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PD - 94286A
HEXFET
®
POWER MOSFET
THRU-HOLE (TO-254AA)
Product Summary
Part Number BV
DSS
IRF5M3415 150V 0.049Ω 35A
Fifth Generation HEXFET® power MOSFETs from
International Rectifier utilize advanced processing
techniques to achieve the lowest possible on-resistance
per silicon unit area. This benefit, combined with the
fast switching speed and ruggedized device design
that HEXFET power MOSFETs are well known for,
provides the designer with an extremely efficient device
for use in a wide variety of applications.
These devices are well-suited for applications such
as switching power supplies, motor controls, inverters, choppers, audio amplifiers and high-energy pulse
circuits.
RDS(on) ID
IRF5M3415
150V, N-CHANNEL
TO-254AA
Features:
n Low RDS(on)
n Avalanche Energy Ratings
n Dynamic dv/dt Rating
n Simple Drive Requirements
n Ease of Paralleling
n Hermetically Sealed
n Light Weight
Absolute Maximum Ratings
Parameter Units
ID @ VGS = 10V, TC = 25°C Continuous Drain Current 35
ID @ VGS = 10V, TC = 100°C Continuous Drain Current 22
I
DM
PD @ TC = 25°C Max. Power Dissipation 125 W
V
GS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt ➂ 2.0
T
J
T
STG
For footnotes refer to the last page
Pulsed Drain Current ➀ 140
Linear Derating Factor 1.0 W/°C
Gate-to-Source Voltage ±20 V
Single Pulse Avalanche Energy ➁ 290 mJ
Avalanche Current ➀ 22 A
Repetitive Avalanche Energy ➀ 12.5 mJ
Operating Junction -55 to 150
Storage Temperature Range
Lead Temperature 300 (0.063in./1.6mm from case for 10s)
Weight 9.3 (Typical) g
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A
V/ns
o
C
10/01/01
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IRF5M3415
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter Min Typ Max Units Test Conditions
BV
∆BV
R
V
g
I
DSS
I
GSS
I
GSS
Q
Q
Q
t
d(on)
t
r
t
d(off)
t
f
LS + L
lC
C
C
DSS
DSS
DS(on)
GS(th)
fs
g
gs
gd
D
iss
oss
rss
Drain-to-Source Breakdown Voltage 150 — — V VGS = 0V, ID = 250µA
/∆TJTemperature Coefficient of Breakdown — 0.18 — V/°C Reference to 25°C, ID = 1.0mA
Voltage
Static Drain-to-Source On-State — — 0.049 Ω VGS = 10V, ID = 22A
Resistance
Gate Threshold Voltage 2.0 — 4.0 V VDS = VGS, ID = 250µA
Forward Transconductance 19 — — S ( )VDS =15V, IDS = 22A ➃
Zero Gate Voltage Drain Current — — 25 V
— — 250 VDS = 120V,
Gate-to-Source Leakage Forward — — 100 VGS =-20V
Gate-to-Source Leakage Reverse — — -100 VGS = -20V
Total Gate Charge — — 200 VGS =10V, ID = 22A
Gate-to-Source Charge — — 17 nC VDS = 120V
Gate-to-Drain (‘Miller’) Charge — — 98
Turn-On Delay Time — — 25 VDD = 75V, ID = 22A,
Rise Time — — 80 VGS = 10V, RG = 2.5Ω
Turn-Off Delay Time — — 75
Fall Time — — 70
Total Inductance — 6.8 —
Input Capacitance — 2730 — VGS = 0V, VDS = 25V
Output Capacitance — 570 — pF f = 1.0MHz
Reverse Transfer Capacitance — 285 —
lead (6mm/0.25in. from pacakge
Ω
µA
nA
ns
Measured from drain lead (6mm /
nH
0.25in. from package ) to source
= 150V ,VGS=0V
DS
VGS = 0V, TJ =125°C
➃
Source-Drain Diode Ratings and Characteristics
Parameter Min Typ Max Units T est Conditions
I
Continuous Source Current (Body Diode) — — 35
Q
S
I
Pulse Source Current (Body Diode) ➀ — — 140
SM
V
Diode Forward Voltage — — 1.3 V Tj = 25°C, IS = 22A, VGS = 0V ➃
SD
t
Reverse Recovery Time — — 390 n s Tj = 25°C, IF = 22A, di/dt ≤ 100A/µs
rr
Reverse Recovery Charge — — 3.3 µCV
RR
t
Forward Turn-On Time Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L
on
A
≤ 25V ➃
DD
Thermal Resistance
Parameter Min Typ Max Units Test Conditions
R
thJC
Note: Corresponding Spice and Saber models are available on the G&S Website.
For footnotes refer to the last page
2 www.irf.com
Junction-to-Case — — 1.0 °C/W
+ LD.
S
Page 3
IRF5M3415
1000
100
10
D
I , Drain-to-Source Current (A)
1
0.1 1 10 100
VGS
TOP
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM
4.5V
4.5V
20µs PULSE WIDTH
T = 25 C
J
V , Drain-to-Source Voltage (V)
DS
°
Fig 1. Typical Output Characteristics
1000
1000
100
10
D
I , Drain-to-Source Current (A)
1
0.1 1 10 100
VGS
TOP
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM
4.5V
4.5V
20µs PULSE WIDTH
T = 150 C
J
V , Drain-to-Source Voltage (V)
DS
°
Fig 2. Typical Output Characteristics
2.5
35A
I =
D
2.0
°
T = 25 C
J
100
T = 150 C
J
D
I , Drain-to-Source Current (A)
V = 50V
DS
15
10
4.0 5.0 6.0 7.0 8.0 9.0
V , Gate-to-Source Voltage (V)
GS
20µs PULSE WIDTH
Fig 3. Typical Transfer Characteristics
°
1.5
1.0
(Normalized)
0.5
DS(on)
R , Drain-to-Source On Resistance
0.0
-60 -40 -20 0 20 40 60 80 100 120 140 160
T , Junction Temperature( C)
J
Fig 4. Normalized On-Resistance
V =
10V
GS
°
Vs. Temperature
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IRF5M3415
6000
5000
4000
3000
2000
C, Capacitance (pF)
1000
0
1 10 100
V
=
0V,
C
C
C
iss
oss
rss
f = 1MHz
+ C
+ C
C SHORTED
GS
C
=
iss gs gd , ds
C
=
rss gd
C
=
oss ds gd
C
C
C
V , Drain-to-Source Voltage (V)
DS
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
1000
100
°
T = 150 C
J
20
I =
22A
D
V = 120V
DS
V = 75V
16
12
8
4
GS
V , Gate-to-Source Voltage (V)
0
0 40 80 120 160 200 240
Q , Total Gate Charge (nC)
G
DS
V = 30V
DS
FOR TEST CIRCUIT
SEE FIGURE
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
1000
OPERATION IN THIS AREA
LIMITED BY RDS(on)
100
13
10
100µs
°
T = 25 C
J
1
SD
I , Reverse Drain Current (A)
V = 0 V
0.1
0.2 0.6 1.0 1.4 1.8 2.2 2.6
V ,Source-to-Drain Voltage (V)
SD
GS
Fig 7. Typical Source-Drain Diode
10
, Drain-to-Source Current (A)
D
Tc = 25°C
I
Tj = 150°C
Single Pulse
1
1 10 100 1000
V
, Drain-toSource Voltage (V)
DS
Fig 8. Maximum Safe Operating Area
1ms
10ms
Forward Voltage
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Page 5
35
30
25
20
15
D
10
I , Drain Current (A)
IRF5M3415
R
V
DS
V
GS
R
G
V
GS
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
Fig 10a. Switching Time Test Circuit
D
D.U.T.
+
V
DD
-
5
0
25 50 75 100 125 150
T , Case Temperature ( C)
C
°
Fig 9. Maximum Drain Current Vs.
Case Temperature
V
DS
90%
10%
V
GS
t
d(on)tr
t
d(off)tf
Fig 10b. Switching Time Waveforms
10
thJC
1
D = 0.50
0.20
0.10
0.1
0.05
Thermal Response (Z )
0.02
0.01
0.01
0.00001 0.0001 0.001 0.01 0.1 1
SINGLE PULSE
(THERMAL RESPONSE)
Notes:
1. Duty factor D = t / t
2. Peak T =P x Z + T
t , Rectangular Pulse Duration (sec)
1
J DM thJC C
P
DM
t
1
1 2
t
2
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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IRF5M3415
A
15V
DRIVER
+
-
V
DD
R
20V
V
DS
G
V
GS
t
L
.
D.U.T
I
AS
0.01
p
Ω
Fig 12a. Unclamped Inductive Test Circuit
V
(BR)DSS
t
p
I
AS
600
TOP
500
400
300
200
100
AS
E , Single Pulse Avalanche Energy (mJ)
0
25 50 75 100 125 150
Starting T , Junction Temperature( C)
J
BOTTOM
Fig 12c. Maximum Avalanche Energy
Vs. Drain Current
I
D
10A
14A
22A
°
Fig 12b. Unclamped Inductive Waveforms
Q
G
10V
Q
GS
V
G
Q
GD
Charge
Fig 13a. Basic Gate Charge Waveform
Current Regulator
Same Type as D.U.T.
50KΩ
12V
.2µF
V
GS
.3µF
D.U.T.
3mA
I
G
Current Sampling Resistors
I
D
Fig 13b. Gate Charge Test Circuit
+
V
DS
-
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Page 7
Footnotes:
L
T
E
Repetitive Rating; Pulse width limited by
maximum junction temperature.
V
= 25 V, Starting TJ = 25°C, L= 1.2 mH
DD
Peak IAS = 22A, V
= 10V, RG= 25Ω
GS
I
VDD ≤ 150V, TJ ≤ 150°C
Pulse width ≤ 300 µs; Duty Cycle ≤ 2%
Case Outline and Dimensions — T O-254AA
≤ 22A, di/dt ≤ 70 A/µs,
SD
IRF5M3415
0.12 [.005]
1.27 [.050]
1.02 [.040]
B
R 1.52 [.060]
4.06 [.160]
3.56 [.140]
3.78 ( .149 )
3.53 ( .139 )
-A-
31.40 ( 1.235 )
30.39 ( 1.199 )
17.40 ( .685 )
16.89 ( .665 )
3.81 ( .150 )
2X
1 2 3
13.84 ( .545 )
13.59 ( .535 )
20.32 ( .800 )
20.07 ( .790 )
-C-
1.14 ( .045 )
3X
0.89 ( .035 )
.50 ( .0 2 0 ) M C A M B
.25 ( .0 1 0 ) M C
IRHM57163SED
IRHM57163SEU
6.60 ( .260 )
6.32 ( .249 )
13.84 ( .545 )
13.59 ( .535 )
-B-
1.27 ( .050 )
1.02 ( .040 )
.12 ( .005 )
LEGE N D
1 - C O L
2 - E M I
3 - GA T
3.81 ( .150 )
22.73 [.895]
21.21 [.835]
3.78 [.149]
3.53 [.139]
17.40 [.685]
16.89 [.665]
4.82 [.190]
3.81 [.150]
3.81 [.150]
A
2X
123
LEGEND
1- DRAIN
2- SOURCE
3- GATE
13.84 [.545]
13.59 [.535]
20.32 [.800]
20.07 [.790]
1.14 [.045]
3X
0.89 [.035]
0.36 [.014]
BA
6.60 [.260]
6.32 [.249]
13.84 [.545]
13.59 [.535]
CAUTION
BERYLLIA WARNING PER MIL-PRF-19500
Packages containing beryllia shall not be ground, sandblasted, machined, or have other operations performed on them
which will produce beryllia or beryllium dust. Furthermore, beryllium oxide packages shall not be placed in acids
that will produce fumes containing beryllium.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.
Data and specifications subject to change without notice. 10/01
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