Datasheet IRF7702 Datasheet (International Rectifier)

Page 1
PD - 93849C
PROVISIONAL
IRF7702
HEXFET® Power MOSFET
l Ultra Low On-Resistance l -1.8V Rated l P-Channel MOSFET l Very Small SOIC Package l Low Profile ( < 1.1mm) l Available in Tape & Reel
Description
HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve ex­tremely low on-resistance per silicon area. This benefit, combined with the ruggedized device design, that Inter­national Rectifier is well known for,
provides thedesigner with an extremely efficient and reliable device for battery and load management.
The TSSOP-8 package has 45% less footprint area than the standard SO-8. This makes the TSSOP-8 an ideal device for applications where printed circuit board space is at a premium. The low profile (<1.1mm) allows it to fit easily into extremely thin environments such as portable electronics and PCMCIA cards.
Absolute Maximum Ratings
Parameter Max. Units
V
DS
ID @ TC = 25°C Continuous Drain Current, VGS @ -4.5V ±8.0 ID @ TC = 70°C Continuous Drain Current, VGS @ -4.5V ±7.0 A I
DM
PD @TC = 25°C Power Dissipation 1.5 PD @TC = 70°C Power Dissipation 0.96
V
GS
T
J, TSTG
Drain- Source Voltage -12 V
Pulsed Drain Current ±70
Linear Derating Factor 0.01 W/°C Gate-to-Source Voltage ± 8.0 V Junction and Storage Temperature Range -55 to + 150 °C
V
DSS
R
DS(on)
max I
0.014@VGS = -4.5V -8.0A
-12V 0.019@VGS = -2.5V -7.0A
0.027@VGS = -1.8V -5.8A
1 2 3 4
1 = D 2 = S 3 = S 4 = G
G
8
D
7 6
S
5
8 = D 7 = S 6 = S 5 = D
TSSOP-8
D
W
Thermal Resistance
Parameter Max. Units
R
θJA
Maximum Junction-to-Ambient 83 °C/W
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6/19/00
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IRF7702
PROVISIONAL
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
∆V
(BR)DSS
R
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
Drain-to-Source Breakdown Voltage -12 ––– ––– V VGS = 0V, ID = -250µA
/∆T
Breakdown Voltage Temp. Coefficient ––– -0.007 ––– V/°C Reference to 25°C, ID = -1mA
J
––– ––– 0.014 VGS = -4.5V, ID = -8.0A
Static Drain-to-Source On-Resistance – – – ––– 0.019 VGS = -2.5V, ID = -7.0A
Ω
––– ––– 0.027 VGS = -1.8V, ID = -5.8A Gate Threshold Voltage -0.45 ––– -1.2 V VDS = VGS, ID = -250µA Forward Transconductance 26 ––– ––– S VDS = -10V, ID = -8.0A
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage ––– ––– -100 VGS = -8.0V Gate-to-Source Reverse Leakage ––– – –– 100 VGS = 8.0V
––– ––– 1.0 VDS = -12V, VGS = 0V
––– ––– -25 VDS = -9.6V, VGS = 0V, TJ = 70°C
µA
nA
Total Gate Charge ––– 54 81 ID = -8.0A Gate-to-Source Charge ––– 7.8 12 nC VDS = -9.6V Gate-to-Drain ("Miller") Charge ––– 15 23 VGS = -4.5V Turn-On Delay Time ––– 16 ––– VDD = -6.0V Rise Time ––– 21 ––– ID = -1.0A
ns
Turn-Off Delay Time ––– 320 –– – RD = 6.0Ω Fall Time ––– 250 ––– RG = 6.0Ω Input Capacitance ––– 3470 ––– VGS = 0V Output Capacitance –– – 1040 ––– pF VDS = -10V Reverse Transfer Capacitance ––– 670 ––– ƒ = 1.0MHz
Source-Drain Ratings and Characteristics
Parameter Min. Typ. Max. Units Conditions
I
S
I
SM
V
SD
t
rr
Q
rr
Continuous Source Current MOSFET symbol (Body Diode) showing the Pulsed Source Current integral reverse (Body Diode) p-n junction diode.
–––
–––
-1.5
––– ––– -70
A
G
Diode Forward Voltage ––– ––– -1.2 V TJ = 25°C, IS = -1.5A, VGS = 0V Reverse Recovery Time ––– 58 87 n s TJ = 25°C, IF = -1.5A Reverse RecoveryCharge ––– 41 62 nC di/dt = 100A/µs
Notes:
Repetitive rating; pulse width limited by
When mounted on 1 inch square copper board, t<10 sec
max. junction temperature.
Pulse width ≤ 300µs; duty cycle ≤ 2%.
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D
S
Page 3
PROVISIONAL
IRF7702
1000
100
10
TOP
BOTTOM
VGS
-7.50V
-5.00V
-4.00V
-3.50V
-3.00V
-2.50V
-2.00V
-1.50V
-1.50V
D
-I , Drain-to-Source Current (A)
20µs PULSE WIDTH
°
T = 25 C
1
0.1 1 10 100
-V , Drain-to-Source Voltage (V)
DS
J
Fig 1. Typical Output Characteristics
1000
1000
100
10
D
-I , Drain-to-Source Current (A)
TOP
BOTTOM
VGS
-7.50V
-5.00V
-4.00V
-3.50V
-3.00V
-2.50V
-2.00V
-1.50V
-1.50V
20µs PULSE WIDTH T = 150 C
1
0.1 1 10 100
-V , Drain-to-Source Voltage (V)
DS
J
Fig 2. Typical Output Characteristics
100.00 TJ = 25°C
°
TJ = 150°C
100
°
T = 150 C
J
10.00
, Reverse Drain Current (A)
D
-I , Drain-to-Source Current (A)
10
1.5 2.0 2.5 3.0 3.5
-V , Gate-to-Source Voltage (V)
GS
°
T = 25 C
J
V = -15V
DS
20µs PULSE WIDTH
Fig 3. Typical Transfer Characteristics
SD
-I
V
= 0V
GS
1.00
0.0 1.0 2.0 3.0 4.0 5.0 6.0
-VSD, Source-toDrain Voltage (V)
Fig 4. Typical Source-Drain Diode
Forward Voltage
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Page 4
IRF7702
PROVISIONAL
5000
4000
3000
2000
V
=
0V,
GS
C
=
issgsgd , ds
C
=
rssgd
C
=
oss dsgd
f = 1MHz
C
+ C C C
+ C
C
iss
C SHORTED
C, Capacitance (pF)
1000
0
1 10 100
-V , Drain-to-Source Voltage (V)
DS
C
oss
C
rss
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
0.80
10
I =
-8.0A
D
V =-9.6V
DS
8
6
4
2
GS
-V , Gate-to-Source Voltage (V)
0
0 20 40 60 80
Q , Total Gate Charge (nC)
G
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
1000
OPERATION IN THIS AREA LIMITED
BY R
DS(on)
ID = -250µA
0.60
, Variace ( V )
0.40
GS(th)
-V
0.20
-75 -50 -25 0 25 50 75 100 125 150
TJ , Temperature ( °C )
Fig 7. Threshold Voltage Vs. Temperature
100
100us
10
D
-I , Drain Current (A)I , Drain Current (A)
°
= 25 C
A
T T= 150 C Single Pulse
1
0.1 1 10 100
°
J
-V , Drain-to-Source Voltage (V)
DS
1ms
10ms
Fig 8. Maximum Safe Operating Area
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Page 5
PROVISIONAL
IRF7702
8.0
6.0
4.0
D
-I , Drain Current (A)
2.0
0.0 25 50 75 100 125 150
T , Case Temperature ( C)
C
Fig 9. Maximum Drain Current Vs.
Case Temperature
100
40
30
20
Power (W)
10
0
°
0.01 0.10 1.00 10.00 100.00
Time (sec)
Fig 10. Typical Power Vs. Time
D = 0.50
thJA
Thermal Response (Z )
0.20
10
0.10
0.05
0.02
0.01
1
SINGLE PULSE
(THERMAL RESPONSE)
0.1
0.00001 0.0001 0.001 0.01 0.1 1 10 100
t , Rectangular Pulse Duration (sec)
1
Notes:
1. Duty factor D = t / t
2. Peak T =P x Z + T
J DM thJA A
1 2
P
DM
t
1
t
2
Fig 11. Typical Effective Transient Thermal Impedance, Junction-to-Ambient
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Page 6
IRF7702
PROVISIONAL
2.0
1.5
1.0
I =
D
-8.0A
(Normalized)
0.5
DS(on)
R , Drain-to-Source On Resistance
0.0
-60 -40 -20 0 20 40 60 80 100 120 140 160
T , Junction Temperature( C)
J
Fig 12. Normalized On-Resistance
Vs. Temperature
)
0.020
Ω
V =
GS
°
-4.5V
)
0.20
Ω
0.16
0.12
V
= -2.5V
0.08
, Drain-to-Source On Resistance (
0.04
DS (on)
R
0.00 0 20406080100
GS
V
= -4.5V
GS
-ID , Drain Current (A)
Fig 13. Typical On-Resistance Vs. Drain
Current
ID = -8.0A
0.015
, Drain-to -Source On Resistance (
DS(on)
0.010
R
1.5 2.5 3.5
-V
Gate -to -Source Voltage (V)
GS,
Fig 14. Typical On-Resistance Vs. Gate
Voltage
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Page 7
PROVISIONAL
EXAMPLE: TH IS IS AN IRF7702
TSSOP-8 Part Marking Information
IRF7702
LOT CODE (XX)
PART NUMBER
DATE CODE EXAMPLES:
9503 = 5C 9532 = EF
XXYW
7702
DATE CODE (YW)
TABLE 1
W ORK WEEK 1-26, NUMERIC YEAR CODE (1,2, ....ETC.)
WORK
YWEEK
YEAR
1
2001 2002 2003 1994 1995 1996 1997 1998 1999 2000
WORK WEEK 27-52, ALPHANUMERIC YEAR CODE (A,B, ...ETC.)
YEAR 2001
2002 2003 1994 1995 1996 1997 1998 1999 2000 K
01
2
02 3C03 404 5 6 7 8 9
24
0
25
TABLE 2
WORK
Y
WEEK26W
AA27 B
28 C
29 D
30 E F G H J
50
51
52
W A
B
D
X Y Z
B C D
X Y Z
TSSOP-8 Tape and Reel
8LT SSOP (MO-153AA)
16 mm
8 mm
FEED D I R ECTIO N
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Ø 13"
16mm
NOTE S :
1. TAPE & REEL OUT LINE CONFORMS TO EIA-481 & EIA-541.
Page 8
IRF7702
TSSOP-8 Package Outline
PROVISIONAL
IR EUROPEAN REGIONAL CENTRE: 439/445 Godstone Rd, Whyteleafe, Surrey CR3 OBL, UK Tel: ++ 44 (0)20 8645 8000
IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 (0)838 4630
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 (0) 6172 96590
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 011 451 0111
IR JAPAN: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo 171 Tel: 81 (0)3 3983 0086
IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673 Tel: 886-(0)2 2377 9936
Data and specifications subject to change without notice. 6/00
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