Datasheet irff9024 Datasheet

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REPETITIVE A VALANCHE AND dv/dt RA TED
HEXFETTRANSISTORS THRU-HOLE (TO-205AF)
60V, P-CHANNEL
Product Summary
Part Number BVDSS RDS(on) ID
IRFF9024 -60V 0.28Ω -6.4A
The HEXFETtechnology is the key to International Rectifier’s adv anced line of power MOSFET transistors.
The efficient geometry and unique processing of this latest “State of the Art” design achieves: very low on-state resis­tance combined with high transconductance.
The HEXFET transistors also feature all of the well established advantages of MOSFETs such as volt­age control, very fast switching, ease of parelleling and temperature stability of the electrical parameters.
They are well suited for applications such as switch­ing power supplies, motor controls, inverters, chop­pers, audio amplifiers and high energy pulse circuits.
Features:
n Repetitive Avalanche Ratings n Dynamic dv/dt Rating n Hermetically Sealed n Simple Drive Requirements n Ease of Paralleling
TO-39
PD -90413
IRFF9024
Absolute Maximum Ratings
Parameter Units
ID @ VGS = -10V, TC = 25°C Continuous Drain Current -6.4
ID @ VGS = -10V, TC = 100°C Continuous Drain Current -4.1
I
DM
PD @ TC = 25°C Max. Power Dissipation 20 W
V
GS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt ➂ -4.5
T
J
T
STG
For footnotes refer to the last page
Pulsed Drain Current ➀ -26
Linear Derating Factor 0.16 W/°C Gate-to-Source Voltage ±20 V Single Pulse Avalanche Energy ➁ 120 mJ Avalanche Current ➀ —A Repetitive Av alanche Energy ➀ —mJ
Operating Junction -55 to 150 Storage T emperature Range Lead Temperature 300 (0.063 in. (1.6mm) from case for 10s) Weight 0.98(typical) g
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A
V/ns
o
C
01/23/01
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IRFF9024
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter Min Typ Max Units Test Conditions
BV ∆BV
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS I
GSS Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
S + LD
iss
oss
rss
DSS
DSS
Drain-to-Source Breakdown V oltage -60 — — V VGS = 0V, ID = -1.0mA
/∆TJTemperature Coefficient of Breakdown — -0.068 — V/°C Reference to 25°C, ID = -1.0mA
Voltage Static Drain-to-Source On-State — — 0.28 VGS = -10V, ID = -4.1A ➃ Resistance — — 0.29 VGS =-10V, ID = -6.4A ➃ Gate Threshold V oltage -2.0 — -4.0 V VDS = VGS, ID = -250µA Forward Transconductance 1.3 — — S ( ) VDS > -15V, IDS = -4.1A ➃ Zero Gate V oltage Drain Current — — -25 VDS= -48V , VGS=0V
— — -250 µA VDS = -48V
Gate-to-Source Leakage Forward — — -100 VGS = -20V Gate-to-Source Leakage Reverse — — 100 nA VGS = 20V T otal Gate Charge 8.4 — 19 VGS =-10V, ID = -6.4A Gate-to-Source Charge 2.0 — 5.4 nC VDS= -30V Gate-to-Drain (‘Miller’) Charge 6.0 — 11 Turn-On Delay Time — — 20 VDD = -30V, ID = -6.4A, Rise Time — — 100 RG =7.5Ω Turn-Off Delay Time — — 23 Fall Time — — 44 Total Inductance — 7.0 —
Input Capacitance — 570 VGS = 0V , VDS = -25V Output Capacitance — 360 — pF f = 1.0MHz Reverse Transfer Capacitance — 65 —
Ω
Ω
ns
nH
VGS = 0V , TJ = 125°C
Measured from drain lead (6mm/0.25in. from package) to source lead (6mm/0.25in. from package)
Source-Drain Diode Ratings and Characteristics
Parameter Min Typ Max Units Test Conditions
I
Continuous Source Current (Body Diode) — — -6.4
S
I
Pulse Source Current (Body Diode) ➀ — — -26
SM
V
Diode Forward V oltage — — -6.3 V Tj = 25°C, IS =-6.4A, VGS = 0V ➃
SD
t
Reverse Recovery Time — — 200 n S Tj = 25°C, IF = -6.4A, di/dt ≤ -100A/µs
rr
Q
Reverse Recovery Charge — — 2.2 µC VDD ≤ -50V ➃
RR
t
Forward Turn-On Time Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L
on
A
S
Thermal Resistance
Parameter Min Typ Max Units Test Conditions
thJC
thJA
Note: Corresponding Spice and Saber models are available on the G&S Website.
For footnotes refer to the last page
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Junction-to-Case — — 6.25 Junction-to-Ambient — — 175 Typical socket mount
°C/W
+ LD.
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IRFF9024
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
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IRFF9024
13 a& b
13 a& b
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 7. Typical Source-Drain Diode
Forward Voltage
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 8. Maximum Safe Operating Area
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IRFF9024
V
DS
V
GS
G
-10V
Pulse Width ≤ 1 µs Duty Factor ≤ 0.1 %
Fig 10a. Switching Time Test Circuit
D
D.U.T.
-
+
V
DD
Fig 9. Maximum Drain Current Vs.
Case Temperature
V
GS
10%
90% V
DS
t
d(on)tr
t
d(off)tf
Fig 10b. Switching Time Waveforms
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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IRFF9024
(BR)
L
D.U.T
I
AS
0.01
p
DRIVER
Ω
15V
R
G
-20V
-10V
V
DS
t
Fig 12a. Unclamped Inductive Test Circuit
I
AS
t
p
V
DSS
V
DD
A
Fig 12c. Maximum Avalanche Energy
Vs. Drain Current
Fig 12b. Unclamped Inductive Waveforms
Current Regulator
Same Type as D.U.T.
Q
G
-10V
Q
GS
V
G
Q
GD
Charge
Fig 13a. Basic Gate Charge Waveform
-12V
12V
V
GS
Fig 13b. Gate Charge Test Circuit
50KΩ
.2µF
.3µF
-3mA
Current Sampling Resistors
­V
DS
+
D.U.T.
I
G
I
D
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Foot Notes:
➀ Repetitive Rating; Pulse width limited by
maximum junction temperature.
➁ V
= -25V, starting TJ = 25°C,
DD
Peak IL = -6.4A,
➂ I
➃ Pulse width ≤ 300 µs; Duty Cycle ≤ 2%
Case Outline and Dimensions —TO-205AF
≤ -6.4A, di/dt ≤ -200A/µs,
SD
VDD≤ -60V , TJ ≤ 150°C Suggested RG = 7.5 Ω
IRFF9024
LEGEND 1- SOURCE 2- GATE 3- DRAIN
IR EUROPEAN REGIONAL CENTRE: 439/445 Godstone Rd, Whyteleafe, Surrey CR3 OBL, UK Tel: ++ 44 (0)20 8645 8000
IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 (0)838 4630
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 (0) 6172 96590
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 011 451 0111
IR JAPAN: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo 171 Tel: 81 (0)3 3983 0086
IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673 Tel: 886-(0)2 2377 9936
Data and specifications subject to change without notice. 1/01
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