Datasheet IS61LV3216-20T, IS61LV3216-20KI, IS61LV3216-20K, IS61LV3216-15TI, IS61LV3216-15KI Datasheet (ISSI)

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IS61LV3216 ISSI
®
32K x 16 LOW VOLTAGE CMOS STATIC RAM
• High-speed access time: 10, 12, 15, and 20 ns
• CMOS low power operation — 150 mW (typical) operating — 150 µW (typical) standby
• TTL compatible interface levels
• Single 3.3V ± 10% power supply
• Fully static operation: no clock or refresh required
• Three state outputs
• Industrial temperature available
• Available in 44-pin 400-mil SOJ package and 44-pin TSOP (Type 2)
FUNCTIONAL BLOCK DIAGRAM
DESCRIPTION
The ISSI IS61LV3216 is a high-speed, 512K static RAM organized as 32,768 words by 16 bits. It is fabricated using
ISSI's high-performance CMOS technology. This highly reli-
able process coupled with innovative circuit design tech­niques, yields fast access times with low power consumption.
When CE is HIGH (deselected), the device assumes a standby mode at which the power dissipation can be reduced down with CMOS input levels.
Easy memory expansion is provided by using Chip Enable and Output Enable inputs, CE and OE. The active LOW Write Enable (WE) controls both writing and reading of the memory.A data byte allows Upper Byte (UB) and Lower Byte (LB) access.
The IS61LV3216 is packaged in the JEDEC standard 44-pin 400-mil SOJ and 44-pin TSOP (Type 2).
NOVEMBER 1997
A0-A14
VCC
GND
I/O0-I/O7
Lower Byte
I/O8-I/O15
Upper Byte
CE
OE WE
UB
LB
ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2001, Integrated Silicon Solution, Inc.
DECODER
I/O
DATA
CIRCUIT
CONTROL
CIRCUIT
32K x 16
MEMORY ARRAY
COLUMN I/O
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
1
IS61LV3216 ISSI
®
PIN CONFIGURATIONS
44-Pin SOJ
NC
A14
A13
A12
A11
CE
I/O0
I/O1
I/O2
I/O3
Vcc
GND
I/O4
I/O5
I/O6
I/O7
WE
A10
A9
A8
A7
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A0
A1
A2
OE UB LB
I/O15
I/O14
I/O13
I/O12
GND
Vcc
I/O11
I/O10
I/O9
I/O8
NC
A3
A4
A5
A6
NC
44-Pin TSOP
NC A14 A13 A12 A11
CE
I/O0 I/O1 I/O2 I/O3
Vcc
GND
I/O4 I/O5 I/O6 I/O7
WE
A10
A9 A8 A7
NC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
A0 A1 A2 OE UB LB I/O15 I/O14 I/O13 I/O12 GND Vcc I/O11 I/O10 I/O9 I/O8 NC A3 A4 A5 A6 NC
PIN DESCRIPTIONS
A0-A14 Address Inputs
I/O0-I/O15 Data Inputs/Outputs
CE Chip Enable Input OE Output Enable Input WE Write Enable Input
LB Lower-byte Control (I/O0-I/O7) UB Upper-byte Control (I/O8-I/O15)
NC No Connection
Vcc Power
GND Ground
TRUTH TABLE
I/O PIN
Mode WE CE OE L B UB I/O0-I/O7 I/O8-I/O15 Vcc Current
Not Selected X H X X X High-Z High-Z ISB1, ISB2 Output Disabled H L H X X High-Z High-Z ICC
X L X H H High-Z High-Z
Read H L L L H DOUT High-Z ICC
H L L H L High-Z DOUT HLLLL DOUT DOUT
Write L L X L H DIN High-Z ICC
L L X H L High-Z DIN LLXLL DIN DIN
2
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
IS61LV3216 ISSI
®
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
VCC Supply Voltage with Respect to GND –0.5 to +4.6 V VTERM Terminal Voltage with Respect to GND –0.5 to Vcc + 0.5 V TSTG Storage Temperature –65 to +150 °C PT Power Dissipation 1.0 W IOUT DC Output Current (LOW) 20 mA
OPERATING RANGE
Range Ambient Temperature VCC
Commercial 0°C to +70°C 3.3V ± 10%
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol Parameter Test Conditions Min. Max. Unit
VOH Output HIGH Voltage VCC = Min., IOH = –4.0 mA 2.4 V
VOL Output LOW Voltage VCC = Min., IOL = 8.0 mA 0.4 V
(1)
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sec­tions of this specification is not im­plied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
1
2
3
4
5
VIH Input HIGH Voltage 2.2 VCC + 0.3 V
VIL Input LOW Voltage
ILI Input Leakage GND - VIN - VCC –22µA
ILO Output Leakage GND - VOUT - VCC, Outputs Disabled –22µA
Notes:
1. VIL (min.) = –3.0V for pulse width less than 10 ns.
(1)
–0.3 0.8 V
6
7
8
POWER SUPPLY CHARACTERISTICS
Symbol Parameter Test Conditions Min. Max. Min. Max. Min. Max. Min. Max. Unit
ICC Vcc Dynamic Operating VCC = Max., Com. 220 200 180 160 mA
Supply Current IOUT = 0 mA, f = fMAX Ind. —— —230 200 180
ISB1 TTL Standby Current VCC = Max., Com. 10 10 10 10 mA
(TTL Inputs) VIN = VIH or VIL Ind. —— —20 20 20
CE VIH , f = 0
ISB2 CMOS Standby VCC = Max., Com. 5 5 5 5mA
Current (CMOS Inputs) CE VCC – 0.2V, Ind. —— 10 10 10
VIN VCC – 0.2V, or VIN - 0.2V, f = 0
(1)
(Over Operating Range)
-10 ns -12 ns -15 ns -20 ns
9
10
11
12
Note:
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
3
IS61LV3216 ISSI
®
CAPACITANCE
(1)
Symbol Parameter Conditions Max. Unit
CIN Input Capacitance VIN = 0V 6 pF
COUT Input/Output Capacitance VOUT = 0V 8 pF
Note:
1. Tested initially and after any design or process changes that may affect these parameters.
READ CYCLE SWITCHING CHARACTERISTICS
(1)
(Over Operating Range)
-10 -12 -15 -20
Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Unit
tRC Read Cycle Time 10 12 15 20 ns
tAA Address Access Time 10 12 15 20 ns
tOHA Output Hold Time 3 3 3 3 ns tACE CE Access Time 10 12 15 20 ns tDOE OE Access Time 5 6 7 8ns
(2)
tHZOE
tLZOE
tHZCE
tLZCE
OE to High-Z Output 0 5 0 6 0 7 0 8 ns
(2)
OE to Low-Z Output 0 0 0 0 ns
(2
CE to High-Z Output 0 5 0 6 0 7 0 8 ns
(2)
CE to Low-Z Output 4 4 4 4 ns
tBA LB, UB Access Time 5 6 7 8ns tHZB LB, UB to High-Z Output 0 5 0 6 0 7 0 8 ns tLZB LB, UB to Low-Z Output 5 5 5 5 ns
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and output loading specified in Figure 1a.
2. Tested with the load in Figure 1b. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
3. Not 100% tested.
AC TEST CONDITIONS
Parameter Unit
Input Pulse Level 0V to 3.0V Input Rise and Fall Times 3 ns Input and Output Timing 1.5V
and Reference Level Output Load See Figures 1a and 1b
AC TEST LOADS
3.3V
OUTPUT
30 pF
Including
jig and
scope
319
3.3V
OUTPUT
353
5 pF
Including
jig and
scope
319
353
Figure 1a. Figure 1b.
4
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
IS61LV3216 ISSI
AC WAVEFORMS
®
READ CYCLE NO. 1
ADDRESS
D
OUT
READ CYCLE NO. 2
ADDRESS
OE
(1,2)
(Address Controlled) (CE = OE = VIL, UB or LB = VIL)
t
RC
t
AA
t
OHA
PREVIOUS DATA VALID
(1,3)
t
AA
t
RC
DATA VALID
t
OHA
t
1
2
3
4
5
OHA
6
t
DOE
t
CE
t
LZCE
LB, UB
t
OUT
D
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CE, UB, or LB = V
3. Address is valid prior to or coincident with CE LOW transition.
HIGH-Z
LZB
LZOE
t
ACE
t
BA
t
HZOE
7
t
HZCE
8
t
HZB
DATA VALID
9
IL.
10
11
12
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
5
IS61LV3216 ISSI
®
WRITE CYCLE SWITCHING CHARACTERISTICS
(1,3)
(Over Operating Range)
-10 -12 -15 -20
Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Unit
tWC Write Cycle Time 10 12 15 20 ns tSCE CE to Write End 9 10 11 12 ns
tAW Address Setup Time 9 10 11 12 ns
to Write End
tHA Address Hold from Write End 0 0 0 0 ns
tSA Address Setup Time 0 0 0 0 ns tPWB LB, UB Valid to End of Write 9 10 11 12 ns tPWE WE Pulse Width 7 8 10 11 ns
tSD Data Setup to Write End 5 6 7 ——8ns
tHD Data Hold from Write End 0 0 0 0 ns
(2)
tHZWE
tLZWE
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and output loading specified in Figure 1a.
2. Tested with the load in Figure 1b. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
3. The internal write time is defined by the overlap of CE LOW and UB or LB, and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the write.
WE LOW to High-Z Output 5 6 7 8ns
(2)
WE HIGH to Low-Z Output 1 1 1 1 ns
6
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
IS61LV3216 ISSI
AC WAVEFORMS
®
WRITE CYCLE NO. 1 (WE Controlled)
ADDRESS
CE
LB, UB
WE
t
SA
WRITE
(1)
(1,2)
t
AW
t
SCE
t
PWB
t
t
PWE
WC
t
1
2
HA
3
4
5
6
t
t
SD
D
IN
t
HZWE
D
OUT
Notes:
1. WRITE is an internally generated signal asserted during an overlap of the LOW states on the CE and WE inputs and at least one of the LB and UB inputs being in the LOW state.
2. WRITE = (CE)
[ (LB) = (UB) ] (WE).
UNDEFINED UNDEFINED
HD
t
LZWE
HIGH-ZHIGH-Z
7
8
9
10
11
12
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
7
IS61LV3216 ISSI
®
ORDERING INFORMATION Commercial Range: 0°C to +70°C
Speed (ns) Order Part No. Package
10 IS61LV3216-10T Plastic TSOP (Type 2) 10 IS61LV3216-10K 400-mil Plastic SOJ
12 IS61LV3216-12T Plastic TSOP (Type 2) 12 IS61LV3216-12K 400-mil Plastic SOJ
15 IS61LV3216-15T Plastic TSOP (Type 2) 15 IS61LV3216-15K 400-mil Plastic SOJ
20 IS61LV3216-20T Plastic TSOP (Type 2) 20 IS61LV3216-20K 400-mil Plastic SOJ
NOTICE
Integrated Silicon Solution, Inc., reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. Integrated Silicon Solution, Inc. assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained herein reflect representative operating parameters, and may vary depending upon a user's specific application. While the information in this publication has been carefully checked, Integrated Silicon Solution, Inc. shall not be liable for any damages arising as a result of any error or omission.
ORDERING INFORMATION Industrial Range: –40°C to +85°C
Speed (ns) Order Part No. Package
12 IS61LV3216-12TI Plastic TSOP (Type 2) 12 IS61LV3216-12KI 400-mil Plastic SOJ
15 IS61LV3216-15TI Plastic TSOP (Type 2) 15 IS61LV3216-15KI 400-mil Plastic SOJ
20 IS61LV3216-20TI Plastic TSOP (Type 2) 20 IS61LV3216-20KI 400-mil Plastic SOJ
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurances, to its satisfaction, that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; and (c) potential liability of Integrated Silicon Solution, Inc. is adequately protected under the circumstances.
Copyright 1997 Integrated Silicon Solution, Inc.
Reproduction in whole or in part, without the prior written consent of Integrated Silicon Solution, Inc., is prohibited.
ISSI
Integrated Silicon Solution, Inc.
2231 Lawson Lane
Santa Clara, CA 95054
Tel: 1-800-379-4774 Fax: (408) 588-0806
E-mail: sales@issi.com
www.issi.com
®
8
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01
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