Datasheet IS62V6416BLL-12TI, IS62V6416BLL-12T, IS62V6416BLL-12KI, IS62V6416BLL-12K, IS62V6416BLL-12BI Datasheet (ISSI)

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Integrated Silicon Solution, Inc. — 1-800-379-4774
1
Rev. A
03/17/00
ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2000, Integrated Silicon Solution, Inc.
IS62V6416BLL ISSI
®
• Access time: 100 and 120 ns
• CMOS low power operation
• TTL compatible interface levels
• Single 2.7V-3.3V power supply
• Fully static operation: no clock or refresh required
• Three state outputs
• Data control for upper and lower bytes
• Industrial temperature available
• Available in Jedec Std 44-pin SOJ package, 44-pin TSOP (Type II), and 48-pin mini BGA
64K x 16 LOW VOLTAGE, ULTRA LOW POWER CMOS STATIC RAM
DESCRIPTION
The ISSI IS62V6416BLL is an ultra-low power, 1,048,576-bit static RAM organized as 65,536 words by 16 bits. It is fabricated using ISSI's high-performance CMOS technology. This highly reliable process coupled with innovative circuit design techniques yields access times as fast as 100 ns with low power consumption.
When CS is HIGH (deselected) or when CS is LOW and both LB and UB are HIGH, the device assumes a standby mode at which the power dissipation can be reduced down with CMOS input levels.
Easy memory expansion is provided by using Chip Select and Output Enable inputs, CS and OE. The active LOW Write Enable (WE) controls both writing and reading of the memory. A data byte allows Upper Byte (UB) and Lower Byte (LB) access.
FUNCTIONAL BLOCK DIAGRAM
MARCH 2000
A0-A15
CS
OE WE
64K x 16
MEMORY ARRAY
DECODER
COLUMN I/O
CONTROL
CIRCUIT
GND
VCC
I/O
DATA
CIRCUIT
I/O0-I/O7
Lower Byte
I/O8-I/O15
Upper Byte
UB
LB
2
Integrated Silicon Solution, Inc. 1-800-379-4774
Rev. A
03/17/00
IS62V6416BLL ISSI
®
PIN DESCRIPTIONS
A0-A15 Address Inputs
I/O0-I/O15 Data Inputs/Outputs
CS Chip Enable Input OE Output Enable Input WE Write Enable Input LB Lower-byte Control (I/O0-I/O7) UB Upper-byte Control (I/O8-I/O15)
NC No Connection
Vcc Power
GND Ground
48-Pin mini BGA (Top View)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
A4 A3 A2 A1 A0
CS I/O0 I/O1 I/O2 I/O3
Vcc
GND
I/O4 I/O5 I/O6 I/O7
WE A15 A14 A13 A12
NC
A5 A6 A7 OE UB LB I/O15 I/O14 I/O13 I/O12 GND Vcc I/O11 I/O10 I/O9 I/O8 NC A8 A9 A10 A11 NC
PIN CONFIGURATIONS
44-Pin SOJ 44-Pin TSOP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A4
A3
A2
A1
A0
CS
I/O0
I/O1
I/O2
I/O3
Vcc
GND
I/O4
I/O5
I/O6
I/O7
WE
A15
A14
A13
A12
NC
A5
A6
A7
OE
UB
LB
I/O15
I/O14
I/O13
I/O12
GND
Vcc
I/O11
I/O10
I/O9
I/O8
NC
A8
A9
A10
A11
NC
1 2 3 4 5 6
A
B
C
D
E
F
G
H
LB
OE
A0
A1
A2
N/C
UB A3
A4
CS
I/O
0
A5
A6
GND
NC
A7
Vcc
Vcc
NC
NC
GND
I/O
14
I/O
15
I/O
13
I/O
12
I/O
11
I/O
10
I/O
1
I/O
3
I/O
2
I/O
5
I/O
4
I/O
6
I/O
7
I/O
9
I/O
8
A14
A15
NC
A12
A13
WE
NC
A8
A9
A10
A11 NC
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Integrated Silicon Solution, Inc. 1-800-379-4774
3
Rev. A
03/17/00
IS62V6416BLL ISSI
®
TRUTH TABLE
I/O Pin
Mode WE CS OE LB UB I/O0-I/O7 I/O8-I/O15 Vcc Current
Not Selected X H X X X High-Z High-Z ISB1, ISB2
X L X H H High-Z High-Z ISB1, ISB2
Output Disabled H L H L L High-Z High-Z ICC
Read H L L L H DOUT High-Z ICC
H L L H L High-Z DOUT HLLLL DOUT DOUT
Write L L X L H DIN High-Z ICC
L L X H L High-Z DIN LLXLL DIN DIN
AC TEST LOADS
Figure 1.
AC TEST CONDITIONS
Parameter Unit
Input Pulse Level 0 to 3V
(1)
Input Rise and Fall Times 5 ns Input and Output Timing and Reference Level 1.5V
(1)
Output Load See Figures 1 and 2
1076
30 pF
Including
jig and
scope
1262
OUTPUT
3V
1076
5 pF
Including
jig and
scope
1262
OUTPUT
3V
Figure 2.
Figure 3.
581
THEVENIN EQUIVALENT
OUTPUT 1.61V
4
Integrated Silicon Solution, Inc. 1-800-379-4774
Rev. A
03/17/00
IS62V6416BLL ISSI
®
OPERATING RANGE
Range Ambient Temperature VCC
Commercial 0°C to +70°C 2.7V (Min.) to 3.3V (Max.)
Industrial –40°C to +85°C 2.7V (Min.) to 3.3V (Max.)
DC ELECTRICAL CHARACTERISTICS (Over Operating Range Unless Otherwise Specified)
Symbol Parameter Test Conditions Min. Max. Unit
VOH Output HIGH Voltage VCC = Min., IOH = –1 mA 2.2 V
VOL Output LOW Voltage VCC = Min., IOL = 2.1 mA 0.4 V
VIH Input HIGH Voltage 2.0 VCC + 0.3 V
VIL
(1)
Input LOW Voltage –0.2 0.4 V
ILI Input Leakage GND VIN VCC –11µA
ILO Output Leakage GND VOUT VCC, Outputs Disabled –11µA
Note:
1. V
IL (min.) = –1.5V for pulse width less than 30 ns.
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol Parameter Value Unit
VTERM Terminal Voltage with Respect to GND –0.5 to Vcc +0.5 V
TSTG Storage Temperature –65 to +150 °C
PT Power Dissipation 1.5 W
IOUT DC Output Current (LOW) 20 mA
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
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Integrated Silicon Solution, Inc. 1-800-379-4774
5
Rev. A
03/17/00
IS62V6416BLL ISSI
®
POWER SUPPLY CHARACTERISTICS
(1)
(Over Operating Range Unless Otherwise Specified)
-100 -120
Symbol Parameter Test Conditions Min. Max. Min. Max. Unit
ICC Vcc Dynamic VCC = Max., Com. 35 30 mA
Operating IOUT = 0 mA, f = fMAX Ind. 45 40 Supply Current CS = VIH
ISB1 TTL Standby VCC = Max., Com. 0.3 0.3 mA
Current VIN = VIH or VIL Ind. 0.3 0.3 (TTL Inputs) CS VIH, f = 0
OR
ULB Control VCC = Max., VIN = VIH or VIL
CS = VIL, f = 0, UB = VIH, LB = VIH
ISB2 CMOS Standby VCC = Max., Com. 5 A
Current CS VCC – 0.2V Ind. 5 5 (CMOS Inputs) VIN 0.2V, f = 0
OR
ULB Control
VCC = Max., CS = VIL VIN 0.2V, f = 0; UB / LB = VCC – 0.2V
Note:
1. At f = f
MAX, address and data inputs are cycling at the maximum frequency; f = 0 means no input lines change.
CAPACITANCE
(1)
Symbol Parameter Conditions Max. Unit
CIN Input Capacitance VIN = 0V 8 pF
COUT Input/Output Capacitance VOUT = 0V 10 pF
Note:
1. Tested initially and after any design or process changes that may affect these parameters.
6
Integrated Silicon Solution, Inc. 1-800-379-4774
Rev. A
03/17/00
IS62V6416BLL ISSI
®
DATA VALID
READ1.eps
PREVIOUS DATA VALID
t
AA
t
OHA
t
OHA
t
RC
D
OUT
ADDRESS
AC WAVEFORMS
READ CYCLE NO. 1
(1,2)
(Address Controlled) (CS = OE = VIL, UB or LB = VIL)
READ CYCLE SWITCHING CHARACTERISTICS
(1)
(Over Operating Range)
-100 -120
Symbol Parameter Min. Max. Min. Max. Unit
tRC Read Cycle Time 100 120 ns
tAA Address Access Time 100 120 ns
tOHA Output Hold Time 10 10 ns tACS CS Access Time 100 120 ns tDOE OE Access Time 50 70 ns
tHZOE
(2)
OE to High-Z Output 0 30 0 35 ns
tLZOE
(2)
OE to Low-Z Output 5 5 ns
tHZCS
(2)
CS to High-Z Output 0 30 0 35 ns
tLZCS
(2)
CS to Low-Z Output 10 10 ns
tBA LB, UB Access Time 100 120 ns
tHZB
(2)
LB, UB to High-Z Output 0 40 0 45 ns
tLZB
(2)
LB, UB to Low-Z Output 10 10 ns
Notes:
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3V and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±500mV from steady-state voltage. Not 100% tested.
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Integrated Silicon Solution, Inc. 1-800-379-4774
7
Rev. A
03/17/00
IS62V6416BLL ISSI
®
t
RC
t
OHA
t
AA
t
DOE
t
LZOE
t
ACS
t
LZCS
t
HZOE
HIGH-Z
DATA VALID
t
HZB
ADDRESS
OE
CS
LB, UB
D
OUT
t
HZCS
t
BA
t
LZB
UB_CSRD2.eps
READ CYCLE NO. 2
(1,3)
(CS, OE, and UB / LB Controlled)
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CS, UB, or LB = V
IL.
3. Address is valid prior to or coincident with CS LOW transition.
8
Integrated Silicon Solution, Inc. 1-800-379-4774
Rev. A
03/17/00
IS62V6416BLL ISSI
®
WRITE CYCLE SWITCHING CHARACTERISTICS
(1,2)
(Over Operating Range)
-100 -120
Symbol Parameter Min. Max. Min. Max. Unit
tWC Write Cycle Time 100 120 ns tSCS CS to Write End 80 100 ns
tAW Address Setup Time to Write End 80 100 ns
tHA Address Hold from Write End 0 0 ns
tSA Address Setup Time 0 0 ns tPWB LB, UB Valid to End of Write 80 100 ns tPWE1,2 WE Pulse Width 80 100 ns
tSD Data Setup to Write End 60 60 ns
tHD Data Hold from Write End 0 0 ns
tHZWE
(3)
WE LOW to High-Z Output 0 30 0 ns
tLZWE
(3)
WE HIGH to Low-Z Output 5 5 ns
Notes:
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3V and output loading specified in Figure 1.
2. The internal write time is defined by the overlap of CS LOW and UB or LB, and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the write.
3. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage.
Notes:
1. WRITE is an internally generated signal asserted during an overlap of the LOW states on the CS and WE inputs and at least one of the LB and UB inputs being in the LOW state.
2. WRITE = (CS) [ (LB) = (UB) ] (WE).
WRITE CYCLE NO. 1
(1,2)
(CS Controlled, OE = HIGH or LOW)
DATA UNDEFINED
t
WC
VALID ADDRESS
t
SCS
t
PWE1
t
PWE2
t
AW
t
HA
HIGH-Z
t
PBW
t
HD
t
SA
t
HZWE
ADDRESS
CS
UB, LB
WE
D
OUT
DIN
DATAIN VALID
t
LZWE
t
SD
UB_CSWR1.eps
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Integrated Silicon Solution, Inc. 1-800-379-4774
9
Rev. A
03/17/00
IS62V6416BLL ISSI
®
WRITE CYCLE NO. 2 (WE Controlled: OE is HIGH During Write Cycle)
DATA UNDEFINED
LOW
t
WC
VALID ADDRESS
t
PWE1
t
AW
t
HA
HIGH-Z
t
PBW
t
HD
t
SA
t
HZWE
ADDRESS
CS
UB, LB
WE
D
OUT
D
IN
OE
DATAIN VALID
t
LZWE
t
SD
UB_CSWR2.eps
WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle)
DATA UNDEFINED
t
WC
VALID ADDRESS
LOW
LOW
t
PWE2
t
AW
t
HA
HIGH-Z
t
PBW
t
HD
t
SA
t
HZWE
ADDRESS
CS
UB, LB
WE
D
OUT
D
IN
OE
DATAIN VALID
t
LZWE
t
SD
UB_CSWR3.eps
10
Integrated Silicon Solution, Inc. 1-800-379-4774
Rev. A
03/17/00
IS62V6416BLL ISSI
®
WRITE CYCLE NO. 4 (UB/LB Controlled)
DATA UNDEFINED
t
WC
ADDRESS 1 ADDRESS 2
t
WC
HIGH-Z
t
PBW
WORD 1
LOW
WORD 2
t
HD
t
SA
t
HZWE
ADDRESS
CS
UB, LB
WE
D
OUT
D
IN
OE
DATA
IN
VALID
t
LZWE
t
SD
t
PBW
DATA
IN
VALID
t
SD
t
HD
t
SA
t
HA
t
HA
UB_CSWR4.eps
DATA RETENTION TIMING DIAGRAM
DATA RETENTION CHARACTERISTICS
Symbol Parameter Test Condition Min. Max. Unit
V
DR
Vcc for Data Retention CS VCC – 0.2V 2.0 V
I
DR
Data Retention Current VCC = V
DR
5.0 µA
CS VCC 0.2V
t
SDR
Data Retention Set up Time
See Data Retention Waveform
0 ns
t
RDR
Recovery Time
See Data Retention Waveform t
RC
ns
V
CC
CS V
CC
– 0.2V
t
SDR
t
RDR
V
DR
CS
GND
Data Retention Mode
CS_DR.eps
1 2 3 4 5 6 7 8 9 10 11 12
Integrated Silicon Solution, Inc. 1-800-379-4774
11
Rev. A
03/17/00
IS62V6416BLL ISSI
®
ISSI
®
Integrated Silicon Solution, Inc.
2231 Lawson Lane
Santa Clara, CA 95054
Tel: 1-800-379-4774 Fax: (408) 588-0806
E-mail: sales@issi.com
www.issi.com
ORDERING INFORMATION
Commercial Range: 0°C to +70°C
Speed (ns) Order Part No. Package
100 IS62V6416BLL-10T Plastic TSOP (Type II)
IS62V6416BLL-10K 400-mil Plastic SOJ IS62V6416BLL-10B Mini BGA (6mm x 8mm)
120 IS62V6416BLL-12T Plastic TSOP (Type II)
IS62V6416BLL-12K 400-mil Plastic SOJ IS62V6416BLL-12B Mini BGA (6mm x 8mm)
Industrial Range: –40°C to +85°C
Speed (ns) Order Part No. Package
100 IS62V6416BLL-10TI Plastic TSOP (Type II)
IS62V6416BLL-10KI 400-mil Plastic SOJ IS62V6416BLL-10BI Mini BGA (6mm x 8mm)
120 IS62V6416BLL-12TI Plastic TSOP (Type II)
IS62V6416BLL-12KI 400-mil Plastic SOJ IS62V6416BLL-12BI Mini BGA (6mm x 8mm)
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