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PD - 93849C
PROVISIONAL
IRF7702
HEXFET® Power MOSFET
l Ultra Low On-Resistance
l -1.8V Rated
l P-Channel MOSFET
l Very Small SOIC Package
l Low Profile ( < 1.1mm)
l Available in Tape & Reel
Description
HEXFET® Power MOSFETs from International Rectifier
utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit,
combined with the ruggedized device design, that International Rectifier is well known for,
provides thedesigner
with an extremely efficient and reliable device for
battery and load management.
The TSSOP-8 package has 45% less footprint area than
the standard SO-8. This makes the TSSOP-8 an ideal
device for applications where printed circuit board space
is at a premium. The low profile (<1.1mm) allows it to fit
easily into extremely thin environments such as portable
electronics and PCMCIA cards.
Absolute Maximum Ratings
Parameter Max. Units
V
DS
ID @ TC = 25°C Continuous Drain Current, VGS @ -4.5V ±8.0
ID @ TC = 70°C Continuous Drain Current, VGS @ -4.5V ±7.0 A
I
DM
PD @TC = 25°C Power Dissipation 1.5
PD @TC = 70°C Power Dissipation 0.96
V
GS
T
J, TSTG
Drain- Source Voltage -12 V
Pulsed Drain Current ±70
Linear Derating Factor 0.01 W/°C
Gate-to-Source Voltage ± 8.0 V
Junction and Storage Temperature Range -55 to + 150 °C
V
DSS
R
DS(on)
max I
0.014@VGS = -4.5V -8.0A
-12V 0.019@VGS = -2.5V -7.0A
0.027@VGS = -1.8V -5.8A
1
2
3
4
1 = D
2 = S
3 = S
4 = G
G
8
D
7
6
S
5
8 = D
7 = S
6 = S
5 = D
TSSOP-8
D
W
Thermal Resistance
Parameter Max. Units
R
θ JA
Maximum Junction-to-Ambient 83 °C/W
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6/19/00
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IRF7702
PROVISIONAL
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
∆ V
(BR)DSS
R
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
Drain-to-Source Breakdown Voltage -12 ––– ––– V VGS = 0V, ID = -250µA
/∆ T
Breakdown Voltage Temp. Coefficient ––– -0.007 ––– V/°C Reference to 25°C, ID = -1mA
J
––– ––– 0.014 VGS = -4.5V, ID = -8.0A
Static Drain-to-Source On-Resistance – – – ––– 0.019 VGS = -2.5V, ID = -7.0A
Ω
––– ––– 0.027 VGS = -1.8V, ID = -5.8A
Gate Threshold Voltage -0.45 ––– -1.2 V VDS = VGS, ID = -250µA
Forward Transconductance 26 ––– ––– S VDS = -10V, ID = -8.0A
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage ––– ––– -100 VGS = -8.0V
Gate-to-Source Reverse Leakage ––– – –– 100 VGS = 8.0V
––– ––– 1.0 VDS = -12V, VGS = 0V
––– ––– -25 VDS = -9.6V, VGS = 0V, TJ = 70°C
µA
nA
Total Gate Charge ––– 54 81 ID = -8.0A
Gate-to-Source Charge ––– 7.8 12 nC VDS = -9.6V
Gate-to-Drain ("Miller") Charge ––– 15 23 VGS = -4.5V
Turn-On Delay Time ––– 16 ––– VDD = -6.0V
Rise Time ––– 21 ––– ID = -1.0A
ns
Turn-Off Delay Time ––– 320 –– – RD = 6.0Ω
Fall Time ––– 250 ––– RG = 6.0Ω
Input Capacitance ––– 3470 ––– VGS = 0V
Output Capacitance –– – 1040 ––– pF VDS = -10V
Reverse Transfer Capacitance ––– 670 ––– ƒ = 1.0MHz
Source-Drain Ratings and Characteristics
Parameter Min. Typ. Max. Units Conditions
I
S
I
SM
V
SD
t
rr
Q
rr
Continuous Source Current MOSFET symbol
(Body Diode) showing the
Pulsed Source Current integral reverse
(Body Diode) p-n junction diode.
–––
–––
-1.5
––– ––– -70
A
G
Diode Forward Voltage ––– ––– -1.2 V TJ = 25°C, IS = -1.5A, VGS = 0V
Reverse Recovery Time ––– 58 87 n s TJ = 25°C, IF = -1.5A
Reverse RecoveryCharge ––– 41 62 nC di/dt = 100A/µs
Notes:
Repetitive rating; pulse width limited by
When mounted on 1 inch square copper board, t<10 sec
max. junction temperature.
Pulse width ≤ 300µs; duty cycle ≤ 2%.
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D
S
Page 3
PROVISIONAL
IRF7702
1000
100
10
TOP
BOTTOM
VGS
-7.50V
-5.00V
-4.00V
-3.50V
-3.00V
-2.50V
-2.00V
-1.50V
-1.50V
D
-I , Drain-to-Source Current (A)
20µs PULSE WIDTH
°
T = 25 C
1
0.1 1 10 100
-V , Drain-to-Source Voltage (V)
DS
J
Fig 1. Typical Output Characteristics
1000
1000
100
10
D
-I , Drain-to-Source Current (A)
TOP
BOTTOM
VGS
-7.50V
-5.00V
-4.00V
-3.50V
-3.00V
-2.50V
-2.00V
-1.50V
-1.50V
20µs PULSE WIDTH
T = 150 C
1
0.1 1 10 100
-V , Drain-to-Source Voltage (V)
DS
J
Fig 2. Typical Output Characteristics
100.00
TJ = 25°C
°
TJ = 150°C
100
°
T = 150 C
J
10.00
, Reverse Drain Current (A)
D
-I , Drain-to-Source Current (A)
10
1.5 2.0 2.5 3.0 3.5
-V , Gate-to-Source Voltage (V)
GS
°
T = 25 C
J
V = -15V
DS
20µs PULSE WIDTH
Fig 3. Typical Transfer Characteristics
SD
-I
V
= 0V
GS
1.00
0.0 1.0 2.0 3.0 4.0 5.0 6.0
-VSD, Source-toDrain Voltage (V)
Fig 4. Typical Source-Drain Diode
Forward Voltage
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IRF7702
PROVISIONAL
5000
4000
3000
2000
V
=
0V,
GS
C
=
issgsgd , ds
C
=
rssgd
C
=
oss dsgd
f = 1MHz
C
+ C
C
C
+ C
C
iss
C SHORTED
C, Capacitance (pF)
1000
0
1 10 100
-V , Drain-to-Source Voltage (V)
DS
C
oss
C
rss
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
0.80
10
I =
-8.0A
D
V =-9.6V
DS
8
6
4
2
GS
-V , Gate-to-Source Voltage (V)
0
0 20 40 60 80
Q , Total Gate Charge (nC)
G
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
1000
OPERATION IN THIS AREA LIMITED
BY R
DS(on)
ID = -250µA
0.60
, Variace ( V )
0.40
GS(th)
-V
0.20
-75 -50 -25 0 25 50 75 100 125 150
TJ , Temperature ( °C )
Fig 7. Threshold Voltage Vs. Temperature
100
100us
10
D
-I , Drain Current (A) I , Drain Current (A)
°
= 25 C
A
T T= 150 C
Single Pulse
1
0.1 1 10 100
°
J
-V , Drain-to-Source Voltage (V)
DS
1ms
10ms
Fig 8. Maximum Safe Operating Area
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Page 5
PROVISIONAL
IRF7702
8.0
6.0
4.0
D
-I , Drain Current (A)
2.0
0.0
25 50 75 100 125 150
T , Case Temperature ( C)
C
Fig 9. Maximum Drain Current Vs.
Case Temperature
100
40
30
20
Power (W)
10
0
°
0.01 0.10 1.00 10.00 100.00
Time (sec)
Fig 10. Typical Power Vs. Time
D = 0.50
thJA
Thermal Response (Z )
0.20
10
0.10
0.05
0.02
0.01
1
SINGLE PULSE
(THERMAL RESPONSE)
0.1
0.00001 0.0001 0.001 0.01 0.1 1 10 100
t , Rectangular Pulse Duration (sec)
1
Notes:
1. Duty factor D = t / t
2. Peak T =P x Z + T
J DM thJA A
1 2
P
DM
t
1
t
2
Fig 11. Typical Effective Transient Thermal Impedance, Junction-to-Ambient
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IRF7702
PROVISIONAL
2.0
1.5
1.0
I =
D
-8.0A
(Normalized)
0.5
DS(on)
R , Drain-to-Source On Resistance
0.0
-60 -40 -20 0 20 40 60 80 100 120 140 160
T , Junction Temperature( C)
J
Fig 12. Normalized On-Resistance
Vs. Temperature
)
0.020
Ω
V =
GS
°
-4.5V
)
0.20
Ω
0.16
0.12
V
= -2.5V
0.08
, Drain-to-Source On Resistance (
0.04
DS (on)
R
0.00
0 2 04 06 08 01 0 0
GS
V
= -4.5V
GS
-ID , Drain Current (A)
Fig 13. Typical On-Resistance Vs. Drain
Current
ID = -8.0A
0.015
, Drain-to -Source On Resistance (
DS(on)
0.010
R
1.5 2.5 3.5
-V
Gate -to -Source Voltage (V)
GS,
Fig 14. Typical On-Resistance Vs. Gate
Voltage
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Page 7
PROVISIONAL
EXAMPLE: TH IS IS AN IRF7702
TSSOP-8 Part Marking Information
IRF7702
LOT CODE (XX)
PART NUMBER
DATE CODE EXAMPLES:
9503 = 5C
9532 = EF
XXYW
7702
DATE CODE (YW)
TABLE 1
W ORK WEEK 1-26, NUMERIC YEAR CODE (1,2, ....ETC.)
WORK
YW E E K
YEAR
1
2001
2002
2003
1994
1995
1996
1997
1998
1999
2000
WORK WEEK 27-52, ALPHANUMERIC YEAR CODE (A,B, ...ETC.)
YEAR
2001
2002
2003
1994
1995
1996
1997
1998
1999
2000 K
01
2
02
3C 03
40 4
5
6
7
8
9
24
0
25
TABLE 2
WORK
Y
WEEK26W
AA 27
B
28
C
29
D
30
E
F
G
H
J
50
51
52
W
A
B
D
X
Y
Z
B
C
D
X
Y
Z
TSSOP-8 Tape and Reel
8LT SSOP (MO-153AA)
16 mm
8 mm
FEED D I R ECTIO N
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Ø 13"
16mm
NOTE S :
1. TAPE & REEL OUT LINE CONFORMS TO EIA-481 & EIA-541.
Page 8
IRF7702
TSSOP-8 Package Outline
PROVISIONAL
IR EUROPEAN REGIONAL CENTRE: 439/445 Godstone Rd, Whyteleafe, Surrey CR3 OBL, UK Tel: ++ 44 (0)20 8645 8000
IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 (0)838 4630
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 (0) 6172 96590
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 011 451 0111
IR JAPAN: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo 171 Tel: 81 (0)3 3983 0086
IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673 Tel: 886-(0)2 2377 9936
Data and specifications subject to change without notice. 6/00
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