8-Bit Bidirectional Universal
Shift Register with Parallel I/O
High-Performance Silicon-Gate CMOS
The IN74HC299 is identical in pinout to the LS/ALS299. The
device inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LS/ALSTTL outputs.
The IN74HC299features a multiplexed parallel input/output data
port to achieve full 8-bit handling in a 20 pin package. Due to the large
output drive capability and the 3-state feature, this device is ideally
suited for interface with bus lines in a bus-oriented system.
Two Mode-Select inputs and two Output Enable inputs are used to
choose the mode of operation as listed in the Function Table.
Synchronous parallel loading is accomplished by taking both ModeSelect lines, S
impedance state, which permits data applied to the data port to be
clocked into the register. Reading out of the register can be
accomplished when the outputs are enabled. The active-low
asynchronous Reset overrides all other inputs.
•
Outputs Directly Interface to CMOS, NMOS, and TTL
•
Operating Voltage Range: 2.0 to 6.0 V
•
Low Input Current: 1.0 µA
•
High Noise Immunity Characteristic of CMOS Devices
and S2, high. This places the outputs in the high-
1
TECHNICAL DATA
IN74HC299
ORDERING INFORMATION
IN74HC299N Plastic
IN74HC299DW SOIC
TA = -55° to 125° C for all packages
PIN ASSIGNMENT
LOGIC DIAGRAM
PIN 20=V
PIN 10 = GND
CC
341
Page 2
IN74HC299
MAXIMUM RATINGS
*
SymbolParameterValueUnit
V
CC
V
V
OUT
I
IN
I
OUT
I
CC
P
DC Supply Voltage (Referenced to GND)-0.5 to +7.0V
DC Input Voltage (Referenced to GND)-1.5 to VCC +1.5V
IN
DC Output Voltage (Referenced to GND)-0.5 to VCC +0.5V
DC Input Current, per Pin
DC Output Current, per Pin
DC Supply Current, VCC and GND Pins
Power Dissipation in Still Air, Plastic DIP+
D
SOIC Package+
±
20
±
35
±
75
750
500
TstgStorage Temperature-65 to +150
T
Lead Temperature, 1 mm from Case for 10 Seconds
L
260
(Plastic DIP or SOIC Package)
*
Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
mA
mA
mA
mW
°
C
°
C
RECOMMENDED OPERATING CONDITIONS
SymbolParameterMinMaxUnit
V
CC
VIN, V
T
A
tr, t
f
This device c ontains p rote ction ci rcuitr y to guard a gainst damage d ue to high st atic voltages or electr ic
fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, V
GND≤(V
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V
Unused outputs must be left open. I/O pins must be connected to a properly terminated line or bus.
DC Supply Voltage (Referenced to GND)2.06.0V
DC Input Voltage, Output Voltage (Referenced to GND)0V
OUT
Operating Temperature, All Package Types-55+125
Input Rise and Fall Time (Figure 1)VCC =2.0 V
IN
or V
OUT
)≤VCC.
V
CC
V
CC
and V
IN
=4.5 V
=6.0 V
OUT
should be constrained to the range
0
0
0
CC
1000
500
400
°
ns
V
C
CC
).
342
Page 3
IN74HC299
DC ELECTRICAL CHARACTERISTICS
(Voltages Referenced to GND)
SymbolParameterTest ConditionsV
V
V
V
OH
V
OL
I
IN
Minimum High-Level
IH
Input Voltage
Maximum Low -
IL
Level Input Voltage
Minimum High-Level
Output Voltage
Maximum Low-Level
Output Voltage
Maximum Input
V
=0.1 V or VCC-0.1 V
OUT
≤
I
20 µA
OUT
V
=0.1 V or VCC-0.1 V
OUT
≤
I
20 µA
OUT
VIN=VIH or V
≤
I
OUT
VIN=VIH or V
≤
I
OUT
≤
I
OUT
VIN=VIH or V
≤
I
OUT
≤
I
OUT
VIN= VIL or V
≤
I
OUT
VIN=VIH or V
≤
I
OUT
≤
I
OUT
VIN=VIH or V
≤
I
OUT
≤
I
OUT
IL
20 µA
IL
6.0 mA (P/Q)
7.8 mA (P/Q)
IL
4.0 mA (Q’)
5.2 mA (Q’)
IH
20 µA
IL
6.0 mA (P/Q)
7.8 mA (P/Q)
IL
4.0 mA (Q’)
5.2 mA (Q’)
VIN=VCC or GND6.0
Leakage Current
I
OZ
Maximum ThreeState Leakage
Current
(Q
thru QH)
A
I
CC
Maximum Qui escent
Supply Current
Output in High-Impedance
State
V
= V
or V
IN
IL
IH
V
OUT=VCC
or GND
VIN=VCC or GND
=0µA
I
OUT
(per Package)
V
CC
Guaranteed Limit
25 °C
to
≤
85
°
C
≤
125
°
-55°C
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
4.5
6.0
4.5
6.0
2.0
4.5
6.0
4.5
6.0
4.5
6.0
6.0
1.5
3.15
4.2
0.3
0.9
1.2
1.9
4.4
5.9
3.98
5.48
3.98
5.48
0.1
0.1
0.1
0.26
0.26
0.26
0.26
±
0.1
±
0.5
1.5
3.15
4.2
0.3
0.9
1.2
1.9
4.4
5.9
3.84
5.34
3.84
5.34
0.1
0.1
0.1
0.33
0.33
0.33
0.33
±
1.0
±
5.0
1.5
3.15
4.2
0.3
0.9
1.2
1.9
4.4
5.9
3.7
5.2
3.7
5.2
0.1
0.1
0.1
0.4
0.4
0.4
0.4
±
±
6.08 .080160
C
1.0
10
Unit
V
V
V
V
µ
A
µ
A
µ
A
343
Page 4
IN74HC299
AC ELECTRICAL CHARACTERISTICS
(CL=50pF,Input tr=tf=6.0 ns)
SymbolParameterV
f
max
Maximum Clock Frequency (50 % Duty Cycle)
(Figures 1 and 5)
t
t
PLH
PLH
t
, t
, t
PHL
Maximum Propagati on Delay, Clock to QA’ or
PHL
Q
’ (Figures 1 and 5)
H
Maximum Propagati on Delay, Clock to QA thru
PHL
Q
(Figures 1 and 5)
H
Maximum Propagation Delay, Reset to QA’ or QH’
(Figures 2 and 5)
t
t
t
TLH
PLZ
PZL
t
PHL
, t
, t
, t
Maximum Propagation Delay, Reset to QA thru
Q
(Figures 2 and 5)
H
Maximum Propagation Delay , OE1, OE2, S1, or
PHZ
S2 to Q
Maximum Propagation Delay , OE1, OE2, S1, or
PZH
S2 to Q
Maximum Output Transition Time, QA thru Q
THL
thru QH (Figures 3 and 6)
A
thru QH (Figures 3 and 6)
A
H
(Figures 1 and 5)
t
TLH
, t
Maximum Output Transition Time, QA’ thru QH’
THL
(Figures 1 and 5)
C
IN
C
OUT
Maximum Input Capacitance)-101010pF
Maximum Three-State I/O Capacitance
(I/O in High-Impedance State), Q
thru Q
A
H
V
CC
Guaranteed Limit
25 °C
≤85°C≤
125°C
Unit
to
-55°C
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
5.0
25
29
170
34
29
160
32
27
175
35
30
190
38
32
150
30
26
150
30
26
60
12
10
75
15
13
4.0
20
24
215
43
37
200
40
34
220
44
37
240
48
41
190
38
33
190
38
33
75
15
13
95
19
16
3.4
17
20
255
51
43
240
48
41
265
53
45
285
57
48
225
45
38
225
45
38
90
18
15
110
22
19
MHz
ns
ns
ns
ns
ns
ns
ns
ns
-151515pF
344
Power Dissipation Capacitance (Per Package),
Typical @25°C,V
=5.0 V
CC
Output Enable
C
PD
Used to determine the no-load dynamic power
consumption:
P
D=CPDVCC
2
f+ICCV
CC
240pF
Page 5
IN74HC299
TIMING REQUIREMENTS
(CL=50pF,Input tr=tf=6.0 ns)
SymbolParameterV
t
su
Minimum Setup Time, Mod e Select
S1 or S2 to Clock (Figure 4)
t
su
Minimum Setup Time, Data Inp uts
S
, SH, PA thru PH to Clock
A
(Figure 4)
t
h
Minimum Hold T ime, Clock to Mode
Select S1 or S2 (Figure 4)
t
h
t
rec
Minimum Hold T ime, Clock to Data
Inputs, S
, SH, PA thru PH (Figure 4)
A
Minimum Recovery Ti me, Reset
Inactive to Clock (Figure 2)
t
t
tr, t
w
w
Minimum Pulse Width, Clock (Figure1)2.0
Minimum Pulse Width, Reset (Figure2)2.0
Maximum Input Rise and Fa ll T imes
f
(Figure 1)
V
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
4.5
6.0
4.5
6.0
2.0
4.5
6.0
CC
Guaranteed Limit
25 °C to-55°C
100
20
17
100
20
17
120
24
20
5
5
5
50
10
9
80
16
14
80
16
14
1000
500
400
≤85°
125
25
21
125
25
21
150
30
26
5
5
5
65
13
11
100
20
17
100
20
17
1000
500
400
≤
C
125°C
150
Unit
ns
30
26
150
ns
30
26
180
ns
36
31
5
ns
5
5
75
ns
15
13
120
ns
24
20
120
ns
24
20
1000
ns
500
400
345
Page 6
IN74HC299
FUNCTION TABLE
InputsResponse
ModeResetMode
Select
S2S1OE1OE2DAD
ResetL X L LL X XXLLLLLLL L L L
L L X LL X XXLLLLLLL L L L
LHHX X XXXQA through QH=ZLL
Shift
HLHHXDXShift Right: QA through QH=Z;
Right
HLHXHDXShift Right: QA through QH=Z;
HLHLLDXShift Right: DA FA =QA;
Shift
HHLHXXDShift Left: QA through QH=Z;
Left
HHLXHXDShift Left: QA through QH=Z;
HHLLLXDShift Left: DH FH =QH;
Parallel
HHHXXXXParallel Load:P
Load
HoldHLLHXXXXHold: QA through QH=Z; FN=F
HLLXHXXXHold: QA through QH=Z; FN=F
HLLLLXXXHold: QN =Q
Z = high impedance
D = data on serial input
F = flip-flop (see Logic Diagram)
When one or both output controls are high the eight input/output terminals are disabled to the high impedance state; however, sequential operation or clearing of the register is not affected.