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PD - 9.1073
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IRGBC40K
INSULATED GATE BIPOLAR TRANSISTOR
Short Circuit Rated
UltraFast IGBT
Features
• Short circuit rated - 10µs @ 125°C, VGE = 15V
• Switching-loss rating includes all "tail" losses
• Optimized for high operating frequency (over 5kHz)
See Fig. 1 for Current vs. Frequency curve
G
C
V
= 600V
CES
V
E
@VGE = 15V, IC = 25A
CE(sat)
≤ 3.2V
n-channel
Description
Insulated Gate Bipolar Transistors (IGBTs) from International Rectifier have
higher usable current densities than comparable bipolar transistors, while at
the same time having simpler gate-drive requirements of the familiar power
MOSFET. They provide substantial benefits to a host of high-voltage, highcurrent applications.
These new short circuit rated devices are especially suited for motor control
and other applications requiring short circuit withstand capability.
Absolute Maximum Ratings
Parameter Max. Units
V
CES
IC @ TC = 25°C Continuous Collector Current 42
IC @ TC = 100°C Continuous Collector Current 25 A
I
CM
I
LM
t
sc
V
GE
E
ARV
PD @ TC = 25°C Maximum Power Dissipation 160 W
PD @ TC = 100°C Maximum Power Dissipation 65
T
J
T
STG
Collector-to-Emitter Voltage 600 V
Pulsed Collector Current 84
Clamped Inductive Load Current 84
Short Circuit Withstand Time 10 µs
Gate-to-Emitter Voltage ±20 V
Reverse Voltage Avalanche Energy 15 mJ
Operating Junction and -55 to +150
Storage Temperature Range °C
Soldering Temperature, for 10 sec. 300 (0.063 in. (1.6mm) from case)
Mounting torque, 6-32 or M3 screw. 10 lbf•in (1.1N•m)
Thermal Resistance
R
θJC
R
θCS
R
θJA
Wt Weight — 2 (0.07) — g (oz)
Parameter Min. Typ. Max. Units
Junction-to-Case — — 0.77
Case-to-Sink, flat, greased surface — 0.50 — °C/W
Junction-to-Ambient, typical socket mount — — 80
C-849
Revision 1
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Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V
(BR)CES
V
(BR)ECS
∆V
(BR)CES
V
CE(on)
V
GE(th)
∆ V
GE(th)
g
fe
I
CES
I
GES
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
Q
g
Q
ge
Q
gc
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
E
ts
t
sc
t
d(on)
t
r
t
d(off)
t
f
E
ts
L
E
C
ies
C
oes
C
res
Collector-to-Emitter Breakdown Voltage 600 — — V VGE = 0V, IC = 250µA
Emitter-to-Collector Breakdown Voltage 20 — — V VGE = 0V, IC = 1.0A
/∆ T
Temperature Coeff. of Breakdown Voltage — 0.46 — V/°C VGE = 0V, IC = 1.0mA
J
Collector-to-Emitter Saturation Voltage — 2.1 3.2 IC = 25A VGE = 15V
— 2.8 — V IC = 42A See Fig. 2, 5
— 2.5 — IC = 25A, TJ = 150°C
Gate Threshold Voltage 3.0 — 5.5 VCE = VGE, IC = 250µA
/∆ TJTemperature Coeff. of Threshold Voltage — -13 — mV/°C VCE = VGE, IC = 250µA
Forward Transconductance 7.0 14 — S VCE = 100V, IC = 25A
Zero Gate Voltage Collector Current — — 250 µA VGE = 0V, VCE = 600V
— — 1000 VGE = 0V, VCE = 600V, TJ = 150°C
Gate-to-Emitter Leakage Current — — ±100 nA VGE = ±20V
Total Gate Charge (turn-on) — 61 92 IC = 25A
Gate - Emitter Charge (turn-on) — 13 19 nC VCC = 400V See Fig. 8
Gate - Collector Charge (turn-on) — 22 33 VGE = 15V
Turn-On Delay Time — 35 — TJ = 25°C
Rise Time — 27 — ns IC = 25A, VCC = 480V
Turn-Off Delay Time — 160 240 VGE = 15V, RG = 10Ω
Fall Time — 130 200 Energy losses include "tail"
Turn-On Switching Loss — 0.52 —
Turn-Off Switching Loss — 1.2 — mJ See Fig. 9, 10, 11, 14
Total Switching Loss — 1.7 2.6
Short Circuit Withstand Time 10 — — µs VCC = 360V, TJ = 125°C
VGE = 15V, RG = 10Ω , V
Turn-On Delay Time — 34 — TJ = 150°C,
Rise Time — 28 — ns IC = 25A, VCC = 480V
Turn-Off Delay Time — 300 — VGE = 15V, RG = 10Ω
Fall Time — 310 — Energy losses include "tail"
Total Switching Loss — 3.6 — mJ See Fig. 10, 14
Internal Emitter Inductance — 7.5 — nH Measured 5mm from package
Input Capacitance — 1500 — VGE = 0V
Output Capacitance — 190 — pF VCC = 30V See Fig. 7
Reverse Transfer Capacitance — 17 — ƒ = 1.0MHz
CPK
< 500V
Notes:
Repetitive rating; VGE=20V, pulse width
limited by max. junction temperature.
( See fig. 13b )
VCC=80%(V
RG= 10Ω , ( See fig. 13a )
), VGE=20V, L=10µH,
CES
Repetitive rating; pulse width limited
by maximum junction temperature.
Pulse width ≤ 80µs; duty factor ≤ 0.1%.
C-850
Pulse width 5.0µs,
single shot.
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50
40
30
20
Sq uare w a v e:
60% of ra ted
v olta g e
For b o th:
Du ty c y cle : 5 0%
T = 1 25 ° C
J
T = 9 0°C
sin k
Ga te driv e a s spe cified
Pow er D issip atio n = 2 8W
Tri a ngu lar w av e:
Cl a mp vol tag e :
80% of rate d
Load Current (A)
10
0
0.1 1 10 100
Ideal diodes
f, Frequency (kHz)
Fig. 1 - Typical Load Current vs. Frequency
(For square wave, I=I
100
of fundamental; for triangular wave, I=IPK)
RMS
1000
10
1
C
I , Collector-to-Emitter Current (A)
0.1
0.1 1 10
V , Collector-to-Emitter Voltage (V)
CE
Fig. 2 - Typical Output Characteristics
T = 150°C
J
T = 25°C
J
V = 15V
GE
20µs PULSE WIDTH
C-851
100
T = 150°C
J
10
C
I , Collector-to-Emitter Current (A)
1
5 10 15 20
T = 25°C
J
V = 100V
CC
5µs PULSE WIDTH
V , Gate-to-Emitter Voltage (V)
GE
Fig. 3 - Typical Transfer Characteristics
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IRGBC40K
t , Rectangular Pulse Duration (sec)
1
thJC
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50
40
30
20
10
V = 15V
GE
Maximum DC Collector Current (A)
0
25 50 75 100 125 150
T , Case Temperature (°C)
C
Fig. 4 - Maximum Collector Current vs.
Case Temperature
1
5.0
V = 15V
GE
80µs PULSE WIDTH
I = 50A
4.0
3.0
2.0
CE
V , Collector-to-Emitter Voltage (V)
1.0
-60 -40 -20 0 20 40 60 80 100 120 140 160
T , Case Temperature (°C)
C
C
I = 25A
C
I = 13A
C
Fig. 5 - Collector-to-Emitter Voltage vs.
Case Temperature
D = 0.50
0.2 0
0.1
0.1 0
0.05
0.0 2
0.0 1
0.01
0.0 0 001 0.0001 0.0 0 1 0.01 0.1 1 10
P
DM
SIN GLE PUL SE
(THERMAL RESPONS E )
Note s:
1. Duty facto r D = t / t
2. Peak T = P x Z + T
J
DM
2
1
thJC
Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
C-852
t
1
t
2
C
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2500
2000
1500
1000
V = 0V, f = 1MHz
GE
C = C + C , C SHORTED
ies ge gc ce
C = C
res gc
C = C + C
oes ce gc
C
ies
C
oes
C, Capacitance (pF)
500
C
res
0
1 10 100
V , Collector-to-Emitter Voltage (V)
CE
Fig. 7 - Typical Capacitance vs.
Collector-to-Emitter Voltage
2.2
V = 480V
CC
V = 15V
GE
T = 25°C
C
2.1
I = 25A
C
20
V = 400V
CE
I = 25A
C
16
12
8
4
GE
V , Gate-to-Emitter Voltage (V)
0
0 20 40 60 80
Q , Total Gate Charge (nC)
g
Fig. 8 - Typical Gate Charge vs.
Gate-to-Emitter Voltage
10
I = 50A
C
2.0
1.9
1.8
Total Switching Losses (mJ)
1.7
1.6
0 10 20 30 40 50 60
Fig. 9 - Typical Switching Losses vs. Gate
R , Gate Resistance (Ω)
G
Resistance
A
C-853
I = 25A
C
1
Total Switching Losses (mJ)
R = 10
V = 15V
V = 480V
0.1
-60 -40 -20 0 20 40 60 80 100 120 140 160
Ω
G
GE
CC
T , Case Temperature (°C)
C
I = 13A
C
Fig. 10 - Typical Switching Losses vs.
Case Temperature
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10
R = 10
T = 150°C
V = 480V
8
V = 15V
6
4
2
Total Switching Losses (mJ)
0
0 10 20 30 40 50 60
Ω
G
C
CC
GE
I , Collector-to-Emitter Current (A)
C
Fig. 11 - Typical Switching Losses vs.
Collector-to-Emitter Current
1000
V = 20V
GE
T = 125°C
J
100
SAFE OPERATING AREA
10
C
I , Collector-to-Emitter Current (A)
1
1 10 100
V , Collector-to-Emitter Voltage (V)
CE
Fig. 12 - Turn-Off SOA
Refer to Section D for the following:
Appendix C: Section D - page D-5
Package Outline 1 - JEDEC Outline TO-220AB Section D - page D-12
Fig. 13a - Clamped Inductive Load Test Circuit
Fig. 13b - Pulsed Collector Current Test Circuit
Fig. 14a - Switching Loss Test Circuit
Fig. 14b - Switching Loss Waveform
C-854