Datasheet IS62C1024-70W, IS62C1024-70TI, IS62C1024-70T, IS62C1024-55WI, IS62C1024-55TI Datasheet (ICSI)

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IS62C1024
A0-A16
CE1
OE WE
512 x 2048
MEMORY ARRAY
DECODER
COLUMN I/O
CONTROL
CIRCUIT
GND
VCC
I/O
DATA
CIRCUIT
I/O0-I/O7
CE2
IS62C1024
128K x 8 HIGH-SPEED CMOS STATIC RAM
FEATURES
• High-speed access time: 35, 45, 55, 70 ns
Low active power: 450 mW (typical)
Low standby power: 500 µW (typical) CMOS
standby
• Output Enable (OE) and two Chip Enable (CE1 and CE2) inputs for ease in applications
• Fully static operation: no clock or refresh required
• TTL compatible inputs and outputs
• Single 5V (±10%) power supply
FUNCTIONAL BLOCK DIAGRAM
DESCRIPTION
The ICSI IS62C1024 is a low power,131,072-word by 8-bit CMOS static RAM. It is fabricated using ICSI's high­performance CMOS technology. This highly reliable process coupled with innovative circuit design techniques, yields higher performance and low power consumption devices.
When CE1 is HIGH or CE2 is LOW (deselected), the device assumes a standby mode at which the power dissipation can be reduced by using CMOS input levels.
Easy memory expansion is provided by using two Chip Enable inputs, CE1 and CE2. The active LOW Write Enable (WE) controls both writing and reading of the memory.
The IS62C1024 is available in 32-pin 600mil DIP, 450mil SOP and 8*20mm TSOP-1 packages.
ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2000, Integrated Circuit Solution Inc.
Integrated Circuit Solution Inc. 1
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IS62C1024
PIN CONFIGURATION
32-Pin SOP and DIP
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
VCC A15 CE2 WE A13 A8 A9 A11 OE A10 CE1 I/O7 I/O6 I/O5 I/O4 I/O3
NC A16 A14 A12
A7 A6 A5 A4 A3 A2 A1
A0 I/O0 I/O1 I/O2
GND
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
PIN DESCRIPTIONS
A0-A16 Address Inputs
PIN CONFIGURATION
32-Pin 8x20mm TSOP-1
A11
A9 A8
A13
WE
CE2
A15
VCC
NC A16 A14 A12
A7 A6 A5 A4
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
OE A10 CE1 I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A0 A1 A2 A3
CE1 Chip Enable 1 Input
CE2 Chip Enable 2 Input
OE Output Enable Input WE Write Enable Input
I/O0-I/O7 Input/Output
Vcc Power
GND Ground
OPERATING RANGE
Range Ambient Temperature VCC
Commercial 0°C to +70°C 5V ± 10%
Industrial –40°C to +85°C 5V ± 10%
TRUTH TABLE
Mode
WEWE
WE
WEWE
Not Selected X H X X High-Z ISB1, ISB2 (Power-down) X X L X High-Z ISB1, ISB2
Output Disabled H L H H High-Z ICC Read H L H L DOUT ICC Write L L H X DIN ICC
CE1CE1
CE1 CE2
CE1CE1
OEOE
OE I/O Operation Vcc Current
OEOE
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IS62C1024
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol Parameter Value Unit
VTERM Terminal Voltage with Respect to GND –0.5 to +7.0 V TBIAS Temperature Under Bias –10 to +85 °C TSTG Storage Temperature –65 to +150 °C PT Power Dissipation 1.5 W IOUT DC Output Current (LOW) 20 mA
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
CAPACITANCE
(1,2)
Symbol Parameter Conditions Max. Unit
CIN Input Capacitance VIN = 0V 6 pF
COUT Output Capacitance VOUT = 0V 8 pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: T
A = 25°C, f = 1 MHz, Vcc = 5.0V.
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol Parameter Test Conditions Min. Max. Unit
VOH Output HIGH Voltage VCC = Min., IOH = –1.0 mA 2.4 V VOL Output LOW Voltage VCC = Min., IOL = 2.1 mA 0.4 V VIH Input HIGH Voltage 2.2 VCC + 0.5 V VIL Input LOW Voltage ILI Input Leakage GND VIN VCC Com. –5 5 µA
ILO Output Leakage GND VOUT VCC Com. –5 5 µA
Notes:
IL = –3.0V for pulse width less than 10 ns.
1. V
POWER SUPPLY CHARACTERISTICS
Symbol Parameter Test Conditions Min. Max. Min. Max. Min. Max. Min. Max. Unit
ICC Vcc Dynamic Operating VCC = Max., CE = VIL Com. 150 135 120 90 mA
Supply Current IOUT = 0 mA, f = fMAX Ind. 160 145 130 100
ISB1 TTL Standby Current VCC = Max., Com. 40 40 40 40 mA
(TTL Inputs) VIN = VIH or VIL, CE1 ≥ VIH, Ind. 60 60 60 60
ISB2 CMOS Standby VCC = Max., Com. 30 30 30 30 mA
Current (CMOS Inputs) CE1 ≥ VCC – 0.2V, Ind. 40 40 40 40
(1)
(1)
(Over Operating Range)
or CE2 ≤ VIL, f = 0
CE2 ≤ 0.2V, VIN > VCC – 0.2V, or VIN ≤ 0.2V, f = 0
–0.3 0.8 V
Ind. –10 10
Ind. –10 10
-35 ns -45 ns -55 ns -70 ns
Notes:
1. At f = f
MAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
Integrated Circuit Solution Inc. 3
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IS62C1024
READ CYCLE SWITCHING CHARACTERISTICS
(1)
(Over Operating Range)
-35 -45 -55 -70
Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Unit
tRC Read Cycle Time 35 45 55 70 ns
tAA Address Access Time 35 45 55 70 ns
tOHA Output Hold Time 3 3 3 3 ns tACE1 CE1 Access Time 35 45 55 70 ns
tACE2 CE2 Access Time 35 45 55 70 ns tDOE OE Access Time 10 20 25 35 ns
(2)
tLZOE
tHZOE
tLZCE1
tLZCE2
tHZCE
Notes:
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and output loading specified in Figure 1a.
2. Tested with the load in Figure 1b. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
OE to Low-Z Output 0 0 0 0 ns
(2)
OE to High-Z Output 0 10 0 15 0 20 0 25 ns
(2)
CE1 to Low-Z Output 3 5 7 10 ns
(2)
CE2 to Low-Z Output 3 5 7 10 ns
(2)
CE1 or CE2 to High-Z Output 0 10 0 15 0 20 0 25 ns
AC TEST CONDITIONS
Parameter Unit
Input Pulse Level 0V to 3.0V Input Rise and Fall Times 5 ns Input and Output Timing 1.5V
and Reference Level Output Load See Figures 1a and 1b
AC TEST LOADS
480
5V
OUTPUT
100 pF
Including
jig and
scope
Figure 1a. Figure 1b.
255
5V
OUTPUT
5 pF
Including
jig and
scope
480
255
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IS62C1024
AC WAVEFORMS
READ CYCLE NO. 1
ADDRESS
D
OUT
READ CYCLE NO. 2
ADDRESS
(1,2)
PREVIOUS DATA VALID
(1,3)
t
AA
t
OHA
t
RC
t
RC
t
AA
DATA VALID
t
OHA
t
OHA
OE
t
DOE
t
CE
t
LZCE
OUT
D
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CE1 = V
3. Address is valid prior to or coincident with CE1 LOW and CE2 HIGH transitions.
HIGH-Z
LZOE
t
ACE
IL, CE2 = VIH.
DATA VALID
t
HZCE
t
HZOE
Integrated Circuit Solution Inc. 5
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IS62C1024
WRITE CYCLE SWITCHING CHARACTERISTICS
(1,3)
(Over Operating Range, Standard and Low
Power)
-35 -45 -55 -70
Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Unit
tWC Write Cycle Time 35 45 55 70 ns tSCE1 CE1 to Write End 25 35 50 60 ns
tSCE2 CE2 to Write End 25 35 50 60 ns
tAW Address Setup Time to Write End 25 35 45 60 ns
tHA Address Hold from Write End 0 0 0 0 ns
tSA Address Setup Time 0 0 0 0 ns
(4)
tPWE
WE Pulse Width 25 35 40 50 ns
tSD Data Setup to Write End 20 25 25 30 ns
tHD Data Hold from Write End 0 0 0 0 ns
(2)
tHZWE
tLZWE
Notes:
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and output loading specified in Figure 1a.
2. Tested with the load in Figure 1b. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
3. The internal write time is defined by the overlap of CE1 LOW, CE2 HIGH and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the Write.
4. Tested with OE HIGH.
WE LOW to High-Z Output 10 15 20 25 ns
(2)
WE HIGH to Low-Z Output 3 5 5 5 ns
AC WAVEFORMS WRITE CYCLE NO. 1 (
ADDRESS
CE
WE
OUT
D
D
IN
WEWE
WE Controlled)
WEWE
t
SA
DATA UNDEFINED
(1,2)
VALID ADDRESS
t
AW
t
HZWE
t
PWE1
t
PWE2
t
t
WC
SCE
HIGH-Z
t
SD
DATAIN VALID
t
HA
t
LZWE
t
HD
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IS62C1024
t
(1,2)
WC
t
HA
WRITE CYCLE NO. 2 (
ADDRESS
CE1CE1
CE1, CE2 Controlled)
CE1CE1
VALID ADDRESS
OE
LOW
CE
t
AW
t
PWE1
WE
t
D
OUT
D
SA
DATA UNDEFINED
IN
t
HZWE
HIGH-Z
t
SD
DATAIN VALID
t
LZWE
t
HD
Notes:
1. The internal write time is defined by the overlap of CE1 LOW, CE2 HIGH and WE LOW. All signals must be in valid states to
initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the Write.
2. I/O will assume the High-Z state if OE = V
IH.
Integrated Circuit Solution Inc. 7
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IS62C1024
ORDERING INFORMATION Commercial Range: 0°C to +70°C
Speed (ns) Order Part No. Package
35 IS62C1024-35W 600mil DIP 35 IS62C1024-35Q 450mil SOP 35 IS62C1024-35T 8*20mm TSOP-1
45 IS62C1024-45W 600mil DIP 45 IS62C1024-45Q 450mil SOP 45 IS62C1024-45T 8*20mm TSOP-1
55 IS62C1024-55W 600mil DIP 55 IS62C1024-55Q 450mil SOP 55 IS62C1024-55T 8*20mm TSOP-1
70 IS62C1024-70W 6600mil DIP 70 IS62C1024-70Q 450mil SOP 70 IS62C1024-70T 8*20mm TSOP-1
ORDERING INFORMATION Industrial Range: –40°C to +85°C
Speed (ns) Order Part No. Package
35 IS62C1024-35WI 600mil DIP 35 IS62C1024-35QI 450mil SOP 35 IS62C1024-35TI 8*20mm TSOP-1
45 IS62C1024-45WI 600mil DIP 45 IS62C1024-45QI 450mil SOP 45 IS62C1024-45TI 8*20mm TSOP-1
55 IS62C1024-55WI 600mil DIP 55 IS62C1024-55QI 450mil SOP 55 IS62C1024-55TI 8*20mm TSOP-1
70 IS62C1024-70WI 600mil DIP 70 IS62C1024-70QI 450mil SOP 70 IS62C1024-70TI 8*20mm TSOP-1
Integrated Circuit Solution Inc.
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