Datasheet IS62LV12816BLL-55T, IS62LV12816BLL-55BI, IS62LV12816BLL-55B, IS62LV12816BLL-10TI, IS62LV12816BLL-10T Datasheet (ISSI)

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IS62LV12816BLL ISSI
®
LOW POWER CMOS STATIC RAM
FEATURES
• High-speed access time: 55, 70, 100 ns
• CMOS low power operation – 120 mW (typical) operating – 6 µW (typical) CMOS standby
• TTL compatible interface levels
• Single 2.7V-3.45V V
CC power supply
• Fully static operation: no clock or refresh required
• Three state outputs
• Data control for upper and lower bytes
• Industrial temperature available
• Available in the 44-pin TSOP (Type II) and 48-pin mini BGA (6mm x 8mm)
FUNCTIONAL BLOCK DIAGRAM
DESCRIPTION
The static RAM organized as 131,072 words by 16 bits. It is fabricated using technology. This highly reliable process coupled with innovative circuit design techniques, yields high-performance and low power consumption devices.
When CE is HIGH (deselected) or when CE is low and both LB and UB are HIGH, the device assumes a standby mode at which the power dissipation can be reduced down with CMOS input levels.
Easy memory expansion is provided by using Chip Enable and Output Enable inputs, CE and OE. The active LOW Write Enable (WE) controls both writing and reading of the memory. A data byte allows Upper Byte (UB) and Lower Byte (LB) access.
The IS62LV12816BLL is packaged in the JEDEC standard 44-pin TSOP (Type II) and 48-pin mini BGA (6mm x 8mm).
FEBRUARY 2001
ISSI
IS62LV12816BLL is a high-speed, 2,097,152-bit
ISSI
's high-performance CMOS
A0-A16
VCC
GND
I/O0-I/O7
Lower Byte
I/O8-I/O15
Upper Byte
CE OE
WE
UB
LB
ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2001, Integrated Silicon Solution, Inc.
DECODER
I/O
DATA
CIRCUIT
CONTROL
CIRCUIT
128K x 16
MEMORY ARRAY
COLUMN I/O
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
03/07/01
1
IS62LV12816BLL ISSI
PIN CONFIGURATIONS
44-Pin TSOP (Type II) 48-Pin mini BGA
®
1
A4
2
A3
3
A2
4
A1
5
A0
6
CE
Vcc
WE
7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
I/O0 I/O1 I/O2 I/O3
GND
I/O4 I/O5 I/O6 I/O7
A16 A15 A14 A13 A12
PIN DESCRIPTIONS
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
A5 A6 A7
OE UB LB
I/O15 I/O14 I/O13 I/O12 GND Vcc I/O11 I/O10 I/O9 I/O8 NC A8 A9 A10 A11 NC
1 2 3 4 5 6
A1
OE
UB A3
I/O10A5
I/O
11
I/O
12
I/O
13
NC
A8
A0
NC
NC
A14
A12
A9
A
B
C
D
E
F
G
H
LB
I/O
I/O
GND
Vcc
I/O
I/O
NC
8
9
14
15
A6
A7
A16
A15
A13
A10
A4
A2
N/C
CE I/O
I/O1I/O
I/O
3
I/O
GND
4
I/O
I/O
5
WE
I/O
A11 NC
0
2
Vcc
6
7
A0-A16 Address Inputs
I/O0-I/O15 Data Inputs/Outputs
CE Chip Enable Input OE Output Enable Input WE Write Enable Input
LB Lower-byte Control (I/O0-I/O7) UB Upper-byte Control (I/O8-I/O15)
NC No Connection
Vcc Power
GND Ground
TRUTH TABLE
I/O PIN
Mode WE CE OE LB UB I/O0-I/O7 I/O8-I/O15 Vcc Current
Not Selected X H X X X High-Z High-Z ISB1, ISB2
X L X H H High-Z High-Z ISB1, ISB2
Output Disabled H L H X X High-Z High-Z ICC
X L X H H High-Z High-Z ISB
Read H L L L H DOUT High-Z ICC
H L L H L High-Z DOUT HLLLL DOUT DOUT
Write L L X L H DIN High-Z ICC
L L X H L High-Z DIN LLXLL DIN DIN
2
Integrated Silicon Solution, Inc. 1-800-379-4774
Rev. B
03/07/01
IS62LV12816BLL ISSI
OPERATING RANGE
Range Ambient Temperature VCC
Commercial 0°C to +70°C 2.7V - 3.45V
Industrial –40°C to +85°C 2.7V - 3.45V
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
VTERM Terminal Voltage with Respect to GND –0.5 to Vcc+0.5 V
TBIAS Temperature Under Bias –40 to +85 °C
VCC Vcc Related to GND –0.3 to +3.6 V
TSTG Storage Temperature –65 to +150 °C
PT Power Dissipation 1.0 W
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
(1)
®
1
2
3
4
5
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol Parameter Test Conditions Min. Max. Unit
VOH Output HIGH Voltage VCC = Min., IOH = –1 mA 2.0 V
VOL Output LOW Voltage VCC = Min., IOL = 2.1 mA 0.4 V
VIH Input HIGH Voltage 2.2 VCC + 0.2 V
(1)
VIL
ILI Input Leakage GND VIN VCC –11µA
ILO Output Leakage GND VOUT VCC, Outputs Disabled –11µA
Notes:
1. V
CAPACITANCE
Symbol Parameter Conditions Max. Unit
Input LOW Voltage –0.2 0.4 V
IL (min.) = –2.0V for pulse width less than 10 ns.
(1)
6
7
8
9
10
11
CIN Input Capacitance VIN = 0V 6 pF
COUT Input/Output Capacitance VOUT = 0V 8 pF
Note:
1. Tested initially and after any design or process changes that may affect these parameters.
Integrated Silicon Solution, Inc. 1-800-379-4774
Rev. B
03/07/01
12
3
IS62LV12816BLL ISSI
AC TEST CONDITIONS
Parameter Unit
Input Pulse Level 0.4V to 2.2V
Input Rise and Fall Times 5 ns
Input and Output Timing 1.3V and Reference Level
Output Load See Figures 1 and 2
®
AC TEST LOADS
3.0V
OUTPUT
Including
Figure 1
30 pF
jig and
scope
3070
3150
Figure 2
3.0V
OUTPUT
5 pF
Including
jig and
scope
3070
3150
4
Integrated Silicon Solution, Inc. 1-800-379-4774
Rev. B
03/07/01
IS62LV12816BLL ISSI
®
POWER SUPPLY CHARACTERISTICS
Symbol Parameter Test Conditions Min. Max. Min. Max. Min. Max. Unit
ICC Vcc Dynamic Operating VCC = Max., Com. 40 30 20 mA
Supply Current IOUT = 0 mA, f = fMAX Ind. 45 35 25
I
SB1 TTL Standby Current VCC = Max., Com. 0.4 0.4 0.4 mA
(TTL Inputs) V
OR
ULB Control V
ISB2 CMOS Standby VCC = Max., Com. 5 5 A
Current (CMOS Inputs) CE ≥ VCC – 0.2V, Ind. 5 5 5
OR
ULB Control VCC = Max., CE = VIL
Note:
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
IN = VIH or VIL Ind. 1.0 1.0 1.0
CE ≥ VIH , f = 0
CC = Max., VIN = VIH or VIL
CE = VIL, f = 0, UB = VIH, LB = VIH
VIN ≥ VCC – 0.2V, or VIN ≤ 0.2V, f = 0
VIN 0.2V, f = 0; UB / LB = VCC – 0.2V
(1)
(Over Operating Range)
-55 -70 -100
1
2
3
4
5
6
READ CYCLE SWITCHING CHARACTERISTICS
-55 -70 -100
Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
tRC Read Cycle Time 55 70 100 ns
tAA Address Access Time 55 70 100 ns
tOHA Output Hold Time 10 10 15 ns tACE CE Access Time 55 70 100 ns tDOE OE Access Time 30 35 50 ns
(2)
tHZOE
tLZOE
tHZCE
tLZCE tBA LB, UB Access Time 55 70 100 ns tHZB LB, UB to High-Z Output 0 25 0 25 0 35 ns tLZB LB, UB to Low-Z Output 0 0 0 ns
Notes:
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 1.3V, input pulse levels of
0.4 to 2.2V and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
OE to High-Z Output 20 25 30 ns
(2)
OE to Low-Z Output 5 5 5 ns
(2)
CE to High-Z Output 0 20 0 25 0 30 ns
(2)
CE to Low-Z Output 10 10 10 ns
(1)
(Over Operating Range)
7
8
9
10
11
12
Integrated Silicon Solution, Inc. 1-800-379-4774
Rev. B
03/07/01
5
IS62LV12816BLL ISSI
AC WAVEFORMS
®
READ CYCLE NO. 1
ADDRESS
D
OUT
PREVIOUS DATA VALID
(1,2)
(Address Controlled) (CE = OE = VIL, UB or LB = VIL)
t
RC
t
AA
t
OHA
t
OHA
DATA VALID
AC WAVEFORMS
t
LZB
(1,3)
(CE, OE, AND UB/LB Controlled)
t
RC
t
AA
t
DOE
t
LZOE
t
ACE
t
LZCE
t
BA
READ CYCLE NO. 2
ADDRESS
OE
CE
LB, UB
OUT
D
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CE, UB, or LB = V
3. Address is valid prior to or coincident with CE LOW transition.
HIGH-Z
DATA VALID
IL.
t
HZOE
t
HZCE
t
HZB
t
OHA
6
Integrated Silicon Solution, Inc. 1-800-379-4774
Rev. B
03/07/01
IS62LV12816BLL ISSI
®
WRITE CYCLE SWITCHING CHARACTERISTICS
Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
(1,2)
(Over Operating Range)
-55 -70 -100
tWC Write Cycle Time 55 70 100 ns tSCE CE to Write End 50 65 80 ns
tAW Address Setup Time to Write End 50 65 80 ns
tHA Address Hold from Write End 0 0 0 ns
tSA Address Setup Time 0 0 0 ns tPWB LB, UB Valid to End of Write 45 60 80 ns tPWE WE Pulse Width 45 60 80 ns
tSD Data Setup to Write End 25 30 40 ns
tHD Data Hold from Write End 0 0 0 ns
(3)
tHZWE
tLZWE
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.3V, input pulse levels of 0.4V to 2.2V and output loading specified in Figure 1.
2. The internal write time is defined by the overlap of CE LOW and UB or LB, and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the write.
3. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
WE LOW to High-Z Output 30 30 40 ns
(3)
WE HIGH to Low-Z Output 5 5 5 ns
1
2
3
4
5
6
AC WAVEFORMS WRITE CYCLE NO. 1
ADDRESS
CE
WE
UB, LB
D
OUT
D
IN
(1,2)
(CE Controlled, OE = HIGH or LOW)
t
WC
VALID ADDRESS
t
SA
t
DATA UNDEFINED
t
HZWE
AW
t
PWE1
t
PWE2
t
SCS
t
PBW
HIGH-Z
t
SD
DATA
IN
VALID
7
t
HA
8
9
10
t
LZWE
11
t
HD
UB_CSWR1.eps
12
Notes:
1. WRITE is an internally generated signal asserted during an overlap of the LOW states on the CE and WE inputs and at least one of the LB and UB inputs being in the LOW state.
2. WRITE = (CE) [ (LB) = (UB) ] (WE).
Integrated Silicon Solution, Inc. 1-800-379-4774
Rev. B
03/07/01
7
IS62LV12816BLL ISSI
WRITE CYCLE NO. 2 (WE Controlled: OE is HIGH During Write Cycle)
t
WC
®
ADDRESS
OE
CE
WE
UB, LB
OUT
D
D
VALID ADDRESS
t
HA
LOW
t
AW
t
PWE1
t
SA
t
HZWE
DATA UNDEFINED
IN
t
PBW
HIGH-Z
t
SD
DATAIN VALID
t
t
HD
LZWE
UB_CSWR2.eps
WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle)
t WC
ADDRESS
OE
CE
WE
UB, LB
D
OUT
DIN
LOW
LOW
t SA
DATA UNDEFINED
VALID ADDRESS
t AW
t PWE2
t PBW
t HZWE
HIGH-Z
t SD
DATAIN VALID
t HA
t LZWE
t HD
UB_CSWR3.eps
8
Integrated Silicon Solution, Inc. 1-800-379-4774
Rev. B
03/07/01
IS62LV12816BLL ISSI
WRITE CYCLE NO. 4 (UB/LB Controlled)
t
t
WC
WC
®
ADDRESS
OE
CE
WE
UB, LB
OUT
D
D
IN
LOW
t
HZWE
DATA UNDEFINED
ADDRESS 1 ADDRESS 2
t
SA
t
HA
t
SA
t
t
SD
PBW
WORD 1
HIGH-Z
DATA
VALID
t
HD
IN
t
SD
t
PBW
WORD 2
DATA
VALID
1
2
t
HA
3
4
t
LZWE
t
HD
IN
UB_CSWR4.eps
5
6
DATA RETENTION SWITCHING CHARACTERISTICS
Symbol Parameter Test Condition Min. Max. Unit
VDR Vcc for Data Retention See Data Retention Waveform 1.5 3.45 V
IDR Data Retention Current Vcc = 2.0V, CE Vcc – 0.2V A
tSDR Data Retention Setup Time See Data Retention Waveform 0 ns
tRDR Recovery Time See Data Retention Waveform tRC ns
DATA RETENTION WAVEFORM (CE Controlled)
Data Retention Mode
CE VCC Ð 0.2V
2.3V
2.0V
GND
VCC
VDR
CE
t
SDR tRDR
7
8
9
10
11
12
Integrated Silicon Solution, Inc. 1-800-379-4774
Rev. B
03/07/01
9
IS62LV12816BLL ISSI
ORDERING INFORMATION
®
Commercial Range: 0°C to +70°C
Speed (ns) Order Part No. Package
55 IS62LV12816BLL-55T TSOP (Type II)
IS62LV12816BLL-55B Mini BGA (6mm x 8mm)
70 IS62LV12816BLL-70T TSOP (Type II)
IS62LV12816BLL-70B Mini BGA (6mm x 8mm)
100 IS62LV12816BLL-10T TSOP (Type II)
IS62LV12816BLL-10B Mini BGA (6mm x 8mm)
Industrial Range: –40°C to +85°C
Speed (ns) Order Part No. Package
55 IS62LV12816BLL-55TI TSOP (Type II)
IS62LV12816BLL-55BI Mini BGA (6mm x 8mm)
70 IS62LV12816BLL-70TI TSOP (Type II)
IS62LV12816BLL-70BI Mini BGA (6mm x 8mm)
100 IS62LV12816BLL-10TI TSOP (Type II)
IS62LV12816BLL-10BI Mini BGA (6mm x 8mm)
10
®
ISSI
Integrated Silicon Solution, Inc.
2231 Lawson Lane
Santa Clara, CA 95054
Tel: 1-800-379-4774 Fax: (408) 588-0806
E-mail: sales@issi.com
www.issi.com
Integrated Silicon Solution, Inc. 1-800-379-4774
Rev. B
03/07/01
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