Datasheet IPD20N03L, IPU20N03L Datasheet (INFINEON)

Page 1
OptiMOSBuck converter series
IPD20N03L IPU20N03L
Feature
N-Channel
Logic Level
Low On-Resistance R
Excellent Gate Charge x R
Superior thermal resistance
DS(on)
product (FOM)
DS(on)
175°C operating temperature
Avalanche rated
dv/dt rated
Ideal for fast switching buck converters
Type Package Ordering Code
IPD20N03L P- TO252 -3-11 Q67042-S4050 IPU20N03L P- TO251 -3-1 Q67042-S4106
Product Summary
V
R
DS(on)
I
D
P- TO251 -3-1 P- TO252 -3-11
30 V 20 m 30 A
Marking
20N03L 20N03L
Maximum Ratings, at Tj = 25 °C, unless otherwise specified Parameter Symbol Value Unit
Continuous drain current
TC=25°C
1)
I
D
30
A
30
Pulsed drain current
TC=25°C
Avalanche energy, single pulse
ID=15A, VDD=25V, RGS=25
Repetitive avalanche energy, limited by T
2) E
jmax
Reverse diode dv/dt
IS=30A, VDS=24V, di/dt=200A/µs, T
jmax
=175°C
Gate source voltage V Power dissipation
TC=25°C
I
D puls
E
AS
AR
dv/dt 6 kV/µs
GS
P
tot
120
15 mJ
6
±20
60 W
V
Operating and storage temperature T
, T
j
stg
-55... +175
IEC climatic category; DIN IEC 68-1 55/175/56
Page 1
°C
2003-01-17
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IPD20N03L IPU20N03L
Thermal Characteristics Parameter Symbol Values Unit
min. typ. max.
Characteristics
Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded SMD version, device on PCB:
@ min. footprint @ 6 cm2 cooling area
3)
R R
R
thJC
thJA
thJA
- 1.7 2.5 K/W
- - 100
-
-
-
-
75 50
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
VGS=0V, ID=1mA
Gate threshold voltage, VGS = V
ID=25µA
Zero gate voltage drain current
VDS=30V, VGS=0V, Tj=25°C VDS=30V, VGS=0V, Tj=125°C
V
(BR)DSS
V
GS(th)
I
DSS
30 - - V
1.2 1.6 2
-
-
0.01 10
1
100
µA
Gate-source leakage current
VGS=20V, VDS=0V
Drain-source on-state resistance
VGS=4.5V, ID=15A
Drain-source on-state resistance
VGS=10V, ID=15A
1
Current limited by bondwire ; with an R
information see app.-note ANPS071E available at www.infineon.com/optimos 2
Defined by design. Not subject to production test.
3
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
= 2.5K/W the chip is able to carry ID= 42A at 25°C, for detailed
thJC
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I
GSS
R
DS(on)
R
DS(on)
- 1 100 nA
- 22.9 31
- 15.5 20
m
2003-01-17
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IPD20N03L IPU20N03L
Electrical Characteristics Parameter Symbol Conditions Values Unit
min. typ. max.
Dynamic Characteristics
Transconductance g
Input capacitance C Output capacitance C Reverse transfer capacitance C Gate resistance R Turn-on delay time t Rise time t Turn-off delay time t Fall time t
Gate Charge Characteristics
Gate to source charge Q Gate to drain charge Q
Gate charge total Q
fs
iss
oss
rss
G
d(on)
r
d(off)
f
gs
gd
g
VDS≥2*ID*R ID=30A
VGS=0V, VDS=25V, f=1MHz
DS(on)max
,
14 28 - S
- 530 700 pF
- 200 275
- 60 90
- 1.3 -
VDD=15V, VGS=10V,
ID=15A,
RG=12.7
- 6.2 9.3 ns
- 11 17
- 23 34
- 18 27
VDD=15V, ID=15A - 2.5 3.1 nC
- 6.4 9.6
VDD=15V, ID=15A, VGS=0 to 5V
- 8.4 11
Output charge Q
Gate plateau voltage V
Reverse Diode
Inverse diode continuous forward current
Inv. diode direct current, pulsed Inverse diode forward voltage V
Reverse recovery time t Reverse recovery charge Q
oss
(plateau)
I
S
I
SM
SD
rr
rr
VDS=15V, ID=15A, VGS=0V
VDD=15V, ID=15A - 3.6 - V
TC=25°C - - 30 A
- 8 10 nC
- - 120
VGS=0V, IF=30A - 1.1 1.4 V
VR=15V, I
diF/dt=100A/µs
F=lS
,
- 15 18 ns
- 2 3 nC
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2003-01-17
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IPD20N03L IPU20N03L
1 Power dissipation
P
= f (TC)
tot
IPD20N03L
65
W
55 50 45
tot
40
P
35 30 25 20 15 10
5
2 Drain current
ID = f (TC) parameter: VGS≥ 10 V
IPD20N03L
32
A
24
D
20
I
16
12
8
4
0
0 20 40 60 80 100 120 140 160°C190
3 Safe operating area
ID = f ( VDS )
parameter : D = 0 , TC = 25 °C
3
IPD20N03L
10
A
2
10
D
I
DS(on)
R
1
10
0
10
-1
10
=
10
D
I
/
DS
V
0
10
DC
1
T
C
tp = 35.0µs
100 µs
1 ms
10 ms
V
V
DS
10
0
0 20 40 60 80 100 120 140 160°C190
4 Max. transient thermal impedance
Z
= f (tp)
thJC
parameter : D = tp/T
1
IPD20N03L
10
K/W
0
10
thJC
-1
Z
10
-2
10
-3
10
single pulse
-4
10
-7
-6
2
10
10
10
-5
10
T
C
D = 0.50
0.20
0.10
0.05
0.02
0.01
-4
-3
10
10
-2
s
t
0
10
p
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2003-01-17
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IPD20N03L IPU20N03L
5 Typ. output characteristic
ID = f (VDS); Tj=25°C
parameter: tp = 80 µs
IPD20N03L
75
P
= 60W
tot
A
h
f
60 55 50
D
I
45 40 35 30 25 20 15 10
5 0
0 0.5 1 1.5 2 2.5 3 3.5 4
g
VGS [V]
e
d
c
b
a
a 3.0 b 3.5 c 4.0 d 4.5 e 5.0 f 6.0 g 7.0 h 10.0
V
V
DS
6 Typ. drain-source on resistance
R
parameter: V
5
= f (ID)
DS(on)
GS
IPD20N03L
65
m
c
55 50 45
DS(on)
40
R
35 30 25 20 15 10
V
[V] =
GS
c
d
e
f
5
4.0
4.5
5.0
0
0 10 20 30 40 50
6.0
7.0
g
h
10.0
d
e
f
g
h
65
A
I
D
7 Typ. transfer characteristics ID= f ( VGS ); VDS≥ 2 x ID x R
DS(on)max
parameter: tp = 80 µs
60
A
50 45 40
D
I
35 30 25 20 15 10
5
8 Typ. forward transconductance
gfs = f(ID); Tj=25°C parameter: g
fs
30
S
20
fs
g
15
10
5
0
0 1 2 3 4
V
V
GS
5.5
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0
0 5 10 15 20
A
I
D
2003-01-17
30
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IPD20N03L IPU20N03L
9 Drain-source on-state resistance
R
DS(on)
= f (Tj)
parameter : ID = 15 A, VGS = 10 V
IPD20N03L
50
m
40
35
DS(on)
R
30
25
20
15
10
5
98%
typ
10 Typ. gate threshold voltage
V
= f (Tj)
GS(th)
parameter: VGS = V
3
V
2
GS(th)
V
1.5
1
0.5
0.868mA
25µA
0
-60 -20 20 60 100 140
11 Typ. capacitances
C = f (VDS) parameter: VGS=0V, f=1 MHz
4
10
pF
3
10
C
2
10
°C
200
T
j
0
-60 -20 20 60 100
°C
180
T
j
12 Forward character. of reverse diode
IF = f (VSD)
parameter: Tj , tp = 80 µs
3
IPD20N03L
10
A
2
C
iss
C
oss
C
rss
10
F
I
1
10
Tj = 25 °C typ Tj = 175 °C typ Tj = 25 °C (98%) Tj = 175 °C (98%)
1
10
0 5 10 15 20
0
V
30
V
DS
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10
0 0.4 0.8 1.2 1.6 2 2.4
V
V
SD
2003-01-17
3
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IPD20N03L IPU20N03L
13 Typ. avalanche energy
EAS = f (Tj) par.: ID = 15 A, VDD = 25 V, RGS = 25
16
mJ
12
AS
10
E
8
6
4
2
15 Drain-source breakdown voltage
V
(BR)DSS
= f (Tj)
parameter: ID=10 mA
IPD20N03L
36
V
34
33
(BR)DSS
V
32
31
30
29
28
0
25 45 65 85 105 125 145
14 Typ. gate charge
V
GS
= f (Q
Gate
)
parameter: ID = 15 A pulsed
IPD20N03L
16
V
12
GS
10
V
0.2 V
DS max
8
0.5 V
DS max
0.8 V
DS max
6
4
°C
T
185
j
27
-60 -20 20 60 100 140
°C
200
T
j
2
0
0 2 4 6 8 10 12 14 16 18nC21
Q
Gate
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2003-01-17
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Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
IPD20N03L IPU20N03L
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2003-01-17
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