The IN74AC174 is identical in pinout to the LS/ALS174,
HC/HCT174. The device inputs are compatible with standard CMOS
outputs; with pullup resistors, they are compatible with LS/ALS
outputs.
This device consists of six D flip-flops with common Clock and
Reset inputs. Each flip-flop is loaded with a low-to-high transition of
the Clock input. Reset is asynchronous and active-low.
•
Outputs Directly Interface to CMOS, NMOS, and TTL
•
Operating Voltage Range: 2.0 to 6.0 V
•
Low Input Current: 1.0 µA; 0.1 µA @ 25°C
•
High Noise Immunity Characteristic of CMOS Devices
•
Outputs Source/Sink 24mA
IN74AC174
ORDERING INFORMATION
IN74AC174N Plastic
IN74AC174D SOIC
TA = -40° to 85° C for all
packages
LOGIC DIAGRAM
PIN 16=V
PIN 8 = GND
CC
PIN ASSIGNMENT
FUNCTION TABLE
InputsOutput
ResetClockDQ
LXXL
HHH
HLL
254
HLXno change
HXno change
X = Don’t care
Page 2
IN74AC174
MAXIMUM RATINGS
*
SymbolParameterValueUnit
V
CC
V
V
OUT
I
IN
I
OUT
I
CC
P
DC Supply Voltage (Referenced to GND)-0.5 to +7.0V
DC Input Voltage (Referenced to GND)-0.5 to VCC +0.5V
IN
DC Output Voltage (Referenced to GND)-0.5 to VCC +0.5V
DC Input Current, per Pin
DC Output Sink/Source Current, per Pin
DC Supply Current, VCC and GND Pins
Power Dissipation in Still Air, Plastic DIP+
D
SOIC Package+
±
20
±
50
±
50
750
500
TstgStorage Temperature-65 to +150
T
Lead Temperature, 1 mm from Case for 10 Seconds
L
260
(Plastic DIP or SOIC Package)
*
Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
mA
mA
mA
mW
°
C
°
C
RECOMMENDED OPERATING CONDITIONS
SymbolParameterMinMaxUnit
V
CC
VIN, V
T
J
T
A
I
OH
I
OL
tr, t
f
*
VIN from 30% to 70% V
This device c ontains p rote ction ci rcuitr y to guard a gainst damage d ue to high st atic voltages or electr ic
fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, V
GND≤(V
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V
Unused outputs must be left open.
DC Supply Voltage (Referenced to GND)2.06.0V
DC Input Voltage, Output Voltage (Referenced to GND)0V
OUT
Junction Temperature (PDIP)140
Operating Temperature, All Package Types-40+85
Output Current - High-24mA
Output Current - Low24mA
Input Rise and Fall Time
(except Schmitt Inputs)
IN
or V
OUT
)≤VCC.
CC
*
V
V
V
=3.0 V
CC
=4.5 V
CC
=5.5 V
CC
and V
IN
0
0
0
should be constrained to the range
OUT
CC
150
40
25
V
°
C
°
C
ns/V
CC
).
255
Page 3
IN74AC174
DC ELECTRICAL CHARACTERISTICS
(Voltages Referenced to GND)
SymbolParameterTest ConditionsV
V
Minimum High-Level
IH
V
=0.1 V or VCC-0.1 V3.0
OUT
Input Voltage
V
Maximum Low -
IL
V
=0.1 V or VCC-0.1 V3.0
OUT
Level Input Voltage
V
OH
Minimum High-Level
I
OUT
≤ -50 µA
Output Voltage
*
VIN=VIH or V
IL
IOH=-12 mA
I
=-24 mA
OH
I
=-24 mA
OH
V
OL
Maximum Low-Level
I
OUT
≤ 50 µA
Output Voltage
*
VIN=VIH or V
IL
IOL=12 mA
I
=24 mA
OL
I
=24 mA
OL
I
IN
Maximum Input
VIN=VCC or GND5.5
Leakage Current
I
OLD
+Minimum Dynamic
V
=1.65 V Max5.575mA
OLD
Output Current
I
OHD
+Minimum Dynamic
V
=3.85 V Min5.5-75mA
OHD
Output Current
I
CC
Maximum Quiescent
VIN=VCC or GND5.58.080
Supply Current
(per Package)
*
All outputs loaded; thresholds on input associated with output under test.
+Maximum test duration 2.0 ms, one output loaded at a time.
Note: I
IN
and I
@ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V V