Datasheet IS61SF6432-9TQ, IS61SF6432-10TQI, IS61SF6432-10TQ, IS61SF6432-10PQI, IS61SF6432-10PQ Datasheet (ISSI)
IS61SF6432 ISSI
64K x 32 SYNCHRONOUS
FLOW-THROUGH STATIC RAM
JUNE 2001
®
FEATURES
• Fast access time: 9 ns, 10 ns
• Internal self-timed write cycle
• Individual Byte Write Control and Global Write
• Clock controlled, registered address, data and
control
• Pentium™ or linear burst sequence control
using MODE input
• Three chip enables for simple depth expansion
and address pipelining
• Common data inputs and data outputs
• Power-down control by ZZ input
• JEDEC 100-Pin TQFP and PQFP package
• Single +3.3V power supply
• Two Clock enables and one Clock disable to
eliminate multiple bank bus contention.
• Control pins mode upon power-up:
– FT in pipeline mode
– MODE in interleave burst mode
– ZZ in normal operation mode
These control pins can be connected to GND
or VCCQ to alter their power-up state
• Industrial temperature available
Q
DESCRIPTION
The ISSI IS61SF6432 is a high-speed, low-power synchronous static RAM designed to provide a burstable, highperformance, secondary cache for the Pentium™, 680X0™,
and PowerPC™ microprocessors. It is organized as 65,536
words by 32 bits, fabricated with ISSI's advanced CMOS
technology. The device integrates a 2-bit burst counter, highspeed SRAM core, and high-drive capability outputs into a
single monolithic circuit. All synchronous inputs pass through
registers controlled by a positive-edge-triggered single clock
input.
Write cycles are internally self-timed and are initiated by the
rising edge of the clock input. Write cycles can be from one to
four bytes wide as controlled by the write control inputs.
Separate byte enables allow individual bytes to be written.
BW1 controls DQ1-DQ8, BW2 controls DQ9-DQ16, BW3
controls DQ17-DQ24, BW4 controls DQ25-DQ32, conditioned
by BWE being LOW. A LOW on GW input would cause all bytes
to be written.
Bursts can be initiated with either ADSP (Address Status
Processor) or ADSC (Address Status Cache Controller) input
pins. Subsequent burst addresses can be generated internally by the IS61SF6432 and controlled by the ADV (burst
address advance) input pin.
Asynchronous signals include output enable (OE), sleep mode
input (ZZ), clock (CLK) and burst mode input (MODE). A HIGH
input on the ZZ pin puts the SRAM in the power-down state.
When ZZ is pulled LOW (or no connect), the SRAM normally
operates after three cycles of the wake-up period. A LOW
input, i.e., GNDQ, on MODE pin selects LINEAR Burst. A VCCQ
(or no connect) on MODE pin selects INTERLEAVED Burst.
ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any
errors which may appear in this publication. © Copyright 2001, Integrated Silicon Solution, Inc.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
06/28/01
1
IS61SF6432 ISSI
BLOCK DIAGRAM
MODE
CLK
ADV
ADSC
ADSP
CLK
BINARY
COUNTER
CE
CLR
Q0
Q1
A0
A1
A0'
A1'
64K x 32
MEMORY
ARRAY
®
A15-A0
GW
BWE
BW4
BW3
BW2
BW1
16
D
Q
14 16
ADDRESS
REGISTER
CE
CLK
D
Q
32
32
DQ32-DQ25
BYTE WRITE
REGISTERS
CLK
D
Q
DQ24-DQ17
BYTE WRITE
REGISTERS
CLK
D
Q
DQ16-DQ9
BYTE WRITE
REGISTERS
CLK
D
Q
DQ8-DQ1
BYTE WRITE
REGISTERS
CLK
CE1
CE2
CE3
D
ENABLE
REGISTER
CE
CLK
D
Q
Q
4
REGISTERS
INPUT
CLK
OE
32
DATA[32:1]
ENABLE
DELAY
REGISTER
CLK
OE
2
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
06/28/01
IS61SF6432 ISSI
PIN CONFIGURATION
100-Pin TQFP and PQFP (Top View)
A6A7CE
CE2
BW4
BW3
BW2
BW1
CE3
VCC
GND
NC
DQ17
DQ18
VCCQ
GNDQ
DQ19
DQ20
DQ21
DQ22
GNDQ
VCCQ
DQ23
DQ24
GNDQ
VCC
NC
GND
DQ25
DQ26
VCCQ
GNDQ
DQ27
DQ28
DQ29
DQ30
GNDQ
VCCQ
DQ31
DQ32
NC
CLKGWBWEOEADSC
99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
100
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45
ADSP
ADVA8A9
46 47 48 49 50
80
NC
79
DQ16
78
DQ15
77
VCCQ
76
GNDQ
75
DQ14
74
DQ13
73
DQ12
72
DQ11
71
GNDQ
70
VCCQ
69
DQ10
68
DQ9
67
GND
66
NC
65
VCC
64
ZZ
63
DQ8
62
DQ7
61
VCCQ
60
GNDQ
59
DQ6
58
DQ5
57
DQ4
56
DQ3
55
GNDQ
54
VCCQ
53
DQ2
52
DQ1
51
NC
®
A5A4A3A2A1
MODE
A0
NC
NC
GND
VCC
PIN DESCRIPTIONS
A0-A15 Address Inputs
CLK Clock
ADSP Processor Address Status
ADSC Controller Address Status
ADV Burst Address Advance
BW1-BW4 Synchronous Byte Write Enable
BWE Byte Write Enable
GW Global Write Enable
CE1, CE2, CE3 Synchronous Chip Enable
OE Output Enable
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
06/28/01
NC
NC
A13
A14
A15
NC
A10
A11
A12
DQ1-DQ32 Data Input/Output
ZZ Sleep Mode
MODE Burst Sequence Mode
VCC +3.3V Power Supply
GND Ground
VCCQ Isolated Output Buffer Supply:
+3.3V
GNDQ Isolated Output Buffer Ground
NC No Connect
3
IS61SF6432 ISSI
TRUTH TABLE
ADDRESS
OPERATION USED CE1 CE2 CE3 ADSP ADSC ADV WR ITE OE DQ
Deselected, Power-down None H X X X L X X X High-Z
Deselected, Power-down None L L X L XXXXHigh-Z
Deselected, Power-down None L X H L XXXXHigh-Z
Deselected, Power-down None L L X H L X X X High-Z
Deselected, Power-down None L X H H L X X X High-Z
Read Cycle, Begin Burst External L H L L X X X L Q
Read Cycle, Begin Burst External L H L L X X X H High-Z
Write Cycle, Begin Burst External L H L H L X L X D
Read Cycle, Begin Burst External L H L H L X H L Q
Read Cycle, Begin Burst External L H L H L X H H High-Z
Read Cycle, Continue Burst Next X X X H H L H L Q
Read Cycle, Continue Burst Next X X X H H L H H High-Z
Read Cycle, Continue Burst Next H X X X H L H L Q
Read Cycle, Continue Burst Next H X X X H L H H High-Z
Write Cycle, Continue Burst Next X X X H H L L X D
Write Cycle, Continue Burst Next H X X X H L L X D
Read Cycle, Suspend Burst Current X X X HHHHLQ
Read Cycle, Suspend Burst Current X X X HHHHHHigh-Z
Read Cycle, Suspend Burst Current H X X X H H H L Q
Read Cycle, Suspend Burst Current H X X X HHHHHigh-Z
Write Cycle, Suspend Burst Current X X X H H H L X D
Write Cycle, Suspend Burst Current H X X X H H L X D
Notes:
1. All inputs except OE must meet setup and hold times for the Low-to-High transition of clock (CLK).
2. Wait states are inserted by suspending burst.
3. X means don't care. WRITE=L means any one or more byte write enable signals (BW1-BW4) and BWE are LOW or GW is LOW.
WRITE=H means all byte write enable signals are HIGH.
4. For a Write operation following a Read operation, OE must be HIGH before the input data required setup time and held HIGH
throughout the input data hold time.
5. ADSP LOW always initiates an internal READ at the Low-to-High edge of clock. A WRITE is performed by setting one or more
byte write enable signals and BWE LOW or GW LOW for the subsequent L-H edge of clock.
®
PARTIAL TRUTH TABLE
FUNCTION GW B W E BW1 BW2 BW3 BW4
READ H H X X X X
READ H X H H H H
WRITE Byte 1 H L L H H H
WRITE All Bytes X LLLLL
WRITE All Bytes L XXXXX
4
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
06/28/01
IS61SF6432 ISSI
INTERLEAVED BURST ADDRESS TABLE (MODE = VCCQ or No Connect)
External Address 1st Burst Address 2nd Burst Address 3rd Burst Address
A1 A0 A1 A0 A1 A0 A1 A0
00 01 10 11
01 00 11 10
10 11 00 01
11 10 01 00
LINEAR BURST ADDRESS TABLE (MODE = GNDQ)
0,0
0,1A1', A0' = 1,1
®
1,0
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
TBIAS Temperature Under Bias –40 to +85 °C
TSTG Storage Temperature –55 to +150 °C
PD Power Dissipation 1.8 W
IOUT Output Current (per I/O) 100 mA
VIN, VOUT Voltage Relative to GND for I/O Pins –0.5 to VCCQ + 0.3 V
VIN Voltage Relative to GND for –0.5 to 5.5 V
for Address and Control Inputs
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliability.
2. This device contains circuity to protect the inputs against damage due to high static voltages or
electric fields; however, precautions may be taken to avoid application of any voltage higher than
maximum rated voltages to this high-impedance circuit.
3. This device contains circuitry that will ensure the output devices are in High-Z at power up.
(1)
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
06/28/01
5
IS61SF6432 ISSI
OPERATING RANGE
Range Ambient Temperature VCC
Commercial 0°C to +70°C 3.3V +10%, –5%
Industrial –40°C to +85°C 3.3V +10%, –5%
®
DC ELECTRICAL CHARACTERISTICS
(1)
(Over Operating Range)
Symbol Parameter Test Conditions Min. Max. Unit
VOH Output HIGH Voltage IOH = –5.0 mA 2.4 — V
VOL Output LOW Voltage IOL = 5.0 mA — 0.4 V
VIH Input HIGH Voltage 2.0 VCCQ + 0.3 V
VIL Input LOW Voltage –0.3 0.8 V
I
LI Input Leakage Current GND - VIN - VCCQ
(2)
Com. –55µA
Ind. –10 10
ILO Output Leakage Current GND - VOUT - VCCQ, OE = VIH Com. –55µA
Ind. –10 10
POWER SUPPLY CHARACTERISTICS (Over Operating Range)
-9 -10
Symbol Parameter Test Conditions Min. Typ. Max. Min. Typ. Max. Unit
I
CC AC Operating Device Selected, Com. — 300 ——290 — mA
Supply Current All Inputs = VIL or VIH Ind. ——— —300 —
OE = VIH, Cycle Time • tKC min.
I
SB Standby Current Device Deselected, Com. — 60 ——60 — mA
VCC = Max., Ind. — —— —70 —
All Inputs = VIH or VIL
CLK Cycle Time • tKC min.
I
ZZ Power-Down Mode ZZ = VCCQ, Com. — 10 ——10 —
CLK Running Ind. ——— —20 — mA
Current All Inputs - GND + 0.2V
or • VCC – 0.2V
Note:
1. MODE pin has an internal pull-up. ZZ pin has an internal pull-down. These pins may be a No Connect, tied to GND, or tied to
VCCQ.
2. MODE pin should be tied to Vcc or GND. They exhibit ±30 µA maximum leakage current when tied to - GND + 0.2V or
• Vcc – 0.2V.
6
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
06/28/01
IS61SF6432 ISSI
®
CAPACITANCE
(1,2)
Symbol Parameter Conditions Max. Unit
CIN Input Capacitance VIN = 0V 6 pF
COUT Input/Output Capacitance VOUT = 0V 8 pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: T
A = 25°C, f = 1 MHz, Vcc = 3.3V.
AC TEST CONDITIONS
Parameter Unit
Input Pulse Level 0V to 3.0V
Input Rise and Fall Times 1.5 ns
Input and Output Timing 1.5V
and Reference Level
Output Load See Figures 1 and 2
AC TEST LOADS
3.3V
317 Ω
Output
Buffer
O = 50Ω
Z
Figure 1
30 pF
1.5V
50Ω
OUTPUT
5 pF
Including
jig and
scope
Figure 2
351 Ω
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
06/28/01
7
IS61SF6432 ISSI
READ CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)
-9 -10
Symbol Parameter Min. Max. Min. Max. Unit
tKC Cycle Time 13 — 15 — ns
tKH Clock High Time 6 — 6 — ns
tKL Clock Low Time 6 — 6 — ns
tKQ Clock Access Time — 9 — 10 ns
(2)
tKQX
tKQLZ
tKQHZ
tAS Address Setup Time 2.5 — 2.5 — ns
tSS Address Status Setup Time 2.5 — 2.5 — ns
tWS Write Setup Time 2.5 — 2.5 — ns
tCES Chip Enable Setup Time 2.5 — 2.5 — ns
tAVS Address Advance Setup Time 2.5 — 2.5 — ns
Clock High to Output Invalid 2 — 2 — ns
(2,3)
Clock High to Output Low-Z 0 — 0 — ns
(2,3)
Clock High to Output High-Z 2 6 2 6 ns
®
tAH Address Hold Time 1 — 1 — ns
tSH Address Status Hold Time 0.5 — 0.5 — ns
tWH Write Hold Time 0.5 — 0.5 — ns
tCEH Chip Enable Hold Time 0.5 — 0.5 — ns
tAVH Address Advance Hold Time 0.5 — 0.5 — ns
tCFG Configuration Setup
Notes:
1. Configuration signal MODE is static and must not change during normal operation.
2. Guaranteed but not 100% tested. This parameter is periodically sampled.
3. Tested with load in Figure 2.
(1)
66.7 — 80 — ns
8
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
06/28/01
IS61SF6432 ISSI
READ CYCLE TIMING: FLOW-THROUGH
t
KC
CLK
t
KL
ADSP is blocked by CE inactive
ADSP
t
SS
t
SH
t
KH
®
ADSC
ADV
A15-A0
GW
BWE
BW4-BW1
CE
CE2
t
AS
t
AH
RD1 RD2
t
WS
t
WS
t
CES
t
CES
t
CEH
t
CEH
t
SS
t
WH
t
WH
ADSC initiate read
t
AVS
t
SH
t
AVH
Suspend Burst
RD3
CE Masks ADSP
CE2 and CE2 only sampled with ADSP or ADSC
Unselected with CE2
t
CES
t
CEH
CE2
OE
DATA
OUT
DATA
IN
High-Z
t
KQLZ
t
KQ
High-Z
1a
2a 2b
Single Read
Flow-through
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
06/28/01
2c 2d 3a
Burst Read
t
KQX
t
KQHZ
Unselected
9
IS61SF6432 ISSI
WRITE CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)
-9 -10
Symbol Parameter Min. Max. Min. Max. Unit
tKC Cycle Time 13 — 15 — ns
tKH Clock High Time 6 — 6 — ns
tKL Clock Low Time 6 — 6 — ns
tAS Address Setup Time 2.5 — 2.5 — ns
tSS Address Status Setup Time 2.5 — 2.5 — ns
tWS Write Setup Time 2.5 — 2.5 — ns
tDS Data In Setup Time 2.5 — 2.5 — ns
tCES Chip Enable Setup Time 2.5 — 2.5 — ns
tAVS Address Advance Setup Time 2.5 — 2.5 — ns
tAH Address Hold Time 1 — 1 — ns
tSH Address Status Hold Time 0.5 — 0.5 — ns
tDH Data In Hold Time 0.5 — 0.5 — ns
®
tWH Write Hold Time 0.5 — 0.5 — ns
tCEH Chip Enable Hold Time 0.5 — 0.5 — ns
tAVH Address Advance Hold Time 0.5 — 0.5 — ns
tCFG Configuration Setup
Notes:
1. Configuration signal MODE is static and must not change during normal operation.
(1)
52 — 60 — ns
10
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
06/28/01
Single Write
DATA
OUT
DATA
IN
OE
CE3
CE2
CE1
BW4-BW1
BWE
GW
A15-A0
ADV
ADSC
ADSP
CLK
WR1 WR2
Unselected
Burst Write
t
KC
t
KL
t
KH
t
SS
t
SH
t
AS
t
AH
t
WS
t
WH
t
WS
t
WH
WR3
t
CES
t
CEH
t
CES
t
CEH
t
CES
t
CEH
CE2 and CE3 only sampled with ADSP or ADSC
CE1 Masks ADSP
Unselected with CE2
ADSC initiate Write
ADSP is blocked by CE1 inactive
t
AVH
t
AVS
ADV must be inactive for ADSP Write
WR1 WR2
t
WS
t
WH
WR3
t
WS
t
WH
High-Z
High-Z
1a
3a
t
DS
t
DH
BW4-BW1 only are applied to first cycle of WR2
Write
2c 2d2b2a
IS61SF6432 ISSI
WRITE CYCLE TIMING: PIPELINE
®
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
06/28/01
11
IS61SF6432 ISSI
READ/WRITE CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)
-9 -10
Symbol Parameter Min. Max. Min. Max. Unit
tKC Cycle Time 13 — 15 — ns
tKH Clock High Time 6 — 6 — ns
tKL Clock Low Time 6 — 6 — ns
tKQ Clock Access Time — 9 — 10 ns
(2)
tKQX
tKQLZ
tKQHZ
tOEQX
tOEHZ
tAS Address Setup Time 2.5 — 2.5 — ns
tSS Address Status Setup Time 2.5 — 2.5 — ns
tWS Write Setup Time 2.5 — 2.5 — ns
Clock High to Output Invalid 2 — 2 — ns
(2,3)
Clock High to Output Low-Z 0 — 0 — ns
(2,3)
Clock High to Output High-Z 2 6 2 6 ns
(2)
Output Disable to Output Invalid 0 — 0 — ns
(2,3)
Output Disable to Output High-Z — 6 — 6ns
®
tCES Chip Enable Setup Time 2.5 — 2.5 — ns
tAH Address Hold Time 0.5 — 0.5 — ns
tSH Address Status Hold Time 0.5 — 0.5 — ns
tWH Write Hold Time 0.5 — 0.5 — ns
tCEH Chip Enable Hold Time 0.5 — 0.5 — ns
Notes:
1. Configuration signal MODE is static and must not change during normal operation.
2. Guaranteed but not 100% tested. This parameter is periodically sampled.
3. Tested with load in Figure 2.
12
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
06/28/01
Single Read
Flow-through
Single Write
High-Z
High-Z
DATA
OUT
DATA
IN
OE
CE2
CE2
CE
BW4-BW1
BWE
GW
A15-A0
ADV
ADSC
ADSP
CLK
RD1 WR1
WR1
1a
1a
2a 2b 2c 2d
Unselected
Burst Read
t
KQX
t
KC
t
KL
t
KH
t
SS
t
SH
ADSP is blocked by CE inactive
t
SS
t
SH
t
AS
t
AH
t
WS
t
WH
t
WS
t
WH
t
WS
t
WH
RD2 RD3
t
CES
t
CEH
t
CES
t
CEH
t
CES
t
CEH
CE2 and CE2 only sampled with ADSP or ADSC
CE Masks ADSP
Unselected with CE2
t
OEQX
t
KQ
t
OEHZ
t
KQX
t
KQHZ
t
DS
t
DH
t
KQHZ
t
KQLZ
IS61SF6432 ISSI
READ/WRITE CYCLE TIMING: FLOW-THROUGH
®
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
06/28/01
13
IS61SF6432 ISSI
SNOOZE AND RECOVERY CYCLE SWITCHING CHARACTERISTICS (Over Operating Range)
-9 -10
Symbol Parameter Min. Max. Min. Max. Unit
tKC Cycle Time 13 — 15 — ns
tKH Clock High Time 6 — 6 — ns
tKL Clock Low Time 6 — 6 — ns
tKQ Clock Access Time — 9 — 10 ns
(4)
tKQX
tKQLZ
tKQHZ
tOEQ Output Enable to Output Valid — 6 — 6ns
tOEQX
tOELZ
tOEHZ
tAS Address Setup Time 2.5 — 2.5 — ns
Clock High to Output Invalid 2 — 2 — ns
(4,5)
Clock High to Output Low-Z 0 — 0 — ns
(4,5)
Clock High to Output High-Z 2 6 2 6 ns
(4)
Output Disable to Output Invalid 0 — 0 — ns
(4,5)
Output Enable to Output Low-Z 0 — 0 — ns
(4,5)
Output Disable to Output High-Z — 6 — 6ns
®
tSS Address Status Setup Time 2.5 — 2.5 — ns
tCES Chip Enable Setup Time 2.5 — 2.5 — ns
tAH Address Hold Time 0.5 — 0.5 — ns
tSH Address Status Hold Time 0.5 — 0.5 — ns
tCEH Chip Enable Hold Time 0.5 — 0.5 — ns
tZZS ZZ Standby
tZZREC ZZ Recovery
tCFG Configuration Setup
Notes:
1. The assertion of ZZ allows the SRAM to enter a lower power state than when deselected within the time specified. Data
retention is guaranteed when ZZ is asserted and clock remains active.
2. ADSC and ADSP must not be asserted for at least 2 cyc after leaving ZZ state.
3. Configuration signal MODE is static and must not change during normal operation.
4. Guaranteed but not 100% tested. This parameter is periodically sampled.
5. Tested with load in Figure 2.
(1)
(2)
(3)
2 — 2 — cyc
2 — 2 — cyc
52 — 60 — ns
14
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
06/28/01
Single Read
High-Z
High-Z
DATA
OUT
DATA
IN
OE
CE3
CE2
CE1
BW4-BW1
BWE
GW
A15-A0
ADV
ADSC
ADSP
CLK
RD1
1a
Read
Snooze with Data Retention
t
KC
t
KL
t
KH
t
SS
t
SH
t
AS
t
AH
RD2
t
CES
t
CEH
t
CES
t
CEH
t
CES
t
CEH
t
OEQ
t
OEQX
t
OELZ
t
KQLZ
t
KQ
t
OEHZ
t
KQX
t
KQHZ
ZZ
t
ZZS
t
ZZREC
IS61SF6432 ISSI
SNOOZE AND RECOVERY CYCLE TIMING
®
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
06/28/01
15
IS61SF6432 ISSI
®
ORDERING INFORMATION
Commercial Range: 0°C to +70°C
Speed (ns) Order Part Number Package
9 IS61SF6432-9TQ TQFP
9 IS61SF6432-9PQ PQFP
10 IS61SF6432-10TQ TQFP
10 IS61SF6432-10PQ PQFP
Integrated Silicon Solution, Inc., reserves the right to make changes to the products contained in this publication in order to
improve design, performance or reliability. Integrated Silicon Solution, Inc. assumes no responsibility for the use of any
circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits
are free of patent infringement. Charts and schedules contained herein reflect representative operating parameters, and may
vary depending upon a user's specific application. While the information in this publication has been carefully checked,
Integrated Silicon Solution, Inc. shall not be liable for any damages arising as a result of any error or omission.
ORDERING INFORMATION
Industrial Range: –40°C to +85°C
Speed (ns) Order Part Number Package
10 IS61SF6432-10TQI TQFP
10 IS61SF6432-10PQI PQFP
NOTICE
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure
or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect
its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc.
receives written assurances, to its satisfaction, that: (a) the risk of injury or damage has been minimized; (b) the user assumes
all such risks; and (c) potential liability of Integrated Silicon Solution, Inc. is adequately protected under the circumstances.
Copyright 1998 Integrated Silicon Solution, Inc.
Reproduction in whole or in part, without the prior written consent of Integrated Silicon Solution, Inc., is prohibited.
ISSI
Integrated Silicon Solution, Inc.
2231 Lawson Lane
Santa Clara, CA 95054
Tel: 1-800-379-4774
Fax: (408) 588-0806
E-mail: sales@issi.com
www.issi.com
®
16
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
06/28/01
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