Datasheet IS42S16128-8T, IS42S16128-12T, IS42S16128-10T Datasheet (ISSI)

Page 1
IS42S16128 ISSI
128K Words x 16 Bits x 2 Banks (4-MBIT)
®
SYNCHRONOUS DYNAMIC RAM
• Clock frequency: 125 MHz, 100 MHz, 83 MHz
• Two banks can be operated simultaneously and independently
• Single 3.3V power supply
• LVTTL interface
• Programmable burst length – (1, 2, 4, 8, full page)
• Programmable burst sequence: Sequential/Interleave
• Auto refresh, self refresh
• 1K refresh cycles every 16 ms
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write operations capability
• Byte controlled by LDQM and UDQM
• Package 400-mil 50-pin TSOP II
PIN CONFIGURATIONS
50-Pin TSOP (Type II)
VCC
I/O0 I/O1
GNDQ
I/O2 I/O3
VCCQ
I/O4 I/O5
GNDQ
I/O6
I/O7 VCCQ LDQM
WE CAS RAS
CS
A9 A8 A0 A1 A2 A3
VCC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
50
GND
49
I/O15
48
I/O14
47
GNDQ
46
I/O13
45
I/O12
44
VCCQ
43
I/O11
42
I/O10
41
GNDQ
40
I/O9
39
I/O8
38
VCCQ
37
NC
36
UDQM
35
CLK
34
CKE
33
NC
32
NC
31
NC
30
A7
29
A6
28
A5
27
A4
26
GND
ORDERING INFORMATION Commercial Range: 0
Frequency Speed (ns) Order Part No. Package
125 MHz 8 IS42S16128-8T 400-mil TSOP II 100 MHz 10 IS42S16128-10T 400-mil TSOP II
DESCRIPTION
ISSI's 4Mb Synchronous DRAM IS42S16128 is organized as a 131072-word x 16-bit x 2-bank for improved performance. The synchronous DRAMs achieve high-speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input.
PIN DESCRIPTIONS
83 MHz 12 IS42S16128-12T 400-mil TSOP II
FEBRUARY 2000
A0-A9 Address Input
A0-A8 Row Address Input
A9 Bank Select Address
A0-A7 Column Address Input
I/O0 to I/O15 Data I/O CLK System Clock Input CKE Clock Enable
CS Chip Select
RAS Row Address Strobe Command
CAS Column Address Strobe Command WE Write Enable
LDQM Lower Bye, Input/Output Mask
UDQM Upper Bye, Input/Output Mask
Vcc Power
GND Ground
VccQ Power Supply for I/O Pin
GNDQ Ground for I/O Pin
NC No Connection
⋅⋅
C to 70
⋅⋅
⋅⋅
C
⋅⋅
ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2000, Integrated Silicon Solution, Inc.
Integrated Silicon Solution, Inc. — 1-800-379-4774
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Page 2
®
IS42S16128 ISSI
PIN FUNCTIONS
Pin No. Symbol Type Function (In Detail)
20 to 24, A0-A8 Input Pin A0 to A8 are address inputs. A0-A8 are used as row address inputs during active
27 to 30 command input and A0-A7 as column address inputs during read or write command
input. A8 is also used to determine the precharge mode during other commands. If A8 is LOW during precharge command, the bank selected by A9 is precharged, but if A8 is HIGH, both banks will be precharged. When A8 is HIGH in read or write command cycle, the precharge starts automati­cally after the burst access. These signals become part of the OP CODE during mode register set command input.
19 A9 Input Pin A9 is the bank selection signal. When A9 is LOW, bank 0 is selected and when high,
bank 1 is selected. This signal becomes part of the OP CODE during mode register set command input.
16 CAS Input Pin CAS, in conjunction with the RAS and WE, forms the device command. See the
"Command Truth Table" item for details on device commands.
34 CKE Input Pin The CKE input determines whether the CLK input is enabled within the device.
When is CKE HIGH, the next rising edge of the CLK signal will be valid, and when LOW, invalid. When CKE is LOW, the device will be in either the power-down mode, the clock suspend mode, or the self refresh mode.
35 CLK Input Pin CLK is the master clock input for this device. Except for CKE, all inputs to this device
are acquired in synchronization with the rising edge of this pin.
18 CS Input Pin The CS input determines whether command input is enabled within the device.
Command input is enabled when CS is LOW, and disabled with CS is HIGH. The device remains in the previous state when CS is HIGH.
2, 3, 5, 6, 8, 9, 11 I/O0 to I/O Pin I/O0 to I/O15 are I/O pins. I/O through these pins can be controlled in byte units 12, 39, 40, 42, 43, I/O15 using the LDQM and UDQM pins. 45, 46, 48, 49
14, 36 LDQM, Input Pin LDQM and UDQM control the lower and upper bytes of the I/O buffers. In read
UDQM mode, LDQM and UDQM control the output buffer. When LDQM or UDQM is LOW,
the corresponding buffer byte is enabled, and when HIGH, disabled. The outputs go to the HIGH impedance state when LDQM/UDQM is HIGH. This function corre­sponds to OE in conventional DRAMs. In write mode, LDQM and UDQM control the input buffer. When LDQM or UDQM is LOW, the corresponding buffer byte is enabled, and data can be written to the device. When LDQM or UDQM is HIGH, input data is masked and cannot be written to the device.
17 RAS Input Pin RAS, in conjunction with CAS and WE, forms the device command. See the
"Command Truth Table" item for details on device commands.
15 WE Input Pin WE, in conjunction with RAS and CAS, forms the device command. See the
"Command Truth Table" item for details on device commands.
7, 13, 38, 44 VCCQ Power Supply Pin VCCQ is the output buffer power supply.
1, 25 VCC Power Supply Pin VCC is the device internal power supply.
4, 10, 41, 47 GNDQ Power Supply Pin GNDQ is the output buffer ground.
26, 50 GND Power Supply Pin GND is the device internal ground.
The CKE is an asynchronous i
nput.
2
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IS42S16128 ISSI
FUNCTIONAL BLOCK DIAGRAM
CLK
CKE
CS RAS CAS
WE
A9
COMMAND
DECODER
&
CLOCK
GENERATOR
MODE
REGISTER
ADDRESS
BUFFER
9
ROW
MEMORY CELL
512
9
ARRAY
BANK 0
DQM
®
A8
A7 A6 A5 A4 A3 A2 A1 A0
REFRESH
CONTROLLER
REFRESH
COUNTER
ROW
ADDRESS
LATCH
9
9
SELF
REFRESH
CONTROLLER
MULTIPLEXER
8
COLUMN
ADDRESS
9
BUFFER
ADDRESS LATCH
ROW
COLUMN
BURST COUNTER
ADDRESS BUFFER
512
9
ROW DECODER ROW DECODER
SENSE AMP I/O GATE
256x16
COLUMN DECODER
8
256x16
SENSE AMP I/O GATE
MEMORY CELL
ARRAY
BANK 1
DATA I N
BUFFER
16
DATA OUT
BUFFER
16 16
16
I/O 0-15
Vcc/VccQ GND/GNDQ
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IS42S16128 ISSI
®
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol Parameters Rating Unit
VCC MAX Maximum Supply Voltage –1.0 to +4.6 V VccQ
MAX Maximum Supply Voltage for Output Buffer –1.0 to +4.6 V
VIN Input Voltage –1.0 to +5.5 V VOUT Output Voltage –1.0 to +4.6 V PD MAX Allowable Power Dissipation 1 W ICS Output Shorted Current 50 mA TOPR Operating Temperature 0 to +70 °C TSTG Storage Temperature –55 to +150 °C
DC RECOMMENDED OPERATING CONDITIONS
At TA = 0 to +70°C
Symbol Parameter Min. Typ. Max. Unit
VCC, VCCQ Supply Voltage 3.0 3.3 3.6 V
VIH Input High Voltage 2.0 5.5 V VIL Input Low Voltage –0.3 +0.8 V
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. All voltages are referenced to GND.
IH (max) = 5.5V for pulse width - 5 ns.
3. V
3. VIL (min) = –1.0V for pulse width - 5 ns.
(2)
CAPACITANCE CHARACTERISTICS
At TA = 0 to +25°C, Vcc = VccQ = 3.3 ± 0.3V, f = 1 MHz
Symbol Parameter Typ. Max. Unit
CIN1 Input Capacitance: A0-A9 5pF CIN2 Input Capacitance: (CLK, CKE, CS, RAS, CAS, WE, LDQM, UDQM) 5pF CI/O Data Input/Output Capacitance: I/O0-I/O15 7pF
4
(1,2)
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IS42S16128 ISSI
DC ELECTRICAL CHARACTERISTICS
(Recommended Operation Conditions unless otherwise noted.)
Symbol Parameter Test Condition Speed Min. Max. Unit
I
IL Input Leakage Current 0V ≤ VIN VCC, with pins other than –10 10 µA
the tested pin at 0V
IOL Output Leakage Current Output is disabled –10 10 µA
0V VOUT VCC VOH Output High Voltage Level IOUT = –2 mA 2.4 V VOL Output Low Voltage Level IOUT = +2 mA 0.4 V
ICC1 Operating Current
CC2P Precharge Standby Current CKE ≤ VIL (MAX)tCK = tCK (MIN) —— 3mA
I ICC2PS (In Power-Down Mode) tCK = ×—2mA
I
CC2N Precharge Standby Current CKE ≥ VIH (MIN)tCK = tCK (MIN) ——30 mA
ICC2NS (In Non Power-Down Mode) tCK = ×—15 mA ICC3P Active Standby Current CKE VIL (MAX)tCK = tCK (MIN) —— 3mA
ICC3PS (In Power-Down Mode) tCK = ×—2mA ICC3N Active Standby Current CKE VIH (MIN)tCK = tCK (MIN) ——30 mA
ICC3NS (In Non Power-Down Mode) tCK = ×—15 mA ICC4 Operating Current tCK = tCK (MIN) CAS latency = 3 -8 160 mA
(In Burst Mode)
ICC5 Auto-Refresh Current tRC = tRC (MIN)-8 100 mA
ICC6 Self-Refresh Current CKE ≤ 0.2V —— 2mA
Notes:
1. These are the values at the minimum cycle time. Since the currents are transient, these values decrease as the cycle time increases. Also note that a bypass capacitor of at least 0.01 µF should be inserted between Vcc and GND for each memory chip to suppress power supply voltage noise (voltage drops) due to these transient currents.
2. Icc1 and Icc4 depend on the output load. The maximum values for Icc1 and Icc4 are obtained with the output open state.
(1,2)
One Bank Operation, Burst Length=1 100 mA tRC tRC (min.), IOUT = 0mA
(1)
IOUT = 0mA -10 160 mA
-12 120 mA
CAS latency = 2 -8 120 mA
-10 120 mA
-12 110 mA
-10 100 mA
-12 80 mA
®
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IS42S16128 ISSI
®
AC CHARACTERISTICS
(1,2,3)
-8 -10 -12
Symbol Parameter Min. Max. Min. Max. Min. Max. Units
CK3 Clock Cycle Time CAS Latency = 3 8 10 12 ns
t tCK2 CAS Latency = 2 13 15 17 ns
t
AC3 Access Time From CLK
(4)
CAS Latency = 3 6 8 10 ns
tAC2 CAS Latency = 2 10 13 15 ns tCHI CLK HIGH Level Width 3 4 4.5 ns tCL CLK LOW Level Width 3 4 4.5 ns t
OH3 Output Data Hold Time CAS Latency = 3 3 4 4 ns
tOH2 CAS Latency = 2 3 4 4 ns tLZ Output LOW Impedance Time 0 0 0 ns
HZ3 Output HIGH Impedance Time
t
(5)
CAS Latency = 3 3648410ns
tHZ2 CAS Latency = 2 3 10 4 12 4 14 ns tDS Input Data Setup Time 2 3 3 ns tDH Input Data Hold Time 1 1.5 2 ns tAS Address Setup Time 2 3 3 ns tAH Address Hold Time 1 1.5 2 ns tCKS CKE Setup Time 2 3 3 ns tCKH CKE Hold Time 1 1.5 2 ns tCKA CKE to CLK Recovery Delay Time 1CLK+3 1CLK+3 1CLK+3 ns tCS Command Setup Time (CS, RAS, CAS, WE, DQM) 2 3 3 ns tCH Command Hold Time (CS, RAS, CAS, WE, DQM) 1 1.5 2 ns tRC Command Period (REF to REF / ACT to ACT) 80 90 108 ns tRAS Command Period (ACT to PRE) 54 12,000 60 12,000 72 12,000 ns tRP Command Period (PRE to ACT) 24 30 34 ns tRCD Active Command To Read / Write Command Delay Time 24 30 34 ns tRRD Command Period (ACT [0] to ACT[1]) 24 30 34 ns tDPL3 Input Data To Precharge CAS Latency = 3 1CLK+8 1CLK+10 1CLK+12 ns
Command Delay time
tDPL2 CAS Latency = 2 8 10 12 ns tDAL3 Input Data To Active / Refresh CAS Latency = 3 2CLK+24 2CLK+30 2CLK+34 ns
Command Delay time (During Auto-Precharge)
tDAL2 CAS Latency = 2 1CLK+24 1CLK+30 1CLK+34 ns tT Transition Time 1 30 1 30 1 30 ns tREF Refresh Cycle Time 16 16 16 ms
Notes:
1. When power is first applied, memory operation should be started 100 µs after Vcc and VccQ reach their stipulated voltages. Also note that the power-on sequence must be executed before starting memory operation.
2. Measured with t
3. The reference level is 1.4 V when measuring input signal timing. Rise and fall times are measured between V
4. Access time is measured at 1.4V with the load shown in the figure below.
5. The time t when the output is in the high impedance state.
6
T = 1 ns.
IH (min.) and VIL (max.).
HZ (max.) is defined as the time required for the output voltage to transition by ± 200 mV from VOH (min.) or VOL (max.)
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IS42S16128 ISSI
OPERATING FREQUENCY / LATENCY RELATIONSHIPS
-8 -10 -12
Symbol Parameter Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Units
Clock Cycle Time 8 10 25 10 15 30 12 17 34 ns Operating Frequency 125 100 40 100 65 33 83 58 29 MHz
tCAC CAS Latency 3 2 1 3 2 1 3 2 1 cycle tRCD Active Command To Read/Write Command Delay Time 3 2 1 3 2 1 3 2 1 cycle tRAC RAS Latency (tRCD + tCAC) 6 4 2 6 4 2 6 4 2 cycle tRC Command Period (REF to REF / ACT to ACT) 9 5 2 9 6 3 9 7 4 cycle tRAS Command Period (ACT to PRE) 6 3 1 6 4 2 6 5 3 cycle tRP Command Period (PRE to ACT) 3 2 1 3 2 1 3 2 1 cycle tRRD Command Period (ACT[0] to ACT [1]) 3 2 1 3 2 1 3 2 1 cycle
CCD Column Command Delay Time 1 1 1 1 1 1 1 1 1 cycle
t
(READ, READA, WRIT, WRITA) tDPL Input Data To Precharge Command Delay Time 1 1 1 1 1 1 1 1 1 cycle tDAL Input Data To Active/Refresh Command Delay Time 4 3 2 4 3 2 4 3 2 cycle
(During Auto-Precharge) tRBD Burst Stop Command To Output in HIGH-Z Delay Time 3 2 1 3 2 1 3 2 1 cycle
(Read) tWBD Burst Stop Command To Input in Invalid Delay Time 0 0 0 0 0 0 0 0 0 cycle
(Write) tRQL Precharge Command To Output in HIGH-Z Delay Time 3 2 1 3 2 1 3 2 1 cycle
(Read) tWDL Precharge Command To Input in Invalid Delay Time 0 0 0 0 0 0 0 0 0 cycle
(Write) tPQL Last Output To Auto-Precharge Start Time (Read) –2 –10 –2 –10 –2 –1 0 cycle tQMD DQM To Output Delay Time (Read) 2 2 2 2 2 2 2 2 2 cycle tDMD DQM To Input Delay Time (Write) 0 0 0 0 0 0 0 0 0 cycle tMCD Mode Register Set To Command Delay Time 2 2 2 2 2 2 2 2 2 cycle
®
AC TEST CONDITIONS (Input/Output Reference Level: 1.4V)
t
Input
2.0V
1.4V
CLK
INPUT
OUTPUT
0.8V
2.0V
1.4V
0.8V
t
CS
t
OH
1.4V 1.4V
Output Load
I/O
50 pF
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CK
t
CHI
t
CH
t
AC
500
t
CL
+1.4V
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IS42S16128 ISSI
COMMANDS
Active Command Read Command
®
CLK
CKE
CS
RAS
CAS
WE
A0-A7
CLK
CKE
CS
RAS
CLK
HIGH
ROW
A8
A9
ROW
BANK 1
BANK 0
CKE
CS
RAS
CAS
WE
A0-A7
HIGH
COLUMN
AUTO PRECHARGE
A8
A9
NO PRECHARGE
BANK 1
BANK 0
Write Command Precharge Command
CLK
HIGH
CKE
CS
RAS
HIGH
CAS
WE
A0-A7
A8
A9
COLUMN
AUTO PRECHARGE
BANK 1
BANK 0
CAS
WE
A0-A7
A8
A9
BANK 0 AND BANK 1
BANK 0 OR BANK 1NO PRECHARGE
BANK 1
BANK 0
No-Operation Command Device Deselect Command
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
HIGH
CLK
CKE
CS
RAS
CAS
WE
A0-A7
HIGH
A8
A9
8
A9
Don't Care
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IS42S16128 ISSI
COMMANDS (cont.)
Mode Register Set Command Auto-Refresh Command
®
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
HIGH
OP-CODE
OP-CODE
OP-CODE
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
HIGH
Self-Refresh Command Power Down Command
CLK
CKE
CS
RAS
CLK
CKE
CS
RAS
ALL BANKS IDLE
NOP
NOP
CAS
WE
A0-A7
CAS
WE
A0-A7
A8
A9
A8
A9
NOP
NOP
Clock Suspend Command Burst Stop Command
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
BANK(S) ACTIVE
NOP
NOP
NOP
NOP
CLK
CKE
CS
RAS
CAS
WE
A0-A7
HIGH
A8
A9
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A9
Don't Care
9
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IS42S16128 ISSI
®
Mode Register Set Command
(CS, RAS, CAS, WE = LOW) The IS42S16128 product incorporates a register that
defines the device operating mode. This command func­tions as a data input pin that loads this register from the pins A0 to A9. When power is first applied, the stipulated power-on sequence should be executed and then the IS42S16128 should be initialized by executing a mode register set command.
Note that the mode register set command can be ex­ecuted only when both banks are in the idle state, i.e.., deactivated.
Another command cannot be executed after a mode register set command until after the passage of the period tMCD, which is the period required for mode register set command execution.
Active Command
(CS, RAS = LOW, CAS, WE= HIGH) The IS42S16128 includes two banks of 512 rows each.
This command selects one of the two banks according to the A9 pin and activates the row selected by the pins A0 to A8.
Read Command (cont.)
When the A8 pin is HIGH, this command functions as a read with auto-precharge command. After the burst read completes, the bank selected by pin A9 is precharged. When the A8 pin is LOW, the bank selected by the A9 pin remains in the activated state after the burst read com­pletes.
Write Command
(CS, CAS, WE = LOW, RAS = HIGH) When burst write mode has been selected with the mode
register set command, this command selects the bank specified by the A9 pin and starts a burst write operation at the start address specified by pins A0 to A7. This first data must be input to the I/O pins in the cycle in which this command.
The selected bank must be activated before executing this command.
When A8 pin is HIGH, this command functions as a write with auto-precharge command. After the burst write com­pletes, the bank selected by pin A9 is precharged. When the A8 pin is low, the bank selected by the A9 pin remains in the activated state after the burst write completes.
This command corresponds to the fall of the RAS signal from HIGH to LOW in conventional DRAMs.
Precharge Command
(CS, RAS, WE = LOW, CAS = HIGH) This command starts precharging the bank selected by
pins A8 and A9. When A8 is HIGH, both banks are precharged at the same time. When A8 is LOW, the bank selected by A9 is precharged. After executing this com­mand, the next command for the selected bank(s) is executed after passage of the period tRP, which is the period required for bank precharging.
This command corresponds to the RAS signal from LOW to HIGH in conventional DRAMs
Read Command
(CS, CAS = LOW, RAS, WE = HIGH) This command selects the bank specified by the A9 pin
and starts a burst read operation at the start address specified by pins A0 to A7. Data is output following CAS latency.
After the input of the last burst write data, the application must wait for the write recovery period (t elapse according to CAS latency.
DPL, tDAL) to
Auto-Refresh Command
(CS, RAS, CAS = LOW, WE, CKE = HIGH) This command executes the auto-refresh operation. The
row address and bank to be refreshed are automatically generated during this operation.
Both banks must be placed in the idle state before executing this command.
The stipulated period (tRC) is required for a single refresh operation, and no other commands can be executed during this period.
The device goes to the idle state after the internal refresh operation completes.
This command must be executed at least 1024 times every 16 ms.
This command corresponds to CBR auto-refresh in con­ventional DRAMs.
The selected bank must be activated before executing this command.
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IS42S16128 ISSI
®
Self-Refresh Command
(CS, RAS, CAS, CKE = LOW, WE = HIGH) This command executes the self-refresh operation. The
row address to be refreshed, the bank, and the refresh interval are generated automatically internally during this operation. The self-refresh operation is started by drop­ping the CKE pin from HIGH to LOW. The self-refresh operation continues as long as the CKE pin remains LOW and there is no need for external control of any other pins. The self-refresh operation is terminated by raising the CKE pin from LOW to HIGH. The next command cannot be executed until the device internal recovery period (tRC) has elapsed. After the self-refresh, since it is impossible to determine the address of the last row to be refreshed, an auto-refresh should immediately be performed for all addresses (1024 cycles).
Both banks must be placed in the idle state before executing this command.
Burst Stop Command
(CS, WE, = LOW, RAS, CAS = HIGH) The command forcibly terminates burst read and write
operations. When this command is executed during a burst read operation, data output stops after the CAS latency period has elapsed.
Power-Down Command (cont.)
All pins other than the CKE pin are invalid and none of the other commands can be executed in this mode. The power-down operation is terminated by raising the CKE pin from LOW to HIGH. The next command cannot be executed until the recovery period (tCKA) has elapsed.
Since this command differs from the self-refresh com­mand described above in that the refresh operation is not performed automatically internally, the refresh operation must be performed within the refresh period (tREF). Thus the maximum time that power-down mode can be held is just under the refresh cycle time.
Clock Suspend
(CKE = LOW) This command can be used to stop the device internal
clock temporarily during a read or write cycle. Clock suspend mode is started by dropping the CKE pin from HIGH to LOW. Clock suspend mode continues as long as the CKE pin is held LOW. All input pins other than the CKE pin are invalid and none of the other commands can be executed in this mode. Also note that the device internal state is maintained. Clock suspend mode is terminated by raising the CKE pin from LOW to HIGH, at which point device operation restarts. The next command cannot be executed until the recovery period (tCKA) has elapsed.
No Operation
(CS, = LOW, RAS, CAS, WE = HIGH) This command has no effect on the device.
Device Deselect Command
(CS = HIGH) This command does not select the device for an object of
operation. In other words, it performs no operation with respect to the device.
Power-Down Command
(CKE = LOW) When both banks are in the idle (inactive) state, or when
at least one of the banks is not in the idle (inactive) state, this command can be used to suppress device power dissipation by reducing device internal operations to the absolute minimum. Power-down mode is started by drop­ping the CKE pin from HIGH to LOW. Power-down mode continues as long as the CKE pin is held low.
Since this command differs from the self-refresh com­mand described above in that the refresh operation is not performed automatically internally, the refresh operation must be performed within the refresh period (tREF). Thus the maximum time that clock suspend mode can be held is just under the refresh cycle time.
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IS42S16128 ISSI
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COMMAND TRUTH TABLE
(1,2)
CKE
Symbol Command n-1 n CS RAS CAS W E DQM A0 A8 A7-A0 I/On
(5)
(5,6)
(3,4)
HXLLLLX OP CODE X H H L L L H X X X X HIGH-Z HLLLLHXX X XHIGH-Z
MRS Mode Register Set REF Auto-Refresh SREF Self-Refresh PRE Precharge Selected Bank H X L L H L X BS L X X PALL Precharge Both Banks H X L L H L X X H X X ACT Bank Activate
(7)
H X L L H H X BS Row Row X WRIT Write H X L H L L X BS L Column X WRITA Write With Auto-Precharge READ Read
(8)
READA Read With Auto-Precharge BST Burst Stop
(9)
(8)
H X L H L L X BS H Column X
H X L H L H X BS L Column X
(8)
H X L H L H X BS H Column X
HXLHHLXXXX X NOP No Operation H X L H H H X X X X X DESL Device Deselect H X H XXXXX X X X SBY Clock Suspend / Standby Mode L XXXXXXX X X X ENB Data Write / Output Enable H XXXXXLX X X Active MASK Data Mask / Output Disable H XXXXXHX X XHIGH-Z
DQM TRUTH TABLE
(1,2)
CKE DQM
Symbol Command n-1 n UPPER LOWER
ENB Data Write / Output Enable H X L L MASK Data Mask / Output Disable H X H H ENBU Upper Byte Data Write / Output Enable H X L X ENBL Lower Byte Data Write / Output Enable H X X L MASKU Upper Byte Data Mask / Output Disable H X H X MASKL Lower Byte Data Mask / Output Disable H X X H
CKE TRUTH TABLE
(1,2)
CKE
Symbol Command Current State n-1 n CS RAS CAS WE A9 A8 A7-A0
SPND Start Clock Suspend Mode Active H L XXXXXXX
Clock Suspend Other States L L XXXXXXX Terminate Clock Suspend Mode Clock Suspend L H XXXXXXX
REF Auto-Refresh Idle H H L L L H X X X SELF Start Self-Refresh Mode Idle H LLLLHXXX SELFX Terminate Self-Refresh Mode Self-Refresh L H L H H H X X X
LHHXXXXXX
PDWN Start Power-Down Mode Idle H L L H H H X X X
HLHXXXXXX
Terminate Power-Down Mode Power-Down L H XXXXXXX
12
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IS42S16128 ISSI
®
OPERATION COMMAND TABLE
(1,2)
Current State Command Operation CS RAS CAS W E A9 A8 A7-A0
Idle DESL No Operation or Power-Down
NOP No Operation or Power-Down
(12)
(12)
HXXXXXX
LHHHXXX BST No Operation or Power-Down L H H L X X X READ / READA Illegal L H L H V V V WRIT/WRITA Illegal L H L L V V V ACT Row Active L L H H V V V PRE/PALL No Operation L L H L V V X REF/SELF Auto-Refresh or Self-Refresh
(13)
LLLHXXX MRS Mode Register Set LLLL OP CODE
Row Active DESL No Operation H XXXXXX
NOP No Operation L H H H X X X BST No Operation L H H L X X X
(10)
(17)
(17)
(15)
LHLHVVV
LHL LVVV
LLHHVVV
LLHLVVX
READ/READA Read Start WRIT/WRITA Write Start ACT Illegal PRE/PALL Precharge REF/SELF Illegal L L L H X X X MRS Illegal LLLL OP CODE
Read DESL Burst Read Continues, Row Active When Done H XXXXXX
NOP Burst Read Continues, Row Active When Done L H H H X X X BST Burst Interrupted, Row Active After Interrupt L H H L X X X
(11,16)
(16)
LHLHVVV
LHL LVVV
LLHHVVV
READ/READA Burst Interrupted, Read Restart After Interrupt WRIT/WRITA Burst Interrupted Write Start After Interrupt ACT Illegal
(10)
PRE/PALL Burst Read Interrupted, Precharge After Interrupt L L H L V V X REF/SELF Illegal L L L H X X X MRS Illegal LLLL OP CODE
Write DESL Burst Write Continues, Write Recovery When Done H XXXXXX
NOP Burst Write Continues, Write Recovery When Done L H H H X X X BST Burst Write Interrupted, Row Active After Interrupt L H H L X X X READ/READA WRIT/WRITA
Burst Write Interrupted, Read Start After Interrupt Burst Write Interrupted, Write Restart After Interrupt
ACT Illegal
(10)
(11,16)
(16)
LHLHVVV
LHL LVVV
LLHHVVV PRE/PALL Burst Write Interrupted, Precharge After Interrupt L L H L V V X REF/SELF Illegal L L L H X X X MRS Illegal LLLL OP CODE
Read With DESL Burst Read Continues, Precharge When Done H XXXXXX Auto- NOP Burst Read Continues, Precharge When Done L H H H X X X
Precharge BST Illegal L H H L X X X
READ/READA Illegal L H L H V V V WRIT/WRITA Illegal L H L L V V V ACT Illegal PRE/PALL Illegal
(10)
(10)
LLHHVVV
LLHLVVX REF/SELF Illegal L L L H X X X MRS Illegal LLLL OP CODE
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IS42S16128 ISSI
®
OPERATION COMMAND TABLE
(1,2)
Current State Command Operation CS RAS CAS W E A9 A8 A7-A0
Write With DESL Burst Write Continues, Write Recovery And Precharge H XXXXXX Auto-Precharge When Done
NOP Burst Write Continues, Write Recovery And Precharge L H H H X X X BST Illegal L H H L X X X READ/READA Illegal L H L H V V V WRIT/WRITA Illegal L H L L V V V ACT Illegal PRE/PALL Illegal
(10)
(10)
LLHHVVV
LLHLVVX REF/SELF Illegal L L L H X X X MRS Illegal LLLL OPCODE
Row Precharge DESL No Operation, Idle State After tRP Has Elapsed H XXXXXX
NOP No Operation, Idle State After t BST No Operation, Idle State After t READ/READA Illegal WRIT/WRITA Illegal ACT Illegal
(10)
(10)
(10)
PRE/PALL No Operation, Idle State After tRP Has Elapsed
RP Has Elapsed L H H H X X X RP Has Elapsed L H H L X X X
LHLHVVV
LHL LVVV
LLHHVVV
(10)
LLHLVVX REF/SELF Illegal L L L H X X X MRS Illegal LLLL OP CODE
Immediately DESL No Operation, Row Active After tRCD Has Elapsed H XXXXXX Following NOP No Operation, Row Active After tRCD Has Elapsed L H H H X X X
Row Active BST No Operation, Row Active After tRCD Has Elapsed L H H L X X X
READ/READA Illegal WRIT/WRITA Illegal ACT Illegal PRE/PALL Illegal
(10)
(10)
(10,14)
(10)
LHLHVVV
LHL LVVV
LLHHVVV
LLHLVVX REF/SELF Illegal L L L H X X X MRS Illegal LLLL OP CODE
Write DESL No Operation, Row Active After tDPL Has Elapsed H XXXXXX Recovery NOP No Operation, Row Active After tDPL Has Elapsed L H H H X X X
BST No Operation, Row Active After tDPL Has Elapsed L H H L X X X READ/READA Read Start L H L H V V V WRIT/WRITA Write Restart L H L L V V V ACT Illegal PRE/PALL Illegal
(10)
(10)
LLHHVVV
LLHLVVX REF/SELF Illegal L L L H X X X MRS Illegal LLLL OP CODE
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IS42S16128 ISSI
®
OPERATION COMMAND TABLE
(1,2)
Current State Command Operation CS RAS CAS W E A9 A8 A7-A0
Write Recovery DESL No Operation, Idle State After tDAL Has Elapsed H XXXXXX With Auto- NOP No Operation, Idle State After tDAL Has Elapsed L H H H X X X
Precharge BST No Operation, Idle State After t
READ/READA Illegal WRIT/WRITA Illegal ACT Illegal PRE/PALL Illegal
(10)
(10)
(10)
(10)
DAL Has Elapsed L H H L X X X
LHLHVVV LHL LVVV LLHHVVV
LLHLVVX REF/SELF Illegal L L L H X X X MRS Illegal LLLL OP CODE
Refresh DESL No Operation, Idle State After t
RP Has Elapsed H XXXXXX
NOP No Operation, Idle State After tRP Has Elapsed L H H H X X X BST No Operation, Idle State After t
RP Has Elapsed L H H L X X X
READ/READA Illegal L H L H V V V WRIT/WRITA Illegal L H L L V V V ACT Illegal L L H H V V V PRE/PALL Illegal L L H L V V X REF/SELF Illegal L L L H X X X MRS Illegal LLLL OP CODE
Mode Register DESL No Operation, Idle State After tMCD Has Elapsed H XXXXXX Set NOP No Operation, Idle State After tMCD Has Elapsed L H H H X X X
BST No Operation, Idle State After tMCD Has Elapsed L H H L X X X READ/READA Illegal L H L H V V V WRIT/WRITA Illegal L H L L V V V ACT Illegal L L H H V V V PRE/PALL Illegal L L H L V V X REF/SELF Illegal L L L H X X X MRS Illegal LLLL OP CODE
Notes:
1. H: HIGH level input, L: LOW level input, X: HIGH or LOW level input, V: Valid data input
2. All input signals are latched on the rising edge of the CLK signal.
3. Both banks must be placed in the inactive (idle) state in advance.
4. The state of the A0 to A9 pins is loaded into the mode register as an OP code.
5. The row address is generated automatically internally at this time. The I/O pin and the address pin data is ignored.
6. During a self-refresh operation, all pin data (states) other than CKE is ignored.
7. The selected bank must be placed in the inactive (idle) state in advance.
8. The selected bank must be placed in the active state in advance.
9. This command is valid only when the burst length set to full page.
10. This is possible depending on the state of the bank selected by the A9 pin.
11. Time to switch internal busses is required.
12. The IS42S16128 can be switched to power-down mode by dropping the CKE pin LOW when both banks in the idle state. Input pins other than CKE are ignored at this time.
13. The IS42S16128 can be switched to self-refresh mode by dropping the CKE pin LOW when both banks in the idle state. Input pins other than CKE are ignored at this time.
14. Possible if t
15. Illegal if tRAS is not satisfied.
16. The conditions for burst interruption must be observed. Also note that the IS42S16128 will enter the precharged state immediately after the burst operation completes if auto-precharge is selected.
17. Command input becomes possible after the period t state immediately after the burst operation completes if auto-precharge is selected.
RRD is satisfied.
RCD has elapsed. Also note that the IS42S16128 will enter the precharged
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IS42S16128 ISSI
®
CKE RELATED COMMAND TRUTH TABLE
(1)
CKE
Current State Operation n-1 n CS RAS CAS W E A9 A8 A7-A0
Self-Refresh Undefined H XXXXXXXX
Self-Refresh Recovery Self-Refresh Recovery
(2)
Illegal
(2)
Illegal
(2)
(2)
LHHXXXXXX LHLHHXXXX LHLHLXXXX LHL LXXXXX
Self-Refresh L L XXXXXXX
Self-Refresh Recovery Idle State After tRC Has Elapsed H H H XXXXXX
Idle State After t
RC Has Elapsed H H L H H XXXX
Illegal H H L H L XXXX Illegal H H L L XXXXX Power-Down on the Next Cycle H L H XXXXXX Power-Down on the Next Cycle H L L H H XXXX Illegal H L L H L XXXX Illegal H L L L XXXXX Clock Suspend Termination on the Next Cycle
(2)
LHXXXXXXX
Clock Suspend L L XXXXXXX
Power-Down Undefined H XXXXXXXX
Power-Down Mode Termination, Idle After L H XXXXXXX That Termination
(2)
Power-Down Mode L L XXXXXXX
Both Banks Idle No Operation H H H XXXXXX
See the Operation Command Table H H L H XXXXX Bank Active Or Precharge H H L L H XXXX Auto-Refresh H H L L L H X X X Mode Register Set H H LLLL OP CODE See the Operation Command Table H L H XXXXXX See the Operation Command Table H L L H XXXXX See the Operation Command Table H L L L H XXXX Self-Refresh
(3)
HLLLLHXXX See the Operation Command Table H LLLLL OP CODE Power-Down Mode
(3)
LXXXXXXXX
Other States See the Operation Command Table H H XXXXXXX
Clock Suspend on the Next Cycle
(4)
HLXXXXXXX Clock Suspend Termination on the Next Cycle L H XXXXXXX Clock Suspend Termination on the Next Cycle L L XXXXXXX
Notes:
1. H: HIGH level input, L: LOW level input, X: HIGH or LOW level input
2. The CLK pin and the other input are reactivated asynchronously by the transition of the CKE level from LOW to HIGH. The minimum setup time (t
3. Both banks must be set to the inactive (idle) state in advance to switch to power-down mode or self-refresh mode.
4. The input must be command defined in the operation command table.
CKA) required before all commands other than mode termination must be satisfied.
16
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IS42S16128 ISSI
®
TWO BANKS OPERATION COMMAND TRUTH TABLE
(1,2)
Previous State Next State
Operation CS RAS CAS WE A9 A8 A7-A0 BANK 0 BANK 1 BANK 0 BANK 1
DESL H XXXXXX Any Any Any Any NOP L H H H X X X Any Any Any Any BST L H H L X X X R/W/A I/A A I/A
I I/A I I/A I/A R/W/A I/A A I/A I I/A I
READ/READA L H L H H H CA I/A R/W/A I/A RP
H H CA R/W A A RP H L CA I/A R/W/A I/A R H L CA R/W A A R L H CA R/W/A I/A RP I/A L H CA A R/W RP A L L CA R/W/A I/A R I/A L L CA A R/W R A
WRIT/WRITA L H L L H H CA I/A R/W/A I/A WP
H H CA R/W A A WP H L CA I/A R/W/A I/A W H L CA R/W A A W L H CA R/W/A I/A WP I/A L H CA A R/W WP A L L CA R/W/A I/A W I/A L L CA A R/W W A
ACT L L H H H RA RA Any I Any A
L RA RA I Any A Any
PRE/PALL L L H L X H X R/W/A/I I/A I I
X H X I/A R/W/A/I I I H L X I/A R/W/A/I I/A I H L X R/W/A/I I/A R/W/A/I I L L X R/W/A/I I/A I I/A
L L X I/A R/W/A/I I R/W/A/I REF LLLHXXX II II MRS LLLL OPCODE I I I I
Notes:
1. H: HIGH level input, L: LOW level input, X: HIGH or LOW level input, RA: Row Address, CA: Column Address
2. The device state symbols are interpreted as follows:
I Idle (inactive state) A Row Active State R Read W Write RP Read With Auto-Precharge WP Write With Auto-Precharge Any Any State
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IS42S16128 ISSI
SIMPLIFIED STATE TRANSITION DIAGRAM (One Bank Operation)
SELF
REFRESH
SREF entry
SREF exit
®
WRIT
CKE_
MODE
REGISTER
MRS
IDLE
REF
SET
CKE_
CKE
ACT
CKE_
CKE
READ
BANK
ACTIVE
READ
READA
BST BST
WRIT
WRITA
WRITE
WRIT
AUTO
REFRESH
IDLE
POWER
DOWN
ACTIVE POWER
DOWN
READ
READ
CKE_
18
CLOCK
SUSPEND
POWER APPLIED
CKE
WRITA
CKE_
CKE
WRITE WITH
AUTO
PRECHARGE
POWER ON
Automatic transition following the completion of command execution.
Transition due to command input.
WRITA
PRE
PRE
PRE
PRE-
CHARGE
READA
PRE
READA
CKE_
READ WITH
AUTO
PRECHARGE
CKE
CKE
CLOCK
SUSPEND
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IS42S16128 ISSI
®
Device Initialization At Power-On
(Power-On Sequence)
As is the case with conventional DRAMs, the IS42S16128 product must be initialized by executing a stipulated power-on sequence after power is applied.
After power is applied and V stipulated voltages, set and hold the CKE and DQM pins HIGH for 100 µs. Then, execute the precharge command to precharge both bank. Next, execute the auto-refresh command twice or more and define the device operation mode by executing a mode register set command.
The mode register set command can be also set before auto-refresh command.
CC and VCCQ reach their
Mode Register Settings
The mode register set command sets the mode register. When this command is executed, pins A0 to A7, A8, and A9 function as data input pins for setting the register, and this data becomes the device internal OP code. This OP code has four fields as listed in the table below.
Input Pin Field
Burst Length
When writing or reading, data can be input or output data continuously. In these operations, an address is input only once and that address is taken as the starting address internally by the device. The device then automatically generates the following address. The burst length field in the mode register stipulates the number of data items input or output in sequence. In the IS42S16128 product, a burst length of 1, 2, 4, 8, or full page can be specified. See the table on the next page for details on setting the mode register.
Burst Type
The burst data order during a read or write operation is stipulated by the burst type, which can be set by the mode register set command. The IS42S16128 product supports sequential mode and interleaved mode burst type set­tings. See the table on the next page for details on setting the mode register. See the "Burst Length and Column Address Sequence" item for details on I/O data orders in these modes.
A9, A8, A7 Write Mode A6, A5, A4 CAS Latency
A3 Burst Type
A2, A1, A0 Burst Length
Note that the mode register set command can be ex­ecuted only when both banks are in the idle (inactive) state. Wait at least two cycles after executing a mode register set command before executing the next com­mand.
CAS Latency
During a read operation, the between the execution of the read command and data output is stipulated as the CAS latency. This period can be set using the mode register set command. The optimal CAS latency is determined by the clock frequency and device speed grade. See the "Operating Frequency / Latency Relationships" item for details on the relationship between the clock frequency and the CAS latency. See the table on the next page for details on setting the mode register.
Write Mode
Burst write or single write mode is selected by the OP code (A9, A8, A7) of the mode register.
A burst write operation is enabled by setting the OP code (A9, A8, A7) to (0,0,0). A burst write starts on the same cycle as a write command set. The write start address is specified by the column address and bank select address at the write command set cycle.
A single write operation is enabled by setting OP code (A9, A8, A7) to (1,0,0). In a single write operation, data is only written to the column address and bank select address specified by the write command set cycle without regard to the bust length setting.
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IS42S16128 ISSI
MODE REGISTER
®
9876543210
WRITE MODE LT MODE BT BL
Address Bus Mode Register (Mx)
Burst Type 0 Sequential
Latency Mode 0 0 0 Reserved
M2 M1 M0 Sequential Interleaved
Burst Length 0 0 0 1 1
001 2 2 010 4 4 011 8 8 1 0 0 Reserved Reserved 1 0 1 Reserved Reserved 1 1 0 Reserved Reserved 1 1 1 Full Page Reserved
M3 Type
1 Interleaved
M6 M5 M4 CAS Latency
001 1 010 2 011 3 1 0 0 Reserved 1 0 1 Reserved 1 1 0 Reserved 1 1 1 Reserved
M9 M8 M7 Write Mode
0 0 0 Burst Read & Burst Write 1 0 0 Burst Read & Single Write
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IS42S16128 ISSI
Burst Length and Column Address Sequence
Column Address Address Sequence
Burst Length A2 A1 A0 Sequential Interleaved
2 X X 0 0-1 0-1
X X 1 1-0 1-0
4 X 0 0 0-1-2-3 0-1-2-3
X 0 1 1-2-3-0 1-0-3-2 X 1 0 2-3-0-1 2-3-0-1 X 1 1 3-0-1-2 3-2-1-0
8 0 0 0 0-1-2-3-4-5-6-7 0-1-2-3-4-5-6-7
0 0 1 1-2-3-4-5-6-7-0 1-0-3-2-5-4-7-6 0 1 0 2-3-4-5-6-7-0-1 2-3-0-1-6-7-4-5 0 1 1 3-4-5-6-7-0-1-2 3-2-1-0-7-6-5-4 1 0 0 4-5-6-7-0-1-2-3 4-5-6-7-0-1-2-3 1 0 1 5-6-7-0-1-2-3-4 5-4-7-6-1-0-3-2 1 1 0 6-7-0-1-2-3-4-5 6-7-4-5-2-3-0-1 1 1 1 7-0-1-2-3-4-5-6 7-6-5-4-3-2-1-0
Full Page n n n Cn, Cn+1, Cn+2 None
(256) Cn+3, Cn+4.....
...Cn-1(Cn+255),
Cn(Cn+256).....
Notes:
1. The burst length in full page mode is 256.
®
Bank Select and Precharge Address Allocation
Row X0 Row Address
X1 Row Address X2 Row Address X3 Row Address X4 Row Address X5 Row Address X6 Row Address X7 Row Address X8 0 Precharge of the Selected Bank (Precharge Command) Row Address
1 Precharge of Both Banks (Precharge Command) (Active Command)
X9 0 Bank 0 Selected (Precharge and Active Command)
1 Bank 1 Selected (Precharge and Active Command)
Column Y0 Column Address
Y1 Column Address Y2 Column Address Y3 Column Address Y4 Column Address Y5 Column Address Y6 Column Address Y7 Column Address Y8 0 Auto-Precharge Not Performed
1 Auto-Precharge Performed
Y9 0 Bank 0 Selected (Read and Write Commands)
1 Bank 1 Selected (Read and Write Commands)
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IS42S16128 ISSI
Burst Read
®
The read cycle is started by executing the read command. The address provided during read command execution is used as the starting address. First, the data correspond­ing to this address is output in synchronization with the clock signal after the CAS latency period. Next, data corresponding to an address generated automatically by the device is output in synchronization with the clock signal.
The output buffers go to the LOW impedance state CAS latency minus one cycle after the read command, and go to the HIGH impedance state automatically after the last data is output. However, the case where the burst length
CLK
COMMAND
I/O
READ
CAC
t
CAS LATENCY
CAS latency = 3, burst length = 4
D
OUT
is a full page is an exception. In this case the output buffers must be set to the high impedance state by executing a burst stop command.
Note that upper byte and lower byte output data can be masked independently under control of the signals ap­plied to the U/LDQM pins. The delay period (tQMD) is fixed at two, regardless of the CAS latency setting, when this function is used.
The selected bank must be set to the active state before executing this command.
0D
OUT
1D
OUT
2D
OUT
3
BURST LENGTH
Burst Write
The write cycle is started by executing the command. The address provided during write command execution is used as the starting address, and at the same time, data for this address is input in synchronization with the clock signal.
Next, data is input in other in synchronization with the clock signal. During this operation, data is written to address generated automatically by the device. This cycle terminates automatically after a number of clock cycles determined by the stipulated burst length. How­ever, the case where the burst length is a full page is an exception. In this case the write cycle must be terminated by executing a burst stop command.
CLK
COMMAND
I/O
WRITE
DIN 0DIN 1DIN 2DIN 3
BURST LENGTH
The latency for I/O pin data input is zero, regardless of the CAS latency setting. However, a wait period (write recov­ery: tDPL) after the last data input is required for the device to complete the write operation.
Note that the upper byte and lower byte input data can be masked independently under control of the signals ap­plied to the U/LDQM pins. The delay period (tDMD) is fixed at zero, regardless of the CAS latency setting, when this function is used.
The selected bank must be set to the active state before executing this command.
CAS latency = 2,3, burst length = 4
22
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IS42S16128 ISSI
Read With Auto-Precharge
®
The read with auto-precharge command first executes a burst read operation and then puts the selected bank in the precharged state automatically. After the precharge completes, the bank goes to the idle state. Thus this command performs a read command and a precharge command in a single operation.
During this operation, the delay period (tPQL) between the last burst data output and the start of the precharge operation differs depending on the CAS latency setting.
When the CAS latency setting is one, the precharge operation starts a the same time as the last burst data is output (tPQL = 0). When the CAS latency setting is two,
CLK
the precharge operation starts on one clock cycle before the last burst data is output (tPQL = –1). When the CAS latency setting is three, the precharge operation starts on two clock cycles before the last burst data is output (tPQL = –2). Therefore, the selected bank can be made active after a delay of tRP from the start position of this precharge operation.
The selected bank must be set to the active state before executing this command.
The auto-precharge function is invalid if the burst length is set to full page.
CAS Latency 3 2
tPQL –2 –1
COMMAND
READA 0
I/O
CAS latency = 2, burst length = 4
READ WITH AUTO-PRECHARGE
(BANK 0)
CLK
COMMAND
READA 0
I/O
READ WITH AUTO-PRECHARGE
(BANK 0)
CAS latency = 3, burst length = 4
D
OUT
0D
OUT
PRECHARGE START
D
OUT
PRECHARGE START
1D
OUT
0D
OUT
t
PQL
2D
t
1D
OUT
RP
t
OUT
3
PQL
2D
t
RP
ACT 0
OUT
ACT 0
3
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IS42S16128 ISSI
Write With Auto-Precharge
®
The write with auto-precharge command first executes a burst write operation and then puts the selected bank in the precharged state automatically. After the precharge completes the bank goes to the idle state. Thus this command performs a write command and a precharge command in a single operation.
During this operation, the delay period (tDAL) between the last burst data input and the completion of the precharge operation differs depending on the CAS latency setting. The delay (tDAL) is tRP plus one CLK period. That is, the precharge operation starts one clock period after the last burst data input.
CLK
COMMAND
I/O
WRITE WITH AUTO-PRECHARGE
WRITE A0
DIN 0DIN 1DIN 2DIN 3
(BANK 0)
CAS latency = 2, burst length = 4
Therefore, the selected bank can be made active after a delay of t
DAL.
The selected bank must be set to the active state before executing this command.
The auto-precharge function is invalid if the burst length is set to full page.
CAS Latency 3 2
tDAL 1CLK 1CLK
+tRP +tRP
ACT 0
PRECHARGE START
tRP
tDAL
CLK
COMMAND
I/O
WRITE WITH AUTO-PRECHARGE
WRITE A0
DIN 0DIN 1DIN 2DIN 3
(BANK 0)
CAS latency = 3, burst length = 4
ACT 0
PRECHARGE START
tRP
tDAL
24
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IS42S16128 ISSI
Interval Between Read Command
®
A new command can be executed while a read cycle is in progress, i.e., before that cycle completes. When the second read command is executed, after the CAS latency has elapsed, data corresponding to the new read com­mand is output in place of the data due to the previous read command.
CLK
COMMAND
I/O
READ A0 READ B0
D
OUT
A0 D
t
CCD
READ (CA=A, BANK 0) READ (CA=B, BANK 0)
CAS latency = 2, burst length = 4
Interval Between Write Command
A new command can be executed while a write cycle is in progress, i.e., before that cycle completes. At the point the second write command is executed, data corresponding to the new write command can be input in place of the data for the previous write command.
The interval between two read command (tCCD) must be at least one clock cycle.
The selected bank must be set to the active state before executing this command.
OUT
B0 D
OUT
B1
D
OUT
B2
D
OUT
B3
The interval between two write commands (tCCD) must be at least one clock cycle.
The selected bank must be set to the active state before executing this command.
CLK
t
CCD
COMMAND
I/O
WRITE A0 WRITE B0
DIN A0 DIN B0 DIN B1 DIN B2 DIN B3
WRITE (CA=A, BANK 0) WRITE (CA=B, BANK 0)
CAS latency = 2, burst length = 4
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IS42S16128 ISSI
Interval Between Write and Read Commands
®
A new read command can be executed while a write cycle is in progress, i.e., before that cycle completes. Data corresponding to the new read command is output after the CAS latency has elapsed from the point the new read command was executed. The I/On pins must be placed in the HIGH impedance state at least one cycle before data is output during this operation.
CLK
t
CCD
COMMAND
I/O
WRITE A0 READ B0
DIN A0
WRITE (CA=A, BANK 0) READ (CA=B, BANK 0)
HI-Z
DOUT B0 DOUT B2DOUT B1 DOUT B3
CAS latency = 2, burst length = 4
CLK
t
CCD
COMMAND
WRITE A0 READ B0
The interval (tCCD) between command must be at least one clock cycle.
The selected bank must be set to the active state before executing this command.
I/O
DIN A0 DOUT B0 DOUT B2DOUT B1 DOUT B3
WRITE (CA=A, BANK 0) READ (CA=B, BANK 0)
CAS latency = 3, burst length = 4
HI-Z
Dont Care
26
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 27
IS42S16128 ISSI
Interval Between Read and Write Commands
®
A read command can be interrupted and a new write command executed while the read cycle is in progress, i.e., before that cycle completes. Data corresponding to the new write command can be input at the point new write command is executed. To prevent collision between input and output data at the I/On pins during this opera­tion, the
CLK
CCD
t
COMMAND
U/LDQM
I/O
READ A0
READ (CA=A, BANK 0) WRITE (CA=B, BANK 0)
WRITE B0
HI-Z
DIN B0 DIN B2DIN B1 DIN B3
CAS latency = 2, 3, burst length = 4
output data must be masked using the U/LDQM pins. The interval (tCCD) between these commands must be at least one clock cycle.
The selected bank must be set to the active state before executing this command.
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IS42S16128 ISSI
®
Precharge
The precharge command sets the bank selected by pin A9 to the precharged state. This command can be executed at a time tRAS following the execution of an active com­mand to the same bank. The selected bank goes to the idle state at a time tRP following the execution of the precharge command, and an active command can be executed again for that bank.
If pin A8 is low when this command is executed, the bank selected by pin A9 will be precharged, and if pin A8 is HIGH, both banks will be precharged at the same time. This input to pin A9 is ignored in the latter case.
CLK
COMMAND
I/O
CAS latency = 2, burst length = 4
READ A0
D
OUT
A0 D
READ (CA=A, BANK 0) PRECHARGE (BANK 0)
Read Cycle Interruption Using the Precharge Command
A read cycle can be interrupted by the execution of the precharge command before that cycle completes. The delay time (tRQL) from the execution of the precharge command to the completion of the burst output is the clock cycle of CAS latency.
CAS Latency 3 2
tRQL 32
t
RQL
PRE 0
OUT
A1 D
OUT
A2
HI-Z
CLK
COMMAND
READ A0
I/O
READ (CA=A, BANK 0) PRECHARGE (BANK 0)
CAS latency = 3, burst length = 4
PRE 0
D
OUT
A0 D
OUT
t
RQL
A1 D
OUT
A2
HI-Z
28
Integrated Silicon Solution, Inc. — 1-800-379-4774
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Page 29
IS42S16128 ISSI
®
Write Cycle Interruption Using the Precharge Command
A write cycle can be interrupted by the execution of the precharge command before that cycle completes. The delay time (tWDL) from the precharge command to the point where burst input is invalid, i.e., the point where input data is no longer written to device internal memory is zero clock cycles regardless of the CAS.
To inhibit invalid write, the DQM signal must be asserted HIGH with the precharge command.
CLK
COMMAND
WRITE A0
This precharge command and burst write command must be of the same bank, otherwise it is not precharge interrupt but only another bank precharge of dual bank operation.
Inversely, to write all the burst data to the device, the precharge command must be executed after the write data recovery period (tDPL) has elapsed. Therefore, the precharge command must be executed on one clock cycle that follows the input of the last burst data item.
CAS Latency 3 2
tWDL 00
tDPL 11
t
WDL=0
PRE 0
DQM
I/O
WRITE (CA=A, BANK 0)
CAS latency = 2, 3, burst length = 4
CLK
COMMAND
I/O
WRITE A0
DIN A0
WRITE (CA=A, BANK 0) PRECHARGE (BANK 0)
CAS latency = 2, 3, burst length = 4
DIN A0
D
IN A1 DIN A2 DIN A3
IN A1 DIN A2 DIN A3
D
MASKED BY DQM
PRECHARGE (BANK 0)
t
DPL
PRE 0
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29
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IS42S16128 ISSI
®
Read Cycle (Full Page) Interruption Using the Burst Stop Command
The IS42S16128 can output data continuously from the burst start address (a) to location a+255 during a read cycle in which the burst length is set to full page. The IS42S16128 repeats the operation starting at the 256th cycle with the data output returning to location (a) and continuing with a+1, a+2, a+3, etc. A burst stop command must be executed to terminate this cycle. A precharge command must be executed within the ACT to PRE command period (tRAS max.) following the burst stop command.
CLK
COMMAND
I/O
CAS latency = 2, burst length = full page
READ A0
READ (CA=A, BANK 0)
D
OUT
A0
D
After the period (t
RBD) required for burst data output to
stop following the execution of the burst stop command has elapsed, the outputs go to the HIGH impedance state. This period (tRBD) is one clock cycle when the CAS latency is one, two clock cycle when the CAS latency is two and three clock cycle when the CAS latency is three.
CAS Latency 3 2
tRBD 32
t
RBD
BST
OUT
A0 D
OUT
A1
BURST STOP
D
OUT
A2
D
OUT
A3
HI-Z
CLK
COMMAND
READ A0
I/O
READ (CA=A, BANK 0) BURST STOP
CAS latency = 3, burst length = full page
D
OUT
A0 D
OUT
A0
D
BST
OUT
A1
D
OUT
t
RBD
A2
D
OUT
A3
HI-Z
30
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Rev. A
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Page 31
IS42S16128 ISSI
®
Write Cycle (Full Page) Interruption Using the Burst Stop Command
The IS42S16128 can input data continuously from the burst start address (a) to location a+255 during a write cycle in which the burst length is set to full page. The IS42S16128 repeats the operation starting at the 256th cycle with data input returning to location (a) and continu­ing with a+1, a+2, a+3, etc. A burst stop command must
CLK
COMMAND
I/O
CAS latency = 2, 3, burst length = full page
WRITE A0
DIN A0 DIN A1 DIN ADIN A1 DIN A2
READ (CA=A, BANK 0) BURST STOP
Burst Data Interruption Using the U/LDQM Pins (Read Cycle)
Burst data output can be temporarily interrupted (masked) during a read cycle using the U/LDQM pins. Regardless of the CAS latency, two clock cycles (tQMD) after one of the U/LDQM pins goes HIGH, the corresponding outputs go to the HIGH impedance state. Subsequently, the outputs are maintained in the high impedance state as long as
be executed to terminate this cycle. A precharge com­mand must be executed within the ACT to PRE command period (tRAS max.) following the burst stop command. After the period (tWBD) required for burst data input to stop following the execution of the burst stop command has elapsed, the write cycle terminates. This period (t
WBD) is
zero clock cycles, regardless of the CAS latency.
WBD=0
t
BST PRE 0
INVALID DATA
PRECHARGE (BANK 0)
t
RP
Dont Care
that U/LDQM pin remains HIGH. When the U/LDQM pin goes LOW, output is resumed at a time tQMD later. This output control operates independently on a byte basis with the UDQM pin controlling upper byte output (pins I/O8-I/O15) and the LDQM pin controlling lower byte output (pins I/O0 to I/O7).
Since the U/LDQM pins control the device output buffers only, the read cycle continues internally and, in particular, incrementing of the internal burst counter continues.
CLK
COMMAND
READ A0
t
QMD=2
UDQM
LDQM
D
I/O8-I/O15
I/O0-I/O 7
READ (CA=A, BANK 0) DATA MASK (LOWER BYTE)
DATA MASK (UPPER BYTE)
OUT
OUT
CAS latency = 2, burst length = 4
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A0
A0
D
OUT
HI-Z
A1D
D
OUT
HI-Z
A2 D
OUT
A3
HI-Z
31
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IS42S16128 ISSI
®
Burst Data Interruption U/LDQM Pins (Write Cycle)
Burst data input can be temporarily interrupted (muted ) during a write cycle using the U/LDQM pins. Regardless of the CAS latency, as soon as one of the U/LDQM pins goes HIGH, the corresponding externally applied input data will no longer be written to the device internal circuits. Subsequently, the corresponding input continues to be muted as long as that U/LDQM pin remains HIGH.
CLK
COMMAND
UDQM
LDQM
I/O8-I/O15
WRITE A0
t
DMD=0
The IS42S16128 will revert to accepting input as soon as that pin is dropped to LOW and data will be written to the device. This input control operates independently on a byte basis with the UDQM pin controlling upper byte input (pin I/O8 to I/O15) and the LDQM pin controlling the lower byte input (pins I/O0 to I/O7).
Since the U/LDQM pins control the device input buffers only, the cycle continues internally and, inparticular, incrementing of the internal burst counter continues.
D
IN
DINA1
DINA2
A3
I/O0-I/O7
WRITE (CA=A, BANK 0) DATA MASK (LOWER BYTE)
DATA MASK (UPPER BYTE)
D
IN
A0 DINA3
CAS latency = 2, burst length = 4
Burst Read and Single Write
The burst read and single write mode is set up using the mode register set command. During this operation, the burst read cycle operates normally, but the write cycle only writes a single data item for each write cycle. The CAS latency and DQM latency are the same as in normal mode.
CLK
COMMAND
I/O
WRITE A0
DIN A0
Dont Care
CAS latency = 2, 3
32
WRITE (CA=A, BANK 0)
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Page 33
IS42S16128 ISSI
®
Bank Active Command Interval
When the selected bank is precharged, the period trp has elapsed and the bank has entered the idle state, the bank can be activated by executing the active command. If the other bank is in the idle state at that time, the active command can be executed for that bank after the period tRRD has elapsed. At that point both banks will be in the active state. When a bank active command has been
CLK
t
RRD
COMMAND
CLK
COMMAND
ACT 0 ACT 1
BANK ACTIVE (BANK 0) BANK ACTIVE (BANK 1)
t
RCD
ACT 0 READ 0
executed, a precharge command must be executed for that bank within the ACT to PRE command period (t
RAS
max.). Also note that a precharge command cannot be executed for an active bank before tRAS (min.) has elapsed.
After a bank active command has been executed and the trcd period has elapsed, read write (including auto­precharge) commands can be executed for that bank.
BANK ACTIVE (BANK 0) BANK ACTIVE (BANK 0)
CAS latency = 3
Clock Suspend
When the CKE pin is dropped from HIGH to LOW during a read or write cycle, the IS42S16128 enters clock sus­pend mode on the next CLK rising edge. This command reduces the device power dissipation by stopping the device internal clock. Clock suspend mode continues as long as the CKE pin remains low. In this state, all inputs other than CKE pin are invalid and no other commands can be executed. Also, the device internal states are maintained. When the CKE pin goes from LOW to HIGH,
CLK
CKE
COMMAND
READ 0
clock suspend mode is terminated on the next CLK rising edge and device operation resumes.
The next command cannot be executed until the recovery period (tcka) has elapsed.
Since this command differs from the self-refresh command described previously in that the refresh operation is not performed automatically internally, the refresh operation must be performed within the refresh period (tref). Thus the maximum time that clock suspend mode can be held is just under the refresh cycle time.
D
I/O
READ (BANK 0) CLOCK SUSPEND
OUT
CAS latency = 2, burst length = 4
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0D
OUT
1D
OUT
2D
OUT
3
33
Page 34
IS42S16128 ISSI
OPERATION TIMING EXAMPLE
Power-On Sequence, Mode Register Set Cycle
T0 T1 T2 T3 T10 T17 T18 T19 T20
CLK
t
CK
CH
AS
BANK 0 & 1
CHI
t
t
t
t
AH
CH
CH
CH
t
CL
t
CODE
CODE
AH
ROW
t
AH
ROW
t
AH
BANK 1
t
AS
t
AS
t
AS
CODE
BANK 0
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
HIGH
t
CS
HIGH
t
t
t
CS
t
CS
t
CS
t
®
I/O
WAIT TIME
T=100 µs
CAS latency = 2, 3
t
t
RP
PALL
><
<
REF
>
RC
REF
t
t
t
RC
MRS
>
><
MCD
<
ACT
><
RAS
t
RC
Undefined Don't Care
34
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IS42S16128 ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0 T1 T2 T3 Tn Tn+1 Tn+2 Tn+3
t
CK
t
CKS
t
CHI
t
CL
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
AH
t
AS
ROW
ROW
BANK 1
BANK 0
t
CKS
t
CKH
t
CKA
t
CKA
t
AH
t
AS
t
RP
POWER DOWN MODE
EXIT
POWER DOWN MODE
t
RAS
t
RC
<
ACT
><
SBY
>
<
PRE
>
<
PALL
>
BANK 0 & 1
BANK 0 OR 1
BANK 1
BANK 0
Power-Down Mode Cycle
®
CAS latency = 2, 3
Undefined Don't Care
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35
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IS42S16128 ISSI
Auto-Refresh Cycle
T0 T1 T2 T3 Tl Tm Tn Tn+1
CLK
t
CHI
t
t
t
t
t
CS
CS
CS
CK
CH
t
CL
t
CH
t
CH
t
CH
CKE
CS
RAS
CAS
WE
t
CKS
t
CS
®
A0-A7
t
AS
A8
A9
DQM
I/O
CAS latency = 2, 3
t
AH
BANK 0 & 1
t
t
RP
PALL
><
<
REF
>
RC
ROW
ROW
BANK 1
BANK 0
t
t
RC
REF
><
REF
>
RC
<
ACT
t
RAS
t
RC
><
Undefined Don't Care
36
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Page 37
IS42S16128 ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0 T1 T2 T3 Tm Tm+2Tm+1 Tn
t
CK
t
CHI
t
CL
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
AH
t
AS
BANK 0 & 1
t
CKS
t
CKS
t
CKA
t
CKA
t
RP
SELF REFRESH MODE
EXIT SELF
REFRESH
t
RC
t
RC
<
REF
>
<
PALL
><
SELF
>
t
CKS
Self-Refresh Cycle
®
CAS latency = 2, 3
Undefined Don't Care
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37
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IS42S16128 ISSI
Read Cycle
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
CLK
t
t
CKE
CKS
t
CS
t
t
CKA
t
CS
t
CS
RAS
t
CS
CAS
t
CS
WE
t
AS
A0-A7
t
AS
A8
t
AS
A9
DQM
I/O
CAS latency = 2, burst length = 4
CHI
CK
CH
ROW ROW
ROW
BANK 1
<
ACT
><
t
CH
t
CH
t
CH
t
AH
t
AH
t
AH
t
RCD
t
RAS
t
RC
t
CL
READ
COLUMN m
BANK 0 AND 1
NO PRE
BANK 1 BANK 1
BANK 0 OR 1
BANK 1
BANK 0BANK 0
t
CS
t
QMD
t
CAC
t
AC
t
LZ
t
AC
t
OH
D
OUT
mD
OUT
>
t
OH
m+1
t
t
AC
CH
BANK 0
t
D
OUT
m+2
PRE
>
<
<
PALL
>
OH
t
AC
t
RQL
t
RP
D
OUT
t
OH
m+3
t
HZ
ROW
BANK 0
t t
t
<
ACT
>
RCD
RAS
RC
Undefined Don't Care
®
38
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Page 39
IS42S16128 ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
tCK
tCHI
tCL
tCHtCS
tCHtCS
tCHtCS
tCHtCS
tAH
tAS
BANK 1
AUTO PRE
tAH
tAS
tCS
tAHtAS
tCKS
tCKA
BANK 0BANK 0
BANK 1 BANK 1
BANK 0
ROW ROW
ROW
COLUMN m
ROW
tQMD
tLZ
tRAS
tRC
<ACT><READA>
<
ACT>
tRCD tCAC
tPQL
tRP
tRCD
tAC
tAC
tOH
tAC tAC
tOH
tCH
tOH
D
OUT
mD
OUT
m+1
D
OUT
m+2
tOH
tHZ
D
OUT
m+3
tRC
tRAS
Read Cycle / Auto-Precharge
®
CAS latency = 2, burst length = 4
Integrated Silicon Solution, Inc. — 1-800-379-4774
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Undefined Don't Care
39
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IS42S16128 ISSI
Read Cycle / Full Page
T0 T1 T2 T3 T4 T5 T6 T260 T261 T262 T263
CLK
t
t
CKE
CKS
t
CS
t
t t
CS
t
CS
RAS
t
CS
CAS
t
CS
WE
t
AS
A0-A7
t
AS
A8
t
AS
A9
DQM
I/O
CAS latency = 2, burst length = full page
CK
CKA CH
CHI
t
CH
t
CH
t
CH
t
AH
ROW
t
AH
ROW
t
AH
BANK 0
t
RCD
t
RAS
t
RC
(BANK 0)
<
ACT 0
><
t
CL
READ0
t
>
COLUMN
NO PRE
CS
BANK 0
t
t
(BANK 0)
QMD
CAC
BANK 0 OR 1
BANK 0
t
CH
t
AC
t
LZ
t
AC
t
OH
D
OUT
0m D
OUT
t
AC
t
OH
0m+1
t
OH
D
OUT
0m-1
t
AC
t
OH
D
OUT
0m D
t
AC
t
RBD
t
OH
OUT
0m+1
t
HZ
t
RP
(BANK 0)
BST
><
<
PRE 0
>
Undefined Don't Care
®
40
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IS42S16128 ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
t
CK
t
CHI
t
CL
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
AH
t
AS
BANK 0 BANK 0
BANK 0
BANK 0
BANK 1
BANK 1
BANK 1
BANK 0 OR 1 BANK 0 OR 1NO PRE
NO PRE
t
CH
t
AH
t
AS
t
QMD
t
CS
t
AC
t
AC
t
AC
t
AC
t
RCD
(BANK 0)
t
RAS
(BANK 0)
<
ACT 0
>
<
ACT 0
><
ACT1
>
<
READ 0
>
<
READA 0
><
READA 1
>
<
READ 1
><
PRE 0
><
PRE 1
>
t
AH
t
AS
t
CKS
t
CKA
ROW
ROW
ROW
ROW
ROW
COLUMN COLUMN
AUTO PRE AUTO PRE
ROW
t
LZ
t
LZ
t
RCD
(BANK 1)
t
RAS
(BANK 1)
t
RC
(BANK 1)
t
CAC
(BANK 1)
t
CAC
(BANK 1)
t
RC
(BANK 0)
t
RP
(BANK 0)
t
RP
(BANK1)
t
RCD
(BANK 0)
t
RAS
(BANK 0)
t
RC
(BANK 0)
t
RRD
(BANK 0 TO 1)
t
OH
t
OH
t
OH
t
OH
t
HZ
t
HZ
D
OUT
0m D
OUT
0m+1 D
OUT
1m D
OUT
1m+1
Read Cycle / Ping-Pong Operation (Bank Switching)
®
CAS latency = 2, burst length = 2
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Undefined Don't Care
41
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IS42S16128 ISSI
Write Cycle
T0 T1 T2 T3 T4 T5 T7 T6 T8 T9 T10
CLK
t
CHI
CK
CKA CH
ROW ROW
AS
ROW
BANK 1 BANK 0
t
CL
t
CH
t
CH
t
CH
t
AH
COLUMN m
t
AH
BANK 0 AND 1
NO PRE
t
AH
BANK 1
BANK 0 OR 1
BANK 1
t
CS
BANK 0
t
CH
BANK 0
ROW
BANK 1
BANK 0
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
t
CKS
t
CS
t
t t
t
CS
t
CS
t
CS
t
AS
t
t
AS
®
I/O
t
RCD
t
RAS
t
RC
ACT
><
CAS latency = 2, burst length = 4
t
DH
t
D
IN
m+2
DS
D
IN
t
DH
m+3
t
DPL
<
PRE
<
PALL
t
RCD
t
RP
>
<
ACT
><
t
RAS
t
RC
>
Undefined Don't Care
t
DS
DIN m
WRIT
t
>
DH
t
DS
IN
D
t
DH
m+1
t
DS
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IS42S16128 ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0 T1 T2 T3 T4 T5 T7 T6 T8 T9 T10
t
CK
t
CHI
t
CL
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
AH
t
AS
BANK 1 BANK 0
AUTO PRE
t
CH
t
AH
t
AS
t
CS
t
DS
t
DS
t
DS
t
DS
t
DH
t
RAS
t
RC
<
ACT
><
ACT
><
WRITA
>
t
AH
t
AS
t
CKS
t
CKA
ROW ROW
ROW
COLUMN m
ROW
t
RCD
t
DH
t
DH
t
DH
t
RP
t
DAL
t
RCD
t
RAS
t
RC
DIN m
D
IN
m+2
D
IN
m+1
D
IN
m+3
BANK 1
BANK 0
BANK 1
BANK 0
Write Cycle / Auto-Precharge
®
CAS latency = 2, burst length = 4
Undefined Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
43
Page 44
IS42S16128 ISSI
Write Cycle / Full Page
T0 T1 T2 T3 T4 T5 T259T258 T260 T261 T262
CLK
t
CK
CKA CH
CHI
t
CH
t
CH
t
CH
t
CL
CKE
CS
RAS
CAS
WE
t
CKS
t
CS
t
t
t
t
CS
t
CS
t
CS
®
t
A0-A7
A8
A9
t
t
t
AS
AS
AS
ROW
t
AH
ROW
t
AH
BANK 0
AH
COLUMN m
t
CS
DQM
t
DS
I/O
t
RCD
t
RAS
t
RC
<
ACT 0
><
CAS latency = 2, burst length = full page
NO PRE
BANK 0
t
t
DH
DIN 0m
WRIT0
>
DS
t
DH
IN
0m+1
D
t
DS
D
IN
0m+2
t
DH
t
DS
t
DH
IN
0m-1 D
D
IN
0m
t
CH
t
DPL
BANK 0 OR 1
BANK 0
t
RP
BST
><
<
PRE 0
>
Undefined Don't Care
44
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 45
IS42S16128 ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
t
CK
t
CHI
t
CL
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
AH
t
AS
BANK 0
BANK 0
BANK 0 BANK 0
BANK 1
BANK 1
BANK 0 OR 1NO PRE
NO PRE
t
CH
t
AH
t
AS
t
CS
t
DS
t
DS
t
RCD
(BANK 0)
t
RAS
(BANK 0)
<
ACT 0
><
ACT 1
>
<
WRIT 0
>
<
WRITA 0
><
WRITA 1
>
<
WRIT 1
><
PRE 0
><
ACT 0
>
t
AH
t
AS
t
CKS
t
CKA
ROW
ROW
ROW
ROW
ROW
COLUMN COLUMN
AUTO PRE
AUTO PRE
ROW
t
RCD
(BANK 1)
t
RAS
(BANK 1)
t
RC
(BANK 1)
t
RC
(BANK 0)
t
RCD
(BANK 0)
t
RP
(BANK 0)
t
RAS
(BANK 0)
t
RC
(BANK 0)
t
RRD
(BANK 0 TO 1)
t
DPL
t
DPL
t
DH
t
DH
t
DS
t
DH
t
DH
DIN 0m
t
DS
t
DS
t
DH
t
DS
t
DH
t
DH
t
DH
t
DS
t
DS
DIN 0m+1 DIN 0m+2 DIN 0m+3 DIN 1m DIN 1m+1 DIN 1m+2 DIN 1m+3
Write Cycle / Ping-Pong Operation
®
CAS latency = 2, burst length = 2
Undefined Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
45
Page 46
IS42S16128 ISSI
Read Cycle / Page Mode
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
CLK
t
t
CKE
CKS
t
CS
t
t t
CS
t
CS
RAS
t
CS
CAS
t
CS
WE
t
AS
A0-A7
t
AS
A8
t
AS
A9
DQM
I/O
CAS latency = 2, burst length = 2
CHI
CK
CKA CH
ROW
ROW
t
CL
t
CH
t
CH
t
CH
t
AH
COLUMN m
t
AH
NO PRE NO PRE
t
AH
BANK 1
BANK 1 BANK 0
t
RCD
t
RAS
t
RC
<
ACT
><
t
CS
BANK 0
t
READ
>
t
QMD
CAC
t
LZ
COLUMN n
BANK 1
BANK 0
t
AC
t
AC
t
OH
D
OUT
mD
t
CAC
READ
>
t
AC
t
OH
OUT
m+1 D
COLUMN o
AUTO PRE
NO PRE
BANK 1
BANK 0
t
AC
t
OH
OUT
nD
t
READ
><
<
<
READA
>
CAC
t
OH
OUT
n+1 D
BANK 0 AND 1
BANK 0 OR 1
BANK 1 BANK 0
t
CH
t
AC
OUT
PRE
>
<
<
PALL
>
t
AC
t
t
OH
oD
t
RQL
t
RP
OH
OUT
o+1
t
HZ
Undefined Don't Care
®
46
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 47
IS42S16128 ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
t
CK
t
CHI
t
CL
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
AH
t
AS
BANK 1 BANK 0
BANK 0
BANK 0 BANK 0
BANK 1
BANK 0 OR 1
BANK 0 AND 1
NO PRE
BANK 1
t
QMD
t
AH
t
AS
t
LZ
t
CS
t
RAS
t
RC
<
ACT
><
READ
>
<
READA, ENB
>
<
READ, ENB
><
MASK
>
<
PALL
>
<
PRE
>
t
AH
t
AS
t
CKS
t
CKA
ROW
COLUMN m
COLUMN n
COLUMN o
NO PRE NO PRE
NO PRE
AUTO PRE
ROW
t
CH
t
RCD
t
CAC
t
CAC
t
CAC
t
RQL
t
HZ
t
HZ
t
RP
t
QMD
BANK 1
BANK 0
BANK 1
t
AC
t
LZ
t
AC
t
OH
t
AC
t
AC
t
AC
t
OH
t
OH
t
OH
t
OH
D
OUT
mD
OUT
m+1 D
OUT
nD
OUT
oD
OUT
o+1
Read Cycle / Page Mode; Data Masking
®
CAS latency = 2, burst length = 2
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Undefined Don't Care
47
Page 48
IS42S16128 ISSI
Write Cycle / Page Mode
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
CLK
t
CK
CKA CH
CHI
ROW
ROW
BANK 1 BANK 0
t
t
t
CH
t
CH
t
CH
t
AH
AH
AH
t
CL
COLUMN m
NO PRE NO PRE
BANK 1
BANK 0
t
CS
COLUMN n
BANK 1
BANK 0
COLUMN o
AUTO PRE
NO PRE
BANK 1 BANK 0
BANK 0 AND 1
BANK 0 OR 1
BANK 1
BANK 0
t
CH
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
t
CKS
t
CS
t
t t
t
CS
t
CS
t
CS
t
AS
t
AS
t
AS
®
I/O
t
RCD
t
RAS
t
RC
<
ACT
><
CAS latency = 2, burst length = 2
t
DS
DIN m
WRIT
t
>
DH
t
DS
t
DH
DIN m+1
t
DH
t
D
WRIT
IN n
>
DS
t
DH
IN
n+1
D
t
DS
t
DS
<
WRIT
WRITA
<
t
DH
D
IN
o
><
>
t
DS
t
DH
IN
o+1
D
t
DPL
t
RP
<
PRE
>
PALL
>
<
Undefined Don't Care
48
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 49
IS42S16128 ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
t
CK
t
CHI
t
CL
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
AH
t
AS
BANK 1 BANK 0
BANK 0
BANK 0
BANK 0
BANK 1
BANK 1OR 0
BANK 0 AND 1
BANK 1
t
CH
t
AH
t
AS
t
CS
t
RAS
t
RC
<
ACT
><
WRIT
><
WRIT
>
<
WRITA
>
<
WRIT
><
MASK
>
<
PALL
>
<
PRE
>
t
AH
t
AS
t
CKS
t
CKA
ROW
COLUMN m
COLUMN n
COLUMN o
NO PRE NO PRE
NO PRE
AUTO PRE
ROW
t
RCD
t
DPL
t
RP
BANK 1
BANK 0
BANK 1
t
DS
t
DS
t
DS
t
DH
t
DS
t
DH
t
DH
t
DH
t
DS
t
DH
DIN m
D
IN n
DIN m+1
D
IN
o
D
IN
o+1
Write Cycle / Page Mode; Data Masking
®
CAS latency = 2, burst length = 2
Undefined Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
49
Page 50
IS42S16128 ISSI
Read Cycle / Clock Suspend
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
CLK
t
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
t
CKS
t
CS
CK
CKA CH
CHI
t
t t
t
CS
t
CS
t
CS
t
AS
ROW ROW
t
AS
t
t
CH
t
CH
t
CH
t
AH
AH
t
CL
COLUMN m
AUTO PRE
t
CKS
ROW
t
CS
NO PRE
BANK 1 BANK 0
t
QMD
t
CAC
t
CH
t
AC
t
LZ
t
AC
t
OH
D
OUT
mD
t
AS
BANK 1 BANK 0
t
AH
t
RCD
t
RAS
t
RC
t
CKH
OUT
m+1
BANK 0 AND 1
BANK 0 OR 1
BANK 1
BANK 0
t
OH
t
HZ
t
RP
ROW
BANK 1
BANK 0
t
RAS
t
RC
®
<
ACT 0
> <
CAS latency = 2, burst length = 2
50
READ
READ A
<
<
SPND
><
SPND
>
><
>
PRE
<
PALL
>
ACT
><
>
Undefined Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 51
IS42S16128 ISSI
Write Cycle / Clock Suspend
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
CLK
t
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
t
CKS
t
CS
CK
CKA
CH
CHI
t
CH
t
CH
t
CH
t
AH
t
t t
t
CS
t
CS
t
CS
t
AS
ROW ROW
t
AS
t
AH
t
CKS
t
CL
COLUMN m
AUTO PRE
ROW
t
CS
NO PRE
BANK 1
BANK 0
t
AS
BANK 1 BANK 0
t
AH
t
CKH
BANK 0 AND 1
BANK 0 OR 1
BANK 1
BANK 0
t
CH
ROW
BANK 1
BANK 0
®
I/O
t
RCD
t
RAS
t
RC
<
ACT
> <
CAS latency = 2, burst length = 2
t
DS
t
DH
DIN mD
<
SPND
WRIT, SPND
<
WRITA, SPND
>
>
><
t
DS
IN
m+1
t
DPL
t
DH
t
PRE
<
PALL
t
RP
> >
ACT
RAS
t
RC
><
Undefined Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
51
Page 52
IS42S16128 ISSI
Read Cycle / Precharge Termination
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
CLK
t
CHI
CK
CH
ROW ROW
t
CL
t
CH
t
CH
t
CH
t
AH
COLUMN m COLUMN n
t
AH
ROW
BANK 0 OR 1
t
CH
t
AC
t
OH
D
OUT
mD
D
OUT
t
OH
m+1
t
AC
t
RQL
t
RP
OUT
t
OH
m+2
t
BANK 0
t
AH
t
RCD
t
RAS
t
RC
NO PRE
BANK 0 BANK 0
t
CS
t
QMD
t
CAC
t
AC
t
LZ
HZ
ROW
BANK 1
BANK 0
t
RCD
t
RAS
t
RC
AUTO PRE
NO PRE
BANK 1 BANK 0
t
CAC
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
t
CKS
t
CS
t
t
CKA
t
t
CS
t
CS
t
CS
t
AS
t
AS
t
AS
®
<
ACT 0
> <
CAS latency = 2, burst length = 4
52
READ 0
PRE 0
><
>
<
ACT
><
READ
<
READA
>
>
Undefined Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 53
IS42S16128 ISSI
Write Cycle / Precharge Termination
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
CLK
t
CHI
CK
CH
ROW ROW
t
CL
t
CH
t
CH
t
CH
t
AH
COLUMN m COLUMN n
t
AH
ROW
BANK 0 OR 1
t
CS
t
CH
BANK 0
t
t
CS
AH
NO PRE
BANK 0 BANK 0
t
CH
ROW
BANK 1
BANK 0
AUTO PRE
NO PRE
BANK 1 BANK 0
t
CS
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
t
CKS
t
CS
t
t
CKA
t
t
CS
t
CS
t
CS
t
AS
t
AS
t
AS
®
I/O
t
RCD
t
RAS
t
RC
<
ACT 0
> <
CAS latency = 2, burst length = 4
t
IN
0m+2
DH
t
RCD
t
ACT
RAS
t
RC
><
t
RP
<
PRE 0
><
t
DIN 0m+1
DH
t
DS
D
t
DH
t
t
DS
DS
DIN 0m DIN 0n
WRIT 0
>
t
WRIT
WRITA
DH
>
>
Undefined Don't Care
t
DS
<
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
53
Page 54
IS42S16128 ISSI
Read Cycle / Byte Operation
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
CLK
t
CK
CKA
CH
CHI
ROW
ROW
BANK 1
BANK 0
t
t
t
CH
t
CH
t
CH
t
AH
AH
AH
t
CL
t
COLUMN m
AUTO PRE
NO PRE
BANK 1
BANK 0
t
CS
CS
t
QMD
t
QMD
ROW
BANK 0 AND 1
ROW
BANK 0 OR 1
BANK 1
BANK 1
t
t
OH
m+1
AC
BANK 0
t
LZ
D
OUT
t
OH
m+2
t
AC
D
OUT
t
CH
t
CH
t
AC
t
LZ
t
AC
t
LZ
D
D
OUT
OUT
t
t
OH
m
OH
m
t
HZ
t
AC
D
OUT
t
OH
m+3
BANK 0
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
UDQM
LDQM
I/O8-15
I/O0-7
t
CKS
t
CS
t
t
t
t
CS
t
CS
t
CS
t
AS
t
AS
t
AS
®
t
RCD
t
RAS
t
RC
<
ACT
> <
CAS latency = 2, burst length = 4
54
READ
<
READA
t
CAC
>
MASKU
>
<
ENBU, MASKL
>
t
QMD
>
<
MASKL
t
RQL
t
RP
PRE
>
<
><
<
PALL
>
ACT
t
RCD
t
RAS
t
RC
><
Undefined Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 55
IS42S16128 ISSI
Write Cycle / Byte Operation
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
CLK
t
t
CK
CKA
CH
AS
CHI
ROW
ROW
BANK 1
BANK 0
t
CL
t
CH
t
CH
t
CH
t
AH
COLUMN m
t
AH
AUTO PRE
BANK 0 AND 1
ROW
ROW
t
AH
NO PRE
BANK 1
t
CS
BANK 0
t
CH
BANK 0 OR 1
BANK 1 BANK 0
BANK 1
BANK 0
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
UDQM
t
CKS
t
CS
t t
t
CS
t
CS
t
CS
t
AS
t
AS
t
®
LDQM
I/O8-15
I/O0-7
t
RCD
t
RAS
t
RC
<
ACT
> <
CAS latency = 2, burst length = 4
t
CS
t
DS
t
DS
<
t
CH
t
t
DS
t
DH
D
IN
m
t
DH
D
IN
m D
WRIT
>
MASKL
WRITA
<
>
DH
DIN m+1 DIN m+3
>
<
MASK
>
t
<
IN
m+3
ENB
DH
t
DH
t
DPL
t
RP
PRE
>
<
>
<
PALL
>
ACT
t
RCD
t
RAS
t
RC
><
Undefined Don't Care
t
DS
t
DS
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
55
Page 56
IS42S16128 ISSI
Read Cycle, Write Cycle / Burst Read, Single Write
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
CLK
t
t
CKS
CKE
t
CS
t
t
CS
t
CS
RAS
t
CS
CAS
t
CS
WE
t
AS
A0-A7
t
AS
A8
t
AS
A9
DQM
I/O
CAS latency = 2, burst length = 4
t
CK
CKA
CH
CHI
ROW
ROW
t
CL
t
CH
t
CH
t
CH
t
AH
COLUMN m
t
AH
NO PRE
t
AH
BANK 1
BANK 1
BANK 0BANK 0
t
CS
t
QMD
t
t
RCD
t
RAS
t
RC
<
ACT
><
READ
t
CAC
>
COLUMN n
D
IN
n
t
DPL
>
>
BANK 0 AND 1
BANK 0 OR 1
BANK 1 BANK 0
t
DH
t
RP
PRE
>
<
<
PALL
>
Undefined Don't Care
AUTO PRE
NO PRE
BANK 1
t
OH
m+3
t
HZ
t
DS
BANK 0
WRIT
<
<
WRITA
t
CH
t
AC
LZ
t
AC
t
OH
D
OUT
mD
OUT
t
OH
m+1
t
AC
D
OUT
t
t
OH
m+2
AC
D
OUT
®
56
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 57
IS42S16128 ISSI
Read Cycle
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12
CLK
t
t
CKS
CKE
t
CS
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
CAS latency = 3, burst length = 4
CHI
t
CK
t
CKA
t
CH
t
CS
t
CS
t
CS
t
AS
ROW ROW
t
AS
ROW
t
AS
BANK 1
<
ACT
><
t
CH
t
CH
t
CH
t
AH
t
AH
t
AH
t
RCD
t
RAS
t
RC
t
CL
COLUMN m
BANK 0 AND 1
NO PRE
BANK 1 BANK 1
BANK 0 OR 1
BANK 1
BANK 0BANK 0
READ
t
CS
t
CAC
t
QMD
t
AC
t
LZ
t
AC
t
OH
D
OUT
mD
>
t
OUT
t
CH
t
AC
OH
m+1
BANK 0
t
OH
D
OUT
m+2
t
PRE
>
<
<
PALL
>
t
AC
t
RQL
RP
D
OUT
t
OH
m+3
t
HZ
ROW
BANK 0
t
RCD
t
RAS
t
RC
<
ACT
>
Undefined Don't Care
®
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
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Page 58
IS42S16128 ISSI
Read Cycle / Auto-Precharge
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12
CLK
t
t
CK
t
CKA
t
CH
t
CS
t
CS
t
CS
t
AS
t
AS
CHI
ROW
t
CL
t
CH
t
CH
t
CH
t
AH
COLUMN
t
AH
AUTO PRE
ROW
t
t
AS
AH
BANK 1 BANK 1
BANK 1
BANK 0BANK 0
t
CS
t
RCD
t
RAS
t
RC
<
ACT
><
READA
>
t
CAC
t
QMD
t
AC
D
OUT
t
LZ
t
CH
t
t
OUT
AC
OH
m+1
t
AC
t
OH
mD
D
OUT
t
AC
t
OH
m+2
t
PQL
t
RP
D
OUT
t
OH
m+3
t
HZ
ROW
ROW
BANK 0
t
RCD
t
RAS
t
RC
ACT
>
<
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
t
CKS
t
CS
®
CAS latency = 3, burst length = 4
58
Undefined Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 59
IS42S16128 ISSI
Read Cycle / Full Page
T0 T1 T2 T3 T4 T5 T6 T7 T8 T262 T263 T264 T265
CLK
t
t
t
t
t
t
t
CS
CS
CS
t
AS
t
AS
t
AS
CK
CKA CH
CHI
ROW
ROW
BANK 0
<
ACT 0
t
CL
t
CH
t
CH
t
CH
t
AH
COLUMN
t
AH
NO PRE
t
AH
BANK 0
t
CS
t
AC
t
LZ
t
RCD
(BANK 0)
t
RAS
(BANK 0)
t
RC
(BANK 0)
><
READ0
t
CAC
(BANK 0)
>
t
AC
t
OH
DOUT 0m DOUT 0m+1
t
OH
t
AC
DOUT 0m-1
BST
><
<
BANK 0 OR 1
BANK 0
t
CH
t
AC
t
OH
DOUT 0m DOUT 0m+1
t
RBD
PRE 0
t
AC
t
OH
t
RP
(BANK 0)
>
t
OH
t
HZ
Undefined Don't Care
t
CKS
CKE
t
CS
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
CAS latency = 3, burst length = full page
®
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
59
Page 60
IS42S16128 ISSI
Read Cycle / Ping Pong Operation (Bank Switching)
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12
CLK
t
t
t
t
t
t
t
t
t
CK
CKA
t
CH
CS
CS
CS
AS
AS
AS
CHI
t
t
t
t
ROW
t
ROW
t
BANK 0
t
RRD
(BANK 0 TO 1)
t
RCD
(BANK 0)
t
RAS
(BANK 0)
t
(BANK 0)
ACT 0
>
<
CH
CH
CH
AH
AH
AH
RC
t
CL
ROW
COLUMN
COLUMN
ROW
AUTO PRE AUTO PRE
ROW
BANK 1
t
RCD
(BANK 1)
<
ACT1
><
<
READA 0
NO PRE
BANK 0
t
CS
t
CAC
(BANK 0)
READ 0
>
><
t
QMD
t
RAS
(BANK 1)
t
RC
(BANK 1)
<
READA 1
BANK 0 OR 1
BANK 1
t
AC
t
LZ
t
CAC
(BANK 1)
READ 1
><
>
BANK 0
t
OH
D
OUT
0m D
(BANK 0)
(BANK 0)
PRE 0
><
t
AC
t
RQL
t
RP
t
AC
t
OH
OUT
0m+1 D
BANK 0 OR 1NO PRE
BANK1
t
CH
PRE 1
t
AC
t
OH
OUT
1m D
t
RP
(BANK1)
>
ROW
BANK 0
t
OH
OUT
1m+1
(BANK 0)
<
ACT 0
>
t
HZ
t
RCD
(BANK 0)
t
RAS
(BANK 0)
t
RC
Undefined Don't Care
t
CKS
CKE
t
CS
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
CAS latency = 3, burst length = 2
®
60
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
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IS42S16128 ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0 T1 T2 T3 T4 T5 T7 T6 T8 T9 T10 T11
tCK
tCHI
tCL
tCHtCS
tCHtCS
tCHtCS
tCHtCS
tAH
tAS
BANK 1
BANK 0
BANK 0 OR 1
BANK 0 AND 1
NO PRE
tCH
tAH
tAS
tCS
tDS tDS tDS
tDS
tDH
tRAS
tRC
<PRE>
<
PALL>
<ACT><ACT><WRIT>
tAHtAS
tCKS
tCKA
ROW ROW
ROW
COLUMN
ROW
tRCD
tDH
tDH
tDH
tRP
tDPL tRCD
tRAS
tRC
DIN m
D
IN
m+2
D
IN
m+1
D
IN
m+3
BANK 1
BANK 0
BANK 1
BANK 0
BANK 1 BANK 0
T12
Write Cycle
®
CAS latency = 3, burst length = 4
Undefined Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
61
Page 62
IS42S16128 ISSI
Write Cycle / Auto-Precharge
®
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
T0 T1 T2 T3 T4 T5 T7 T6 T8 T9 T10
t
t
CKS
t
CS
CHI
t
CK
t
CKA
t
CH
t
CS
t
CS
t
CS
t
AS
ROW ROW
t
AS
t
t
CH
t
CH
t
CH
t
AH
AH
t
CL
COLUMN
AUTO PRE
ROW
t
t
AS
AH
BANK 1
BANK 1
BANK 0
t
CS
BANK 0
t
CH
T11 T12
ROW
BANK 1
BANK 0
I/O
t
RCD
t
RAS
t
RC
ACT
><
CAS latency = 3, burst length = 4
t
DS
t
DH
DIN m
WRITA
>
t
DH
t
D
IN
m+2
DS
D
t
IN
m+3
DH
t
DAL
t
RCD
t
RP
<
ACT
><
Undefined Don't Care
t
RAS
t
RC
t
DS
IN
D
t
DH
m+1
t
DS
62
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 63
IS42S16128 ISSI
Write Cycle / Full Page
T0 T1 T2 T3 T4 T5 T259T6 T260 T261 T262 T263 T264
CLK
t
t
t
CKA
t
CH
t
CS
t
CS
t
CS
t
AS
t
AS
t
AS
CK
CHI
ROW
ROW
BANK 0
t
t
t
t
t
t
CH
CH
CH
AH
AH
AH
t
CL
COLUMN
NO PRE
BANK 0 OR 1
t
CS
BANK 0
t
CH
BANK 0
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
t
CKS
t
CS
®
t
DS
I/O
t
RCD
t
RAS
t
RC
<
ACT 0
><
CAS latency = 3, burst length = full page
t
DIN 0m
WRIT0
>
DH
t
DH
t
D
IN
0m+2
DS
t
DH
IN
0m-1 D
D
IN
0m
t
DPL
<
BST
><
PRE 0
t
RP
>
Undefined Don't Care
t
DS
t
IN
0m+1
D
DH
t
DS
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
63
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IS42S16128 ISSI
Write Cycle / Ping-Pong Operation (Bank Switching)
®
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
t
t
t
t
t
t
t
t
t
t
CS
CS
CS
AS
AS
AS
CK
CKA CH
CHI
t
CH
t
CH
t
CH
t
AH
ROW
t
AH
ROW
t
AH
BANK 0
t
CL
COLUMN
AUTO PRE
ROW
COLUMN
AUTO PRE
ROW
NO PRE
t
CS
BANK 0
BANK 1
NO PRE
BANK 1
BANK 0 OR 1
BANK 0
t
CKS
t
CS
T11 T12
ROW
ROW
BANK 1 BANK 0
t
CH
I/O
t
RRD
(BANK 0 TO 1)
t
RCD
(BANK 0)
t
RAS
(BANK 0)
t
RC
(BANK 0)
<
ACT 0
><
CAS latency = 3, burst length = 4
t
DS
t
DS
t
DH
DIN 0m
<
WRIT 0
>
<
WRITA 0
><
t
DS
t
DH
t
DH
t
DS
t
DS
t
DH
t
DH
t
DS
t
DH
t
DS
t
DS
t
DH
t
DH
DIN 0m+1 DIN 0m+2 DIN 0m+3 DIN 1m DIN 1m+1 DIN 1m+2 DIN 1m+3
t
DPL
(BANK 0)
WRIT 1
<
WRITA 1
t
RP
(BANK 0)
><
PRE 0
><
>
ACT 1
t
RCD
(BANK 1)
t
RAS
(BANK 1)
t
RC
(BANK 1)
>
t
DPL
t
RCD
t
RAS
t
RC
ACT 0
>
Undefined Don't Care
64
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 65
IS42S16128 ISSI
Read Cycle / Page Mode
®
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
t
t
CKS
t
CS
CHI
t
CK
t
CKA
t
CH
t
CS
t
CS
t
CS
t
AS
ROW
t
AS
ROW
t
AS
BANK 1 BANK 0
<
ACT
><
t
CH
t
CH
t
CH
t
AH
t
AH
t
AH
t
RCD
t
RAS
t
RC
t
CL
COLUMN m
COLUMN n
NO PRE NO PRE BANK 1
BANK 1
BANK 0
t
t
CAC
READ
>
CS
t
QMD
BANK 0
t
LZ
READ
>
t
AC
t
CAC
t
AC
t
OH
D
OUT
mD
COLUMN o
AUTO PRE
NO PRE
BANK 1
BANK 0
t
AC
t
OH
OUT
m+1 D
t
CAC
READ
><
<
<
READA
>
t
AC
t
OH
OUT
nD
BANK 0 AND 1
BANK 0 OR 1
BANK 1 BANK 0
t
CH
t
AC
t
OH
OUT
n+1 D
t
RQL
t
RP
PRE
>
<
<
PALL
>
T11 T12
t
AC
t
t
OH
OUT
oD
OH
OUT
o+1
t
HZ
CAS latency = 3, burst length = 2
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Undefined Don't Care
65
Page 66
IS42S16128 ISSI
Read Cycle / Page Mode; Data Masking
®
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
t
t
CKS
t
CS
t
t
CKA
t
t
CS
t
CS
t
CS
t
AS
t
AS
t
AS
CK
CH
CHI
t
t
t
t
ROW
t
AH
ROW
t
AH
BANK 1 BANK 0
CH
CH
CH
AH
t
CL
COLUMN m
COLUMN n
COLUMN o
AUTO PRE
NO PRE NO PRE
NO PRE
BANK 1
BANK 1
t
CS
t
QMD
BANK 0
t
LZ
t
AC
BANK 1
BANK 0
t
t
CH
t
AC
t
OH
D
OUT
mD
QMD
t
AC
t
OH
OUT
m+1 D
t
OUT
t
AC
OH
nD
BANK 0 AND 1
BANK 0 OR 1
BANK 1 BANK 0 BANK 0
T11 T12
t
AC
t
t
OH
OUT
oD
OH
OUT
o+1
t
RCD
t
RAS
t
RC
<
ACT
><
CAS latency = 3, burst length = 2
t
t
CAC
READ
><
CAC
READ
><
READ, MASK
<
<
READA, MASK
t
>
>
CAC
ENB
t
HZ
t
RQL
t
RP
>
PRE
>
<
<
PALL
>
Undefined Don't Care
66
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 67
IS42S16128 ISSI
Write Cycle / Page Mode
®
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
t
t t
t
CS
t
CS
t
CS
t
AS
t
AS
t
t
CK
CKA CH
AS
CHI
t
t
t
t
ROW
t
AH
ROW
t
AH
BANK 0
CH
CH
CH
AH
t
CL
COLUMN m
COLUMN n
COLUMN o
AUTO PRE
NO PRE NO PRE
BANK 1
BANK 1
NO PRE
BANK 1
t
CS
BANK 0
BANK 0
t
CH
BANK 0
t
CKS
t
CS
T11 T12
BANK 0 AND 1
BANK 0 OR 1
BANK 1 BANK 0
I/O
t
RCD
t
RAS
t
RC
<
ACT
><
CAS latency = 3, burst length = 2
t
DS
DIN m
WRIT
t
>
DH
t
DS
t
DH
DIN m+1
t
DH
t
DS
D
IN n
WRIT
><
MASK
t
DH
t
DS
D
IN
o
WRIT
<
<
WRITA
><
>
>
t
DS
t
DH
IN
o+1
D
t
DPL
t
RP
PRE
>
<
<
PALL
>
Undefined Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
67
Page 68
IS42S16128 ISSI
Write Cycle / Page Mode; Data Masking
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12
CLK
t
t
t
CKA
t
t
CS
t
CS
t
CS
t
AS
t
AS
t
AS
CK
CH
CHI
t
t
t
t
ROW
t
AH
ROW
t
AH
BANK 1 BANK 0
CH
CH
CH
AH
t
CL
COLUMN m
COLUMN n
COLUMN o
AUTO PRE
BANK 0 AND 1
NO PRE NO PRE
t
CS
BANK 1
BANK 0
BANK 1
BANK 0
t
CH
BANK 1
BANK 0
NO PRE
BANK 1 BANK 0
BANK 1OR 0
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
t
CKS
t
CS
®
t
DS
I/O
t
RCD
t
RAS
t
RC
<
ACT
><
CAS latency = 3, burst length = 2
t
t
DS
t
DH
DIN m
WRIT
><
t
DH
DIN m+1
DH
t
DS
D
IN n
WRIT
>
MASK
>
t
DS
D
WRIT
<
<
WRITA
IN
t
DH
o
><
>
t
DS
t
DH
IN
o+1
D
t
DPL
t
RP
PRE
>
<
<
PALL
>
Undefined Don't Care
68
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 69
IS42S16128 ISSI
Read Cycle / Clock Suspend
®
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11
t
t
CKS
t
CS
t t
t
CS
t
CS
t
CS
t
AS
t
AS
t
AS
t
CK
CKA CH
CHI
ROW
t
ROW
t BANK 1 BANK 0
t
t
t
t
CH
t
CH
t
CH
t
AH
AH
AH
RCD
RAS
RC
t
t
CL
CKS
COLUMN m
AUTO PRE
NO PRE
BANK 1 BANK 0
t
CS
t
QMD
t
CAC
t
CH
t
AC
t
LZ
t
AC
t
OH
D
OUT
mD
t
CKH
BANK 0 AND 1
BANK 0 OR 1
OUT
m+1
BANK 1
BANK 0
t
OH
T12
t
HZ
t
RP
<
ACT
><
READ
<
READ A
>
>
CAS latency = 3, burst length = 2
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
<
SPND
><
SPND
><
PRE
<
PALL
>
>
Undefined Don't Care
69
Page 70
IS42S16128 ISSI
Write Cycle / Clock Suspend
®
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
t
t
CKS
t
CS
t
t
CKA
t
CH
t
CS
t
CS
t
CS
t
AS
CK
CHI
t
t
t
t
CH
CH
CH
AH
t
CL
ROW ROW
t
AS
t
AH
t
CKS
COLUMN m
AUTO PRE
ROW
t
CS
NO PRE
BANK 1 BANK 0
t
AS
t BANK 1 BANK 0
AH
t
CKH
t
CH
BANK 0 AND 1
BANK 0 OR 1
BANK 1 BANK 0
T11 T12
ROW
BANK 1
BANK 0
I/O
t
RCD
t
RAS
t
RC
<
ACT
> <
CAS latency = 3, burst length = 2
t
DS
t
DH
DIN mD
<
SPND
WRIT, SPND
<
WRITA, SPND
><
>
>
t
DS
IN
m+1
t
DPL
t
DH
PRE
<
PALL
t
ACT
RAS
t
RC
><
t
RP
>
>
Undefined Don't Care
70
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 71
IS42S16128 ISSI
Read Cycle / Precharge Termination
®
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
t
t
CKS
t
CS
CHI
t
CK
t
CKA
t
CH
t
CS
t
CS
t
CS
t
AS
ROW ROW
t
AS
t
t
CH
t
CH
t
CH
t
AH
AH
t
CL
COLUMN m
ROW
t
AS
t
BANK 0
t t
t
AH
RCD
RAS
RC
t
CS
NO PRE
BANK 0
t
QMD
t
CAC
t
LZ
BANK 0 OR 1
BANK 0
t
CH
t
AC
D
OUT
t
AC
t
OH
mD
D
OUT
t
OH
m+1
t
AC
t
RQL
t
RP
OUT
t
OH
m+2
T11 T12
ROW
BANK 1
BANK 0
t
HZ
t
RCD
t
RAS
t
RP
<
ACT 0
> <
READ 0
>
CAS latency = 3, burst length = 4
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
PRE 0
<
>
ACT
><
Undefined Don't Care
71
Page 72
IS42S16128 ISSI
Write Cycle / Precharge Termination
®
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
t
t
CKS
t
CS
CHI
t
CK
t
CKA
t
CH
t
CS
t
CS
t
CS
t
AS
ROW ROW
t
AS
t
t
CH
t
CH
t
CH
t
AH
AH
t
CL
COLUMN m
ROW
t
AS
t
BANK 0
AH
t
CS
NO PRE
BANK 0
t
CH
BANK 0 OR 1
BANK 0
t
CS
t
CH
T11 T12
ROW
BANK 1
BANK 0
I/O
t
RCD
t
RAS
t
RC
<
ACT 0
>
CAS latency = 3, burst length = 4
t
DS
DIN 0m
WRIT 0
<
t
D
IN 0m+2
DH
<
PRE 0
t
RCD
t
<
ACT
RAS
t
RP
>
Undefined Don't Care
t
RP
>
t
DIN 0m+1
DH
t
DS
t
DH
t
DS
>
72
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 73
IS42S16128 ISSI
Read Cycle / Byte Operation
®
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
UDQM
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11
t
t
CKS
t
CS
t
t
CKA
t
CH
t
CS
t
CS
t
CS
t
AS
CK
CHI
t
CL
t
CH
t
CH
t
CH
t
AH
ROW
t
AS
t
AH
ROW
t
t
AS
AH
BANK 1 BANK 1
BANK 0
COLUMN m
AUTO PRE
NO PRE
BANK 0
t
CS
t
QMD
BANK 0 AND 1
BANK 0 OR 1
BANK 1
t
CH
BANK 0
T12
ROW
ROW
BANK 1
BANK 0
LDQM
I/O8-15
I/O0-7
t
RCD
t
RAS
t
RC
<
ACT
> <
CAS latency = 3, burst length = 4
READ
READA
<
t
t
CS
t
CAC
>
>
QMD
<
MASKU
t
AC
t
LZ
t
AC
t
LZ
>
ENBU, MASKL
D
D
OUT
OUT
t
OH
t
OH
m
m
t
HZ
t
AC
t
QMD
>
D
<
MASKL
OUT
t
AC
t
t
OH
m+1
><
HZ
t
CH
t
AC
t
LZ
D
OUT
m+2
t
RQL
t
RP
PRE
>
<
<
PALL
>
D
OUT
t
t
OH
m+3
HZ
t
RCD
t
RAS
t
RP
ACT
><
Undefined Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
73
Page 74
IS42S16128 ISSI
Write Cycle / Byte Operation
®
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
UDQM
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
t
t
CKS
t
CS
t
CK
t
CKA
t
CH
t
CS
t
CS
t
CS
t
AS
t
AS
t
AS
CHI
t
CH
t
CH
t
CH
t
AH
ROW
t
AH
ROW
t
AH
BANK 1
BANK 0
t
CL
COLUMN m
AUTO PRE
t
CS
NO PRE
BANK 1
BANK 0
t
CH
BANK 0 AND 1
BANK 0 OR 1
BANK 1 BANK 0
T12T11
ROW
ROW
BANK 1
BANK 0
LDQM
I/O8-15
I/O0-7
t
RCD
t
RAS
t
RC
<
ACT
> <
CAS latency = 3, burst length = 4
t
CS
t
DS
t
DS
t
CH
t
DS
t
DH
D
IN
m
DIN m+1 DIN m+3
t
DH
D
IN
m D
WRIT
>
MASKL
WRITA
<
<
>
t
DH
t
DS
t
DS
>
<
MASK
>
<
IN
m+3
ENB
t
DH
t
DH
t
DPL
t
RP
PRE
>
>
<
<
PALL
>
t
RCD
t
RAS
t
RP
ACT
><
Undefined Don't Care
74
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 75
IS42S16128 ISSI
Read Cycle, Write Cycle / Burst Read, Single Write
®
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
t
t
CKS
t
CS
CHI
t
CK
t
CKA
t
CH
t
CS
t
CS
t
CS
t
AS
ROW
t
AS
ROW
t
AS
BANK 1
<
ACT
><
t
CH
t
CH
t
CH
t
AH
t
AH
t
AH
t
RC
t
RAS
t
RC
t
CL
COLUMN m
NO PRE
BANK 1
BANK 0BANK 0
t
READ
CS
t
CAC
>
t
QMD
t
AC
t
D
OUT
t
LZ
OH
m
t
AC
D
OUT
t
OH
m+1
t
HZ
t
DS
COLUMN n
AUTO PRE
NO PRE
BANK 1 BANK 0
t
CH
t
DH
D
IN
n
t
DPL
WRIT
>
<
<
WRITA
>
T11 T12
BANK 0 AND 1
BANK 0 OR 1
BANK 1 BANK 0
t
RP
PRE
>
<
<
PALL
>
CAS latency = 3, burst length = 2
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Undefined Don't Care
®
ISSI
Integrated Silicon Solution, Inc.
2231 Lawson Lane
Santa Clara, CA 95054
Tel: 1-800-379-4774 Fax: (408) 588-0806
E-mail: sales@issi.com
www.issi.com
75
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