the record and/or playback duration of the device. A resistor connected between the R

pin and VSS determines the

OSC

sample frequency for the ISD1600 device. Please refer to the Duration Section in Section 7.1.

16 : This output is LOW during a record cycle and blinks

LED

during playback cycle. It can be used to drive an LED to indicate either a record or playback cycle is in progress.

[1]

The REC and Play signal are internally debounced on the falling edge to prevent a false re-triggering

from a push-button switch.

[2]

The internal pull-up resistors are 600kΩ (typical).

Publication Release Date: November 4, 2004

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ISD1600 SERIES

7. FUNCTIONAL DESCRIPTION

7.1. DETAILED DESCRIPTION

Audio Quality

Winbond’s patented ChipCorder solution on a single chip. The input audio signals are stored directly into the non-volatile memory and are reproduced in its natural form without any compression artifacts caused by the digital speech solutions. A complete sample is stored in a single cell, minimizing the memory needed to store a single message.

Duration

The ISD1600 series offer single-chip solution with record/playback duration from 6.6 seconds to 40 seconds. Sampling rate and duration are determined by an external resistor connected to the Rosc pin.

Sample Rate

12 KHz 8 KHz

6.4 KHz

5.3 KHz

4 KHz

Rosc

60 kΩ

80 kΩ

100 kΩ

120 kΩ

160 kΩ

MLS technology provides natural high quality record and playback

ISD1610 ISD1612 ISD1616 ISD1620

6.6 secs 8 secs 10.6 secs 13.3 secs

10 secs 12 secs 16 secs 20 secs

12.5 secs 15 secs 20 secs 25 secs

15 secs 18 secs 24 secs 30 secs

20 secs 24 secs 32 secs 40 secs

Flash Storage

The ISD1600 product utilizes the on-chip Flash memory providing zero-power message storage. The message is retained for up to 100 years without power. In addition, the device can be re-recorded typically over 10,000 times.

Basic Operation

The ISD1600 ChipCorder

device is controlled by either the REC pin, or one of the two playback modes, PLAYE and PLAYL. The ISD1600 parts are configured for design simplicity in a singlemessage application. Device operation is explained in Section 7.2.

Automatic Power-Down Mode

At the end of a playback or record cycle, the

ISD1600 device automatically enters into a low-power

standby mode, consuming typically 0.5µA, provided that PLAY and REC pins are HIGH (see DC parameters, Section 10). During a playback cycle, the device powers down automatically at the end of the message. During a record cycle, the device powers down immediately after REC is released to HIGH.

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ISD1600 SERIES

7.2. Functional Description Example

The following example operating sequences demonstrate the functionality of the ISD1600 series.

1. Record a message

The device starts recording from the beginning of the memory when REC transits from HIGH to LOW and stays at LOW. A record cycle is completed when REC is pulled to HIGH or entire memory is filled up. Then an End-of-Message (EOM) marker is written at the end of message, enabling a subsequent playback cycle to terminate appropriately. Hence, the device automatically enters into standby mode.

REC takes precedence over any playback operations. If REC is pulled LOW during a playback cycle, the playback immediately halts and recording starts from the beginning of the memory.

The REC pin has an internal pull-up device standby current consumption.

2. Edge-trigger playback

A playback operation starts from the beginning of the memory when PLAYE detects a LOW going signal exceeding the specified debounced time. Playback continues until an EOM marker is encountered. Upon completion of a playback cycle, the device automatically powers down and enters into standby mode.

During playback, a subsequent LOW going signal will terminate the current playback operation.

This pin has an internal pull-up device standby current consumption.

3. Level- trigger playback

When PLAYL switches from HIGH to LOW and stays at LOW, a playback starts from the beginning of the memory until either an EOM marker is reached, then it automatically powers down.

If PLAYL is pulled HIGH any time during playback, the playback operation stops immediately and the device enters into the power-down mode.

4. LED operation

The output pin provides an active-LOW signal during recording, which is used to turn on an LED

LED as a “record-in-progress” indicator. However, during playback, the LED blinks a few times per second to indicate a “playback-in-progress” operation. It returns to a HIGH state when operation stops.

5. R

operation

OSC

The duration of the device can be varied by changing the value of R the flexibility to choose different sampling frequency, up to 12 KHz, depending upon the needs.

This feature allows frequency shifting where a recorded audio can be played back faster or slower than normal for special sound effects.

Another feature is a “Pause” function that can be activated by taking the R playback momentarily, and to resume when the resistor is switched back to ground.

[2]

. Holding this pin LOW after recording cycle will increase

[2]

. Holding this pin LOW after playback operation will increase

. This means the designer has

OSC

resistor to V

OSC

to stop

Publication Release Date: November 4, 2004

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8. TIMING DIAGRAMS

ISD1600 SERIES

Rec

LED

Mic+

Mic-

TRS

TDb1

FIGURE 1: RECORD OPERATION

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ISD1600 SERIES

PlayE

PlayL

LED

Sp+

Odd # pulses starts playback

TDb2

TDb1

Tcyc

TRU

Even # pulses stops playback

TDb1

TPS1 or TPS2

Sp-

TPS1 or TPS2

Aud

TRU

Ramps up gradually to analog ground

to eliminate the "pop" at the beginning

Slowly returns to analog ground to eliminate the "pop" at the end

FIGURE 2: PLAYBACK OPERATION

Publication Release Date: November 4, 2004

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9. ABSOLUTE MAXIMUM RATINGS

ABSOLUTE MAXIMUM RATINGS (DIE)

CONDITIONS VALUES

Junction temperature 150°C

Storage temperature range -65°C to +150°C

Voltage applied to any pins (VSS –0.3V) to (VDD +0.3V)

Power supply voltage to ground potential -0.3V to +7.0V

ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS)

CONDITIONS VALUES

Junction temperature 150°C

Storage temperature range -65°C to +150°C

Voltage applied to any pins (VSS –0.3V) to (VDD +0.3V)

Lead temperature (Soldering – 10 sec) 300°C

ISD1600 SERIES

[1]

Power supply voltage to ground potential -0.3V to +7.0V

[1]

Stresses above those listed may cause permanent damage to the device. Exposure to the

absolute maximum ratings may affect device reliability and performance. Functional operation is not implied at these conditions.

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ISD1600 SERIES

9.1 OPERATING CONDITIONS

OPERATING CONDITIONS (DIE)

CONDITIONS VALUES

Operating temperature range 0°C to +50°C

Supply voltage (VDD)

Ground voltage (VSS)

Input voltage (VDD)

Voltage applied to any pins (VSS –0.3V) to (VDD +0.3V)

Operating temperature range (Case temperature) -40°C to +85°C

Supply voltage (VDD)

Ground voltage (VSS)

Input voltage (VDD)

[1]

+2.4V to +5.5V

[2]

[1]

0V to 5.5V

OPERATING CONDITIONS (PACKAGED PARTS)

CONDITIONS VALUES

[1]

+2.4V to +5.5V

[2]

[1]

0V to 5.5V

Voltage applied to any pins (VSS –0.3V) to (VDD +0.3V)

[1]

VDD = V

[2]

VSS = V

CCA

SSA

= V

CCD

SSD

= V

SSAD

Publication Release Date: November 4, 2004

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10. ELECTRICAL CHARACTERISTICS

10.1. DC PARAMETERS

ISD1600 SERIES

PARAMETER SYMBOL MIN TYP

[1]

MAX UNITS CONDITIONS

Supply Voltage VDD 2.4 5.5 V

Input Low Voltage VIL V

-0.3 0.3xVDD V

Input High Voltage VIH 0.7xVDD VDD V

Output Low Voltage VOL V

Output High Voltage VOH 0.7xVDD VDD V I

Record Current I

Playback Current I

DD_Record

DD_Playback

20 mA

Standby Current ISB 0.5 1 µA

Input Leakage Current I

Input Current HIGH I

Preamp Input Resistance R

ILPD1

-3 -10 µA Force V

ILPD2

MIC+,RMIC-

20 K Across both pins

-0.3 0.3xVDD V I

±1

µA Force V

= 4.0 mA

= -1.6 mA

= 5.5V, No load,

Sampling freq = 12 kHz

= 5.5V, T=25°C

[5]

MIC Input Voltage VIN 15 300 mV Peak-to-Peak

Gain from MIC to SP+/- A

6 40 dB VIN = 15 to 300mV,

MSP

AGC = 4.7µF, V

= 2.4V to 5.5V

Output Load Impedance R

Speaker Output Power Pout

Speaker Output Voltage Vout VDD V

8  Speaker Load

EXT

= 5.5V

670 mW

313 mW

117 mW

49 mW

= 4.4V

= 3V

= 2.4V

= 8 (Speaker),

EXT

70mH-160 (Buzzer)

AUD I

Total Harmonic Distortion THD 1 %

Notes:

[1]

Conditions: VCC = 4.5V, 8kHz sampling frequency and TA = 25°C, unless otherwise stated.

[2]

LED output during Record operation.

[3]

and V

CCA

[4]

REC, PLAYL, PLAYE must be at V

[5]

REC, PLAYL and PLAYE are forced to specified condition.

[6]

Balanced input signal applied between MIC and MIC REF as shown in the applications example. Single-

ended MIC or MIC REF recommended to be less than 100 mV peak to peak.

[7]

For industrial grade, the maximum limit is 10µA.

are connected together. V

CCD

-3.0 mA V

AUD

, V

CCD

SSAD

and V

SSA

are connected together.

SSD

=4.5V, R

15mV p-p 1KHz sinewave, Cmessage weighted

[2]

[3] [4] [7]

[6]

15mVp-p 1kHz freq sinewave,

= 8;

EXT

= 100

EXT

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10.2. AC PARAMETERS

ISD1600 SERIES

CHARACTERISTIC SYMBOL MIN TYP

Sampling Frequency

Duration

[3]

Dur

[2]

FS 4 12 KHz Vcc=2.4V~5.5V

I1610 I1612 I1616 I1620

6.6 8 10.6 13.3 Sec SF=12kHz

10 12 16 20 Sec SF=8kHz

[1]

MAX UNITS CONDITIONS

Vcc=2.4 V~5.5V

12.5 15 20 25 Sec SF=6.4kHz

15 18 24 30 Sec SF=5.3kHz

20 24 32 40 Sec SF=4kHz

Rising time Tr 0 100 nsec

Falling Time Tf 0 100 nsec

Debounce Time (Record & PlayL)

Db1

26.6 26.6 26.6 26.6 msec SF=12kHz

40 40 40 40 msec SF=8kHz

Vcc=2.4 V~5.5V

50 50 50 50 msec SF=6.4kHz

60.4 60.4 60.4 60.4 msec SF=5.3kHz

80 80 80 80 msec SF=4kHz

Debounce Time (PlayE)

Db2

13.3 13.3 13.3 13.3 msec SF=12kHz

20 20 20 20 msec SF=8kHz

Vcc=2.4 V~5.5V

25 25 25 25 msec SF=6.4kHz

30.2 30.2 30.2 30.2 msec SF=5.3kHz

40 40 40 40 msec SF=4kHz

Signal Ramp Up Time TRU 100 msec Vcc=2.4V~5.5V

Record Stop Time TRS 2 Sample Clock Vcc=2.4V~5.5V

PlayL Stop Time T

PlayE Stop Time T

LED Cycle frequency T

PS1

2 X T

PS2

1 6 Hz Playback at any SF

Cyc

msec Vcc=2.4V~5.5V

Db1

msec Vcc=2.4V~5.5V

Db1

Notes:

[1]

Typical values : VCC = 4.5V, SF = 8 kHz and @ TA = 25°C, unless otherwise stated.

[2]

Sampling Frequency can vary as much as ±2.25 percent over the commercial temperature and voltage

ranges, and –6/+4 percent over the industrial temperature and voltage ranges.

[6]

Duration can vary as much as ±2.25 percent over the commercial temperature and voltage ranges, and –

6/+4 percent over the industrial temperature and voltage ranges.

Publication Release Date: November 4, 2004

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11. TYPICAL APPLICATION CIRCUIT

ISD1600 SERIES

PLAYL

PLAYE

RECORD

CCD

LED

CCA

0.1 F

C9 *

10 F

0.1 F

4.7 F

C8 *

10 F

Speaker or

Buzzer

4.7 K

0.1 F

1 K

Ω

8050

R5 390

Ω

4.7 F

Ω

4.7 K

ELECTRET

MICROPHONE

Ω

OSC

Ω

80 K

I1800

1600

PLAYL

PLAYE

1 K

Ω

SSAD

SSD

SSA

REC

LED

SSAD

AUD

SP+

SP-

MIC+

MIC -

AGC

CCD

CCA

SSD

SSA

0.1 F

Speaker

Ω

Schematic shows both speaker and AUD outputs

* C8 and C9 may be needed in order to optimize for the best voice quality, which is also depended upon the layout of the PCB. Please refer to ChipCorder Applications section or consult Winbond for layout advice.

The above example represents a typical implementation of ISD1600 in most applications.

In addition, it is important to have a separate path for each ground (V

SSD

, V

SSA

& V

) back to the

SSAD

ground terminal of power source to minimize the noises. Please refer to the ChipCorder Applications section in our website.

Good Audio Design Practices

Winbond products are very high-quality single-chip voice recording and playback systems. To ensure the highest quality voice reproduction, it is important that good audio design practices on layout and power supply decoupling be followed. See Application Information or below links for details.

Good Audio Design Practices

http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf

Single-Chip Board Layout Diagrams

http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf

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12. PACKAGE DRAWING AND DIMENSIONS

12.1. 16-LEAD 150MIL SMALL OUTLINE IC (SOIC) PACKAGE

ISD1600 SERIES

Publication Release Date: November 4, 2004

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Page 18

12.2. 16-Lead 300mil Plastic Dual Inline Package (PDIP)

ISD1600 SERIES

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ISD1600 SERIES

12.3. DIE PHYSICAL LAYOUT

ISD1610 / 1612 / 1616 / 1620

REC

PLAYE

PLAYL

SSA

MIC+

MIC-

SP-

Notes:

[1]

The backside of die is internally connected to VSS. It MUST NOT be connected to any other potential or damage may occur.

SSAD

SSD

CCA

LED

CCA

SP+

CCD

OSC

AUD

AGC

Publication Release Date: November 4, 2004

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ISD1600 SERIES

13. ORDERING INFORMATION

Product Number Descriptor Key

When ordering, please refer to the following part numbers that are supported in volume for this product series. Consult the local Winbond Sales Representative or Distributor for availability information.

I1600 Series

Duration:

I1610 : 6.6 – 20 secs

I1612 : 8 – 24 secs

I1616 : 10.6 – 30 secs

I1620 : 13.3 – 40 secs

I16xxxx

Temperature:

I = Industrial (-40°C to +85°C) Blank = Commerical

• Die (0°C to +50°C)

• Package (0°C to +70°C)

Package Type:

X = Die

S = Small Outline Integrated Circuit

(SOIC) Package

P = Plastic Dual Inline Package (PDIP)

Die / Package Ordering Part Number

Die I1610X I1612X I1616X I1620X

I1610P I1612P I1616P I1620P PDIP

I1610PI I1612PI I1616PI I1620PI

I1610S I1612S I1616S I1620S SOIC

I1610SI I1612SI I1616SI I1620SI

For the latest product information, access Winbond’s worldwide website at

http://www.winbond-usa.com

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ISD1600 SERIES

14. VERSION HISTORY

VERSION DATE DESCRIPTION

0.1 July 2004

1 Nov. 2004

Initial draft

Revise Ground description Revise application diagram Revise die information

Publication Release Date: November 4, 2004

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ISD1600 SERIES

The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no representation or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice. No license, whether express or implied, to any intellectual property or other right o Winbond or others is granted by this publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability whatsoever and disclaims any express or implied warranty o merchantability, fitness for a particular purpose or infringement of any Intellectual property.

Winbond products are not designed, intended, authorized or warranted for use as components in systems o equipments intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for othe applications intended to support or sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental injury could occur.

pplication examples and alternative uses of any integrated circuit contained in this publication are for illustration only and Winbond makes no representation or warranty that such applications shall be suitable for the use specified.

The 100-year retention and 10K record cycle projections are based upon accelerated reliability tests, as published in the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporates SuperFlash

Information contained in this Winbond ChipCorder products published by ISD® prior to August, 1998.

This datasheet and any future addendum to this data sheet is(are) the complete and controlling ISD product specifications. In the event any inconsistencies exist between the information in this and other product documentation, or in the event that other product documentation contains information in addition to the information in this, the information contained herein supersedes and governs such other information in its entirety.

ll other trademarks are properties of their respective owners.

technology.

datasheet supersedes all data for the ISD® ChipCorder

ChipCorder

is the trademark of Silicon Storage Technology, Inc.

and ChipCorder® are registered

Headquarters Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd.

No. 4, Creation Rd. III 2727 North First Street, San Jose, 27F, 299 Yan An W. Rd. Shanghai, Science-Based Industrial Park, CA 95134, U.S.A. 200336 China Hsinchu, Taiwan TEL: 1-408-9436666 TEL: 86-21-62365999 TEL: 886-3-5770066 FAX: 1-408-5441797 FAX: 86-21-62356998 FAX: 886-3-5665577 http://www.winbond-usa.com/ http://www.winbond.com.tw/

Taipei Office Winbond Electronics Corporation Japan Winbond Electronics (H.K.) Ltd.

9F, No. 480, Pueiguang Rd. 7F Daini-ueno BLDG. 3-7-18 Unit 9-15, 22F, Millennium City, Neihu District Shinyokohama Kohokuku, No. 378 Kwun Tong Rd., Taipei, 114 Taiwan Yokohama, 222-0033 Kowloon, Hong Kong TEL: 886-2-81777168 TEL: 81-45-4781881 TEL: 852-27513100 FAX: 886-2-87153579 FAX: 81-45-4781800 FAX: 852-27552064

Please note that all data and specifications are subject to change without notice. All the trademarks of products and companies mentioned in this datasheet belong to their respective owners.

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