Datasheet IPD06N03L Datasheet (Infineon)

Page 1
)
)
)
j
g
=
OptiMOS
==
Feature
N-Channel
Logic Level
Low on-resistance R
Excellent Gate Charge x R

Superior thermal resistance

175°C operating temperature
dv/dt rated

Ideal for fast switching buck converters
DS(on
DS(on
product (FOM)
Preliminary data
IPD06N03L
Product Summary
V
DS
R
DS(on
I
D
P-TO252
30 V
5.9 m
50 A
Type Package Ordering Code
IPD06N03L P-TO252 Q67042-S4109
Marking
06N03L
Maximum Ratings,at Tj = 25 °C, unless otherwise specified
Parameter Symbol Value Unit
Continuous drain current
TC=25°C1)
T
=100°C
C
Pulsed drain current
TC=25°C
Avalanche energy, single pulse
ID=20A, VDD=25V, RGS=25
Reverse diode dv/dt
IS=50A, VDS=24V, di/dt=200A/µs, T
jmax
=175°C
I
I
E
dv/dt 6 kV/µs
Gate source voltage V
Power dissipation
TC=25°C
P
D
D puls
AS
GS
tot
50
50
200
30 mJ
±20
125 W
A
V
Operating and storage temperature T
T
,
st
-55... +175
°C
IEC climatic category; DIN IEC 68-1 55/175/56
Page 1
2001-10-18
Page 2
Preliminary data
IPD06N03L
Thermal Characteristics
Parameter Symbol Values Unit
min. typ. max.
Characteristics
Thermal resistance, junction - case
Thermal resistance, junction - ambient, leaded
SMD version, device on PCB:
@ min. footprint
@ 6 cm
2
cooling area
2)
R
R
R
thJC
thJA
thJA
- - 1.2 K/W
- - 100
-
-
-
-
75
50
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
VGS=0V, ID=1mA
Gate threshold voltage, VGS = V
I
= 80 µA
D
Zero gate voltage drain current
VDS=30V, VGS=0V, Tj=25°C
DS
V
(BR)DSS
V
GS(th)
I
DSS
30 - - V
1.2 1.6 2
-
0.01
1
µA
V
=30V, VGS=0V, Tj=125°C
DS
Gate-source leakage current
VGS=20V, VDS=0V
Drain-source on-state resistance
VGS=4.5V, ID=30A
Drain-source on-state resistance
VGS=10V, ID=30A
1
Current limited by bondwire and calculated with max. source pin temperature of 85°C;
with a R
2
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
= 1.2K/W the chip is able to carry ID= 91A.
thJC
Page 2
I
GSS
R
DS(on)
R
DS(on)
-
10
100
- 1 100 nA
- 6.8 8.7
- 4.7 5.9
2001-10-18
m
Page 3
Preliminary data
(p
)
IPD06N03L
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter Symbol Conditions Values Unit
min. typ. max.
Dynamic Characteristics
Transconductance g
Input capacitance C
Output capacitance C
Reverse transfer capacitance C
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Gate Charge Characteristics
Gate to source charge Q
Gate to drain charge Q
Gate charge total Q
fs
iss
oss
rss
d(on)
r
d(off)
f
gs
gd
g
VDS
2*ID*R
DS(on)max
I
=30A
D
VGS=0V, VDS=25V,
f=1MHz
,
29 58 - S
- 1900 2370 pF
- 750 940
- 170 250
VDD=15V, VGS=10V,
I
=25A, RG=3.6
D
- 7.3 11 ns
- 22 33
- 34 50
- 20.5 30.7
VDD=15V, ID=25A - 6.3 8.4 nC
- 12.3 16.4
VDD=15V, ID=25A,
V
=0 to 5V
GS
- 25.8 34.3
Output charge Q
Gate plateau voltage V
Reverse Diode
Inverse diode continuous
I
forward current
Inverse diode direct current,
I
pulsed
Inverse diode forward voltage V
Reverse recovery time t
Reverse recovery charge Q
oss
S
SM
SD
rr
rr
lateau
VDS=15V, ID=25A,
V
=0V
GS
VDD=15V, ID=25A - 3.1 - V
TC=25°C - - 50 A
- 25.5 31.9
- - 200
VGS=0V, IF=50A - 0.9 1.3 V
VR=15V, I
di
/dt=100A/µs
F
lS,
=
F
- 43 54 ns
- 50 63 nC
Page 3
2001-10-18
Page 4
Preliminary data
IPD06N03L
1 Power dissipation
P
= f (TC)
tot
IPD06N03L
140
W
120
110
100
tot
90
P
80
70
60
50
40
30
20
10
0
0 20 40 60 80 100 120 140 160°C190
2 Drain current
ID = f (TC)
parameter: VGS
IPD06N03L
55
A
45
40
35
D
I
30
25
20
15
10
5
0
0 20 40 60 80 100 120 140 160°C190
T
C
10 V
T
C
3 Safe operating area
ID = f ( VDS )
parameter : D = 0 , TC = 25 °C
3
IPD06N03L
10
A
2
10
D
I
1
10
0
10
-1
10
D
R
D
I
/
S
D
V
=
)
n
o
(
S
0
10
10
DC
1
tp = 6.9µs
10 µs
100 µs
1 ms
10 ms
V
V
DS
10
4 Transient thermal impedance
Z
= f (tp)
thJC
parameter : D = tp/T
1
IPD06N03L
10
K/W
0
10
thJC
-1
Z
10
-2
10
single pulse
-3
10
-4
2
10
10
-7
-6
10
-5
10
10
D = 0.50
0.20
0.10
0.05
0.02
0.01
-4
-3
10
10
-2
s
t
0
10
p
Page 4
2001-10-18
Page 5
Preliminary data
IPD06N03L
5 Typ. output characteristic
ID = f (VDS); Tj=25°C
parameter: tp = 80 µs
IPD06N03L
120
P
= 125W
tot
A
i
h
100
90
80
D
I
70
60
50
40
30
20
10
0
0 0.5 1 1.5 2 2.5 3 3.5 4
VGS [V]
g
f
e
d
c
b
a
a 2.6
b 2.8
c 3.0
d 3.2
e 3.4
f 3.6
g 3.8
h 4.5
i 10.0
V
V
DS
6 Typ. drain-source on resistance
R
DS(on)
parameter: V
R
5
= f (ID)
GS
IPD06N03L
19
d
[V] =
e
3.4
3.6
d
f
16
14
DS(on)
12
10
8
6
4
V
GS
2
3.2
0
0 10 20 30 40 50 60 70
3.8
e
g
h
i
4.5
10.0
f
g
h
i
85
A
I
D
7 Typ. transfer characteristics
ID= f ( VGS ); VDS
2 x ID x R
DS(on)max
parameter: tp = 80 µs
60
A
50
45
40
D
I
35
30
25
20
15
10
5
0
0 0.5 1 1.5 2 2.5 3
V
V
GS
8 Typ. forward transconductance
gfs = f(ID); Tj=25°C
parameter: g
90
S
70
60
fs
g
50
40
30
20
10
4
0
0 20 40 60 80 100
fs
130
A
I
D
Page 5
2001-10-18
Page 6
Preliminary data
IPD06N03L
9 Drain-source on-state resistance
R
DS(on)
= f (Tj)
parameter : ID = 30 A, VGS = 10 V
IPD06N03L
14
12
11
10
DS(on)
9
R
8
7
6
5
4
3
2
1
0
-60 -20 20 60 100 140
98%
typ
°C
10 Gate threshold voltage
V
GS(th)
= f (Tj)
parameter: VGS = VDS, ID = 80 µA
2.5
V
GS(th)
V
1.5
1
0.5
200
T
j
0
-60 -20 20 60 100
max.
typ.
min.
°C
T
180
j
11 Typ. capacitances
C = f (VDS)
parameter: VGS=0V, f=1 MHz
4
10
pF
i
ss
C
C
3
10
2
10
0 5 10 15 20
C
oss
C
rss
V
V
DS
30
12 Forward character. of reverse diode
IF = f (VSD)
parameter: Tj , tp = 80 µs
3
IPD06N03L
10
A
2
10
F
I
1
10
Tj = 25 °C typ
Tj = 175 °C typ
Tj = 25 °C (98%)
Tj = 175 °C (98%)
0
10
0 0.4 0.8 1.2 1.6 2 2.4
V
V
SD
3
Page 6
2001-10-18
Page 7
Preliminary data
IPD06N03L
13 Typ. avalanche energy
EAS = f (Tj)
par.: ID = 20 A, VDD = 25 V, RGS = 25
260
mJ
220
200
180
AS
160
E
140
120
100
80
60
40
20
0
25 45 65 85 105 125 145
°C
T
j
185
14 Typ. gate charge
V
GS
= f (Q
Gate
)
parameter: ID = 25 A pulsed
IPD06N03L
16
V
12
GS
10
V
0.2 V
DS max
8
0.5 V
DS max
0.8 V
6
DS max
4
2
0
0 10 20 30 40 50 60
nC
Q
75
Gate
15 Drain-source breakdown voltage
V
(BR)DSS
= f (Tj)
parameter: ID=10 mA
IPD06N03L
36
V
34
33
(BR)DSS
V
32
31
30
29
28
27
-60 -20 20 60 100 140
°C
200
T
j
Page 7
2001-10-18
Page 8
Preliminary data
Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
IPD06N03L
Page 8
2001-10-18
Page 9
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