Datasheet IN74HC299DW Datasheet (INTEGRAL)

Page 1
8-Bit Bidirectional Universal Shift Register with Parallel I/O
High-Performance Silicon-Gate CMOS
The IN74HC299 is identical in pinout to the LS/ALS299. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALSTTL outputs.
Two Mode-Select inputs and two Output Enable inputs are used to choose the mode of operation as listed in the Function Table. Synchronous parallel loading is accomplished by taking both Mode­Select lines, S impedance state, which permits data applied to the data port to be clocked into the register. Reading out of the register can be accomplished when the outputs are enabled. The active-low asynchronous Reset overrides all other inputs.
•
Outputs Directly Interface to CMOS, NMOS, and TTL
•
Operating Voltage Range: 2.0 to 6.0 V
•
Low Input Current: 1.0 µA
•
High Noise Immunity Characteristic of CMOS Devices
and S2, high. This places the outputs in the high-
1
TECHNICAL DATA
IN74HC299
ORDERING INFORMATION
IN74HC299N Plastic
IN74HC299DW SOIC
TA = -55° to 125° C for all packages
PIN ASSIGNMENT
LOGIC DIAGRAM
PIN 20=V
PIN 10 = GND
CC
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Page 2
IN74HC299
MAXIMUM RATINGS
*
Symbol Parameter Value Unit
V
CC
V
V
OUT
I
IN
I
OUT
I
CC
P
DC Supply Voltage (Referenced to GND) -0.5 to +7.0 V DC Input Voltage (Referenced to GND) -1.5 to VCC +1.5 V
IN
DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Input Current, per Pin DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP+
D
SOIC Package+
±
20
±
35
±
75
750 500
Tstg Storage Temperature -65 to +150
T
Lead Temperature, 1 mm from Case for 10 Seconds
L
260
(Plastic DIP or SOIC Package)
*
Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
mA mA mA
mW
°
C
°
C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
CC
VIN, V
T
A
tr, t
f
This device c ontains p rote ction ci rcuitr y to guard a gainst damage d ue to high st atic voltages or electr ic fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, V GND≤(V
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V Unused outputs must be left open. I/O pins must be connected to a properly terminated line or bus.
DC Supply Voltage (Referenced to GND) 2.0 6.0 V DC Input Voltage, Output Voltage (Referenced to GND) 0 V
OUT
Operating Temperature, All Package Types -55 +125 Input Rise and Fall Time (Figure 1) VCC =2.0 V
IN
or V
OUT
)≤VCC.
V
CC
V
CC
and V
IN
=4.5 V
=6.0 V
OUT
should be constrained to the range
0 0 0
CC
1000
500 400
°
ns
V
C
CC
).
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Page 3
IN74HC299
DC ELECTRICAL CHARACTERISTICS
(Voltages Referenced to GND)
Symbol Parameter Test Conditions V
V
V
V
OH
V
OL
I
IN
Minimum High-Level
IH
Input Voltage
Maximum Low -
IL
Level Input Voltage
Minimum High-Level Output Voltage
Maximum Low-Level Output Voltage
Maximum Input
V
=0.1 V or VCC-0.1 V
OUT
≤
I
20 µA
OUT
V
=0.1 V or VCC-0.1 V
OUT
 ≤
I
20 µA
OUT
VIN=VIH or V
 ≤
I
OUT
VIN=VIH or V
 ≤
I
OUT
 ≤
I
OUT
VIN=VIH or V
 ≤
I
OUT
 ≤
I
OUT
VIN= VIL or V
 ≤
I
OUT
VIN=VIH or V
 ≤
I
OUT
 ≤
I
OUT
VIN=VIH or V
 ≤
I
OUT
 ≤
I
OUT
IL
20 µA
IL
6.0 mA (P/Q)
7.8 mA (P/Q)
IL
4.0 mA (Q’)
5.2 mA (Q’)
IH
20 µA
IL
6.0 mA (P/Q)
7.8 mA (P/Q)
IL
4.0 mA (Q’)
5.2 mA (Q’)
VIN=VCC or GND 6.0
Leakage Current
I
OZ
Maximum Three­State Leakage Current (Q
thru QH)
A
I
CC
Maximum Qui escent Supply Current
Output in High-Impedance State V
= V
or V
IN
IL
IH
V
OUT=VCC
or GND
VIN=VCC or GND
=0µA
I
OUT
(per Package)
V
CC
Guaranteed Limit
25 °C
to
≤
85
°
C
≤
125
°
-55°C
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
4.5
6.0
4.5
6.0
2.0
4.5
6.0
4.5
6.0
4.5
6.0
6.0
1.5
3.15
4.2
0.3
0.9
1.2
1.9
4.4
5.9
3.98
5.48
3.98
5.48
0.1
0.1
0.1
0.26
0.26
0.26
0.26
±
0.1
±
0.5
1.5
3.15
4.2
0.3
0.9
1.2
1.9
4.4
5.9
3.84
5.34
3.84
5.34
0.1
0.1
0.1
0.33
0.33
0.33
0.33
±
1.0
±
5.0
1.5
3.15
4.2
0.3
0.9
1.2
1.9
4.4
5.9
3.7
5.2
3.7
5.2
0.1
0.1
0.1
0.4
0.4
0.4
0.4
±
±
6.0 8 .0 80 160
C
1.0
10
Unit
V
V
V
V
µ
A
µ
A
µ
A
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IN74HC299
AC ELECTRICAL CHARACTERISTICS
(CL=50pF,Input tr=tf=6.0 ns)
Symbol Parameter V
f
max
Maximum Clock Frequency (50 % Duty Cycle) (Figures 1 and 5)
t
t
PLH
PLH
t
, t
, t
PHL
Maximum Propagati on Delay, Clock to QA’ or
PHL
Q
’ (Figures 1 and 5)
H
Maximum Propagati on Delay, Clock to QA thru
PHL
Q
(Figures 1 and 5)
H
Maximum Propagation Delay, Reset to QA’ or QH’ (Figures 2 and 5)
t
t
t
TLH
PLZ
PZL
t
PHL
, t
, t
, t
Maximum Propagation Delay, Reset to QA thru Q
(Figures 2 and 5)
H
Maximum Propagation Delay , OE1, OE2, S1, or
PHZ
S2 to Q
Maximum Propagation Delay , OE1, OE2, S1, or
PZH
S2 to Q
Maximum Output Transition Time, QA thru Q
THL
thru QH (Figures 3 and 6)
A
thru QH (Figures 3 and 6)
A
H
(Figures 1 and 5)
t
TLH
, t
Maximum Output Transition Time, QA’ thru QH’
THL
(Figures 1 and 5)
C
IN
C
OUT
Maximum Input Capacitance) - 10 10 10 pF Maximum Three-State I/O Capacitance
(I/O in High-Impedance State), Q
thru Q
A
H
V
CC
Guaranteed Limit
25 °C
≤85°C≤
125°C
Unit
to
-55°C
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
5.0 25 29
170
34 29
160
32 27
175
35 30
190
38 32
150
30 26
150
30 26
60 12 10
75 15 13
4.0 20 24
215
43 37
200
40 34
220
44 37
240
48 41
190
38 33
190
38 33
75 15 13
95 19 16
3.4 17 20
255
51 43
240
48 41
265
53 45
285
57 48
225
45 38
225
45 38
90 18 15
110
22 19
MHz
ns
ns
ns
ns
ns
ns
ns
ns
-151515pF
344
Power Dissipation Capacitance (Per Package),
Typical @25°C,V
=5.0 V
CC
Output Enable
C
PD
Used to determine the no-load dynamic power consumption: P
D=CPDVCC
2
f+ICCV
CC
240 pF
Page 5
IN74HC299
TIMING REQUIREMENTS
(CL=50pF,Input tr=tf=6.0 ns)
Symbol Parameter V
t
su
Minimum Setup Time, Mod e Select S1 or S2 to Clock (Figure 4)
t
su
Minimum Setup Time, Data Inp uts S
, SH, PA thru PH to Clock
A
(Figure 4)
t
h
Minimum Hold T ime, Clock to Mode Select S1 or S2 (Figure 4)
t
h
t
rec
Minimum Hold T ime, Clock to Data Inputs, S
, SH, PA thru PH (Figure 4)
A
Minimum Recovery Ti me, Reset Inactive to Clock (Figure 2)
t
t
tr, t
w
w
Minimum Pulse Width, Clock (Figure1)2.0
Minimum Pulse Width, Reset (Figure2)2.0
Maximum Input Rise and Fa ll T imes
f
(Figure 1)
V
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
4.5
6.0
4.5
6.0
2.0
4.5
6.0
CC
Guaranteed Limit
25 °C to-55°C
100
20 17
100
20 17
120
24 20
5 5 5
50 10
9
80 16 14
80 16 14
1000
500 400
≤85°
125
25 21
125
25 21
150
30 26
5 5 5
65 13 11
100
20 17
100
20 17
1000
500 400
≤
C
125°C
150
Unit
ns 30 26
150
ns 30 26
180
ns 36 31
5
ns
5 5
75
ns 15 13
120
ns 24 20
120
ns 24 20
1000
ns
500 400
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Page 6
IN74HC299
FUNCTION TABLE
Inputs Response
Mode Reset Mode
Select
S2S1OE1 OE2 DAD
Reset L X L L L X XXLLLLLLL L L L
L L X L L X XXLLLLLLL L L L LHHX X XXX QA through QH=Z L L
Shift
H L H H X D X Shift Right: QA through QH=Z;
Right
H L H X H D X Shift Right: QA through QH=Z;
H L H L L D X Shift Right: DA FA =QA;
Shift
H H L H X X D Shift Left: QA through QH=Z;
Left
H H L X H X D Shift Left: QA through QH=Z;
H H L L L X D Shift Left: DH FH =QH;
Parallel
H H H X X X X Parallel Load:P
Load Hold H L L H X X X X Hold: QA through QH=Z; FN=F
H L L X H X X X Hold: QA through QH=Z; FN=F H L L L L X X X Hold: QN =Q
Z = high impedance D = data on serial input F = flip-flop (see Logic Diagram) When one or both output controls are high the eight input/output terminals are disabled to the high­ impedance state; however, sequential operation or clearing of the register is not affected.
Output
Enables
Clock Serial
Inputs
PA/
PB/
PC/
PD/
PE/
PF/
PG/
PH/
QA’QH’
Q
Q
Q
Q
Q
Q
Q
A
B
C
D
E
F
H
D
FA; FA FB; etc
A
D
FA; FA FB; etc
A
F
FB =QB; etc
A
D
FH; FH FG; etc
H
D
FH; FH FG; etc
H
F
FG =QG; etc
H
F
N
H
Q
G
H
DQ
G
DQ
G
DQ
G
D
Q
B
D
Q
B
D
Q
B
N
PAP
PAP
N
PAP
N
PAP
H
H
H
H
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IN74HC299
Figure 1. Switching Waveforms Figure 2. Switching Waveforms
Figure 3a. Switching Waveforms Figure 3b. Switching Waveforms
Figure 4. Switching Waveforms Figure 5. Test Circuit
Figure 6. Test Circuit
347
Page 8
IN74HC299
EXPANDED LOGIC DIAGRAM
348
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