INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
IRGIB7B60KD
C
V
CES
= 600V
Features
• Low VCE (on) Non Punch Through IGBT Technology.
• 10µs Short Circuit Capability.
• Square RBSOA.
• Positive VCE (on) Temperature Coefficient.
• Maximum Junction Temperature rated at 175°C.
G
E
n-channel
= 8.0A, TC=100°C
I
C
t
> 10µs, TJ=150°C
sc
V
CE(on)
typ. = 1.8V
Benefits
• Benchmark Efficiency for Motor Control.
• Rugged Transient Performance.
• Low EMI.
• Excellent Current Sharing in Parallel Operation.
TO-220AB
FullPak
Absolute Maximum Ratings
ParameterMax.Units
V
CES
@ TC = 25°CConti n uous Col lecto r Cu rr ent12
I
C
@ TC = 100°C
I
C
I
CM
I
LM
@ TC = 25°CDiode Continuous Forward Curr ent9.0
I
F
@ TC = 100°C
I
F
I
FM
V
ISOL
V
GE
@ TC = 25°C
P
D
@ TC = 100°C Maximum Power Dissipation20
P
D
T
J
T
STG
Collector-to-Emitter Voltage600V
Conti n uous Col lecto r Cu r rent8.0A
Pulse Collecto r Current (Ref.F ig .C. T. 5)24
Clamped Inductive Load current
Diode Continuous Forward Current6.0
Diode M ax imum Fo r war d Cu r rent18
RMS Isolation Voltage, Terminal to Case, t=1 min.2500V
Gate-to-Emitt er Volt age ±20
Maximum Power Dissipation39W
Operating Junction and-55 to +175
Stor ag e Temperature Ra ng e°C
Soldering Tempera tu re, for 10 sec.300 (0.06 3 in. (1.6mm) fro m case)
Mount ing Torq ue, 6-32 or M 3 Sc r ew10 lbf·in (1. 1 N· m )
c
24
Thermal / Mechanical Characteristics
ParameterMin.Typ.Max. Units
R
JC
θ
R
θJC
R
CS
θ
R
θJA
WtWeight –––2.0–––g
Junction-to-Case- IGBT––––––3.8
Junction- to-Cas e- D io de––––––6.0 °C/W
Case- t o- Sink , f l at, gre as e d surfac e–––0.50–––
Junction-to-Ambient, typical socket mount ––––––62
Total Gate C harge (tur n-on)—2944
Gate -t o - Em itter C ha r ge (t ur n-on)—3.75.6nC
Gate-to-Collector Charge (turn-on)—1421
Turn- O n Sw itch in g Loss—160268
Turn-Off Switching Loss—160268 µJ
Total Switching Los s—320433
Turn-On delay tim e—2327
Rise time—2 226ns
Turn-Off delay time—140150
Fall time—3242
Turn- O n Sw itch in g Loss—220330
Turn-Off Switching Loss—270381µJ
Total Switching Los s—490608
Turn-On delay tim e—2227
Rise time—2 125ns
Turn-Off delay time—180198
Fall time—4056WF2
Internal Emitter Induc tance—7.5—nH Measure d 5 mm fro m packa g e
Input Capacitance—440660
Output Capacitance—3857pF
Reverse Transfer Capacitance—1624f = 1.0MHz
Peak Short Circuit Collector Current—70—A
Reverse Recovery Energ y of the Diode—100133µJ
Diode R ev e r s e R ec o v er y Time—95120n s
Peak Reverse Recovery Current—1317A
Diode R ev erse Rec overy Charge—620800nC di/dt = 500A/µS
Note to are on page 12
2 www.irf.com
= 0V, IC = 500µA
V
GE
V
= 0V, IC = 1mA (25°C-150°C)
GE
= 8.0A, VGE = 15V, TJ = 25°C
I
C
= 8.0A, VGE = 15V, TJ = 150°C
I
C
= 8.0A, VGE = 15V, TJ = 175°C
I
C
V
= VGE, IC = 250µA
CE
VCE = VGE, IC = 1mA (25°C -150°C)
V
= 50V, IC = 8.0A, PW = 80µs
CE
= 0V, VCE = 600V
V
GE
V
= 0V, VCE = 600V, TJ = 150°C
GE
= 0V, VCE = 600V, TJ = 175°C
V
GE
I
= 5.0A, VGE = 0V
F
I
= 5.0A, TJ = 150°C, VGE = 0V
F
= 5.0A, TJ = 175°C, VGE = 0V
I
F
= ±20V, VCE = 0V
V
GE
I
= 8.0A
C
V
= 400V
CC
V
= 15V
GE
I
= 8.0A, VCC = 400V
C
V
= 15V, RG = 50Ω, L = 1.1mH
GE
= 25°C
T
J
I
= 8.0A, VCC = 400V
C
V
GE
T
= 25°C
J
I
= 8.0A, VCC = 400V
C
V
GE
T
= 150°C
J
= 8.0A, VCC = 400V
I
C
V
GE
= 150°C
T
J
V
GE
V
CC
= 150°C, IC = 54A, Vp = 600V
T
J
d
= 15V, RG = 50Ω, L = 1.1mH
= 15V, RG = 50Ω, L = 1.1mH
d
= 15V, RG = 50Ω, L = 1.1mH
= 0V
= 30V
VCC=500V,VGE = +15V to 0V,RG = 50Ω
= 150°C, Vp = 600V, RG = 100
T
J
Ω
VCC=360V,VGE = +15V to 0V
T
= 150°C
J
V
= 400V, IF = 8.0A, L = 1.07mH
CC
= 15V, RG = 50
V
GE
Ω
Ref.Fig.
5,6,7
9,10,11
9,10,11
12
8
23
CT1
CT4
CT4
CT4
13,15
WF1,WF2
14,16
CT4
WF1
22
4
CT2
CT3
WF4
WF4
17,18,19
20,21
CT4,WF3
Page 3
IRGIB7B60KD
14
12
10
8
)
A
(
C
I
6
4
2
0
020 40 60 80 100 120 140 160 180
TC (°C)
Fig. 1 - Maximum DC Collector Current vs.
Case Temperature
100
50
40
30
)
W
(
t
o
t
P
20
10
0
020 40 60 80 100 120 140 160 180
TC (°C)
Fig. 2 - Power Dissipation vs. Case
Temperature
100
(V)
J
100 µs
1ms
10ms
DC
≤ 150°C
10
)
A
C
I
1
0
101001000
V
(V)
CE
Fig. 4 - Reverse Bias SOA
TJ = 150°C; V
GE
=15V
10
)
A
(
1
C
I
0.1
0.01
110100100010000
V
CE
Fig. 3 - Forward SOA
TC = 25°C; T
www.irf.com3
Page 4
IRGIB7B60KD
40
VGE = 18V
35
VGE = 15V
VGE = 12V
30
VGE = 10V
VGE = 8.0V
25
)
A
(
20
E
C
I
15
10
5
0
0123456
V
(V)
CE
Fig. 5 - Typ. IGBT Output Characteristics
TJ = -40°C; tp = 80µs
40
35
30
25
)
A
(
20
E
C
I
15
10
5
0
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
0123456
V
(V)
CE
Fig. 6 - Typ. IGBT Output Characteristics
TJ = 25°C; tp = 80µs
40
35
30
25
)
A
(
20
E
C
I
15
10
5
0
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
0123456
V
(V)
CE
Fig. 7 - Typ. IGBT Output Characteristics
TJ = 150°C; tp = 80µs
30
25
20
)
A
(
15
F
I
10
5
0
0.00.51.01.52.0
-40°C
25°C
150°C
VF (V)
Fig. 8 - Typ. Diode Forward Characteristics
tp = 80µs
4 www.irf.com
Page 5
IRGIB7B60KD
20
18
16
14
12
)
V
(
10
E
C
V
8
6
4
2
0
5 101520
Fig. 9 - Typical V
V
GE
ICE = 4.0A
I
= 8.0A
CE
I
= 16A
CE
(V)
vs. V
CE
GE
TJ = -40°C
20
18
16
14
12
)
V
(
10
E
C
V
8
6
4
2
0
5 101520
Fig. 10 - Typical V
V
GE
ICE = 4.0A
I
= 8.0A
CE
I
= 16A
CE
(V)
vs. V
CE
GE
TJ = 25°C
20
18
16
14
12
)
V
(
10
E
C
V
8
6
4
2
0
5101520
Fig. 11 - Typical V
V
GE
ICE = 4.0A
I
= 8.0A
CE
I
= 16A
CE
(V)
vs. V
CE
GE
TJ = 150°C
100
80
TJ = 25°C
60
)
A
(
E
C
I
40
TJ = 150°C
20
0
05101520
TJ = 150°C
V
(V)
GE
TJ = 25°C
Fig. 12 - Typ. Transfer Characteristics
VCE = 360V; tp = 10µs
www.irf.com5
Page 6
IRGIB7B60KD
600
500
400
)
J
µ
(
y
300
g
r
e
n
E
200
100
0
05101520
Fig. 13 - Typ. Energy Loss vs. I
E
OFF
E
ON
IC (A)
C
TJ = 150°C; L=1.1mH; VCE= 400V,
RG= 50Ω; VGE= 15V
700
E
600
ON
1000
td
)
s
n
(
e
m
i
T
100
g
n
i
h
c
i
w
S
10
OFF
t
F
td
ON
t
R
05101520
IC (A)
Fig. 14 - Typ. Switching Time vs. I
TJ = 150°C; L=1.1mH; VCE= 400V
RG= 50Ω; VGE= 15V
10000
C
500
)
J
µ
400
(
y
g
r
e
300
n
E
200
100
0
0100200300400500
RG (Ω)
Fig. 15 - Typ. Energy Loss vs. R
TJ = 150°C; L=1.1mH; VCE= 400V
ICE= 8.0A; VGE= 15V
E
OFF
G
)
s
1000
n
(
e
m
i
T
g
n
i
h
c
i
100
w
S
10
td
OFF
t
F
t
R
0100200300400500
RG (Ω)
Fig. 16 - Typ. Switching Time vs. R
TJ = 150°C; L=1.1mH; VCE= 400V
ICE= 8.0A; VGE= 15V
td
ON
G
6 www.irf.com
Page 7
IRGIB7B60KD
16
14
12
10
)
A
(
8
R
R
I
6
4
2
0
05101520
IF (A)
R
R
R
G =
G =
G =
R
G =
Fig. 17 - Typical Diode I
TJ = 150°C
16
50 Ω
150
270
470
RR
Ω
Ω
Ω
vs. I
20
18
16
14
12
)
A
(
10
R
R
I
8
6
4
2
0
0100200300400500
RG (
Ω)
F
Fig. 18 - Typical Diode I
RR
vs. R
G
TJ = 150°C; IF = 8.0A
1500
14
12
10
)
A
(
8
R
R
I
6
4
2
0
0100200300400500600
diF /dt (A/µs)
Fig. 19- Typical Diode I
RR
VCC= 400V; VGE= 15V;
vs. diF/dt
150Ω
270Ω
diF /dt (A/µs)
)
C
n
(
R
R
Q
1000
500
0
0100 200 300 400 500 600 700
470
Ω
Fig. 20 - Typical Diode Q
VCC= 400V; VGE= 15V;TJ = 150°C
50Ω
16A
8.0A
4.0A
RR
IF= 8.0A; TJ = 150°C
www.irf.com7
Page 8
IRGIB7B60KD
250
)
F
p
(
e
c
n
a
t
i
c
a
p
a
C
1000
100
200
)
J
150
µ
(
y
g
r
e
n
100
E
50
0
05101520
IF (A)
Fig. 21 - Typical Diode E
470Ω
50
RR
150 Ω
Ω
vs. I
270Ω
F
TJ = 150°C
Cies
Coes
Cres
10
16
14
12
10
)
V
(
8
E
G
V
6
4
300V
400V
2
1
020406080100
V
(V)
CE
Fig. 22- Typ. Capacitance vs. V
CE
VGE= 0V; f = 1MHz
0
051015202530
Q G, Total Gate Charge (nC)
Fig. 23 - Typical Gate Charge vs. V
I
= 8.0A; L = 600µH
CE
GE
8 www.irf.com
Page 9
IRGIB7B60KD
τ
τ
10
)
C
J
h
t
Z
(
e
s
n
0.1
o
p
s
e
R
l
a
m
r
e
0.01
h
T
D = 0.50
1
0.20
0.10
R
R
R
R
0.05
0.01
0.02
SINGLE PULSE
( THERMAL RESPONSE )
τ
J
τ
J
τ
1
τ
1
Ci= τi/Ri
1
2
R
1
τ
2
τ
3
R
R
2
3
τ
3
τ
2
3
Ri (°C/W) τi (sec)
4
R
4
0.367 0.000164
τ
C
τ
0.425 0.000652
4
τ
4
1.070 0.081521
1.928 2.124500
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001
1E-61E-51E-41E-31E-21E-11E+01E+1
t1 , Rectangular Pulse Duration (sec)
Fig 24. Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)
10
)
C
J
h
t
Z
(
e
s
n
o
p
s
e
R
l
a
m
r
e
h
T
D = 0.50
0.20
1
0.10
0.05
0.1
0.01
0.02
0.01
τ
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-0061E-0050.00010.0010.010.1110100
J
τ
J
τ
1
τ
1
Ci= τi/Ri
R
R
1
R
1
R
2
3
R
2
τ
2
τ
2
Ri (°C/W) τi (sec)
R
3
τ
2.530 0.001
C
τ
3
1.354 0.068689
τ
3
2.114 2.758
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
t1 , Rectangular Pulse Duration (sec)
Fig 25. Maximum Transient Thermal Impedance, Junction-to-Case (DIODE)
www.irf.com9
Page 10
IRGIB7B60KD
0
1K
DUT
L
L
VCC
80 V
+
-
DUT
480V
Rg
Fig.C.T.1 - Gate Charge Circuit (turn-off)
Driver
DC
360V
DUT
Fig.C.T.2 - RBSOA Circuit
diode clamp /
DUT
- 5V
Rg
L
DUT /
DRIVER
VCC
Fig.C.T.3 - S.C.SOA CircuitFig.C.T.4 - Switching Loss Circuit
V
CC
R =
I
CM
DUT
Rg
VCC
Fig.C.T.5 - Resistive Load Circuit
10 www.irf.com
Page 11
IRGIB7B60KD
(uS)
600
500
400
300
200
Vce (V)
100
0
-100
-200
00.20.40.60.81
tf
Vce
90% Ice
5% Vce
5% Ice
Ice
Eoff Loss
Time (u S)
Fig. WF1- Typ. Turn-off Loss Waveform
@ TJ = 150°C using Fig. CT.4
100
Q
0
t
-100
RR
12
10
8
6
4
2
0
-2
-4
15
10
5
600
500
400
300
Ice (A)
Vce (V)
200
100
0
-100
0.30.50.70.9
Eon
Loss
Time (uS )
tr
Vce
Ice
90% Ice
10% Ice
5% Vce
24
20
16
12
8
4
0
-4
Ice (A)
Fig. WF2- Typ. Turn-on Loss Waveform
@ TJ = 150°C using Fig. CT.4
400
350
300
80
60
-200
(V)
F
V
-300
-400
Peak
I
RR
10%
Peak
IRR
-500
-600
-0.15-0.050. 050.150.25
time (µS)
Fig. WF3- Typ. Diode Recovery Waveform
@ TJ = 150°C using Fig. CT.4
0
-5
-10
-15
-20
(A)
F
I
250
200
Vce (V)
150
100
50
0
0.0010.0020.0030.0040.0050.00
Time
Fig. WF4- Typ. S.C Waveform
@ TC = 150°C using Fig. CT.3
40
Ice (A)
20
0
www.irf.com11
Page 12
IRGIB7B60KD
I
R
F
I
8
4
0
G
3
4
3
2
9
2
4
K
E
X
A
M
P
L
E
:
T
H
I
S
I
S
A
N
I
R
F
I
8
4
0
G
W
I
T
H
A
S
S
E
M
B
L
Y
P
A
R
T
N
U
M
B
E
R
L
O
G
O
R
E
C
T
I
F
I
E
R
I
N
T
E
R
N
A
T
I
O
N
A
L
A
S
S
E
M
B
L
Y
L
O
T
C
O
D
E
W
E
E
K
2
4
L
I
N
E
K
Y
E
A
R
9
=
1
9
9
9
D
A
T
E
C
O
D
E
I
N
T
H
E
A
S
S
E
M
B
L
Y
L
I
N
E
"
K
"
A
S
S
E
M
B
L
E
D
O
N
W
W
2
4
1
9
9
9
L
O
T
C
O
D
E
3
4
3
2
TO-220 Full-Pak Package Outline
Dimensions are shown in millimeters (inches)
10.60 (.417)
10.40 (.409)
16.00 (.630)
15.80 (.622)
1 2 3
13.70 (.540)
13.50 (.530)
1.40 (.055)
3X
1.05 (.042)
2.54 (.100)
2X
3X
TO-220 Full-Pak Part Marking Information
3.70 (.145)
3.20 (.126)
1.15 (.045)
MIN.
3.30 (. 13 0)
3.10 (. 12 2)
0.90 (.0 35 )
0.70 (.0 28 )
0.25 (.010)
3.40 (.133)
ø
3.10 (.123)
- A -
- B -
M
A M B
4.80 (.1 89 )
4.60 (.1 81 )
7.10 (.280)
6.70 (.263)
2.80 (.11 0)
2.60 (.10 2)
NOTES:
1 DIMENSI ONING & TOLE RANCING
PER ANSI Y14.5M, 1982
2 CONTROL LI NG DI M E NSION: INCH.
0.48 (. 01 9)
3X
0.44 (. 01 7)
2.85 (.1 12)
2.65 (.1 04)
LEAD ASSIGNMENTS 1 -GATE 2 -DRAIN 3 -SOURCE
MINI MUM CRE EPAGE
DISTANCE BET WEEN
A-B-C-D = 4.80 (.189)
C
D
A
B
Notes:
VCC = 80% (V
), VGE = 15V, L = 100µH, RG = 50Ω.
CES
Energy losses include "tail" and diode reverse recovery.
TO-220AB FullPak package is not recommended for Surface Mount Application.
Data and specifications subject to change without notice.
This product has been designed and qualified for Industrial market.
Qualification Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
12 www.irf.com
Visit us at www.irf.com for sales contact information. 01/03
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