Datasheet irgb4b60k Datasheet

Page 1
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE
PD - 94633
IRGB4B60K IRGS4B60K
IRGSL4B60K
Features
• Low VCE (on) Non Punch Through IGBT Technology.
• 10µs Short Circuit Capability.
• Square RBSOA.
• Positive VCE (on) Temperature Coefficient.
• Maximum Junction Temperature rated at 175°C.
Benefits
• Benchmark Efficiency for Motor Control.
• Rugged Transient Performance.
• Low EMI.
• Excellent Current Sharing in Parallel Operation.
G
n-channel
TO-220
IRGB4B60K
C
E
V
CES
I
= 6.8A, TC=100°C
C
> 10µs, TJ=150°C
t
sc
V
CE(on)
D2Pak
IRGS4B60K
typ. = 2.1V
TO-262
IRGSL4B60K
Absolute Maximum Ratings
Parameter Max. Units
V
CES
I
@ TC = 25°C Continuous Collector Current 12
C
I
@ TC = 100°C Continuous Collector Current 6.8 A
C
I
CM
I
LM
V
GE
P
@ TC = 25°C Maximum Power Dissipation 63 W
D
P
@ TC = 100°C Maximum Power Dissipation 31
D
T
J
T
STG
Collector-to-Emitt er Voltage 600 V
Pulse Collector Current (Ref.Fig.C.T.5) 24 Clamped Inductive Load current
Gate-to-Emitter Voltage ±20 V
Operating Junction and -55 to +175 Storage Temperature Range °C Soldering Temperature, for 10 sec. 300 (0.063 in. (1.6mm) from cas e)
c
24
Thermal / Mechanical Characteristics
Parameter Min. Typ. Max. Units
R
θJC
R
θCS
R
θJA
R
θJA
Wt Weight ––– 1.44 ––– g
Junction-to-Case- IGBT ––– ––– 2.4 °C/W Case-to-Sink, flat, greased surface ––– 0.50 ––– Junction-to-Ambient ––– ––– 62 Junction-to-Ambient (PCB Mount, steady stat e)
d
––– ––– 40
www.irf.com 1
3/4/03
Page 2
IRGB/S/SL4B60K
C
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions Ref.Fig.
V
(BR)CES
∆V
(BR)CES
V
CE(on)
V
GE(th)
∆V
GE(th)
gfe Forward Transconductance — 1.7 — S
I
CES
I
GES
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Q
g
Q
ge
Q
gc
E
on
E
off
E
tot
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
E
tot
t
d(on)
t
r
t
d(off)
t
f
C
ies
C
oes
C
res
RBSOA Reverse Bias Safe Operating Area FULL SQUARE
SCSOA Short Circuit Safe Operating Area 10 — — µs
Collector-to-Emitter Breakdown Voltage 600 — — V
/∆T
Temperature Coeff. of Breakdown Voltage —0.28—V/°C
J
—2.12.5
Collector-to-Emitt er Voltage — 2.5 2.8 V
—2.62.8
Gate Threshold Voltage 3.5 4.5 5.5 V
/∆T
Threshold Voltage temp. coef f i cient — -8.1 — mV/°
J
— 1.0 150
Zero Gate Voltage Collector Current — 54 300 µA
— 300 800
Gate-to-Emitter Leakage Current — — ±100 nA
Parameter Min. Typ. Max. Units Conditions Ref.Fig.
Total Gate Charge (turn-on) — 12 — Gate-to-Emitter Charge (turn-on) — 1.7 — nC Gate-to-Collector Charge (turn-on) — 6.5 — Turn-On Switching Loss — 73 80 Turn-Off Switching Loss — 47 53 µJ Total Switching Loss — 120 130 Turn-On delay time — 22 28 Rise time — 18 23 ns Turn-Off delay time — 100 110 Fall time — 66 80 Turn-On Switching Loss — 130 150 Turn-Off Switching Loss — 83 140 µJ Total Switching Loss — 220 280 Turn-On delay time — 22 27 Rise time — 18 22 ns Turn-Off delay time — 120 130 Fall time — 79 89 WF2 Input Capacitance — 190 — Output Capacitance — 25 — pF Reverse Transfer Capacitance — 6.2 — f = 1.0MHz
= 0V, IC = 500µA
V
GE
V
= 0V, IC = 1mA (25°C-150°C)
GE
= 4.0A, VGE = 15V, TJ = 25°C
I
C
= 4.0A, VGE = 15V, TJ = 150°C
I
C
I
= 4.0A, VGE = 15V, TJ = 175°C
C
V
= VGE, IC = 250µA
CE
VCE = VGE, IC = 1mA (25°C-150°C) V
= 50V, IC = 4.0A, PW = 80µs
CE
= 0V, VCE = 600V
V
GE
V
= 0V, VCE = 600V, TJ = 150°C
GE
= 0V, VCE = 600V, TJ = 175°C
V
GE
V
= ±20V
GE
I
= 4.0A
C
V
= 400V
CC
V
= 15V
GE
I
= 4.0A, VCC = 400V
C
V
= 15V, RG = 100Ω, L = 2.5mH
GE
T
= 25°C
J
I
= 4.0A, VCC = 400V
C
V
GE
T
J
I
= 4.0A, VCC = 400V
C
V
GE
T
J
I
= 4.0A, VCC = 400V
C
V
GE
T
J
V
GE
V
CC
T
J
e
= 15V, RG = 100Ω, L = 2.5mH
= 25°C
= 15V, RG = 100Ω, L = 2.5mH
= 150°C
e
= 15V, RG = 100Ω, L = 2.5mH
= 150°C
= 0V = 30V
= 150°C, IC = 24A, Vp = 600V VCC=500V,VGE = +15V to 0V,RG = 100Ω T
= 150°C, Vp = 600V, RG = 100Ω
J
VCC=360V,VGE = +15V to 0V
5,6,7
9,10,11
9,10,11
12
23
CT1
CT4
CT4
CT4
13,15
WF1,WF2
14,16
CT4
WF1
22
4 CT2 CT3
WF3
Note to are on page 16
2 www.irf.com
Page 3
IRGB/S/SL4B60K
12
10
8
) A
(
6
C
I
4
2
0
0 20 40 60 80 100 120 140 160 180
TC (°C)
Fig. 1 - Maximum DC Collector Current vs.
Case Temperature
100
70
60
50
)
40
W
(
t
o
t
30
P
20
10
0
0 20 40 60 80 100 120 140 160 180
TC (°C)
Fig. 2 - Power Dissipation vs. Case
Temperature
100
10
) A
(
1
C
I
0.1
0.01 0 1 10 100 1000 10000
V
(V)
CE
Fig. 3 - Forward SOA
TC = 25°C; T
≤ 150°C
J
100µs
1ms 10ms
DC
10
) A
C
I
1
0
10 100 1000
V
(V)
CE
Fig. 4 - Reverse Bias SOA
TJ = 150°C; V
GE
=15V
www.irf.com 3
Page 4
IRGB/S/SL4B60K
30
VGE = 18V VGE = 15V
25
VGE = 12V VGE = 10V VGE = 8.0V
20
) A
(
15
E C
I
10
5
0
0 2 4 6 8 10 12
V
(V)
CE
Fig. 5 - Typ. IGBT Output Characteristics
TJ = -40°C; tp = 80µs
25
VGE = 18V VGE = 15V
VGE = 12V
20
VGE = 10V VGE = 8.0V
15
) A
(
E C
I
10
30
VGE = 18V VGE = 15V
25
VGE = 12V VGE = 10V VGE = 8.0V
20
) A
(
15
E C
I
10
5
0
0 2 4 6 8 10 12
V
(V)
CE
Fig. 6 - Typ. IGBT Output Characteristics
TJ = 25°C; tp = 80µs
5
0
0 2 4 6 8 10 12
V
(V)
CE
Fig. 7 - Typ. IGBT Output Characteristics
TJ = 150°C; tp = 80µs
4 www.irf.com
Page 5
IRGB/S/SL4B60K
20 18 16 14 12
) V
(
10
E C
V
8 6 4 2 0
5 101520
V
Fig. 8 - Typical V
GE
ICE = 2.0A I
CE
I
CE
(V)
vs. V
CE
= 4.0A = 8.0A
GE
TJ = -40°C
20 18 16 14 12
) V
(
10
E C
V
8 6 4 2 0
5 101520
V
GE
ICE = 2.0A I
CE
I
CE
(V)
= 4.0A = 8.0A
20 18 16 14 12
) V
(
10
E C
V
8 6 4 2 0
5 101520
V
Fig. 9 - Typical V
GE
(V)
CE
ICE = 2.0A I
CE
I
CE
vs. V
= 4.0A = 8.0A
GE
TJ = 25°C
30
)
25
Α
(
t
n
e
r
r
20
u C e
c
r
15
u
o S
-
o
t
-
10
n
i
a
r D
,
D
5
I
0
0 5 10 15 20
VGS, Gate-to-Source Voltage (V)
TJ = 25°C
TJ = 150°C
Fig. 10 - Typical V
TJ = 150°C
CE
vs. V
GE
Fig. 11 - Typ. Transfer Characteristics
VCE = 360V; tp = 10µs
www.irf.com 5
Page 6
IRGB/S/SL4B60K
350
300
E
250
)
J
µ
200
(
y
g
r
e
150
n E
100
50
0
12345678910
Fig. 12 - Typ. Energy Loss vs. I
ON
IC (A)
E
OFF
C
TJ = 150°C; L=2.5mH; VCE= 400V,
RG= 100Ω; VGE= 15V
350
1000
td
)
s
100
n
( e m
i T
g
n
i
h
c
i
10
w S
1
0 2 4 6 8 10
OFF
t
F
td
ON
t
R
IC (A)
Fig. 13 - Typ. Switching Time vs. I
TJ = 150°C; L=2.5mH; VCE= 400V
RG= 100Ω; VGE= 15V
1000
C
300
250
)
J
200
µ
( y
g
r
e
150
n E
100
50
0
0 100 200 300 400 500
Fig. 14 - Typ. Energy Loss vs. R TJ = 150°C; L=2.5mH; VCE= 400V
ICE= 4.0A; VGE= 15V
RG (Ω)
E
ON
)
s
n
(
E
OFF
e m
i T
g
n
i
h
c
i w S
G
td
100
OFF
t
F
td
ON
t
R
10
0 100 200 300 400 500
RG (Ω)
Fig. 15 - Typ. Switching Time vs. R
G
TJ = 150°C; L=2.5mH; VCE= 400V
ICE= 4.0A; VGE= 15V
6 www.irf.com
Page 7
IRGB/S/SL4B60K
τ
1000
Cies
)
100
F
p
( e
c
n
a
t
i
c
a
p
a
10
C
1
0 20 40 60 80 100
Coes
Cres
V
CE
(V)
Fig. 16- Typ. Capacitance vs. V
VGE= 0V; f = 1MHz
10
CE
16
14
300V
12
400V
10
) V
(
8
E G
V
6
4
2
0
02468101214
Q G, Total Gate Charge (nC)
Fig. 17 - Typical Gate Charge vs. V
I
= 4.0A; L = 3150µH
CE
GE
)
C
J
h
t
Z (
e
s
n
o
p
s
e R
l
a m
r
e
0.01
h T
0.1
D = 0.50
1
0.20
0.10
0.05
0.02
0.01
τ
J
τ
J
τ
1
τ
1
Ci= τi/Ri
R
R
1
R
1
R
2
3
R
2
τ
2
τ
2
Ri (°C/W) τi (sec)
R
3
τ
0.0429 0.000001
C
τ
3
1.3417 0.000178
τ
3
1.0154 0.000627
SINGLE PULSE ( THERMAL RESPONSE )
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001 1E-006 1E-005 0.0001 0.001 0.01 0.1 1
t1 , Rectangular Pulse Duration (sec)
Fig 18. Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)
www.irf.com 7
Page 8
IRGB/S/SL4B60K
0
1K
DUT
L
L
VCC
80 V
+
-
DUT
480V
Rg
Fig.C.T.1 - Gate Charge Circuit (turn-off)
Driver
DC
360V
DUT
Fig.C.T.2 - RBSOA Circuit
diode clamp /
DUT
- 5V
Rg
L
DUT /
DRIVER
VCC
Fig.C.T.3 - S.C.SOA Circuit Fig.C.T.4 - Switching Loss Circuit
V
CC
R =
I
CM
DUT
Rg
VCC
Fig.C.T.5 - Resistive Load Circuit
8 www.irf.com
Page 9
IRGB/S/SL4B60K
I (A)
700
tf
600
Vce
500
90% Ice
400
300
Vce (V)
200
100
0
Eoff Loss
-100
0.4 0.6 0.8 1 1.2
Time (uS)
5% Vce
5% Ice
Ice
Fig. WF1- Typ. Turn-off Loss Waveform
@ TJ = 150°C using Fig. CT.4
400
350
14
12
10
8
6
4
2
0
-2
700
600
500
400
Ice (A)
300
Vce (V)
200
100
0
-100
0.35 0.45 0.55 0.65
tr
Vce Ice
90% Ice
10% Ice 5% Vce
Eon Loss
Time (uS)
14
12
10
8
6
Ice (A)
4
2
0
-2
Fig. WF2- Typ. Turn-on Loss Waveform
@ TJ = 150°C using Fig. CT.4
Vce
40
35
300
250
30
25
Ice
(V)
200
CE
V
150
100
50
0
-50 30 40 50 60 70
Time (uS)
(A)
20
CE
I
15
10
5
0
-5
Fig. WF3- Typ. S.C Waveform @ TC = 150°C using Fig. CT.3
www.irf.com 9
Page 10
IRGB/S/SL4B60K
TO-220AB Package Outline
Dimensions are shown in millimeters (inches)
10.54 (.415)
2.87 (.113)
2.62 (.103)
15.24 (.600)
14.84 (.584)
14.09 (.555)
13.47 (.530)
1.40 (. 0 5 5)
3X
1.15 (. 0 4 5)
2.54 (.100)
NOTES: 1 DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982. 3 OUTLINE CONFORMS TO JEDEC OUTLINE TO-220AB. 2 CONTROLLING DIMENSION : INCH 4 HEATSINK & LEAD MEASUREMENTS DO NOT INCLUDE BURRS.
2X
10.29 (.405)
4
1 2 3
3X
0.36 (.014) M B A M
6.47 (.255)
6.10 (.240)
1.15 (.045) MIN
4.06 (.160)
3.55 (.140)
0.93 (.037)
0.69 (.027)
3.78 (.149)
3.54 (.139)
- A -
4.69 (.185)
4.20 (.165)
- B -
1.32 (.052)
1.22 (.048)
2.92 (.115)
2.64 (.104)
3X
LEAD ASSIGNMENTS 1 - GATE
LEAD ASSI G NM ENTS 1 - GATE
2 -COLLECTOR
2 - DRAIN
3 EMITTER
3 - SOURCE 4 - DRAIN
4 - COLLECTOR
0.55 (.022)
0.46 (.018)
TO-220AB Part Marking Information
EXAMPLE:
10 www.irf.com
T HI S IS AN IRF 1010
LOT CODE 1789 AS S E MBL ED ON WW 19, 1997 IN THE ASSEMBLY LINE "C"
INTE RNATIONAL
RECT IFIER
LOGO
AS S E MB L Y LOT CODE
PAR T NUMBER
DATE CODE YEAR 7 = 1997 WEEK 19 LINE C
Page 11
D2Pak Package Outline
IRGB/S/SL4B60K
D2Pak Part Marking Information
THIS IS AN IRF530S WITH
LOT CODE 8024 AS S E MBLE D ON WW 02, 2000 IN T HE AS SEMBLY LINE "L"
INTE RNATIONAL
RECTIF IER
LOGO
ASSEMBLY LOT CODE
F530S
www.irf.com 11
PART NUMBER
DAT E CODE YEAR 0 = 2000 WEEK 02 LINE L
Page 12
IRGB/S/SL4B60K
TO-262 Package Outline
IGBT
1- GATE 2- COLLECTOR 3- EMITTER 4- COLLECTOR
TO-262 Part Marking Information
E
X
A
M
P
H
E
T
L
S
:
I
I
S
A
R
I
N
3
L
0
1
L
C
T
O
L
D
O
A
S
S
E
M
B
N
I
T
E
H
A
12 www.irf.com
3
7
1
E
9
8
E
L
D
O
N
W
W
1
,
9
9
1
S
S
E
M
B
N
Y
L
I
L
E
"
C
"
I
T
N
E
R
A
N
T
I
N
O
L
7
9
R
E
A
I
E
I
T
C
F
R
O
G
O
L
A
S
S
E
Y
M
B
L
O
L
E
D
O
C
T
P
A
R
T
B
N
E
M
U
R
A
D
T
E
E
D
O
C
E
Y
A
R
7
=
1
9
9
E
W
E
I
L
E
N
7
9
1
K
C
Page 13
IRGB/S/SL4B60K
D2Pak Tape & Reel Information
TRR
4.10 (.161)
3.90 (.153)
FEED DIRECTION
TRL
FEED DIRECTION
NOTES :
1. COMFORMS TO EIA-418.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION MEASURED @ HUB.
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.
330.00
(14.173) MAX.
1.85 (.073)
1.65 (.065)
10.90 (.429)
10.70 (.421)
13.50 (.532)
12.80 (.504)
1.60 (.063)
1.50 (.059)
11.60 (.457)
11.40 (.449)
16.10 (.634)
15.90 (.626)
1.60 (.063)
1.50 (.059)
1.75 (.069)
1.25 (.049)
15.42 (.609)
15.22 (.601)
27.40 (1.079)
23.90 (.941)
4
26.40 (1.039)
24.40 (.961)
3
0.368 (.0145)
0.342 (.0135)
24.30 (.957)
23.90 (.941)
4.72 (.136)
4.52 (.178)
60.00 (2.362) MIN.
30.40 (1.197) MAX.
4
Notes:
VCC = 80% (V
), VGE = 15V, L = 100µH, RG = 50Ω.
CES
When mounted on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and soldering techniques
refer to application note #AN-994.
Energy losses include "tail" and diode reverse recovery, using Diode FD059H06A5.
TO-220AB package is not recommended for Surface Mount Application.
Data and specifications subject to change without notice.
This product has been designed and qualified for Industrial
market.
Qualification Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information. 3/03
www.irf.com 13
Loading...