125 MHz8IS42S16128-8T400-mil TSOP II
100 MHz10IS42S16128-10T400-mil TSOP II
DESCRIPTION
ISSI's 4Mb Synchronous DRAM IS42S16128 is organized as
a 131072-word x 16-bit x 2-bank for improved performance.
The synchronous DRAMs achieve high-speed data transfer
using pipeline architecture. All inputs and outputs signals refer
to the rising edge of the clock input.
PIN DESCRIPTIONS
83 MHz12IS42S16128-12T400-mil TSOP II
FEBRUARY 2000
A0-A9Address Input
A0-A8Row Address Input
A9Bank Select Address
A0-A7Column Address Input
I/O0 to I/O15Data I/O
CLKSystem Clock Input
CKEClock Enable
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
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Page 2
®
IS42S16128ISSI
PIN FUNCTIONS
Pin No.SymbolTypeFunction (In Detail)
20 to 24,A0-A8Input PinA0 to A8 are address inputs. A0-A8 are used as row address inputs during active
27 to 30command input and A0-A7 as column address inputs during read or write command
input. A8 is also used to determine the precharge mode during other commands. If
A8 is LOW during precharge command, the bank selected by A9 is precharged, but
if A8 is HIGH, both banks will be precharged.
When A8 is HIGH in read or write command cycle, the precharge starts automatically after the burst access.
These signals become part of the OP CODE during mode register set command
input.
19A9Input PinA9 is the bank selection signal. When A9 is LOW, bank 0 is selected and when high,
bank 1 is selected. This signal becomes part of the OP CODE during mode register
set command input.
16CASInput PinCAS, in conjunction with the RAS and WE, forms the device command. See the
"Command Truth Table" item for details on device commands.
34CKEInput PinThe CKE input determines whether the CLK input is enabled within the device.
When is CKE HIGH, the next rising edge of the CLK signal will be valid, and when
LOW, invalid. When CKE is LOW, the device will be in either the power-down mode,
the clock suspend mode, or the self refresh mode.
35CLKInput PinCLK is the master clock input for this device. Except for CKE, all inputs to this device
are acquired in synchronization with the rising edge of this pin.
18CSInput PinThe CS input determines whether command input is enabled within the device.
Command input is enabled when CS is LOW, and disabled with CS is HIGH. The
device remains in the previous state when CS is HIGH.
2, 3, 5, 6, 8, 9, 11I/O0 toI/O PinI/O0 to I/O15 are I/O pins. I/O through these pins can be controlled in byte units
12, 39, 40, 42, 43,I/O15using the LDQM and UDQM pins.
45, 46, 48, 49
14, 36LDQM,Input PinLDQM and UDQM control the lower and upper bytes of the I/O buffers. In read
UDQMmode, LDQM and UDQM control the output buffer. When LDQM or UDQM is LOW,
the corresponding buffer byte is enabled, and when HIGH, disabled. The outputs go
to the HIGH impedance state when LDQM/UDQM is HIGH. This function corresponds to OE in conventional DRAMs. In write mode, LDQM and UDQM control the
input buffer. When LDQM or UDQM is LOW, the corresponding buffer byte is
enabled, and data can be written to the device. When LDQM or UDQM is HIGH,
input data is masked and cannot be written to the device.
17RASInput PinRAS, in conjunction with CAS and WE, forms the device command. See the
"Command Truth Table" item for details on device commands.
15WEInput Pin WE, in conjunction with RAS and CAS, forms the device command. See the
"Command Truth Table" item for details on device commands.
7, 13, 38, 44VCCQPower Supply PinVCCQ is the output buffer power supply.
1, 25VCCPower Supply PinVCC is the device internal power supply.
4, 10, 41, 47GNDQ Power Supply PinGNDQ is the output buffer ground.
26, 50GNDPower Supply PinGND is the device internal ground.
The CKE is an asynchronous i
nput.
2
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IS42S16128ISSI
FUNCTIONAL BLOCK DIAGRAM
CLK
CKE
CS
RAS
CAS
WE
A9
COMMAND
DECODER
&
CLOCK
GENERATOR
MODE
REGISTER
ADDRESS
BUFFER
9
ROW
MEMORY CELL
512
9
ARRAY
BANK 0
DQM
®
A8
A7
A6
A5
A4
A3
A2
A1
A0
REFRESH
CONTROLLER
REFRESH
COUNTER
ROW
ADDRESS
LATCH
9
9
SELF
REFRESH
CONTROLLER
MULTIPLEXER
8
COLUMN
ADDRESS
9
BUFFER
ADDRESS LATCH
ROW
COLUMN
BURST COUNTER
ADDRESS BUFFER
512
9
ROW DECODERROW DECODER
SENSE AMP I/O GATE
256x16
COLUMN DECODER
8
256x16
SENSE AMP I/O GATE
MEMORY CELL
ARRAY
BANK 1
DATA I N
BUFFER
16
DATA OUT
BUFFER
1616
16
I/O 0-15
Vcc/VccQ
GND/GNDQ
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IS42S16128ISSI
®
ABSOLUTE MAXIMUM RATINGS
(1)
SymbolParametersRatingUnit
VCCMAXMaximum Supply Voltage–1.0 to +4.6V
VccQ
MAXMaximum Supply Voltage for Output Buffer–1.0 to +4.6V
VINInput Voltage–1.0 to +5.5V
VOUTOutput Voltage–1.0 to +4.6V
PDMAXAllowable Power Dissipation1W
ICSOutput Shorted Current50mA
TOPROperating Temperature0 to +70°C
TSTGStorage Temperature–55 to +150°C
DC RECOMMENDED OPERATING CONDITIONS
At TA = 0 to +70°C
SymbolParameterMin.Typ.Max.Unit
VCC, VCCQSupply Voltage3.03.33.6V
VIHInput High Voltage2.0—5.5V
VILInput Low Voltage–0.3—+0.8V
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent
damage to the device. This is a stress rating only and functional operation of the device at these
or any other conditions above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
2. All voltages are referenced to GND.
IH (max) = 5.5V for pulse width - 5 ns.
3. V
3. VIL (min) = –1.0V for pulse width - 5 ns.
(2)
CAPACITANCE CHARACTERISTICS
At TA = 0 to +25°C, Vcc = VccQ = 3.3 ± 0.3V, f = 1 MHz
1. These are the values at the minimum cycle time. Since the currents are transient, these values decrease as the cycle time increases.
Also note that a bypass capacitor of at least 0.01 µF should be inserted between Vcc and GND for each memory chip to suppress
power supply voltage noise (voltage drops) due to these transient currents.
2. Icc1 and Icc4 depend on the output load. The maximum values for Icc1 and Icc4 are obtained with the output open state.
(1,2)
One Bank Operation, Burst Length=1—100mA
tRC≥ tRC (min.), IOUT = 0mA
(1)
IOUT = 0mA-10—160mA
-12—120mA
CAS latency = 2-8—120mA
-10—120mA
-12—110mA
-10—100mA
-12—80mA
®
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IS42S16128ISSI
®
AC CHARACTERISTICS
(1,2,3)
-8-10-12
SymbolParameterMin.Max.Min.Max.Min.Max.Units
CK3Clock Cycle TimeCAS Latency = 38—10—12—ns
t
tCK2CAS Latency = 213—15—17—ns
t
AC3Access Time From CLK
(4)
CAS Latency = 3—6—8—10ns
tAC2CAS Latency = 2—10—13—15ns
tCHICLK HIGH Level Width3—4—4.5—ns
tCLCLK LOW Level Width3—4—4.5—ns
t
tHZ2CAS Latency = 2310412414ns
tDSInput Data Setup Time2—3—3—ns
tDHInput Data Hold Time1—1.5—2—ns
tASAddress Setup Time2—3—3—ns
tAHAddress Hold Time1—1.5—2—ns
tCKSCKE Setup Time2—3—3—ns
tCKHCKE Hold Time1—1.5—2—ns
tCKACKE to CLK Recovery Delay Time1CLK+3—1CLK+3—1CLK+3—ns
tCSCommand Setup Time (CS, RAS, CAS, WE, DQM)2—3—3—ns
tCHCommand Hold Time (CS, RAS, CAS, WE, DQM)1—1.5—2—ns
tRCCommand Period (REF to REF / ACT to ACT)80—90—108—ns
tRASCommand Period (ACT to PRE)5412,0006012,0007212,000ns
tRPCommand Period (PRE to ACT)24—30—34—ns
tRCDActive Command To Read / Write Command Delay Time24—30—34—ns
tRRDCommand Period (ACT [0] to ACT[1])24—30—34—ns
tDPL3Input Data To PrechargeCAS Latency = 31CLK+8—1CLK+10—1CLK+12—ns
Command Delay time
tDPL2CAS Latency = 28—10—12—ns
tDAL3Input Data To Active / RefreshCAS Latency = 3 2CLK+24—2CLK+30—2CLK+34—ns
1. When power is first applied, memory operation should be started 100 µs after Vcc and VccQ reach their stipulated voltages. Also
note that the power-on sequence must be executed before starting memory operation.
2. Measured with t
3. The reference level is 1.4 V when measuring input signal timing. Rise and fall times are measured between V
4. Access time is measured at 1.4V with the load shown in the figure below.
5. The time t
when the output is in the high impedance state.
6
T = 1 ns.
IH (min.) and VIL (max.).
HZ (max.) is defined as the time required for the output voltage to transition by ± 200 mV from VOH (min.) or VOL (max.)
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tCACCAS Latency321321321cycle
tRCDActive Command To Read/Write Command Delay Time321321321cycle
tRACRAS Latency (tRCD + tCAC)642642642cycle
tRCCommand Period (REF to REF / ACT to ACT)952963974cycle
tRASCommand Period (ACT to PRE)631642653cycle
tRPCommand Period (PRE to ACT)321321321cycle
tRRDCommand Period (ACT[0] to ACT [1])321321321cycle
CCDColumn Command Delay Time111111111cycle
t
(READ, READA, WRIT, WRITA)
tDPLInput Data To Precharge Command Delay Time111111111cycle
tDALInput Data To Active/Refresh Command Delay Time432432432cycle
(During Auto-Precharge)
tRBDBurst Stop Command To Output in HIGH-Z Delay Time321321321cycle
(Read)
tWBDBurst Stop Command To Input in Invalid Delay Time000000000cycle
(Write)
tRQLPrecharge Command To Output in HIGH-Z Delay Time321321321cycle
(Read)
tWDLPrecharge Command To Input in Invalid Delay Time000000000cycle
(Write)
tPQLLast Output To Auto-Precharge Start Time (Read)–2–10–2–10–2–10cycle
tQMDDQM To Output Delay Time (Read)222222222cycle
tDMDDQM To Input Delay Time (Write)000000000cycle
tMCDMode Register Set To Command Delay Time222222222cycle
®
AC TEST CONDITIONS (Input/Output Reference Level: 1.4V)
t
Input
2.0V
1.4V
CLK
INPUT
OUTPUT
0.8V
2.0V
1.4V
0.8V
t
CS
t
OH
1.4V1.4V
Output Load
I/O
50 pF
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Rev. A
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CK
t
CHI
t
CH
t
AC
500 Ω
t
CL
+1.4V
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IS42S16128ISSI
COMMANDS
Active CommandRead Command
®
CLK
CKE
CS
RAS
CAS
WE
A0-A7
CLK
CKE
CS
RAS
CLK
HIGH
ROW
A8
A9
ROW
BANK 1
BANK 0
CKE
CS
RAS
CAS
WE
A0-A7
HIGH
COLUMN
AUTO PRECHARGE
A8
A9
NO PRECHARGE
BANK 1
BANK 0
Write CommandPrecharge Command
CLK
HIGH
CKE
CS
RAS
HIGH
CAS
WE
A0-A7
A8
A9
COLUMN
AUTO PRECHARGE
BANK 1
BANK 0
CAS
WE
A0-A7
A8
A9
BANK 0 AND BANK 1
BANK 0 OR BANK 1NO PRECHARGE
BANK 1
BANK 0
No-Operation CommandDevice Deselect Command
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
HIGH
CLK
CKE
CS
RAS
CAS
WE
A0-A7
HIGH
A8
A9
8
A9
Don't Care
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IS42S16128ISSI
COMMANDS (cont.)
Mode Register Set CommandAuto-Refresh Command
®
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
HIGH
OP-CODE
OP-CODE
OP-CODE
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
HIGH
Self-Refresh CommandPower Down Command
CLK
CKE
CS
RAS
CLK
CKE
CS
RAS
ALL BANKS IDLE
NOP
NOP
CAS
WE
A0-A7
CAS
WE
A0-A7
A8
A9
A8
A9
NOP
NOP
Clock Suspend CommandBurst Stop Command
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
BANK(S) ACTIVE
NOP
NOP
NOP
NOP
CLK
CKE
CS
RAS
CAS
WE
A0-A7
HIGH
A8
A9
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A9
Don't Care
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IS42S16128ISSI
®
Mode Register Set Command
(CS, RAS, CAS, WE = LOW)
The IS42S16128 product incorporates a register that
defines the device operating mode. This command functions as a data input pin that loads this register from the
pins A0 to A9. When power is first applied, the stipulated
power-on sequence should be executed and then the
IS42S16128 should be initialized by executing a mode
register set command.
Note that the mode register set command can be executed only when both banks are in the idle state, i.e..,
deactivated.
Another command cannot be executed after a mode
register set command until after the passage of the period
tMCD, which is the period required for mode register set
command execution.
Active Command
(CS, RAS = LOW, CAS, WE= HIGH)
The IS42S16128 includes two banks of 512 rows each.
This command selects one of the two banks according to
the A9 pin and activates the row selected by the pins A0
to A8.
Read Command (cont.)
When the A8 pin is HIGH, this command functions as a
read with auto-precharge command. After the burst read
completes, the bank selected by pin A9 is precharged.
When the A8 pin is LOW, the bank selected by the A9 pin
remains in the activated state after the burst read completes.
Write Command
(CS, CAS, WE = LOW, RAS = HIGH)
When burst write mode has been selected with the mode
register set command, this command selects the bank
specified by the A9 pin and starts a burst write operation
at the start address specified by pins A0 to A7. This first
data must be input to the I/O pins in the cycle in which this
command.
The selected bank must be activated before executing
this command.
When A8 pin is HIGH, this command functions as a write
with auto-precharge command. After the burst write completes, the bank selected by pin A9 is precharged. When
the A8 pin is low, the bank selected by the A9 pin remains
in the activated state after the burst write completes.
This command corresponds to the fall of the RAS signal
from HIGH to LOW in conventional DRAMs.
Precharge Command
(CS, RAS, WE = LOW, CAS = HIGH)
This command starts precharging the bank selected by
pins A8 and A9. When A8 is HIGH, both banks are
precharged at the same time. When A8 is LOW, the bank
selected by A9 is precharged. After executing this command, the next command for the selected bank(s) is
executed after passage of the period tRP, which is the
period required for bank precharging.
This command corresponds to the RAS signal from LOW
to HIGH in conventional DRAMs
Read Command
(CS, CAS = LOW, RAS, WE = HIGH)
This command selects the bank specified by the A9 pin
and starts a burst read operation at the start address
specified by pins A0 to A7. Data is output following CAS
latency.
After the input of the last burst write data, the application
must wait for the write recovery period (t
elapse according to CAS latency.
DPL, tDAL) to
Auto-Refresh Command
(CS, RAS, CAS = LOW, WE, CKE = HIGH)
This command executes the auto-refresh operation. The
row address and bank to be refreshed are automatically
generated during this operation.
Both banks must be placed in the idle state before
executing this command.
The stipulated period (tRC) is required for a single refresh
operation, and no other commands can be executed
during this period.
The device goes to the idle state after the internal refresh
operation completes.
This command must be executed at least 1024 times
every 16 ms.
This command corresponds to CBR auto-refresh in conventional DRAMs.
The selected bank must be activated before executing
this command.
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IS42S16128ISSI
®
Self-Refresh Command
(CS, RAS, CAS, CKE = LOW, WE = HIGH)
This command executes the self-refresh operation. The
row address to be refreshed, the bank, and the refresh
interval are generated automatically internally during this
operation. The self-refresh operation is started by dropping the CKE pin from HIGH to LOW. The self-refresh
operation continues as long as the CKE pin remains LOW
and there is no need for external control of any other pins.
The self-refresh operation is terminated by raising the
CKE pin from LOW to HIGH. The next command cannot
be executed until the device internal recovery period (tRC)
has elapsed. After the self-refresh, since it is impossible
to determine the address of the last row to be refreshed,
an auto-refresh should immediately be performed for all
addresses (1024 cycles).
Both banks must be placed in the idle state before
executing this command.
Burst Stop Command
(CS, WE, = LOW, RAS, CAS = HIGH)
The command forcibly terminates burst read and write
operations. When this command is executed during a
burst read operation, data output stops after the CAS
latency period has elapsed.
Power-Down Command (cont.)
All pins other than the CKE pin are invalid and none of the
other commands can be executed in this mode. The
power-down operation is terminated by raising the CKE
pin from LOW to HIGH. The next command cannot be
executed until the recovery period (tCKA) has elapsed.
Since this command differs from the self-refresh command described above in that the refresh operation is not
performed automatically internally, the refresh operation
must be performed within the refresh period (tREF). Thus
the maximum time that power-down mode can be held is
just under the refresh cycle time.
Clock Suspend
(CKE = LOW)
This command can be used to stop the device internal
clock temporarily during a read or write cycle. Clock
suspend mode is started by dropping the CKE pin from
HIGH to LOW. Clock suspend mode continues as long as
the CKE pin is held LOW. All input pins other than the CKE
pin are invalid and none of the other commands can be
executed in this mode. Also note that the device internal
state is maintained. Clock suspend mode is terminated by
raising the CKE pin from LOW to HIGH, at which point
device operation restarts. The next command cannot be
executed until the recovery period (tCKA) has elapsed.
No Operation
(CS, = LOW, RAS, CAS, WE = HIGH)
This command has no effect on the device.
Device Deselect Command
(CS = HIGH)
This command does not select the device for an object of
operation. In other words, it performs no operation with
respect to the device.
Power-Down Command
(CKE = LOW)
When both banks are in the idle (inactive) state, or when
at least one of the banks is not in the idle (inactive) state,
this command can be used to suppress device power
dissipation by reducing device internal operations to the
absolute minimum. Power-down mode is started by dropping the CKE pin from HIGH to LOW. Power-down mode
continues as long as the CKE pin is held low.
Since this command differs from the self-refresh command described above in that the refresh operation is not
performed automatically internally, the refresh operation
must be performed within the refresh period (tREF). Thus
the maximum time that clock suspend mode can be held
is just under the refresh cycle time.
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IS42S16128ISSI
®
COMMAND TRUTH TABLE
(1,2)
CKE
SymbolCommandn-1nCSRASCASW E DQMA0A8A7-A0I/On
(5)
(5,6)
(3,4)
HXLLLLX OP CODEX
HHLLLHXXXXHIGH-Z
HLLLLHXX X XHIGH-Z
MRSMode Register Set
REFAuto-Refresh
SREFSelf-Refresh
PREPrecharge Selected BankHXLLHLXBSLXX
PALLPrecharge Both BanksHXLLHLXXHXX
ACTBank Activate
(7)
HXLLHHXBSRowRowX
WRITWriteHXLHLLXBSLColumnX
WRITAWrite With Auto-Precharge
READRead
(8)
READARead With Auto-Precharge
BSTBurst Stop
(9)
(8)
HXLHLLXBSHColumnX
HXLHLHXBSLColumnX
(8)
HXLHLHXBSH ColumnX
HXLHHLXXXX X
NOPNo OperationHXLHHHXXXXX
DESLDevice DeselectHXHXXXXX X XX
SBYClock Suspend / Standby ModeLXXXXXXX X XX
ENBData Write / Output EnableHXXXXXLX X X Active
MASKData Mask / Output DisableHXXXXXHX X XHIGH-Z
DQM TRUTH TABLE
(1,2)
CKEDQM
SymbolCommandn-1nUPPERLOWER
ENBData Write / Output EnableHXLL
MASKData Mask / Output DisableHXHH
ENBUUpper Byte Data Write / Output EnableHXLX
ENBLLower Byte Data Write / Output EnableHXXL
MASKUUpper Byte Data Mask / Output DisableHXHX
MASKLLower Byte Data Mask / Output DisableHXXH
LLHLVVX
REF/SELFIllegalLLLHXXX
MRSIllegalLLLL OP CODE
RefreshDESLNo Operation, Idle State After t
RP Has ElapsedHXXXXXX
NOPNo Operation, Idle State After tRP Has ElapsedLHHHXXX
BSTNo Operation, Idle State After t
RP Has ElapsedLHHLXXX
READ/READAIllegalLHLHVVV
WRIT/WRITAIllegalLHLLVVV
ACTIllegalLLHHVVV
PRE/PALLIllegalLLHLVVX
REF/SELFIllegalLLLHXXX
MRSIllegalLLLL OP CODE
Mode Register DESLNo Operation, Idle State After tMCD Has ElapsedHXXXXXX
SetNOPNo Operation, Idle State After tMCD Has ElapsedLHHHXXX
BSTNo Operation, Idle State After tMCD Has ElapsedLHHLXXX
READ/READAIllegalLHLHVVV
WRIT/WRITAIllegalLHLLVVV
ACTIllegalLLHHVVV
PRE/PALLIllegalLLHLVVX
REF/SELFIllegalLLLHXXX
MRSIllegalLLLL OP CODE
Notes:
1. H: HIGH level input, L: LOW level input, X: HIGH or LOW level input, V: Valid data input
2. All input signals are latched on the rising edge of the CLK signal.
3. Both banks must be placed in the inactive (idle) state in advance.
4. The state of the A0 to A9 pins is loaded into the mode register as an OP code.
5. The row address is generated automatically internally at this time. The I/O pin and the address pin data is ignored.
6. During a self-refresh operation, all pin data (states) other than CKE is ignored.
7. The selected bank must be placed in the inactive (idle) state in advance.
8. The selected bank must be placed in the active state in advance.
9. This command is valid only when the burst length set to full page.
10. This is possible depending on the state of the bank selected by the A9 pin.
11. Time to switch internal busses is required.
12. The IS42S16128 can be switched to power-down mode by dropping the CKE pin LOW when both banks in the idle state. Input
pins other than CKE are ignored at this time.
13. The IS42S16128 can be switched to self-refresh mode by dropping the CKE pin LOW when both banks in the idle state. Input
pins other than CKE are ignored at this time.
14. Possible if t
15. Illegal if tRAS is not satisfied.
16. The conditions for burst interruption must be observed. Also note that the IS42S16128 will enter the precharged state
immediately after the burst operation completes if auto-precharge is selected.
17. Command input becomes possible after the period t
state immediately after the burst operation completes if auto-precharge is selected.
RRD is satisfied.
RCD has elapsed. Also note that the IS42S16128 will enter the precharged
Integrated Silicon Solution, Inc. — 1-800-379-4774
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IS42S16128ISSI
®
CKE RELATED COMMAND TRUTH TABLE
(1)
CKE
Current StateOperationn-1nCSRASCASW EA9A8 A7-A0
Self-RefreshUndefinedHXXXXXXXX
Self-Refresh Recovery
Self-Refresh Recovery
(2)
Illegal
(2)
Illegal
(2)
(2)
LHHXXXXXX
LHLHHXXXX
LHLHLXXXX
LHL LXXXXX
Self-RefreshLLXXXXXXX
Self-Refresh RecoveryIdle State After tRC Has ElapsedHHHXXXXXX
Idle State After t
RC Has ElapsedHHLHHXXXX
IllegalHHLHLXXXX
IllegalHHLLXXXXX
Power-Down on the Next CycleHLHXXXXXX
Power-Down on the Next CycleHLLHHXXXX
IllegalHLLHLXXXX
IllegalHLLLXXXXX
Clock Suspend Termination on the Next Cycle
(2)
LHXXXXXXX
Clock SuspendLLXXXXXXX
Power-DownUndefinedHXXXXXXXX
Power-Down Mode Termination, Idle AfterLHXXXXXXX
That Termination
(2)
Power-Down ModeLLXXXXXXX
Both Banks IdleNo OperationHHHXXXXXX
See the Operation Command TableHHLHXXXXX
Bank Active Or PrechargeHHLLHXXXX
Auto-RefreshHHLLLHXXX
Mode Register SetHHLLLLOP CODE
See the Operation Command TableHLHXXXXXX
See the Operation Command TableHLLHXXXXX
See the Operation Command TableHLLLHXXXX
Self-Refresh
(3)
HLLLLHXXX
See the Operation Command TableHLLLLL OP CODE
Power-Down Mode
(3)
LXXXXXXXX
Other StatesSee the Operation Command TableHHXXXXXXX
Clock Suspend on the Next Cycle
(4)
HLXXXXXXX
Clock Suspend Termination on the Next CycleLHXXXXXXX
Clock Suspend Termination on the Next CycleLLXXXXXXX
Notes:
1. H: HIGH level input, L: LOW level input, X: HIGH or LOW level input
2. The CLK pin and the other input are reactivated asynchronously by the transition of the CKE level from LOW to HIGH. The
minimum setup time (t
3. Both banks must be set to the inactive (idle) state in advance to switch to power-down mode or self-refresh mode.
4. The input must be command defined in the operation command table.
CKA) required before all commands other than mode termination must be satisfied.
16
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IS42S16128ISSI
®
TWO BANKS OPERATION COMMAND TRUTH TABLE
(1,2)
Previous State Next State
OperationCSRASCASWEA9A8A7-A0BANK 0 BANK 1BANK 0BANK 1
DESLHXXXXXXAny AnyAny Any
NOPLHHHXXXAnyAnyAnyAny
BSTLHHLXXXR/W/AI/AAI/A
1. H: HIGH level input, L: LOW level input, X: HIGH or LOW level input, RA: Row Address, CA: Column Address
2. The device state symbols are interpreted as follows:
IIdle (inactive state)
ARow Active State
RRead
WWrite
RPRead With Auto-Precharge
WPWrite With Auto-Precharge
AnyAny State
Integrated Silicon Solution, Inc. — 1-800-379-4774
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IS42S16128ISSI
SIMPLIFIED STATE TRANSITION DIAGRAM (One Bank Operation)
SELF
REFRESH
SREF entry
SREF exit
®
WRIT
CKE_
MODE
REGISTER
MRS
IDLE
REF
SET
CKE_
CKE
ACT
CKE_
CKE
READ
BANK
ACTIVE
READ
READA
BSTBST
WRIT
WRITA
WRITE
WRIT
AUTO
REFRESH
IDLE
POWER
DOWN
ACTIVE
POWER
DOWN
READ
READ
CKE_
18
CLOCK
SUSPEND
POWER APPLIED
CKE
WRITA
CKE_
CKE
WRITE WITH
AUTO
PRECHARGE
POWER ON
Automatic transition following the
completion of command execution.
Transition due to command input.
WRITA
PRE
PRE
PRE
PRE-
CHARGE
READA
PRE
READA
CKE_
READ WITH
AUTO
PRECHARGE
CKE
CKE
CLOCK
SUSPEND
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IS42S16128ISSI
®
Device Initialization At Power-On
(Power-On Sequence)
As is the case with conventional DRAMs, the IS42S16128
product must be initialized by executing a stipulated
power-on sequence after power is applied.
After power is applied and V
stipulated voltages, set and hold the CKE and DQM pins
HIGH for 100 µs. Then, execute the precharge command
to precharge both bank. Next, execute the auto-refresh
command twice or more and define the device operation
mode by executing a mode register set command.
The mode register set command can be also set before
auto-refresh command.
CC and VCCQ reach their
Mode Register Settings
The mode register set command sets the mode register.
When this command is executed, pins A0 to A7, A8, and
A9 function as data input pins for setting the register, and
this data becomes the device internal OP code. This OP
code has four fields as listed in the table below.
Input PinField
Burst Length
When writing or reading, data can be input or output data
continuously. In these operations, an address is input only
once and that address is taken as the starting address
internally by the device. The device then automatically
generates the following address. The burst length field in
the mode register stipulates the number of data items
input or output in sequence. In the IS42S16128 product,
a burst length of 1, 2, 4, 8, or full page can be specified.
See the table on the next page for details on setting the
mode register.
Burst Type
The burst data order during a read or write operation is
stipulated by the burst type, which can be set by the mode
register set command. The IS42S16128 product supports
sequential mode and interleaved mode burst type settings. See the table on the next page for details on setting
the mode register. See the "Burst Length and Column
Address Sequence" item for details on I/O data orders in
these modes.
A9, A8, A7Write Mode
A6, A5, A4CAS Latency
A3Burst Type
A2, A1, A0Burst Length
Note that the mode register set command can be executed only when both banks are in the idle (inactive)
state. Wait at least two cycles after executing a mode
register set command before executing the next command.
CAS Latency
During a read operation, the between the execution of the
read command and data output is stipulated as the CAS
latency. This period can be set using the mode register
set command. The optimal CAS latency is determined by
the clock frequency and device speed grade. See the
"Operating Frequency / Latency Relationships" item for
details on the relationship between the clock frequency
and the CAS latency. See the table on the next page for
details on setting the mode register.
Write Mode
Burst write or single write mode is selected by the OP code
(A9, A8, A7) of the mode register.
A burst write operation is enabled by setting the OP code
(A9, A8, A7) to (0,0,0). A burst write starts on the same
cycle as a write command set. The write start address is
specified by the column address and bank select address
at the write command set cycle.
A single write operation is enabled by setting OP code
(A9, A8, A7) to (1,0,0). In a single write operation, data is
only written to the column address and bank select
address specified by the write command set cycle without
regard to the bust length setting.
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X1—Row Address
X2—Row Address
X3—Row Address
X4—Row Address
X5—Row Address
X6—Row Address
X7—Row Address
X80Precharge of the Selected Bank (Precharge Command)Row Address
1Precharge of Both Banks (Precharge Command)(Active Command)
X90Bank 0 Selected (Precharge and Active Command)
1Bank 1 Selected (Precharge and Active Command)
ColumnY0—Column Address
Y1—Column Address
Y2—Column Address
Y3—Column Address
Y4—Column Address
Y5—Column Address
Y6—Column Address
Y7—Column Address
Y80Auto-Precharge Not Performed
1Auto-Precharge Performed
Y90Bank 0 Selected (Read and Write Commands)
1Bank 1 Selected (Read and Write Commands)
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IS42S16128ISSI
Burst Read
®
The read cycle is started by executing the read command.
The address provided during read command execution is
used as the starting address. First, the data corresponding to this address is output in synchronization with the
clock signal after the CAS latency period. Next, data
corresponding to an address generated automatically by
the device is output in synchronization with the clock
signal.
The output buffers go to the LOW impedance state CAS
latency minus one cycle after the read command, and go
to the HIGH impedance state automatically after the last
data is output. However, the case where the burst length
CLK
COMMAND
I/O
READ
CAC
t
CAS LATENCY
CAS latency = 3, burst length = 4
D
OUT
is a full page is an exception. In this case the output
buffers must be set to the high impedance state by
executing a burst stop command.
Note that upper byte and lower byte output data can be
masked independently under control of the signals applied to the U/LDQM pins. The delay period (tQMD) is fixed
at two, regardless of the CAS latency setting, when this
function is used.
The selected bank must be set to the active state before
executing this command.
0D
OUT
1D
OUT
2D
OUT
3
BURST LENGTH
Burst Write
The write cycle is started by executing the command. The
address provided during write command execution is
used as the starting address, and at the same time, data
for this address is input in synchronization with the clock
signal.
Next, data is input in other in synchronization with the
clock signal. During this operation, data is written to
address generated automatically by the device. This
cycle terminates automatically after a number of clock
cycles determined by the stipulated burst length. However, the case where the burst length is a full page is an
exception. In this case the write cycle must be terminated
by executing a burst stop command.
CLK
COMMAND
I/O
WRITE
DIN 0DIN 1DIN 2DIN 3
BURST LENGTH
The latency for I/O pin data input is zero, regardless of the
CAS latency setting. However, a wait period (write recovery: tDPL) after the last data input is required for the device
to complete the write operation.
Note that the upper byte and lower byte input data can be
masked independently under control of the signals applied to the U/LDQM pins. The delay period (tDMD) is fixed
at zero, regardless of the CAS latency setting, when this
function is used.
The selected bank must be set to the active state before
executing this command.
CAS latency = 2,3, burst length = 4
22
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IS42S16128ISSI
Read With Auto-Precharge
®
The read with auto-precharge command first executes a
burst read operation and then puts the selected bank in
the precharged state automatically. After the precharge
completes, the bank goes to the idle state. Thus this
command performs a read command and a precharge
command in a single operation.
During this operation, the delay period (tPQL) between the
last burst data output and the start of the precharge
operation differs depending on the CAS latency setting.
When the CAS latency setting is one, the precharge
operation starts a the same time as the last burst data is
output (tPQL = 0). When the CAS latency setting is two,
CLK
the precharge operation starts on one clock cycle before
the last burst data is output (tPQL = –1). When the CAS
latency setting is three, the precharge operation starts on
two clock cycles before the last burst data is output
(tPQL = –2). Therefore, the selected bank can be made
active after a delay of tRP from the start position of this
precharge operation.
The selected bank must be set to the active state before
executing this command.
The auto-precharge function is invalid if the burst length
is set to full page.
CAS Latency32
tPQL–2–1
COMMAND
READA 0
I/O
CAS latency = 2, burst length = 4
READ WITH AUTO-PRECHARGE
(BANK 0)
CLK
COMMAND
READA 0
I/O
READ WITH AUTO-PRECHARGE
(BANK 0)
CAS latency = 3, burst length = 4
D
OUT
0D
OUT
PRECHARGE START
D
OUT
PRECHARGE START
1D
OUT
0D
OUT
t
PQL
2D
t
1D
OUT
RP
t
OUT
3
PQL
2D
t
RP
ACT 0
OUT
ACT 0
3
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IS42S16128ISSI
Write With Auto-Precharge
®
The write with auto-precharge command first executes a
burst write operation and then puts the selected bank in
the precharged state automatically. After the precharge
completes the bank goes to the idle state. Thus this
command performs a write command and a precharge
command in a single operation.
During this operation, the delay period (tDAL) between the
last burst data input and the completion of the precharge
operation differs depending on the CAS latency setting.
The delay (tDAL) is tRP plus one CLK period. That is, the
precharge operation starts one clock period after the last
burst data input.
CLK
COMMAND
I/O
WRITE WITH AUTO-PRECHARGE
WRITE A0
DIN 0DIN 1DIN 2DIN 3
(BANK 0)
CAS latency = 2, burst length = 4
Therefore, the selected bank can be made active after a
delay of t
DAL.
The selected bank must be set to the active state before
executing this command.
The auto-precharge function is invalid if the burst length
is set to full page.
CAS Latency32
tDAL1CLK1CLK
+tRP+tRP
ACT 0
PRECHARGE START
tRP
tDAL
CLK
COMMAND
I/O
WRITE WITH AUTO-PRECHARGE
WRITE A0
DIN 0DIN 1DIN 2DIN 3
(BANK 0)
CAS latency = 3, burst length = 4
ACT 0
PRECHARGE START
tRP
tDAL
24
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IS42S16128ISSI
Interval Between Read Command
®
A new command can be executed while a read cycle is in
progress, i.e., before that cycle completes. When the
second read command is executed, after the CAS latency
has elapsed, data corresponding to the new read command is output in place of the data due to the previous
read command.
CLK
COMMAND
I/O
READ A0READ B0
D
OUT
A0D
t
CCD
READ (CA=A, BANK 0) READ (CA=B, BANK 0)
CAS latency = 2, burst length = 4
Interval Between Write Command
A new command can be executed while a write cycle is in
progress, i.e., before that cycle completes. At the point the
second write command is executed, data corresponding
to the new write command can be input in place of the data
for the previous write command.
The interval between two read command (tCCD) must be
at least one clock cycle.
The selected bank must be set to the active state before
executing this command.
OUT
B0D
OUT
B1
D
OUT
B2
D
OUT
B3
The interval between two write commands (tCCD) must be
at least one clock cycle.
The selected bank must be set to the active state before
executing this command.
CLK
t
CCD
COMMAND
I/O
WRITE A0WRITE B0
DIN A0DIN B0DIN B1DIN B2DIN B3
WRITE (CA=A, BANK 0) WRITE (CA=B, BANK 0)
CAS latency = 2, burst length = 4
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IS42S16128ISSI
Interval Between Write and Read Commands
®
A new read command can be executed while a write cycle
is in progress, i.e., before that cycle completes. Data
corresponding to the new read command is output after
the CAS latency has elapsed from the point the new read
command was executed. The I/On pins must be placed
in the HIGH impedance state at least one cycle before
data is output during this operation.
CLK
t
CCD
COMMAND
I/O
WRITE A0READ B0
DIN A0
WRITE (CA=A, BANK 0)READ (CA=B, BANK 0)
HI-Z
DOUT B0DOUT B2DOUT B1DOUT B3
CAS latency = 2, burst length = 4
CLK
t
CCD
COMMAND
WRITE A0READ B0
The interval (tCCD) between command must be at least
one clock cycle.
The selected bank must be set to the active state before
executing this command.
I/O
DIN A0DOUT B0DOUT B2DOUT B1DOUT B3
WRITE (CA=A, BANK 0)READ (CA=B, BANK 0)
CAS latency = 3, burst length = 4
HI-Z
Don’t Care
26
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IS42S16128ISSI
Interval Between Read and Write Commands
®
A read command can be interrupted and a new write
command executed while the read cycle is in progress,
i.e., before that cycle completes. Data corresponding to
the new write command can be input at the point new write
command is executed. To prevent collision between
input and output data at the I/On pins during this operation, the
CLK
CCD
t
COMMAND
U/LDQM
I/O
READ A0
READ (CA=A, BANK 0) WRITE (CA=B, BANK 0)
WRITE B0
HI-Z
DIN B0DIN B2DIN B1DIN B3
CAS latency = 2, 3, burst length = 4
output data must be masked using the U/LDQM pins. The
interval (tCCD) between these commands must be at least
one clock cycle.
The selected bank must be set to the active state before
executing this command.
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IS42S16128ISSI
®
Precharge
The precharge command sets the bank selected by pin A9
to the precharged state. This command can be executed
at a time tRAS following the execution of an active command to the same bank. The selected bank goes to the
idle state at a time tRP following the execution of the
precharge command, and an active command can be
executed again for that bank.
If pin A8 is low when this command is executed, the bank
selected by pin A9 will be precharged, and if pin A8 is
HIGH, both banks will be precharged at the same time.
This input to pin A9 is ignored in the latter case.
CLK
COMMAND
I/O
CAS latency = 2, burst length = 4
READ A0
D
OUT
A0D
READ (CA=A, BANK 0)PRECHARGE (BANK 0)
Read Cycle Interruption
Using the Precharge Command
A read cycle can be interrupted by the execution of the
precharge command before that cycle completes. The
delay time (tRQL) from the execution of the precharge
command to the completion of the burst output is the clock
cycle of CAS latency.
CAS Latency32
tRQL32
t
RQL
PRE 0
OUT
A1D
OUT
A2
HI-Z
CLK
COMMAND
READ A0
I/O
READ (CA=A, BANK 0)PRECHARGE (BANK 0)
CAS latency = 3, burst length = 4
PRE 0
D
OUT
A0D
OUT
t
RQL
A1D
OUT
A2
HI-Z
28
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IS42S16128ISSI
®
Write Cycle Interruption Using the
Precharge Command
A write cycle can be interrupted by the execution of the
precharge command before that cycle completes. The
delay time (tWDL) from the precharge command to the
point where burst input is invalid, i.e., the point where input
data is no longer written to device internal memory is zero
clock cycles regardless of the CAS.
To inhibit invalid write, the DQM signal must be asserted
HIGH with the precharge command.
CLK
COMMAND
WRITE A0
This precharge command and burst write command must
be of the same bank, otherwise it is not precharge
interrupt but only another bank precharge of dual bank
operation.
Inversely, to write all the burst data to the device, the
precharge command must be executed after the write
data recovery period (tDPL) has elapsed. Therefore, the
precharge command must be executed on one clock
cycle that follows the input of the last burst data item.
CAS Latency32
tWDL00
tDPL11
t
WDL=0
PRE 0
DQM
I/O
WRITE (CA=A, BANK 0)
CAS latency = 2, 3, burst length = 4
CLK
COMMAND
I/O
WRITE A0
DIN A0
WRITE (CA=A, BANK 0)PRECHARGE (BANK 0)
CAS latency = 2, 3, burst length = 4
DIN A0
D
IN A1DIN A2DIN A3
IN A1DIN A2DIN A3
D
MASKED BY DQM
PRECHARGE (BANK 0)
t
DPL
PRE 0
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IS42S16128ISSI
®
Read Cycle (Full Page) Interruption Using
the Burst Stop Command
The IS42S16128 can output data continuously from the
burst start address (a) to location a+255 during a read
cycle in which the burst length is set to full page. The
IS42S16128 repeats the operation starting at the 256th
cycle with the data output returning to location (a) and
continuing with a+1, a+2, a+3, etc. A burst stop command
must be executed to terminate this cycle. A precharge
command must be executed within the ACT to PRE
command period (tRAS max.) following the burst stop
command.
CLK
COMMAND
I/O
CAS latency = 2, burst length = full page
READ A0
READ (CA=A, BANK 0)
D
OUT
A0
D
After the period (t
RBD) required for burst data output to
stop following the execution of the burst stop command
has elapsed, the outputs go to the HIGH impedance state.
This period (tRBD) is one clock cycle when the CAS latency
is one, two clock cycle when the CAS latency is two and
three clock cycle when the CAS latency is three.
CAS Latency32
tRBD32
t
RBD
BST
OUT
A0D
OUT
A1
BURST STOP
D
OUT
A2
D
OUT
A3
HI-Z
CLK
COMMAND
READ A0
I/O
READ (CA=A, BANK 0)BURST STOP
CAS latency = 3, burst length = full page
D
OUT
A0D
OUT
A0
D
BST
OUT
A1
D
OUT
t
RBD
A2
D
OUT
A3
HI-Z
30
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IS42S16128ISSI
®
Write Cycle (Full Page) Interruption
Using the Burst Stop Command
The IS42S16128 can input data continuously from the
burst start address (a) to location a+255 during a write
cycle in which the burst length is set to full page. The
IS42S16128 repeats the operation starting at the 256th
cycle with data input returning to location (a) and continuing with a+1, a+2, a+3, etc. A burst stop command must
CLK
COMMAND
I/O
CAS latency = 2, 3, burst length = full page
WRITE A0
DIN A0DIN A1DIN ADIN A1DIN A2
READ (CA=A, BANK 0)BURST STOP
Burst Data Interruption Using the
U/LDQM Pins (Read Cycle)
Burst data output can be temporarily interrupted (masked)
during a read cycle using the U/LDQM pins. Regardless
of the CAS latency, two clock cycles (tQMD) after one of the
U/LDQM pins goes HIGH, the corresponding outputs go
to the HIGH impedance state. Subsequently, the outputs
are maintained in the high impedance state as long as
be executed to terminate this cycle. A precharge command must be executed within the ACT to PRE command
period (tRAS max.) following the burst stop command.
After the period (tWBD) required for burst data input to stop
following the execution of the burst stop command has
elapsed, the write cycle terminates. This period (t
WBD) is
zero clock cycles, regardless of the CAS latency.
WBD=0
t
BSTPRE 0
INVALID DATA
PRECHARGE (BANK 0)
t
RP
Don’t Care
that U/LDQM pin remains HIGH. When the U/LDQM pin
goes LOW, output is resumed at a time tQMD later. This
output control operates independently on a byte basis
with the UDQM pin controlling upper byte output (pins
I/O8-I/O15) and the LDQM pin controlling lower byte
output (pins I/O0 to I/O7).
Since the U/LDQM pins control the device output buffers
only, the read cycle continues internally and, in particular,
incrementing of the internal burst counter continues.
CLK
COMMAND
READ A0
t
QMD=2
UDQM
LDQM
D
I/O8-I/O15
I/O0-I/O 7
READ (CA=A, BANK 0)DATA MASK (LOWER BYTE)
DATA MASK (UPPER BYTE)
OUT
OUT
CAS latency = 2, burst length = 4
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A0
A0
D
OUT
HI-Z
A1D
D
OUT
HI-Z
A2D
OUT
A3
HI-Z
31
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IS42S16128ISSI
®
Burst Data Interruption U/LDQM Pins
(Write Cycle)
Burst data input can be temporarily interrupted (muted )
during a write cycle using the U/LDQM pins. Regardless
of the CAS latency, as soon as one of the U/LDQM pins
goes HIGH, the corresponding externally applied input
data will no longer be written to the device internal circuits.
Subsequently, the corresponding input continues to be
muted as long as that U/LDQM pin remains HIGH.
CLK
COMMAND
UDQM
LDQM
I/O8-I/O15
WRITE A0
t
DMD=0
The IS42S16128 will revert to accepting input as soon as
that pin is dropped to LOW and data will be written to the
device. This input control operates independently on a
byte basis with the UDQM pin controlling upper byte input
(pin I/O8 to I/O15) and the LDQM pin controlling the lower
byte input (pins I/O0 to I/O7).
Since the U/LDQM pins control the device input buffers
only, the cycle continues internally and, inparticular,
incrementing of the internal burst counter continues.
D
IN
DINA1
DINA2
A3
I/O0-I/O7
WRITE (CA=A, BANK 0)DATA MASK (LOWER BYTE)
DATA MASK (UPPER BYTE)
D
IN
A0DINA3
CAS latency = 2, burst length = 4
Burst Read and Single Write
The burst read and single write mode is set up using the
mode register set command. During this operation, the
burst read cycle operates normally, but the write cycle
only writes a single data item for each write cycle. The
CAS latency and DQM latency are the same as in normal
mode.
CLK
COMMAND
I/O
WRITE A0
DIN A0
Don’t Care
CAS latency = 2, 3
32
WRITE (CA=A, BANK 0)
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IS42S16128ISSI
®
Bank Active Command Interval
When the selected bank is precharged, the period trp has
elapsed and the bank has entered the idle state, the bank
can be activated by executing the active command. If the
other bank is in the idle state at that time, the active
command can be executed for that bank after the period
tRRD has elapsed. At that point both banks will be in the
active state. When a bank active command has been
CLK
t
RRD
COMMAND
CLK
COMMAND
ACT 0ACT 1
BANK ACTIVE (BANK 0)BANK ACTIVE (BANK 1)
t
RCD
ACT 0READ 0
executed, a precharge command must be executed for
that bank within the ACT to PRE command period (t
RAS
max.). Also note that a precharge command cannot be
executed for an active bank before tRAS (min.) has elapsed.
After a bank active command has been executed and the
trcd period has elapsed, read write (including autoprecharge) commands can be executed for that bank.
BANK ACTIVE (BANK 0)BANK ACTIVE (BANK 0)
CAS latency = 3
Clock Suspend
When the CKE pin is dropped from HIGH to LOW during
a read or write cycle, the IS42S16128 enters clock suspend mode on the next CLK rising edge. This command
reduces the device power dissipation by stopping the
device internal clock. Clock suspend mode continues as
long as the CKE pin remains low. In this state, all inputs
other than CKE pin are invalid and no other commands
can be executed. Also, the device internal states are
maintained. When the CKE pin goes from LOW to HIGH,
CLK
CKE
COMMAND
READ 0
clock suspend mode is terminated on the next CLK rising
edge and device operation resumes.
The next command cannot be executed until the recovery
period (tcka) has elapsed.
Since this command differs from the self-refresh command
described previously in that the refresh operation is not
performed automatically internally, the refresh operation
must be performed within the refresh period (tref). Thus the
maximum time that clock suspend mode can be held is just
under the refresh cycle time.
D
I/O
READ (BANK 0)CLOCK SUSPEND
OUT
CAS latency = 2, burst length = 4
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
0D
OUT
1D
OUT
2D
OUT
3
33
Page 34
IS42S16128ISSI
OPERATION TIMING EXAMPLE
Power-On Sequence, Mode Register Set Cycle
T0T1T2T3T10T17 T18T19T20
CLK
t
CK
CH
AS
BANK 0 & 1
CHI
t
t
t
t
AH
CH
CH
CH
t
CL
t
CODE
CODE
AH
ROW
t
AH
ROW
t
AH
BANK 1
t
AS
t
AS
t
AS
CODE
BANK 0
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
HIGH
t
CS
HIGH
t
t
t
CS
t
CS
t
CS
t
®
I/O
WAIT TIME
T=100 µs
CAS latency = 2, 3
t
t
RP
PALL
><
<
REF
>
RC
REF
t
t
t
RC
MRS
>
><
MCD
<
ACT
><
RAS
t
RC
Undefined
Don't Care
34
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 35
IS42S16128ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0T1T2T3Tn Tn+1Tn+2Tn+3
t
CK
t
CKS
t
CHI
t
CL
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
AH
t
AS
ROW
ROW
BANK 1
BANK 0
t
CKS
t
CKH
t
CKA
t
CKA
t
AH
t
AS
t
RP
POWER DOWN MODE
EXIT
POWER DOWN MODE
t
RAS
t
RC
<
ACT
><
SBY
>
<
PRE
>
<
PALL
>
BANK 0 & 1
BANK 0 OR 1
BANK 1
BANK 0
Power-Down Mode Cycle
®
CAS latency = 2, 3
Undefined
Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
35
Page 36
IS42S16128ISSI
Auto-Refresh Cycle
T0T1T2T3TlTmTnTn+1
CLK
t
CHI
t
t
t
t
t
CS
CS
CS
CK
CH
t
CL
t
CH
t
CH
t
CH
CKE
CS
RAS
CAS
WE
t
CKS
t
CS
®
A0-A7
t
AS
A8
A9
DQM
I/O
CAS latency = 2, 3
t
AH
BANK 0 & 1
t
t
RP
PALL
><
<
REF
>
RC
ROW
ROW
BANK 1
BANK 0
t
t
RC
REF
><
REF
>
RC
<
ACT
t
RAS
t
RC
><
Undefined
Don't Care
36
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 37
IS42S16128ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0T1T2T3TmTm+2Tm+1Tn
t
CK
t
CHI
t
CL
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
AH
t
AS
BANK 0 & 1
t
CKS
t
CKS
t
CKA
t
CKA
t
RP
SELF REFRESH MODE
EXIT
SELF
REFRESH
t
RC
t
RC
<
REF
>
<
PALL
><
SELF
>
t
CKS
Self-Refresh Cycle
®
CAS latency = 2, 3
Undefined
Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
37
Page 38
IS42S16128ISSI
Read Cycle
T0T1T2T3T4T5T6T7T8T9T10
CLK
t
t
CKE
CKS
t
CS
t
t
CKA
t
CS
t
CS
RAS
t
CS
CAS
t
CS
WE
t
AS
A0-A7
t
AS
A8
t
AS
A9
DQM
I/O
CAS latency = 2, burst length = 4
CHI
CK
CH
ROWROW
ROW
BANK 1
<
ACT
><
t
CH
t
CH
t
CH
t
AH
t
AH
t
AH
t
RCD
t
RAS
t
RC
t
CL
READ
COLUMN m
BANK 0 AND 1
NO PRE
BANK 1BANK 1
BANK 0 OR 1
BANK 1
BANK 0BANK 0
t
CS
t
QMD
t
CAC
t
AC
t
LZ
t
AC
t
OH
D
OUT
mD
OUT
>
t
OH
m+1
t
t
AC
CH
BANK 0
t
D
OUT
m+2
PRE
>
<
<
PALL
>
OH
t
AC
t
RQL
t
RP
D
OUT
t
OH
m+3
t
HZ
ROW
BANK 0
t
t
t
<
ACT
>
RCD
RAS
RC
Undefined
Don't Care
®
38
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 39
IS42S16128ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0T1T2T3T4T5T6T7T8T9T10
tCK
tCHI
tCL
tCHtCS
tCHtCS
tCHtCS
tCHtCS
tAH
tAS
BANK 1
AUTO PRE
tAH
tAS
tCS
tAHtAS
tCKS
tCKA
BANK 0BANK 0
BANK 1BANK 1
BANK 0
ROWROW
ROW
COLUMN m
ROW
tQMD
tLZ
tRAS
tRC
<ACT><READA>
<
ACT>
tRCDtCAC
tPQL
tRP
tRCD
tAC
tAC
tOH
tACtAC
tOH
tCH
tOH
D
OUT
mD
OUT
m+1
D
OUT
m+2
tOH
tHZ
D
OUT
m+3
tRC
tRAS
Read Cycle / Auto-Precharge
®
CAS latency = 2, burst length = 4
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Undefined
Don't Care
39
Page 40
IS42S16128ISSI
Read Cycle / Full Page
T0T1T2T3T4T5T6T260T261T262T263
CLK
t
t
CKE
CKS
t
CS
t
t
t
CS
t
CS
RAS
t
CS
CAS
t
CS
WE
t
AS
A0-A7
t
AS
A8
t
AS
A9
DQM
I/O
CAS latency = 2, burst length = full page
CK
CKA
CH
CHI
t
CH
t
CH
t
CH
t
AH
ROW
t
AH
ROW
t
AH
BANK 0
t
RCD
t
RAS
t
RC
(BANK 0)
<
ACT 0
><
t
CL
READ0
t
>
COLUMN
NO PRE
CS
BANK 0
t
t
(BANK 0)
QMD
CAC
BANK 0 OR 1
BANK 0
t
CH
t
AC
t
LZ
t
AC
t
OH
D
OUT
0mD
OUT
t
AC
t
OH
0m+1
t
OH
D
OUT
0m-1
t
AC
t
OH
D
OUT
0mD
t
AC
t
RBD
t
OH
OUT
0m+1
t
HZ
t
RP
(BANK 0)
BST
><
<
PRE 0
>
Undefined
Don't Care
®
40
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 41
IS42S16128ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0T1T2T3T4T5T6T7T8T9T10
t
CK
t
CHI
t
CL
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
AH
t
AS
BANK 0 BANK 0
BANK 0
BANK 0
BANK 1
BANK 1
BANK 1
BANK 0 OR 1BANK 0 OR 1NO PRE
NO PRE
t
CH
t
AH
t
AS
t
QMD
t
CS
t
AC
t
AC
t
AC
t
AC
t
RCD
(BANK 0)
t
RAS
(BANK 0)
<
ACT 0
>
<
ACT 0
><
ACT1
>
<
READ 0
>
<
READA 0
><
READA 1
>
<
READ 1
><
PRE 0
><
PRE 1
>
t
AH
t
AS
t
CKS
t
CKA
ROW
ROW
ROW
ROW
ROW
COLUMNCOLUMN
AUTO PREAUTO PRE
ROW
t
LZ
t
LZ
t
RCD
(BANK 1)
t
RAS
(BANK 1)
t
RC
(BANK 1)
t
CAC
(BANK 1)
t
CAC
(BANK 1)
t
RC
(BANK 0)
t
RP
(BANK 0)
t
RP
(BANK1)
t
RCD
(BANK 0)
t
RAS
(BANK 0)
t
RC
(BANK 0)
t
RRD
(BANK 0 TO 1)
t
OH
t
OH
t
OH
t
OH
t
HZ
t
HZ
D
OUT
0mD
OUT
0m+1D
OUT
1mD
OUT
1m+1
Read Cycle / Ping-Pong Operation (Bank Switching)
®
CAS latency = 2, burst length = 2
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Undefined
Don't Care
41
Page 42
IS42S16128ISSI
Write Cycle
T0T1T2T3T4T5T7 T6 T8T9T10
CLK
t
CHI
CK
CKA
CH
ROWROW
AS
ROW
BANK 1
BANK 0
t
CL
t
CH
t
CH
t
CH
t
AH
COLUMN m
t
AH
BANK 0 AND 1
NO PRE
t
AH
BANK 1
BANK 0 OR 1
BANK 1
t
CS
BANK 0
t
CH
BANK 0
ROW
BANK 1
BANK 0
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
t
CKS
t
CS
t
t
t
t
CS
t
CS
t
CS
t
AS
t
t
AS
®
I/O
t
RCD
t
RAS
t
RC
ACT
><
CAS latency = 2, burst length = 4
t
DH
t
D
IN
m+2
DS
D
IN
t
DH
m+3
t
DPL
<
PRE
<
PALL
t
RCD
t
RP
>
<
ACT
><
t
RAS
t
RC
>
Undefined
Don't Care
t
DS
DIN m
WRIT
t
>
DH
t
DS
IN
D
t
DH
m+1
t
DS
42
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 43
IS42S16128ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0T1T2T3T4T5T7 T6 T8T9T10
t
CK
t
CHI
t
CL
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
AH
t
AS
BANK 1
BANK 0
AUTO PRE
t
CH
t
AH
t
AS
t
CS
t
DS
t
DS
t
DS
t
DS
t
DH
t
RAS
t
RC
<
ACT
><
ACT
><
WRITA
>
t
AH
t
AS
t
CKS
t
CKA
ROWROW
ROW
COLUMN m
ROW
t
RCD
t
DH
t
DH
t
DH
t
RP
t
DAL
t
RCD
t
RAS
t
RC
DIN m
D
IN
m+2
D
IN
m+1
D
IN
m+3
BANK 1
BANK 0
BANK 1
BANK 0
Write Cycle / Auto-Precharge
®
CAS latency = 2, burst length = 4
Undefined
Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
43
Page 44
IS42S16128ISSI
Write Cycle / Full Page
T0T1T2T3T4T5T259T258T260T261T262
CLK
t
CK
CKA
CH
CHI
t
CH
t
CH
t
CH
t
CL
CKE
CS
RAS
CAS
WE
t
CKS
t
CS
t
t
t
t
CS
t
CS
t
CS
®
t
A0-A7
A8
A9
t
t
t
AS
AS
AS
ROW
t
AH
ROW
t
AH
BANK 0
AH
COLUMN m
t
CS
DQM
t
DS
I/O
t
RCD
t
RAS
t
RC
<
ACT 0
><
CAS latency = 2, burst length = full page
NO PRE
BANK 0
t
t
DH
DIN 0m
WRIT0
>
DS
t
DH
IN
0m+1
D
t
DS
D
IN
0m+2
t
DH
t
DS
t
DH
IN
0m-1D
D
IN
0m
t
CH
t
DPL
BANK 0 OR 1
BANK 0
t
RP
BST
><
<
PRE 0
>
Undefined
Don't Care
44
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 45
IS42S16128ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0T1T2T3T4T5T6T7T8T9T10
t
CK
t
CHI
t
CL
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
AH
t
AS
BANK 0
BANK 0
BANK 0BANK 0
BANK 1
BANK 1
BANK 0 OR 1NO PRE
NO PRE
t
CH
t
AH
t
AS
t
CS
t
DS
t
DS
t
RCD
(BANK 0)
t
RAS
(BANK 0)
<
ACT 0
><
ACT 1
>
<
WRIT 0
>
<
WRITA 0
><
WRITA 1
>
<
WRIT 1
><
PRE 0
><
ACT 0
>
t
AH
t
AS
t
CKS
t
CKA
ROW
ROW
ROW
ROW
ROW
COLUMNCOLUMN
AUTO PRE
AUTO PRE
ROW
t
RCD
(BANK 1)
t
RAS
(BANK 1)
t
RC
(BANK 1)
t
RC
(BANK 0)
t
RCD
(BANK 0)
t
RP
(BANK 0)
t
RAS
(BANK 0)
t
RC
(BANK 0)
t
RRD
(BANK 0 TO 1)
t
DPL
t
DPL
t
DH
t
DH
t
DS
t
DH
t
DH
DIN 0m
t
DS
t
DS
t
DH
t
DS
t
DH
t
DH
t
DH
t
DS
t
DS
DIN 0m+1DIN 0m+2DIN 0m+3DIN 1mDIN 1m+1DIN 1m+2DIN 1m+3
Write Cycle / Ping-Pong Operation
®
CAS latency = 2, burst length = 2
Undefined
Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
45
Page 46
IS42S16128ISSI
Read Cycle / Page Mode
T0T1T2T3T4T5T6T7T8T9T10
CLK
t
t
CKE
CKS
t
CS
t
t
t
CS
t
CS
RAS
t
CS
CAS
t
CS
WE
t
AS
A0-A7
t
AS
A8
t
AS
A9
DQM
I/O
CAS latency = 2, burst length = 2
CHI
CK
CKA
CH
ROW
ROW
t
CL
t
CH
t
CH
t
CH
t
AH
COLUMN m
t
AH
NO PRENO PRE
t
AH
BANK 1
BANK 1
BANK 0
t
RCD
t
RAS
t
RC
<
ACT
><
t
CS
BANK 0
t
READ
>
t
QMD
CAC
t
LZ
COLUMN n
BANK 1
BANK 0
t
AC
t
AC
t
OH
D
OUT
mD
t
CAC
READ
>
t
AC
t
OH
OUT
m+1D
COLUMN o
AUTO PRE
NO PRE
BANK 1
BANK 0
t
AC
t
OH
OUT
nD
t
READ
><
<
<
READA
>
CAC
t
OH
OUT
n+1D
BANK 0 AND 1
BANK 0 OR 1
BANK 1
BANK 0
t
CH
t
AC
OUT
PRE
>
<
<
PALL
>
t
AC
t
t
OH
oD
t
RQL
t
RP
OH
OUT
o+1
t
HZ
Undefined
Don't Care
®
46
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 47
IS42S16128ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0T1T2T3T4T5T6T7T8T9T10
t
CK
t
CHI
t
CL
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
AH
t
AS
BANK 1
BANK 0
BANK 0
BANK 0 BANK 0
BANK 1
BANK 0 OR 1
BANK 0 AND 1
NO PRE
BANK 1
t
QMD
t
AH
t
AS
t
LZ
t
CS
t
RAS
t
RC
<
ACT
><
READ
>
<
READA, ENB
>
<
READ, ENB
><
MASK
>
<
PALL
>
<
PRE
>
t
AH
t
AS
t
CKS
t
CKA
ROW
COLUMN m
COLUMN n
COLUMN o
NO PRENO PRE
NO PRE
AUTO PRE
ROW
t
CH
t
RCD
t
CAC
t
CAC
t
CAC
t
RQL
t
HZ
t
HZ
t
RP
t
QMD
BANK 1
BANK 0
BANK 1
t
AC
t
LZ
t
AC
t
OH
t
AC
t
AC
t
AC
t
OH
t
OH
t
OH
t
OH
D
OUT
mD
OUT
m+1D
OUT
nD
OUT
oD
OUT
o+1
Read Cycle / Page Mode; Data Masking
®
CAS latency = 2, burst length = 2
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Undefined
Don't Care
47
Page 48
IS42S16128ISSI
Write Cycle / Page Mode
T0T1T2T3T4T5T6T7T8T9T10
CLK
t
CK
CKA
CH
CHI
ROW
ROW
BANK 1
BANK 0
t
t
t
CH
t
CH
t
CH
t
AH
AH
AH
t
CL
COLUMN m
NO PRENO PRE
BANK 1
BANK 0
t
CS
COLUMN n
BANK 1
BANK 0
COLUMN o
AUTO PRE
NO PRE
BANK 1
BANK 0
BANK 0 AND 1
BANK 0 OR 1
BANK 1
BANK 0
t
CH
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
t
CKS
t
CS
t
t
t
t
CS
t
CS
t
CS
t
AS
t
AS
t
AS
®
I/O
t
RCD
t
RAS
t
RC
<
ACT
><
CAS latency = 2, burst length = 2
t
DS
DIN m
WRIT
t
>
DH
t
DS
t
DH
DIN m+1
t
DH
t
D
WRIT
IN n
>
DS
t
DH
IN
n+1
D
t
DS
t
DS
<
WRIT
WRITA
<
t
DH
D
IN
o
><
>
t
DS
t
DH
IN
o+1
D
t
DPL
t
RP
<
PRE
>
PALL
>
<
Undefined
Don't Care
48
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 49
IS42S16128ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0T1T2T3T4T5T6T7T8T9T10
t
CK
t
CHI
t
CL
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
CH
t
CS
t
AH
t
AS
BANK 1
BANK 0
BANK 0
BANK 0
BANK 0
BANK 1
BANK 1OR 0
BANK 0 AND 1
BANK 1
t
CH
t
AH
t
AS
t
CS
t
RAS
t
RC
<
ACT
><
WRIT
><
WRIT
>
<
WRITA
>
<
WRIT
><
MASK
>
<
PALL
>
<
PRE
>
t
AH
t
AS
t
CKS
t
CKA
ROW
COLUMN m
COLUMN n
COLUMN o
NO PRENO PRE
NO PRE
AUTO PRE
ROW
t
RCD
t
DPL
t
RP
BANK 1
BANK 0
BANK 1
t
DS
t
DS
t
DS
t
DH
t
DS
t
DH
t
DH
t
DH
t
DS
t
DH
DIN m
D
IN n
DIN m+1
D
IN
o
D
IN
o+1
Write Cycle / Page Mode; Data Masking
®
CAS latency = 2, burst length = 2
Undefined
Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
49
Page 50
IS42S16128ISSI
Read Cycle / Clock Suspend
T0T1T2T3T4T5T6T7T8T9T10
CLK
t
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
t
CKS
t
CS
CK
CKA
CH
CHI
t
t
t
t
CS
t
CS
t
CS
t
AS
ROWROW
t
AS
t
t
CH
t
CH
t
CH
t
AH
AH
t
CL
COLUMN m
AUTO PRE
t
CKS
ROW
t
CS
NO PRE
BANK 1
BANK 0
t
QMD
t
CAC
t
CH
t
AC
t
LZ
t
AC
t
OH
D
OUT
mD
t
AS
BANK 1
BANK 0
t
AH
t
RCD
t
RAS
t
RC
t
CKH
OUT
m+1
BANK 0 AND 1
BANK 0 OR 1
BANK 1
BANK 0
t
OH
t
HZ
t
RP
ROW
BANK 1
BANK 0
t
RAS
t
RC
®
<
ACT 0
><
CAS latency = 2, burst length = 2
50
READ
READ A
<
<
SPND
><
SPND
>
><
>
PRE
<
PALL
>
ACT
><
>
Undefined
Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 51
IS42S16128ISSI
Write Cycle / Clock Suspend
T0T1T2T3T4T5T6T7T8T9T10
CLK
t
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
t
CKS
t
CS
CK
CKA
CH
CHI
t
CH
t
CH
t
CH
t
AH
t
t
t
t
CS
t
CS
t
CS
t
AS
ROWROW
t
AS
t
AH
t
CKS
t
CL
COLUMN m
AUTO PRE
ROW
t
CS
NO PRE
BANK 1
BANK 0
t
AS
BANK 1
BANK 0
t
AH
t
CKH
BANK 0 AND 1
BANK 0 OR 1
BANK 1
BANK 0
t
CH
ROW
BANK 1
BANK 0
®
I/O
t
RCD
t
RAS
t
RC
<
ACT
><
CAS latency = 2, burst length = 2
t
DS
t
DH
DIN mD
<
SPND
WRIT, SPND
<
WRITA, SPND
>
>
><
t
DS
IN
m+1
t
DPL
t
DH
t
PRE
<
PALL
t
RP
>
>
ACT
RAS
t
RC
><
Undefined
Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
51
Page 52
IS42S16128ISSI
Read Cycle / Precharge Termination
T0T1T2T3T4T5T6T7T8T9T10
CLK
t
CHI
CK
CH
ROWROW
t
CL
t
CH
t
CH
t
CH
t
AH
COLUMN mCOLUMN n
t
AH
ROW
BANK 0 OR 1
t
CH
t
AC
t
OH
D
OUT
mD
D
OUT
t
OH
m+1
t
AC
t
RQL
t
RP
OUT
t
OH
m+2
t
BANK 0
t
AH
t
RCD
t
RAS
t
RC
NO PRE
BANK 0BANK 0
t
CS
t
QMD
t
CAC
t
AC
t
LZ
HZ
ROW
BANK 1
BANK 0
t
RCD
t
RAS
t
RC
AUTO PRE
NO PRE
BANK 1
BANK 0
t
CAC
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
t
CKS
t
CS
t
t
CKA
t
t
CS
t
CS
t
CS
t
AS
t
AS
t
AS
®
<
ACT 0
><
CAS latency = 2, burst length = 4
52
READ 0
PRE 0
><
>
<
ACT
><
READ
<
READA
>
>
Undefined
Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 53
IS42S16128ISSI
Write Cycle / Precharge Termination
T0T1T2T3T4T5T6T7T8T9T10
CLK
t
CHI
CK
CH
ROWROW
t
CL
t
CH
t
CH
t
CH
t
AH
COLUMN mCOLUMN n
t
AH
ROW
BANK 0 OR 1
t
CS
t
CH
BANK 0
t
t
CS
AH
NO PRE
BANK 0BANK 0
t
CH
ROW
BANK 1
BANK 0
AUTO PRE
NO PRE
BANK 1
BANK 0
t
CS
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
t
CKS
t
CS
t
t
CKA
t
t
CS
t
CS
t
CS
t
AS
t
AS
t
AS
®
I/O
t
RCD
t
RAS
t
RC
<
ACT 0
><
CAS latency = 2, burst length = 4
t
IN
0m+2
DH
t
RCD
t
ACT
RAS
t
RC
><
t
RP
<
PRE 0
><
t
DIN 0m+1
DH
t
DS
D
t
DH
t
t
DS
DS
DIN 0mDIN 0n
WRIT 0
>
t
WRIT
WRITA
DH
>
>
Undefined
Don't Care
t
DS
<
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
53
Page 54
IS42S16128ISSI
Read Cycle / Byte Operation
T0T1T2T3T4T5T6T7T8T9T10
CLK
t
CK
CKA
CH
CHI
ROW
ROW
BANK 1
BANK 0
t
t
t
CH
t
CH
t
CH
t
AH
AH
AH
t
CL
t
COLUMN m
AUTO PRE
NO PRE
BANK 1
BANK 0
t
CS
CS
t
QMD
t
QMD
ROW
BANK 0 AND 1
ROW
BANK 0 OR 1
BANK 1
BANK 1
t
t
OH
m+1
AC
BANK 0
t
LZ
D
OUT
t
OH
m+2
t
AC
D
OUT
t
CH
t
CH
t
AC
t
LZ
t
AC
t
LZ
D
D
OUT
OUT
t
t
OH
m
OH
m
t
HZ
t
AC
D
OUT
t
OH
m+3
BANK 0
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
UDQM
LDQM
I/O8-15
I/O0-7
t
CKS
t
CS
t
t
t
t
CS
t
CS
t
CS
t
AS
t
AS
t
AS
®
t
RCD
t
RAS
t
RC
<
ACT
><
CAS latency = 2, burst length = 4
54
READ
<
READA
t
CAC
>
MASKU
>
<
ENBU, MASKL
>
t
QMD
>
<
MASKL
t
RQL
t
RP
PRE
>
<
><
<
PALL
>
ACT
t
RCD
t
RAS
t
RC
><
Undefined
Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 55
IS42S16128ISSI
Write Cycle / Byte Operation
T0T1T2T3T4T5T6T7T8T9T10
CLK
t
t
CK
CKA
CH
AS
CHI
ROW
ROW
BANK 1
BANK 0
t
CL
t
CH
t
CH
t
CH
t
AH
COLUMN m
t
AH
AUTO PRE
BANK 0 AND 1
ROW
ROW
t
AH
NO PRE
BANK 1
t
CS
BANK 0
t
CH
BANK 0 OR 1
BANK 1
BANK 0
BANK 1
BANK 0
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
UDQM
t
CKS
t
CS
t
t
t
CS
t
CS
t
CS
t
AS
t
AS
t
®
LDQM
I/O8-15
I/O0-7
t
RCD
t
RAS
t
RC
<
ACT
><
CAS latency = 2, burst length = 4
t
CS
t
DS
t
DS
<
t
CH
t
t
DS
t
DH
D
IN
m
t
DH
D
IN
mD
WRIT
>
MASKL
WRITA
<
>
DH
DIN m+1DIN m+3
>
<
MASK
>
t
<
IN
m+3
ENB
DH
t
DH
t
DPL
t
RP
PRE
>
<
>
<
PALL
>
ACT
t
RCD
t
RAS
t
RC
><
Undefined
Don't Care
t
DS
t
DS
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
55
Page 56
IS42S16128ISSI
Read Cycle, Write Cycle / Burst Read, Single Write
T0T1T2T3T4T5T6T7T8T9T10
CLK
t
t
CKS
CKE
t
CS
t
t
CS
t
CS
RAS
t
CS
CAS
t
CS
WE
t
AS
A0-A7
t
AS
A8
t
AS
A9
DQM
I/O
CAS latency = 2, burst length = 4
t
CK
CKA
CH
CHI
ROW
ROW
t
CL
t
CH
t
CH
t
CH
t
AH
COLUMN m
t
AH
NO PRE
t
AH
BANK 1
BANK 1
BANK 0BANK 0
t
CS
t
QMD
t
t
RCD
t
RAS
t
RC
<
ACT
><
READ
t
CAC
>
COLUMN n
D
IN
n
t
DPL
>
>
BANK 0 AND 1
BANK 0 OR 1
BANK 1
BANK 0
t
DH
t
RP
PRE
>
<
<
PALL
>
Undefined
Don't Care
AUTO PRE
NO PRE
BANK 1
t
OH
m+3
t
HZ
t
DS
BANK 0
WRIT
<
<
WRITA
t
CH
t
AC
LZ
t
AC
t
OH
D
OUT
mD
OUT
t
OH
m+1
t
AC
D
OUT
t
t
OH
m+2
AC
D
OUT
®
56
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 57
IS42S16128ISSI
Read Cycle
T0T1T2T3T4T5T6T7T8T9T10 T11 T12
CLK
t
t
CKS
CKE
t
CS
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
CAS latency = 3, burst length = 4
CHI
t
CK
t
CKA
t
CH
t
CS
t
CS
t
CS
t
AS
ROWROW
t
AS
ROW
t
AS
BANK 1
<
ACT
><
t
CH
t
CH
t
CH
t
AH
t
AH
t
AH
t
RCD
t
RAS
t
RC
t
CL
COLUMN m
BANK 0 AND 1
NO PRE
BANK 1BANK 1
BANK 0 OR 1
BANK 1
BANK 0BANK 0
READ
t
CS
t
CAC
t
QMD
t
AC
t
LZ
t
AC
t
OH
D
OUT
mD
>
t
OUT
t
CH
t
AC
OH
m+1
BANK 0
t
OH
D
OUT
m+2
t
PRE
>
<
<
PALL
>
t
AC
t
RQL
RP
D
OUT
t
OH
m+3
t
HZ
ROW
BANK 0
t
RCD
t
RAS
t
RC
<
ACT
>
Undefined
Don't Care
®
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
57
Page 58
IS42S16128ISSI
Read Cycle / Auto-Precharge
T0T1T2T3T4T5T6T7T8T9T10 T11 T12
CLK
t
t
CK
t
CKA
t
CH
t
CS
t
CS
t
CS
t
AS
t
AS
CHI
ROW
t
CL
t
CH
t
CH
t
CH
t
AH
COLUMN
t
AH
AUTO PRE
ROW
t
t
AS
AH
BANK 1BANK 1
BANK 1
BANK 0BANK 0
t
CS
t
RCD
t
RAS
t
RC
<
ACT
><
READA
>
t
CAC
t
QMD
t
AC
D
OUT
t
LZ
t
CH
t
t
OUT
AC
OH
m+1
t
AC
t
OH
mD
D
OUT
t
AC
t
OH
m+2
t
PQL
t
RP
D
OUT
t
OH
m+3
t
HZ
ROW
ROW
BANK 0
t
RCD
t
RAS
t
RC
ACT
>
<
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
t
CKS
t
CS
®
CAS latency = 3, burst length = 4
58
Undefined
Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 59
IS42S16128ISSI
Read Cycle / Full Page
T0T1T2T3T4T5T6T7T8T262T263T264T265
CLK
t
t
t
t
t
t
t
CS
CS
CS
t
AS
t
AS
t
AS
CK
CKA
CH
CHI
ROW
ROW
BANK 0
<
ACT 0
t
CL
t
CH
t
CH
t
CH
t
AH
COLUMN
t
AH
NO PRE
t
AH
BANK 0
t
CS
t
AC
t
LZ
t
RCD
(BANK 0)
t
RAS
(BANK 0)
t
RC
(BANK 0)
><
READ0
t
CAC
(BANK 0)
>
t
AC
t
OH
DOUT 0mDOUT 0m+1
t
OH
t
AC
DOUT 0m-1
BST
><
<
BANK 0 OR 1
BANK 0
t
CH
t
AC
t
OH
DOUT 0mDOUT 0m+1
t
RBD
PRE 0
t
AC
t
OH
t
RP
(BANK 0)
>
t
OH
t
HZ
Undefined
Don't Care
t
CKS
CKE
t
CS
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
CAS latency = 3, burst length = full page
®
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
59
Page 60
IS42S16128ISSI
Read Cycle / Ping Pong Operation (Bank Switching)
T0T1T2T3T4T5T6T7T8T9T10 T11T12
CLK
t
t
t
t
t
t
t
t
t
CK
CKA
t
CH
CS
CS
CS
AS
AS
AS
CHI
t
t
t
t
ROW
t
ROW
t
BANK 0
t
RRD
(BANK 0 TO 1)
t
RCD
(BANK 0)
t
RAS
(BANK 0)
t
(BANK 0)
ACT 0
>
<
CH
CH
CH
AH
AH
AH
RC
t
CL
ROW
COLUMN
COLUMN
ROW
AUTO PREAUTO PRE
ROW
BANK 1
t
RCD
(BANK 1)
<
ACT1
><
<
READA 0
NO PRE
BANK 0
t
CS
t
CAC
(BANK 0)
READ 0
>
><
t
QMD
t
RAS
(BANK 1)
t
RC
(BANK 1)
<
READA 1
BANK 0 OR 1
BANK 1
t
AC
t
LZ
t
CAC
(BANK 1)
READ 1
><
>
BANK 0
t
OH
D
OUT
0mD
(BANK 0)
(BANK 0)
PRE 0
><
t
AC
t
RQL
t
RP
t
AC
t
OH
OUT
0m+1D
BANK 0 OR 1NO PRE
BANK1
t
CH
PRE 1
t
AC
t
OH
OUT
1mD
t
RP
(BANK1)
>
ROW
BANK 0
t
OH
OUT
1m+1
(BANK 0)
<
ACT 0
>
t
HZ
t
RCD
(BANK 0)
t
RAS
(BANK 0)
t
RC
Undefined
Don't Care
t
CKS
CKE
t
CS
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
CAS latency = 3, burst length = 2
®
60
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 61
IS42S16128ISSI
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
I/O
T0T1T2T3T4T5T7 T6 T8T9T10 T11
tCK
tCHI
tCL
tCHtCS
tCHtCS
tCHtCS
tCHtCS
tAH
tAS
BANK 1
BANK 0
BANK 0 OR 1
BANK 0 AND 1
NO PRE
tCH
tAH
tAS
tCS
tDStDStDS
tDS
tDH
tRAS
tRC
<PRE>
<
PALL>
<ACT><ACT><WRIT>
tAHtAS
tCKS
tCKA
ROWROW
ROW
COLUMN
ROW
tRCD
tDH
tDH
tDH
tRP
tDPLtRCD
tRAS
tRC
DIN m
D
IN
m+2
D
IN
m+1
D
IN
m+3
BANK 1
BANK 0
BANK 1
BANK 0
BANK 1
BANK 0
T12
Write Cycle
®
CAS latency = 3, burst length = 4
Undefined
Don't Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
61
Page 62
IS42S16128ISSI
Write Cycle / Auto-Precharge
®
CLK
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
T0T1T2T3T4T5T7 T6 T8T9T10
t
t
CKS
t
CS
CHI
t
CK
t
CKA
t
CH
t
CS
t
CS
t
CS
t
AS
ROWROW
t
AS
t
t
CH
t
CH
t
CH
t
AH
AH
t
CL
COLUMN
AUTO PRE
ROW
t
t
AS
AH
BANK 1
BANK 1
BANK 0
t
CS
BANK 0
t
CH
T11T12
ROW
BANK 1
BANK 0
I/O
t
RCD
t
RAS
t
RC
ACT
><
CAS latency = 3, burst length = 4
t
DS
t
DH
DIN m
WRITA
>
t
DH
t
D
IN
m+2
DS
D
t
IN
m+3
DH
t
DAL
t
RCD
t
RP
<
ACT
><
Undefined
Don't Care
t
RAS
t
RC
t
DS
IN
D
t
DH
m+1
t
DS
62
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
03/13/00
Page 63
IS42S16128ISSI
Write Cycle / Full Page
T0T1T2T3T4T5T259T6T260T261T262 T263T264
CLK
t
t
t
CKA
t
CH
t
CS
t
CS
t
CS
t
AS
t
AS
t
AS
CK
CHI
ROW
ROW
BANK 0
t
t
t
t
t
t
CH
CH
CH
AH
AH
AH
t
CL
COLUMN
NO PRE
BANK 0 OR 1
t
CS
BANK 0
t
CH
BANK 0
CKE
CS
RAS
CAS
WE
A0-A7
A8
A9
DQM
t
CKS
t
CS
®
t
DS
I/O
t
RCD
t
RAS
t
RC
<
ACT 0
><
CAS latency = 3, burst length = full page
t
DIN 0m
WRIT0
>
DH
t
DH
t
D
IN
0m+2
DS
t
DH
IN
0m-1D
D
IN
0m
t
DPL
<
BST
><
PRE 0
t
RP
>
Undefined
Don't Care
t
DS
t
IN
0m+1
D
DH
t
DS
Integrated Silicon Solution, Inc. — 1-800-379-4774