Datasheet IS61NSCS51236-333B, IS61NSCS51236-300B, IS61NSCS25672-300B, IS61NSCS25672-250B, IS61NSCS51236-250B Datasheet (ISSI)
...
IS61NSCS25672
IS61NSCS51236 ISSI
®
ΣΣ
ΣRAM 256K x 72, 512K x 36
ΣΣ
18Mb Synchronous SRAM
Features
• JEDEC SigmaRam pinout and package standard
• Single 1.8V power supply (V
to 1.9V (max)
• Dedicated output supply voltage (VCCQ): 1.8V
or 1.5V typical
• LVCMOS-compatible I/O interface
• Common data I/O pins (DQs)
• Single Data Rate (SDR) data transfers
• Pipelined (PL) read operations
• Double Late Write (DLW) write operations
• Burst and non-burst read and write operations,
selectable via dedicated control pin (ADV)
• Internally controlled Linear Burst address
sequencing during burst operations
• Burst length of 2, 3, or 4, with automatic address
wrap
• Full read/write coherency
• Byte write capability
• Two cycle deselect
• Single-ended input clock (CLK)
• Data-referenced output clocks (CQ/CQ)
• Selectable output driver impedance via dedicated
control pin (ZQ)
• Echo clock outputs track data output drivers
• Depth expansion capability (2 or 4 banks) via
programmable chip enables (E2, E3, EP2, EP3)
• JTAG boundary scan (subset of IEEE standard
1149.1)
• 209 pin (11x19), 1mm pitch, 14mm x 22mm Ball
Grid Array (BGA) package
CC): 1.7V (min)
SigmaRAM Family Overview
The IS61NSCS series
the SigmaRAM pinout standard for synchronous SRAMs.
The implementations are 18,874,368-bit (18Mb) SRAMs.
These are the first in a family of wide, very low voltage
I/O SRAMs
implement economical high performance networking
systems.
ISSI’s
emulate other synchronous SRAMs, such as Burst RAMs,
NBT RAMs, Late Write, or Double Data Rate (DDR) SRAMs.
The logical differences between the protocols employed by
these RAMs hinge mainly on various combinations of
address bursting, output data registering and write cueing.
ΣΣ
ΣRAMs allow a user to implement the interface protocol best
ΣΣ
suited to the task at hand.
This specific product is Common I/O, SDR, Double Late
Write & Pipelined Read (same as Pipelined NBT) and in
the family is identified as 1x1Dp.
ADVANCE INFORMATION
JUNE 2001
Bottom View
209-Bump, 14 mm x 22 mm BGA
1 mm Bump Pitch, 11 x 19 Bump Array
ΣΣ
ΣRAMs are built in compliance with
ΣΣ
CMOS
designed to operate at the speeds needed to
ΣΣ
ΣRAMs are offered in a number of configurations that
ΣΣ
This document contains ADVANCE INFORMATION data. ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best
possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2001, Integrated Silicon Solution, Inc.
Integrated Silicon Solution, Inc. — 1-800-379-4774
ADVANCE INFORMATION Rev. 00A
06/19/01
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IS61NSCS25672
IS61NSCS51236 ISSI
Functional Description
Because SigmaRAM is a synchronous device, address,
data Inputs, and read/write control inputs are captured on
the rising edge of the input clock. Write cycles are
internally self-timed and initiated by the rising edge of the
clock input. This feature eliminates complex off-chip write
pulse generation required by asynchronous SRAMs and
simplifies input signal timing.
IS61NSCS25672 PINOUT
256K x 72 Common I/O—Top View
1234567891011
Single data rate ΣRAMs incorporate a rising-edge-triggered
output register. For read cycles, ΣRAM’s output data is
temporarily stored by the edge-triggered output register
during the access cycle and then released to the output
drivers at the next rising edge of clock.
IS61NSCS series
high performance CMOS technology and are packaged in
a 209-bump BGA.
ΣΣ
ΣRAMs are implemented with ISSI’s
ΣΣ
®
A DQg DQg A E2 A ADV A E3 A DQb DQb
(16M) (8M)
B DQg DQg Bc Bg NC W A Bb Bf DQb DQb
C DQg DQg Bh Bd NC E1 NC Be Ba DQb DQb
(128M)
D DQg DQg GND NC NC MCL NC NC GND DQb DQb
E DQPg DQPc VCCQ VCCQ VCC VCC VCC VCCQ VCCQ DQPf DQPb
F DQc DQc GND GND GND ZQ GND GND GND DQf DQf
G DQc DQc VCCQ VCCQ VCC EP2 VCC VCCQ VCCQ DQf DQf
H DQc DQc GND GND GND EP3 GND GND GND DQf DQf
J DQc DQc VCCQ VCCQ VCC M4 VCC VCCQ VCCQ DQf DQf
K CQ2 CQ2 CLK NC GND MCL GND NC NC CQ1 CQ1
L DQh DQh VCCQ VCCQ VCC M2 VCC VCCQ VCCQ DQa DQa
M DQh DQh GND GND GND M3 GND GND GND DQa DQa
N DQh DQh VCCQ VCCQ VCC SD VCC VCCQ VCCQ DQa DQa
P DQh DQh GND GND GND MCL GND GND GND DQa DQa
R DQPd DQPh VCCQ VCCQ VCC VCC VCC VCCQ VCCQ DQPa DQPe
T DQd DQd GND NC NC MCL NC NC GND DQe DQe
U DQd DQd NC A NC A NC A NC DQe DQe
(64M) (32M)
V DQd DQd A A A A1 A A A DQe DQe
W DQd DQd TMS TDI A A0 A TDO TCK DQe DQe
11 x 19 Bump BGA—14 x 22 mm2 Body—1 mm Bump Pitch
2
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IS61NSCS25672
IS61NSCS51236 ISSI
IS61NSCS51236 PINOUT
512K x 36 Common I/O—Top View
1234567891011
A NC NC A E2 A ADV A E3 A DQb DQb
(16M)
BNC NC Bc NC A W A Bb NC DQb DQb
(x36)
CNC NC NC Bd NC E1 NC NC Ba DQb DQb
(128M)
D NC NC GND NC NC MCL NC NC GND DQb DQb
E NC DQPc VCCQ V CCQ VCC VCC VCC V CCQ V CCQ NC DQPb
F DQc DQc GND GND GND ZQ GND GND GND NC NC
G DQc DQc VCCQ V CCQ VCC EP2 VCC V CCQ V CCQ NC NC
H DQc DQc GND GND GND EP3 GND GND GND NC NC
J DQc DQc VCCQ V CCQ VCC M4 VCC V CCQ V CCQ NC NC
K CQ2 CQ2 CLK NC GND MCL GND NC NC CQ1 CQ1
®
LNC NC VCCQ VCCQ VCC M2 VCC VCCQ VCCQ DQa DQa
M NC NC GND GND GND M3 GND GND GND DQa DQa
NNC NC VCCQ VCCQ VCC SD VCC VCCQ VCCQ DQa DQa
P NC NC GND GND GND MCL GND GND GND DQa DQa
R DQPd NC VCCQ VCCQ VCC VCC VCC VCCQ VCCQ DQPa NC
T DQd DQd GND NC NC MCL NC NC GND NC NC
U DQd DQd NC A NC A NC A NC NC NC
(64M) (32M)
V DQd DQd A A A A1 A A A NC NC
W DQd DQd TMS TDI A A0 A TDO TCK NC NC
11 x 19 Bump BGA—14 x 22 mm2 Body—1 mm Bump Pitch
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IS61NSCS25672
IS61NSCS51236 ISSI
PIN DESCRIPTION TABLE
Symbol Pin Location Description Type Comments
A A3, A5, A7, A9, B7, U4, Address Input —
U6, U8, V3, V4, V5, V6,
V7, V8, V9, W5, W6, W7
A B5 Address Input x36 version
ADV A6 Advance Input Acti ve High
Bx B3, C9 Byte Write Enable Input Active Low (all versions)
Bx B8, C4 Byte Write Enable Input
Active Low (x36 and x72 versions)
®
Bx B4, B9, C3, C8 Byte Write Enable Input
CK K3 Clock Input A ctive Hi gh
CQ K1, K11 Echo Clock Output Active High
CQ K2, K10 Echo Clock Output Active Low
DQ E2, F1, F2, G1, G2, H1, Data I/O Input/Output x36, and x72 versions
H2, J1, J2, L10, L11,
M10, M11, N10, N11,
P10, P11, R10
A10, A11, B10, B11, Data I/O Input/Output
C10, C11, D10, D11,
E11, R1, T1, T2, U1, U2,
V1, V2, W1, W2
DQ A1, A2, B1, B2, C1, C2, Data I/O Input/Output x72 version only
D1, D2, E1, E10, F10,
F11, G10, G11, H10,
H11, J10, J11, L1, L2,
M1, M2, N1, N2, P1, P2,
R2, R11, T10, T11, U10,
U11, V10, V11, W10,
W11
E1 C6 Chip Enable Input Active Low
E2 & E3 A4, A8 Chip Enable Input
EP2 & EP3 G6, H6 Chip Enable Program Pin Input —
Active Low (x72 version only)
Programmable Active High or Low
TCK W9 Test Clock Input A ctive Hig h
TDI W4 Test Data In Input —
TDO W8 Test Data Out Output —
TMS W3 Test Mode Select Input —
M2, M3 & M4 L6, M6, J6 Mode Control Pins Input —
SD N6 Slow Down Input Active Low
MCL B3, C9, D6, K6 Must Connect Low Input —
P6, T6, W6
4
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IS61NSCS25672
®
IS61NSCS51236 ISSI
PIN DESCRIPTION TABLE
Symbol Pin Location Description Type Comments
C5, D4, D5, D7, D8, K4,
NC K8, K9, T4, T5, T7, No Connect — Not connected to die (all versions)
T8, U3, U5, U7, U9
NC B5 No Connect — Not connected to die (x72 version)
NC C7 No Connect — Not connected to die (x72/x36 versions)
A1, A2, B1, B2, B4, B9,
C1, C2, C3, C8, D1, D2,
E1, E10, F10, F11, G10,
NC G11, H10, H11, J10, J11, No Connect — Not connected to die (x36 version)
L1, L2, M1, M2, N1, N2,
P1, P2, R2, R11, T10,
T11, U10, U11, V10,
V11, W10, W11
W B6 Write Input Active Low
E5, E6, E7, G5, G7,
VCC J5, J7, L5, L7, N5, Core Power Supply Input 1.8 V Nominal
N7, R5, R6, R7
E3, E4, E8, E9, J3, J4,
VCCQ J8, J9, L3, L4, L8, Output Driver Power Supply Input 1.8 V or 1.5 V Nominal
L9, N3, N4, N8, N9,
R3, R4, R8, R9
D3, D9, F3, F4, F5, F7,
F8, F9, H3, H4, H5, H7,
GND H8, H9, K5, K7, M3, M4, Ground Input —
M5, M7, M8, M9, P3, P4,
P5, P7, P8, P9, T3, T9
ZQ F6 Output Impedance Control Input Low = Low Impedance [High Drive]
High = High Impedance [Low Drive]
Default = High
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IS61NSCS25672
IS61NSCS51236 ISSI
BACKGROUND
The central characteristics of the ISSI ΣRAMs are that
they are extremely fast and consume very little power.
Because both operating and interface power is low,
ΣRAMs can be implemented in a wide (x72) configuration,
providing very high single package bandwidth (in excess
of 20 Gb/s in ordinary pipelined configuration) and very low
random access latency (5 ns). The use of very low voltage
circuits
in the core and 1.8V or 1.5V interface voltages allow
the speed, power and density performance of ΣRAMs.
Although the
to support a number of different common read and write
protocol options, not all SigmaRAM implementations will
support all possible
provide a quick comparison between read and write
protocols options available in the context of the SigmaRAM
Sigma
RAM
family pinouts
protocols. The following timing diagrams
have been designed
COMMON I/O SigmaRAM FAMILY MODE COMPARISON—LATE WRITE VS. DOUBLE LATE WRITE
standard. This data sheet covers the single data rate
DDR)
, Double Late Write, Pipelined Read SigmaRAM.
The character of the applications for fast synchronous
SRAMs in networking systems are extremely diverse.
ΣRAMs have been developed to address the diverse
needs of the networking market in a manner that can be
supported with a unified development and manufacturing
infrastructure. ΣRAMs address each of the bus protocol
options commonly found in networking systems. This
allows the ΣRAM to find application in radical shrinks and
speed-ups of existing networking chip sets that were
designed for use with older SRAMs, like the NBT or Nt,
Late Write, or Double Data Rate SRAMs, as well as with
new chip sets and ASIC’s that employ the Echo Clocks
and realize the full potential of the ΣRAMs.
(non-
®
Double Late Write—Pipelined Read (
CK
Address
Control
DQ
CQ
Late Write—Pipelined Read (
CK
Address
A B C D E F
R W R W R W
QA DB QC DD QE
ΣΣ
Σ1x1Lp). For reference only.
ΣΣ
A B C D E F
ΣΣ
Σ1x1Dp). For reference only.
ΣΣ
6
Control
DQ
CQ
R X W R X W
QA DC QD DF
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IS61NSCS25672
IS61NSCS51236 ISSI
®
Double Data Rate Write—Double Data Rate Read (
CK
Address
Control
DQ
CQ
A B C D E F
R X W R X W
QA0 QA1 QD0 QD1
ΣΣ
Σ1x2Lp). For reference only.
ΣΣ
DC0
Mode Selection Truth Table Standard
Name M2 M3 M4 Function Analogous to... In This Data Sheet?
Σ1x2Lp 0 1 1
Σ1x1Dp 1 0 1
Double Late Write, Pipelined Read Pipelined NBT SRAM
DDR
Double Data Rate SRAM
No
Yes
DF0DC1
Σ1x1Lp 1 1 0
Notes:
All address, data and control inputs (with the exception of EP2, EP3, and the mode pins, M2–M4) are synchronized to rising clock
edges. Read and write operations must be initiated with the Advance/Load pin (ADV) held low, in order to load the new address.
Device activation is accomplished by asserting all three of the Chip Enable inputs (E1, E2, and E3). Deassertion of any one of the
Enable inputs will deactivate the device. It should be noted that ONLY deactivation of the RAM via E2 and/or E3 deactivates the
Echo Clocks, CQ1–CQn.
READ OPERATIONS
Pipelined Read
Read operation is initiated when the following conditions
are satisfied at the rising edge of clock: All three chip
enables
signal
The address presented to the address inputs is latched into
the address register and presented to the memory core
and control logic. The control logic determines that a read
access is in progress and allows the requested data to
(E1, E2, and E3)
(W)
is deasserted high, and ADV is asserted low.
are active, the write enable input
Late Write, Pipelined Read Pipelined Late Write SRAM
WRITE OPERATIONS
Write operation occurs when the following conditions are
satisfied at the rising edge of clock: All three chip enables
(E1, E2, and E3) are active and the write enable input
signal (W) is asserted low.
Double Late Write
Double Late Write means that Data In is required on the
third rising edge of clock. Double Late Write is used to
implement Pipeline mode NBT SRAMs.
No
propagate to the input of the output register. At the next
rising edge of clock the read data is allowed to propagate
through the output register and onto the output pins.
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IS61NSCS25672
IS61NSCS51236 ISSI
Single Data Rate Pipelined Read
CLK
®
Address
E1
W
DQ
CQ
A XX C D E F
Read Deselect Read Read Read
Double Late Write with Pipelined Read
QA QC QD
CLK
Address
E1
W
DQ
CQ
8
A B C D E F
QA DB QC DD
Read Write Read Write Read Write
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IS61NSCS25672
IS61NSCS51236 ISSI
SPECIAL FUNCTIONS
®
Slow Down Mode
The SD pin allows the user to activate a delay element in
the on-chip clock chain that is routed to the data and echo
Clock output drivers. Activating Slow Down mode by
pulling the SD pin low introduces extra delay in every
Burst Order
The burst address counter wraps around to its initial state
after four addresses (the loaded address and three more)
have been accessed. SigmaRAMs always count in linear
burst order.
synchronous output driver specification. Address, control
and data input specifications are not affected by Slow
Down Mode. See “Slow Down Mode Clock to Data Out and
Clock to Echo Clock Timing” table for specifics.
Linear Burst Order
Burst Cycles
ΣΣ
ΣRAMs provide an on-chip burst address generator that
ΣΣ
can be utilized, if desired, to further simplify burst read or
write implementations. The ADV control pin, when driven
high, commands the
ΣΣ
ΣRAM to advance the internal ad-
ΣΣ
dress counter and use the counter generated address to
read or write the
cycle in a burst cycle series is loaded into the
ΣΣ
ΣRAM. The starting address for the first
ΣΣ
ΣΣ
ΣRAM by
ΣΣ
driving the ADV pin low, into Load mode.
1st address 00 01 10 11
2nd address 01 10 11 00
3rd address 10 11 00 01
4th address 11 00 01 10
Note:
1. The burst counter wraps to initial state on the 5th rising edge
of clock.
Sigma Pipelined Burst Reads with Counter Wrap-around
A[1:0] A[1:0] A[1:0] A[1:0]
CLK
External
Address
Internal
Address
E1
W
ADV
DQ
CQ
A2 XX XX XX XX XX
A2 A3 A0 A1 A2 A3
Counter Wraps
QA2 QA3 QA0 QA1
Read Continue Continue Continue Continue
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IS61NSCS25672
IS61NSCS51236 ISSI
Echo Clock
ΣΣ
ΣRAMs feature Echo Clocks, CQ1,CQ2, CQ1, and CQ2
ΣΣ
that track the performance of the output drivers. The Echo
Clocks are delayed copies of the main RAM clock, CLK.
Echo Clocks are designed to track changes in output
driver delays due to variance in die temperature and
supply voltage. The Echo Clocks are designed to fire with
the rest of the data output drivers. Sigma RAMs provide
both in-phase, or true, Echo Clock outputs (CQ1 and
CQ2) and inverted Echo Clock outputs (CQ1 and CQ2).
It should be noted that deselection of the RAM via E2 and
E3 also deselects the Echo Clock output drivers. The
deselection of Echo Clock drivers is always pipelined to
Echo Clock Control in Two Banks of Sigma Pipelined SRAMs
the same degree as output data. Deselection of the RAM
via E1 does not deactivate the Echo Clocks.
In some applications it may be appropriate to pause
between banks; to deselect both RAMs with E1 before
resuming read operations. An E1 deselect at a bank
switch will allow at least one clock to be issued from the
new bank before the first read cycle in the bank. Although
the following drawing illustrates a E1 read pause upon
switching from Bank 1 to Bank 2, a write to Bank 2 would
have the same effect, causing the RAM in Bank 2 to issue
at least one clock before it is needed.
®
CLK
Address
E1
E2 Bank 1
E2 Bank 2
DQ Bank 1
DQ Bank 2
CQ Bank 1
CQ Bank 2
A B C D E F
QA QC
QB QD
CQ1+ CQ2
Read Read Read Read Read Read
Note:
E1 does not deselect the Echo Clock Outputs. Echo Clock outputs are synchronously deselected by E2 or E3 being sampled false.
10
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IS61NSCS51236 ISSI
Echo Clock Continued:
It should be noted that deselection of the RAM via E2 and
E3 also deselects the Echo Clock output drivers. The
deselection of Echo Clock drivers is always pipelined to
the same degree as output data. Deselection of the RAM
via E1 does not deactivate the Echo Clocks.
In some applications it may be appropriate to pause
between banks; to deselect both RAMs with E1 before
resuming read operations. An E1 deselect at a bank
switch will allow at least one clock to be issued from the
new bank before the first read cycle in the bank.
Pipelined Read Bank Switch with E1 Deselect
Although the following drawing illustrates a E1 read pause
upon switching from Bank 1 to Bank 2, a write to Bank 2
would have the same effect, causing the RAM in Bank 2
to issue at least one clock before it is needed.
®
CLK
Address
E1
E2 Bank 1
E2 Bank 2
DQ Bank 1
DQ Bank 2
CQ Bank 1
CQ Bank 2
A XX C D E F
QA
QC QD
CQ1+ CQ2
Read No Op Read Read Read Read
Note:
E1 does not deselect the Echo Clock Outputs. Echo Clock outputs are synchronously deselected by E2 or E3 being sampled false.
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IS61NSCS25672
IS61NSCS51236 ISSI
Output Driver Impedance Control
SigmaRAMs may be supplied with either selectable (high) impedance output drivers. The ZQ pin of SigmaRAMs supplied
with selectable impedance drivers, allows selection between ΣRAM nominal drive strength (ZQ low) for multi-drop bus
applications and low drive strength (ZQ floating or high) point-to-point applications. The impedance of the data and clock
output drivers in these devices can be controlled via the static input ZQ. When ZQ is tied "low", output driver impedance
is set to ~25 Ω. When ZQ is tied "high" or left unconnected, output driver impedeance is set to ~50Ω. See the DC Electrical
Characteristics section for further information. The SRAM requires 32K cycles of power-up time after VCC reaches its
operating range.
Output Driver Characteristics - TBD
®
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IS61NSCS51236 ISSI
Programmable Enables
SRAMs feature two user-programmable chip enable inputs,
E2 and E3. The sense of the inputs, whether they function
as active low or active high inputs, is determined by the
state of the programming inputs, EP2 and EP3. For
example, if EP2 is held at V
CC , E2 functions as an active
high enable. If EP2 is held to GND , E2 functions as an
active low chip enable input.
BANK ENABLE TRUTH TABLE
EP2 EP3 E2 E3
Bank 0 GND GND Active Low Active Low
Programmability of E2 and E3 allows four banks of depth
expansion to be accomplished with no additional logic. By
programming the enable inputs of four SRAMs in binary
sequence (00, 01, 10, 11) and driving the enable inputs
with two address inputs, four SRAMs can be made to look
like one larger RAM to the system.
®
Bank 1 GND Vcc Active Low Active High
Bank 2 Vcc GND Active High Active Low
Bank 3 Vcc Vcc Active High Active High
EXAMPLE FOUR BANK DEPTH EXPANSION SCHEMATIC
A0-An
E1
CLK
W
DQ0-DQn
Bank 0 Bank 1 Bank 2 Bank 3
A
0-An-2
A
n-1
A
n
A
A
E3
E3
E2
E2
E1
E1
CLK
CLK
W
W
DQ
DQ
CQ
CQ
A
0-An-2
A
n-1
A
n
A
A
E3
E3
E2
E2
E1
E1
CLK
CLK
W
W
DQ
DQ
CQ
CQ
A
0-An-2
A
n-1
A
n
A
A
E3
E3
E2
E2
E1
E1
CLK
CLK
W
W
DQ
DQ
CQ
CQ
A
0-An-2
A
n-1
A
n
A
A
E3
E3
E2
E2
E1
E1
CLK
CLK
W
W
DQ
DQ
CQ
CQ
CQ
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IS61NSCS25672
IS61NSCS51236 ISSI
SYNCHRONOUS TRUTH TABLE
CLK E1 E ADV WBW Previous Current Operation DQ/CQ DQ/CQ
(tn) (tn) (tn) (tn) (tn) Operation (tn) (tn+1)
→→
0
→1 X F 0 X X X Bank Deselect *** Hi-Z
→→
→→
0
→1 X X 1 X X Bank Deselect
→→
→→
0
→1 1 T 0 X X X Deselect *** Hi-Z/CQ
→→
→→
0
→1 X X 1 X X Deselect Deselect (Continue) Hi-Z/CQ Hi-Z/CQ
→→
→→
0
→1 0 T 0 0 T X Write *** Dn/CQ
→→
→→
0
→1 0 T 0 0 F X Write (Abort) *** Hi-Z/CQ
→→
→→
0
→1 X X 1 X T Write Write Continue Dn-1/CQ Dn/CQ
→→
→→
0
→1 X X 1 X F Write Write Continue (Abort) Dn-1/CQ Hi-Z/CQ
→→
→→
0
→1 0 T 0 1 X X Read *** Qn/CQ
→→
→→
0
→1 X X 1 X X Read Read Continue Qn-1/CQ Qn/CQ
→→
Notes:
1. If E2 = EP2 and E3 = EP3 then E = “T” else E = “F”.
2. If one or more BWx = 0 then BW = “T” else BW = “F”.
3. “1” = input “high”; “0” = input “low”; “X” = input “don’t care”; “T” = input “true”; “F” = input “false”.
4. “***” indicates that the DQ input requirement/output state and CQ output state are determined by the previous operation.
5. DQs are tri-stated in response to Bank Deselect, Deselect, and Write commands, one full cycle after the command is sampled.
6. CQs are tri-stated in response to Bank Deselect commands only, one full cycle after the command is sampled.
7. Up to 3 Continue operations may be initiated after iniating a Read or Write operation to burst transfer up to 4 distinct pieces of data per single
external address input. If a fourth (4th) Continue operation is initiated, the internal address wraps back to the initial external (base) address.
Bank Deselect (Continue)
Loads new address
Stores DQx if BWx = 0
Loads new address
No data stored
Increments address by 1
Stores DQx if BWx = 0
Increments address by 1
No data stored
Loads new address
Increments address by 1
Hi-Z Hi-Z
(tn)
(tn-1) (tn)
(tn-1)
(tn)
(tn-1) (tn)
®
14
Integrated Silicon Solution, Inc. — 1-800-379-4774
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IS61NSCS25672
IS61NSCS51236 ISSI
READ/WRITE CONTROL STATE DIAGRAM
®
0,T,0,0
X,X,1,X
0,T,0,1
0,T,0,1
X,X,1,X
READ
CONTINUE
READ
1,T,0,X
X,F,0,X
1,T,0,X
0,T,0,0
0,T,0,1
X,F,0,X or
X,X,1,X
0,T,0,1
1,T,0,X or
X,X,1,X
X,F,0,X
BANK
DESELECT
X,F,0,X
DESELECT
1,T,0,X
0,T,0,0
X,F,0,X
X,X,1,X
1,T,0,X
0,T,0,1
0,T,0,0
0,T,0,0
0,T,0,1
X,F,0,X
0,T,0,0
WRITE
CONTINUE
WRITE
1,T,0,X
X,X,1,X
Notes:
1. The notation “X,X,X,X” controlling the state transitions above indicate the states of inputs E1, E, ADV, and W respectively.
2. If (E2 = EP2 and E3 = EP3) then E = “T” else E = “F”.
3. “1” = input “high”; “0” = input “low”; “X” = input “don’t care”; “T” = input “true”; “F” = input “false”.
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15
IS61NSCS25672
IS61NSCS51236 ISSI
Current State & Next State Definition for Read/Write Control State Diagram
n n+1 n+2 n+3
CK
®
Command
Current State Next State
ƒ ƒ ƒ ƒ
KEY
Current State (n)
Input Command Code
ƒ Transition
Next State (n+1)
ABSOLUTE MAXIMUM RATINGS
(All voltages reference to GND )
Symbol Description Value Unit
VCC Voltage on VCC Pins –0.5 to 2.5 V
VCCQ Voltage in VCCQ Pins –0.5 to 2.3V V
VI/O Voltage on I/O Pins –0.5 to VCCQ +0.5 (≤ 2.3 V max.) V
VIN Voltage on Other Input Pins –0.5 to VCCQ +0.5 (≤ 2.3 V max.) V
IIN Input Current on Any Pin ±100 mA dc
IOUT Output Current on Any Pin ±100 mA dc
TJ Maximum Junction Temperature 125 °C
TSTG Storage Temperature -55 to 125 °C
Note:
Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Operation should be limited to Recommended
Operating Conditions. Exposure to conditions exceeding Recommended Operating Conditions, for an extended period of time, may
affect reliability of this component.
POWER SUPPLY CHARACTERISTICS (TA = 0 min., 25 typ, 70 max °C)
Symbol Parameter Min. Typ. Max. Unit
VCC Supply Voltage 1.7 1.8 1.9 V
(1)
VCCQ
Note:
1. Unless otherwise noted, all performance specifications quoted are evaluated for worst case at both 1.4 V ≤ VCCQ ≤ 1.6V
(i.e., 1.5 V I/O) and 1.7 V ≤ V
16
1.8 V I/O Supply Voltage 1.7 1.8 VCC V
1.5 V I/O Supply Voltage 1.4 1.5 1.6 V V
CCQ ≤ 1.95 V (i.e., 1.8 V I/O) and quoted at whichever condition is worst case.
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ADVANCE INFORMATION Rev. 00A
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IS61NSCS25672
IS61NSCS51236 ISSI
CMOS I/O DC Input Characteristics
Symbol Parameter VCCQ Min. Typ. Max. Unit
®
VIH CMOS Input High Voltage 1.8 1.2 —
1.5 1.0 —
VCCQ + 0.3
VCCQ + 0.3
VIL CMOS Input Low Voltage 1.8 –0.3 — 0.6 V
1.5 –0.3 — 0.5
Note:
For devices supplied with CMOS input buffers. Compatible with both 1.8 V and 1.5 V I/O drivers.
Undershoot Measurement and Timing Overshoot Measurement and Timing
IH
V
GND
50%
GND - 1.0V
CC
V
+ 1.0V
50%
V
CC
20% t
KC
V
20% tKC
V
IL
I/O CAPACITANCE (TA = 25 °C, f = 1 MHZ)
Symbol Parameter Test conditions Min. Max. Unit
CA Address Input Capacitance VIN = 0 V — 3.5 pF
CB Control Input Capacitance VIN = 0 V — 3.5 pF
CCK Clock Input Capacitance VIN = 0 V — 3.5 pF
CDQ Data Output Capacitance VOUT = 0 V — 4.5 pF
CCQ CQ Clock Output Capacitance VOUT = 0 V — 4.5 pF
Note: These parameters are sampled and not 100% tested.
Integrated Silicon Solution, Inc. — 1-800-379-4774
ADVANCE INFORMATION Rev. 00A
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17
IS61NSCS25672
IS61NSCS51236 ISSI
AC TEST CONDITIONS
(VCC = 1.8V ± 0.1V, TA = 0 to 85°C)
Parameter Symbol Conditions Units
VCCQ 1.5V±0.1 1.8 ±0.1 V
Input High Level VIH 1.25 1.4 V
Input Low Level VIL 0.25 0.4 V
Input Rise & Fall Time 2.0 2.0 V/ns
Input Reference Level 0.75 0.9 V
Clock Input High Voltage VKIH 1.25 1.4 V
Clock Input Low Voltage VKIL 0.25 0.4 V
Clock Input Rise & Fall Time 2.0 2.0 V/ns
Clock Input Reference Level 0.75 0.9 V
Output Reference Level 0.75 0.9 V
Output Load Conditions ZQ = VIH see below see below
Notes:
1. Include scope and jig capacitance.
2. Test conditions as specified with output loading as shown unless otherwise noted.
®
AC TEST LOADS
CCQ
= 1.5V
V
0.75V
50Ω
16.7Ω
16.7Ω
DQ
16.7Ω
50Ω
5 pF
50Ω
5 pF
50Ω
0.75V
Figure 1 (VCCQ = 1.5V) Figure 2 (VCCQ = 1.8V)
CCQ
V
16.7Ω
DQ
= 1.8V
16.7Ω
16.7Ω
0.9V
50Ω
50Ω
5 pF
50Ω
5 pF
50Ω
0.9V
18
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IS61NSCS25672
IS61NSCS51236 ISSI
INPUT AND OUTPUT LEAKAGE CHARACTERISTICS
Symbol Parameter Test Conditions Min. Max. Units
IIL Input Leakage Current VIN = 0 to VCC –22µA
(except mode pins)
IINM Mode Pin Input Current VCC ≥ VIN ≥ VIL –100 2 µA
0V ≤ VIN ≤ VIL –22
IOL Output Leakage Current Output Disable, –22µA
VOUT = 0 to VCCQ
SELECTABLE IMPEDANCE OUTPUT DRIVER DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Test Conditions Min. Max. Units
(1)
VOHL
(1)
VOLL
(2)
VOHH
(2)
VOLH
Notes:
1. ZQ = 1; High Impedance output driver setting
2. ZQ = 0; Low Impedance output driver setting
Low Drive Output High Voltage IOHL = –4 mA VCCQ – 0.4 — V
Low Drive Output Low Voltage IOLL = 4 mA — 0.4 V
High Drive Output High Voltage IOHH = –8 mA VCCQ – 0.4 — V
High Drive Output Low Voltage IOLH = 8 mA — 0.4 V
®
OUTPUT RESISTANCE
Symbol Parameter Test Conditions Min. Typ. Max. Units
ROUT Output Resistance
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VOH, VOL = VCCQ/2
ZQ = VIL
VOH, VOL = VCCQ/2
ZQ = VIH
17 25 33 Ω
35 50 65 Ω
19
IS61NSCS25672
IS61NSCS51236 ISSI
OPERATING CURRENTS
Symbol Parameter Test Conditions -333 -300 -250 Units
Com. Ind. Com. Ind. Com. Ind.
ICCP Pipeline Operating Current E1 < VIL Max. Pipeline x72 mA
tKHKH > tKHKH Min. x36
All other inputs Flow-through x72
ICCF Flow-through Operating Current VIL = VIN > VIH x36
ISB1 Bank Deselect Current E1 < VIH Min. or Pipeline x72 mA
& & E2 or E3 False x36
ISB2 Chip Disable Current tKHKH > tKHKH Min. Flow-through x72
All other inputs x36
VIL > VIN > VIH
IDD3 CMOS Deselect Current Device Deselected Pipeline x72 mA
All inputs x36
GND+0.10V > VIN > VCC–0.10V
Flow-through x72
x36
®
ICC Average Power Supply IOUT = 0mA Pipeline x72 750 mA
Operating Current VIN = VIH or VIL x36 550
Flow-through x72
x36
ICC2 Power Supply Deselect IOUT = 0mA Pipeline x72 250 mA
Operating Current VIN = VIH or VIL x36
Flow-through x72
x36
Note: Com. = 0°C to 70°C
Ind. = –40°C to +85°C
DC ELECTRICAL CHARACTERISTICS
(VCC = 1.8V ±0.1V, GND = 0V, TA = 0° to 85°C)
Symbol Parameter Test Conditions Min Typ Max Units
ILI Input Leakage Current VIN = GND to VCCQ -5 — 5uA
(Address, Control, Clock)
IMLI Input Leakage Current VMIN = GND to VCC -10 — 10 uA
(EP2, EP3, M2, M3, M4, ZQ)
IDLI Input Leakage Current VDIN = GND to VCCQ -10 — 10 uA
(Data)
20
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IS61NSCS25672
IS61NSCS51236 ISSI
AC ELECTRICAL CHARACTERISTICS
-333 -300 -250
Symbol Parameter Min Max Min Max Min Max Unit
tKHKH Clock Cycle Time 3.0 — 3.3 — 4.0 — ns
tKHKL Clock HIGH Time 1.2 — 1.3 — 1.5 — ns
tKLKH Clock LOW Time 1.2 — 1.3 — 1.5 — ns
(2)
tKHCX1
tKHCH Clock High to Echo Clock High 0.5 1.5 0.5 1.7 0.5 2.0 ns
(2)
tCHCL
tKLCL Clock Low to Echo Clock Low 0.5 1.5 0.5 1.7 0.5 2.0 ns
(2)
tCLCH
(1, 2)
tKHCZ
(1)
tKHQX1
tKHQV Clock High to Output Valid — 1.6 — 1.8 — 2.1 ns
Clock High to Echo Clock Low-Z 0.5 — 0.5 — 0.5 — ns
Echo Clock High Time
Echo Clock Low Time
tKHKL ±200 ps tKHKL ±200 ps tKHKL ±250 ps
tKLKH ±200 ps tKLKH ±200 ps tKLKH ±250 ps
ns
ns
Clock High to Echo Clock High-Z — 1.5 — 1.7 — 2.0 ns
Clock High to Output in Low-Z 0.5 — 0.5 — 0.5 — ns
®
tKHQX Clock High to Output Invalid 0.5 — 0.5 — 0.5 — ns
(1)
tKHQZ
tCHQV
tCHQX
(2)
(2)
Clock High to Output in High-Z 0.5 1.6 0.5 1.8 0.5 2.1 ns
Echo Clock High to Output Valid — 0.4 — 0.4 — 0.5 ns
Output Invalid to Echo Clock High —–0.4 —–0.4 —–0.5 ns
tAVKH Address Valid to Clock High 0.6 — 0.7 — 0.8 — ns
tKHAX Clock High to Address Don’t Care 0.4 — 0.4 — 0.5 — ns
tEVKH Enable Valid to Clock High 0.6 — 0.7 — 0.8 — ns
tKHEX Clock High to Enable Don’t Care 0.4 — 0.4 — 0.5 — ns
tWVKH Write Valid to Clock High 0.6 — 0.7 — 0.8 — ns
tKHWX Clock High to Write Don’t Care 0.4 — 0.4 — 0.5 — ns
tBVKH Byte Write Valid to Clock High 0.6 — 0.7 — 0.8 — ns
tKHBX Clock High to Byte Write Don’t Care 0.4 — 0.4 — 0.5 — ns
tDVKH Data In Valid to Clock High 0.6 — 0.7 — 0.8 — ns
tKHDX Clock High to Data In Don’t Care 0.4 — 0.4 — 0.5 — ns
tadvVKH ADV Valid to Clock High 0.6 — 0.7 — 0.8 — ns
tKHadvX Clock High to ADV Don’t Care 0.4 — 0.4 — 0.5 — ns
Notes:
1. Measured at 100 mV from steady state. Not 100% tested.
2. Guaranteed by design. Not 100% tested.
3. For any specific temperature and voltage t
KHCZ < tKHCX1.
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21
IS61NSCS25672
IS61NSCS51236 ISSI
SLOW DONW MODE CLOCK TO DATA OUT and CLOCK TO ECHO CLOCK TIMING
-333 -300 -250
Symbol Parameter Min Max Min Max Min Max Unit
(2)
tKHCX1
tKHCH Clock High to Echo Clock High 1.1 2.4 1.1 2.6 1.1 3.1 ns
(2)
tCHCL
(2)
tCLCH
(1, 2)
tKHCZ
(1)
tKHQX1
tKHQV Clock High to Output Valid — 2.5 — 2.7 — 3.2 ns
tKHQX Clock High to Output Invalid 1.1 — 1.1 — 1.1 — ns
(1)
tKHQZ
(2)
tCHQV
(2)
tCHQX
Notes:
1. Measured at 100 mV from steady state. Not 100% tested.
2. Guaranteed by design. Not 100% tested.
3. For any specific temperature and voltage t
Clock High to Echo Clock Low-Z 1.1 — 1.1 — 1.1 — ns
Echo Clock High Time tKHKL ±300 ps tKHKL ±300 ps
Echo Clock Low Time tKLKH ±300 ps tKLKH ±300 ps
tKHKL ±350 ps
tKLKH ±350 ps
ns
ns
Clock High to Echo Clock High-Z 1.1 2.4 1.1 2.6 1.1 3.1 ns
Clock High to Output in Low-Z 1.1 — 1.1 — 1.1 — ns
Clock High to Output in High-Z 1.1 2.5 1.1 2.7 1.1 3.2 ns
Echo Clock High to Output Valid — 0.5 — 0.5 — 0.6 ns
Echo Clock High to Output Invalid —–0.5 —–0.5 —–0.6 ns
KHCZ < tKHCX1.
®
22
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IS61NSCS25672
E
IS61NSCS51236 ISSI
TIMING PARAMETER KEY—PIPELINED READ CYCLE TIMING
t
CK
t
AVK H
t
KHAX
KHKH
t
KLKH
t
KHKL
®
DQ (DDR)
C
t
KHQV
t
KHQX1
DE
t
KHQZ
t
KHQX
QB
t
CHQX
t
KHCZ
t
t
KHCX1
KHCH
t
CHQV
t
CHCL
t
CLCH
CQ
= CQ High Z
TIMING PARAMETER KEY—DOUBLE LATE WRITE MODE CONTROL AND DATA IN TIMING
CK
t
KHAX
t
AVK H
A
A
t
nVKH
BC
t
KHnX
1, E2, E3
W, Bn, ADV
t
DVK H
DQ
DA
t
KHDX
Note: tnVKH = tEVKH, tWVKH, tBVKH, etc. and tKHnX = tKHEX, tKHWX, tKHBX, etc.
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IS61NSCS25672
IS61NSCS51236 ISSI
JTAG PORT OPERATION
Overview
These devices provide a
Boundary Scan interface using a limited set of IEEE std.
1149.1 functions. This test mode is intended to provide a
mechanism for testing the interconnect between master
(processor, controller, etc.), SRAMs, other components,
and the printed circuit board.
In conformance with a subset of IEEE std. 1149.1, these
devices contain a TAP Controller and four TAP Registers.
The TAP Registers consist of one Instruction Register
JTAG
Test Access Port
(TAP)
and
and three Data Registers (ID, Bypass, and Boundary
Scan Registers).
Disabling the JTAG Port
It is possible to use this device without utilizing the JTAG
port. The port is reset at power-up and will remain inactive
unless clocked. To assure normal operation of the RAM
with the
and TMS may be left floating or tied to VCC . TDO should
be left unconnected.
JTAG
Port unused, TCK should be tied Low, TDI
®
JTAG PIN DESCRIPTIONS
Pin Pin Name I/O Description
TCK Test Clock In Clocks all TAP events. All inputs are captured on the rising edge of TCK and
all outputs propagate from the falling edge of TCK.
TMS Test Mode Select In The TMS input is sampled on the rising edge of TCK. This is the command input
for the TAP controller. An undriven TMS input will produce the same result as
a logic one input level.
TDI Test Data In In The TDI input is sampled on the rising edge of TCK. This is the input side of the
serial registers placed between TDI and TDO. The register placed between TDI
and TDO is determined by the state of the TAP Controller and the instruction
that is currently loaded in the TAP Instruction Register (refer to the TAP
Controller State Diagram). An undriven TDI pin will produce the same result as
a logic one input level.
TDO Test Data Out Out Output that is active depending on the state of the TAP Controller. Output
changes in response to the falling edge of TCK. This is the output side of the
serial registers placed between TDI and TDO.
Note:
This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while
TMS is held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.
24
Integrated Silicon Solution, Inc. — 1-800-379-4774
ADVANCE INFORMATION Rev. 00A
06/19/01
IS61NSCS25672
IS61NSCS51236 ISSI
®
JTAG PORT REGISTERS
Overview
The JTAG registers, refered to as Test Access Port (TAP)
registers, are selected (one at a time) via the sequences
of 1s and 0s applied to TMS as TCK is strobed. Each of
the TAP registers are serial shift registers that capture
serial input data on the rising edge of TCK and push serial
data out on the next falling edge of TCK. When a register
is selected, it is placed between the TDI and TDO pins.
Instruction Register
The Instruction Register holds the instructions that are
executed by the TAP controller when it is moved into the
Run, Test/Idle, or the various data register states. Instructions are 3 bits long. The Instruction Register can be
loaded when it is placed between the TDI and TDO pins.
The Instruction Register is automatically preloaded with
the IDCODE instruction at power-up or whenever the
controller is placed in Test-Logic-Reset state.
Bypass Register
The Bypass Register is a single-bit register that can be
placed between TDI and TDO. It allows serial test data to
be passed through the RAM’s JTAG Port to another
device in the scan chain with as little delay as possible.
Boundary Scan Register
The Boundary Scan Register is a collection of flip flops that can be
preset by the logic level found on the RAM’s input or I/O pins. The
flip flops are then daisy chained together so the levels found can be
shifted serially out of the JTAG Port’s TDO pin. The Boundary Scan
Register also includes a number of place holder flip flops (always set
to a logic 1). The relationship between the device pins and the bits
in the Boundary Scan Register is described in the following Scan
Order Table. The Boundary Scan Register, under the control of the
TAP Controller, is loaded with the contents of the RAMs I/O ring
when the controller is in Capture-DR state and then is placed
between the TDI and TDO pins when the controller is moved to
Shift-DR state. SAMPLE-Z, SAMPLE/PRELOAD and EXTEST
instructions can be used to activate the Boundary Scan Register.
JTAG TAP Block Diagram
TDI
TMS
TCK
0
Bypass Register
2 1 0
Instruction Register
31 30 29 2 1 0
ID Code Register
n 2 1 0
Boundary Scan Register
Test Access Port (TAP) Controller
. . .
. . . . .
TDO
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25
IS61NSCS25672
IS61NSCS51236 ISSI
®
Identification (ID) Register
The ID Register is a 32-bit register that is loaded with a
device and vendor specific 32-bit code when the controller
is put in Capture-DR state with the IDCODE command
loaded in the Instruction Register. The code is loaded from
a 32-bit on-chip ROM. It describes various attributes of
the RAM as indicated below. The register is then placed
between the TDI and TDO pins when the controller is
moved into Shift-DR state. Bit 0 in the register is the LSB
and the first to reach TDO when shifting begins.
ID Register Contents
Die I/O ISSI Technology
Revision Not Used
Code ID Code
Bit # 31302928 27262524 2322212019 1817161514 1312 1110 9 8 7 6 5 4 3 2 1 0
x72 XXXX00000000000011 00 00011010101 1
x36 XXXX00000000000010 0000011 010101 1
Configuration
JEDEC Vendor
Presence Register
JTAG TAP CONTROLLER STATE DIAGRAM
Test Logic Reset
10
Run Test Idle
00
11 1
Select DR
11
Capture DR
Shift DR
11
Exit1 DR
Pause DR
Exit2 DR
1
Update DR
Select IR
0
Capture IR
0
0
1
0
0
0
0
1
0
Shift IR
1
Exit1 IR
0
Pause IR
11
Exit2 IR
11
Update IR
0
0
0
0
26
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IS61NSCS25672
IS61NSCS51236 ISSI
®
TAP CONTROLLER INSTRUCTION SET
When the
two least significant bits of the instruction register are
Overview
There are two classes of instructions defined in the
Standard
device specific (private) instructions.
are mandatory for
instructions must be implemented in prescribed ways.
The TAP on this device may be used to monitor all input
and I/O pads.This device will not perform INTEST but can
1149.1-1990
1149.1
; standard (
public
) instructions, and
Some public instructions
compliance. Optional public
loaded with 01. When the controller is moved to the
state, the Instruction Register is placed between TDI and
TDO. In this state the desired instruction is serially loaded
through the TDI input (while the previous contents are
shifted out at TDO). For all instructions, the TAP executes
newly loaded instructions only when the controller is
moved to Update-IR state. The TAP instruction set for this
device is listed in the
preform the preload portion of the SAMPLE/PRELOAD
command.
JTAG TAP Instruction Set Summary
Instruction Code Description
EXTEST
IDCODE
SAMPLE-Z
RFU
SAMPLE/PRELOAD
Private
RFU
BYPASS
Notes:
1. Instruction codes expressed in binary, MSB on left, LSB on right.
2. Default instruction automatically loaded at power-up and in Test-Logic-Reset state.
(1)
000 Places the Boundary Scan Register between TDI and TDO. When EXTEST is
selected, data will be driven out of the DQ pad.
(1,2)
(1)
001 Preloads ID Register and places it between TDI and TDO.
010 Captures I/O ring contents. Places the Boundary Scan Register between TDI
and TDO. Forces all Data and Clock output drivers to High-Z.
(1)
011 Do not use this instruction; Reserved for Future Use. Replicates BYPASS
instruction. Places Bypass Register between TDI and TDO.
(1)
100
(1)
(1)
(1)
101 Private instruction.
110 Do not use this instruction; Reserved for Future Use.
111 Places Bypass Register between TDI and TDO.
Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO.
TAP
controller is placed in
JTAG TAP
Capture-IR
state, the
Shift-IR
Instruction Set Summary.
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27
IS61NSCS25672
IS61NSCS51236 ISSI
JTAG DC RECOMMENDED OPERATING CONDITIONS (TA = 0 to 85°C)
Symbol Parameter Test Conditions Min. Max. Unit
VTIH JTAG Input High Voltage 1.2 VCC +0.3 V
VTIL JTAG Input Low Voltage -0.3 0.6 V
VTOH JTAG Output High Voltage CMOS ITOH = -100µΑ VCC-0.1 — V
TTL ITOH = -8m Α VCC-0.4 —
VTOL JTAG Output Low Voltage CMOS ITOL = 100µΑ — 0.1 V
TTL ITOL = 8m Α — 0.4
ITLI JTAG Input Leakage Current VTIN=GND to VCC -10 10 µΑ
®
JTAG AC TEST CONDITIONS (VCC = 1.8V ±0.1V, TA = 0 to 85°C)
Symbol Parameter Test Conditions Unit
VTIH JTAG Input High Voltage 1.6 V
VTIL JTAG Input Low Voltage 0.2 V
JTAG Input Rise & Fall Time 1.0 V/ns
JTAG Input Reference Level 0.9 V
JTAG Output Reference Level 0.9 V
JTAG Output Load Condition see AC TEST LOADS
28
Integrated Silicon Solution, Inc. — 1-800-379-4774
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06/19/01
IS61NSCS25672
IS61NSCS51236 ISSI
JTAG Port AC Electrical Characteristics
Symbol Parameter Min Max Unit
®
tTHTH
tTHTL
tTLTH
TCK Cycle Time
TCK High Pulse Width
TCK Low Pulse Width
20 — ns
8 — ns
8 — ns
tMVTH TMS Setup Time 5 — ns
tTHMX TMS Hold Time 5 — ns
tDVTH
tTHDX
tTLQV
tTLQX
TDI Set Up Time
TDI Hold Time
TCK Low to TDO Valid
TCK Low to TDO Hold
5 — ns
5 — ns
— 10 ns
0 — ns
JTAG Port Timing Diagram
t
t
THTL
TLTH
t
THTH
TCK
t
MVTHtTHMX
TMS
t
DVTHtTHDX
TDI
TDO
Integrated Silicon Solution, Inc. — 1-800-379-4774
ADVANCE INFORMATION Rev. 00A
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t
TLQX
t
TLQV
29
IS61NSCS25672
IS61NSCS51236 ISSI
INSTRUCTION DESCRIPTIONS
®
BYPASS
When the BYPASS instruction is loaded to the Instruction
Register, the Bypass Register is placed between TDI and
TDO. This occurs when the TAP controller is moved to the
Shift-DR state. This allows the board level scan path to be
shortened to facilitate testing of other devices in the scan
path.
SAMPLE/PRELOAD
SAMPLE/PRELOAD
instruction. When the
loaded in the
into the Capture-DR state loads the data in the RAMs input
and I/O buffers into the Boundary Scan Register. Some
Boundary Scan Register locations are not associated with
an input or I/O pin, and are loaded with the default state
identified in the BSDL file. Because the RAM clock is
independent from the TAP Clock (TCK) it is possible for
the TAP to attempt to capture the I/O ring contents while
the input buffers are in transition (i.e. in a metastable
state). Although allowing the TAP to sample metastable
inputs will not harm the device, repeatable results cannot
be expected. RAM input signals must be stabilized for
long enough to meet the TAP’s input data capture set-up
plus hold time (tTS plus tTH ). The RAM’s clock inputs need
not be paused for any other TAP operation except capturing the I/O ring contents into the Boundary Scan Register.
Moving the controller to Shift-DR state then places the
Boundary Scan Register between the TDI and TDO pins.
is a Standard 1149.1 mandatory public
SAMPLE/PRELOAD
Instruction Register
, moving the
instruction is
TAP
controller
EXTEST (EXTEST-A)
EXTEST is an IEEE 1149.1 mandatory public instruction.
It is to be executed whenever the instruction register is
loaded with all logic 0s. The EXTEST command does not
block or override the RAM’s input pins; therefore, the
RAM’s internal state is still determined by its input pins.
Typically, the Boundary Scan Register is loaded with the
desired pattern of data with the SAMPLE/PRELOAD
command. Then the EXTEST command is used to output
the Boundary Scan Register’s contents, in parallel, on the
RAM’s data output drivers on the falling edge of TCK when
the controller is in the Update-IR state.
Alternately, the Boundary Scan Register may be loaded in
parallel using the EXTEST command. When the EXTEST
instruction is selected, the state of all the RAM’s input and
I/O pins, as well as the default values at Scan Register
locations not associated with a pin (pin marked NC), are
transferred in parallel into the Boundary Scan Register on
the rising edge of TCK in the Capture-DR state, the RAM’s
output pins drive out the value of the Boundary Scan
Register location with which each output pin is associated.
IDCODE
The IDCODE instruction causes the ID ROM to be loaded
to the ID register when the controller is in Capture-DR
mode and places the ID register between the TDI and TDO
pins in Shift-DR mode. The IDCODE instruction is the
default instruction loaded in at power up and any time the
controller is placed in the Test-Logic-Reset state.
SAMPLE-Z
If the SAMPLE-Z instruction is loaded to the instruction
register, all RAM outputs are forced to inactive state
(high-Z) and the Boundary Scan Register is connected
between TDI and TDO when the TAP controller is moved
to the Shift-DR state.
RFU
These instructions are reserved for future use. In this
device they replicate the BYPASS instruction.
30
Integrated Silicon Solution, Inc. — 1-800-379-4774
ADVANCE INFORMATION Rev. 00A
06/19/01
IS61NSCS25672
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Boundary Scan Order Assignments (by Exit Sequence) -TBD
®
Integrated Silicon Solution, Inc. — 1-800-379-4774
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06/19/01
31
IS61NSCS25672
IS61NSCS51236 ISSI
ORDERING INFORMATION
®
Commercial Range: 0
256K x 72 250 IS61NSCS25672-250B 209-pin BGA
512K x 36 250 IS61NSCS51236-250B 209-pin BGA
Industrial Range: -40
°°
°C to 70
°°
Frequency Order Part No. Package
300 IS61NSCS25672-300B 209-pin BGA
333 IS61NSCS25672-333B 209-pin BGA
300 IS61NSCS51236-300B 209-pin BGA
333 IS61NSCS51236-333B 209-pin BGA
°°
°C to 85
°°
FrequencySpeed (ns) Order Part No. Package
°°
°C
°°
°°
°C
°°
TBD
32
®
ISSI
Integrated Silicon Solution, Inc.
2231 Lawson Lane
Santa Clara, CA 95054
Tel: 1-800-379-4774
Fax: (408) 588-0806
E-mail: sales@issi.com
www.issi.com
Integrated Silicon Solution, Inc. — 1-800-379-4774
ADVANCE INFORMATION Rev. 00A
06/19/01
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