Datasheet IDT7MP4145S20Z, IDT7MP4145S20M, IDT7MP4145S15Z, IDT7MP4145S15M, IDT7MP4045S20Z Datasheet (Integrated Device Technology)

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Page 1
2703 drw 01
PD
0
31
29
9 11 13 15 17 19 21 23 25
1
3
5
7
27
33
63
61
41 43 45 47 49 51 53 55 57
35 37 39
59
PD
1
– GND – GND
32
30
28
8 10 12 14 16 18 20 22 24
2 4 6
26
34
64
62
42 44 46 48 50 52 54 56 58
36 38 40
60
GND
CS
A
16
I/O
16
I/O
17
I/O
18
I/O
19
A
10
A
11
A
12
A
13
I/O
20
I/O
21
I/O
22
I/O
23
GND
I/O
0
I/O
1
I/O
2
I/O
3
V
CC
A
7
A
8
A
9
I/O
4
I/O
5
I/O
6
WE
I/O
7
CS
PD
0
A
14
CS
A
17
OE
I/O
24
I/O
25
I/O
26
I/O
27
A
3
A
4
A
5
V
CC
A
6
I/O
28
I/O
29
I/O
30
I/O
31
PD
1
GND
I/O
8
I/O
9
I/O
10
I/O
11
A
0
A
1
A
2
I/O
12
I/O
13
I/O
14
I/O
15
GND
CS
A
15
FEATURES:
• High density 1 megabyte static RAM module (IDT7MP4145 upgradeable to 4 megabyte, IDT7MP4120)
• Low profile 64 pin ZIP (Zig-zag In-line vertical Package) or 64 pin SIMM (Single In-line Memory Module) for IDT7MP4045 and 72 pin SIMM (Single In-line Memory Module) for IDT7MP4145
• Very fast access time: 15ns (max.)
• Surface mounted plastic components on an epoxy laminate (FR-4) substrate
• Single 5V (±10%) power supply
• Multiple GND pins and decoupling capacitors for maxi­mum noise immunity
• Inputs/outputs directly TTL-compatible
PIN NAMES
I/O031 Data Inputs/Outputs A017 Addresses
CS
1–4 Chip Selects
WE
Write Enable
OE
Output Enable PD0–1 Depth Identification VCC Power GND Ground NC No Connect
2703 tbl 01
Integrated Device Technology, Inc.
COMMERCIAL TEMPERATURE RANGE SEPTEMBER 1996
1996 Integrated Device Technology, Inc. DSC-2703/7
1
The IDT logo is a registered trademark of Integrated Device Technology Inc.
NOTE:
1. Pins 2 and 3 (PD
0 and PD1) are read by the user to determine the density
of the module. If PD
0 reads GND and PD1 reads GND, then the module
has a 256K depth.
DESCRIPTION:
The IDT7MP4045/4145 is a 256K x 32 static RAM module constructed on an epoxy laminate (FR-4) substrate using 8 256K x 4 static RAMs in plastic SOJ packages. Availability of four chip select lines (one for each group of two RAMs) provides byte access. The IDT7MP4045 is available with access time as fast as 10ns with minimal power consumption.
The IDT7MP4045 is packaged in a 64 pin FR-4 ZIP (Zig­zag In-line vertical Package)or a 64 pin SIMM (Single In-line Memory Module) where as the 7MP4145 is packaged in a 72 pin SIMM (Single In-line Memory Module). The 4045 ZIP configuration allows 64 pins to be placed on a package 3.65 inches long and 0.365 inches wide. The 7MP4045 ZIP is only
0.585 inches high, this low profile package is ideal for systems with minimum board spacing while the SIMM configuration allows use of edge mounted sockets to secure the module.
All inputs and outputs of the IDT7MP4045/4145 are TTL­compatible and operate from a single 5V supply. Full asyn­chronous circuitry requires no clocks or refresh for operation and provides equal access and cycle times for ease of use.
Identification pins are provided for applications in which different density versions of the module are used. In this way, the target system can read the respective levels of PD
pins to
determine a 256K depth.
The contact pins are plated with 100 micro-inches of nickel covered by 30 micro-inches minimum of selective gold.
PIN CONFIGURATION – 7MP4045
(1)
ZIP, SIMM
TOP VIEW
FUNCTIONAL BLOCK DIAGRAM
OE
WE
2703 drw 02
8
18
256K x 32
RAM
8 8 8
2
CS1CS2CS3CS
4
ADDRESS
I/O
0-31
PD
IDT7MP4045 IDT7MP4145
256K x 32 CMOS STATIC RAM MODULE
15.2
Page 2
IDT7MP4045/7MP4145 256K x 32 CMOS STATIC RAM MODULE COMMERCIAL TEMPERATURE RANGE
15.2 2
RECOMMENDED OPERATING TEMPERATURE AND SUPPLY VOLTAGE
Ambient
Grade Temperature GND VCC
Commercial 0°C to +70°C 0V 5.0V ± 10%
2703 tbl 04
CAPACITANCE (TA = +25°C, F = 1.0MHz)
Symbol Parameter
(1)
Conditions Max. Unit
C
IN(C) Input Capacitance V(IN) = 0V 20 pF
(CS)
C
IN(A) Input Capacitance V(IN) = 0V 70 pF
(Address & Control)
C
I/O I/O Capacitance V(OUT) = 0V 12 pF
NOTE: 2703 tbl 02
1. This parameter is guaranteed by design but not tested.
RECOMMENDED DC OPERATING CONDITIONS
Symbol Parameter Min. Typ. Max. Unit
VCC Supply Voltage 4.5 5.0 5.5 V GND Supply Voltage 0 0 0 V VIH Input High Voltage 2.2 6.0 V V
IL Input Low Voltage –0.5
(1)
0.8 V
NOTE: 2703 tbl 03
1. VIL (min) = –1.5V for pulse width less than 10ns.
TRUTH TABLE
Mode
CSCSOEOEWE
WE
Output Power
Standby H X X High-Z Standby Read L L H DATAOUT Active Write L X L DATAIN Active Read L H H High-Z Active
2703 tbl 05
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol Rating Value Unit
V
TERM Terminal Voltage with –0.5 to +7.0 V
Respect to GND TA Operating Temperature 0 to +70 °C TBIAS Temperature Under Bias –10 to +85 °C TSTG Storage Temperature –55 to +125 °C I
OUT DC Output Current 50 mA
NOTE: 2703 tbl 06
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
PIN CONFIGURATION – 7MP4145
(1)
SIMM
TOP VIEW
NOTE:
1. Pins 3,4,6,and 7 (PD
0-3) are read by the user to determine the density of
the module. If PD
0, PD1 read GND and PD2, PD3 read OPEN, then the
module has a 256K depth.
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35
37 39 41 43 45 47 49 51 53 55 57 59 61 63 65 67 69 71
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36
38 40 42 44 46 48 50 52 54 56 58 60 62 64 66 68 70 72
NC PD
2
GND PD
1
I/O8 I/O9 I/O10 I/O11 A0 A1 A2 I/O12 I/O13 I/O14 I/O15 GND A
15
CS
2
CS
4
A17
OE
I/O
24
I/O25 I/O26 I/O27 A3 A4 A5 VCC A6 I/O28 I/O29 I/O30 I/O31 NC NC
NC
PD
3
PD0
I/O0 I/O1 I/O2 I/O3 VCC
A7 A8
A9 I/O4 I/O5 I/O6 I/O7
WE
A
14
CS
1
CS
3
A16 GND I/O
16
I/O17 I/O18 I/O19
A10
A11
A12
A13 I/O20 I/O21 I/O22 I/O23 GND
NC NC
PD
0 - GND
PD
1 - GND
PD
2 - OPEN
PD
3 - OPEN
2703 drw 15
Page 3
15.2 3
IDT7MP4045/7MP4145 256K x 32 CMOS STATIC RAM MODULE COMMERCIAL TEMPERATURE RANGE
Figure 1. Output Load
*Includes scope and jig.
Figure 2. Output Load
(for t
OLZ,tOHZ, tCHZ, tCLZ, tWHZ, tOW)
+5 V
480
30 pF*
DATA
OUT
255
2703 drw 03
+5 V
480
5 pF*
DATA
OUT
255
2703 drw 04
AC TEST CONDITIONS
Input Pulse Levels GND to 3.0V Input Rise/Fall Times 5ns Input Timing Reference Levels 1.5V Output Reference Levels 1.5V Output Load See Figures 1-4
2703 tbl 09
Symbol Parameter Test Conditions Max. Unit
I
CC Dynamic Operating f = fMAX;
CS
= VIL 1360 mA
Current VCC = Max.; Output Open
I
SB Standby Supply
CS
VIH, VCC = Max. 480 mA
Current Outputs Open, f = fMAX
ISB1 Full Standby
CS
VCC – 0.2V; f = 0 120 mA
Supply Current V
IN > VCC – 0.2V or < 0.2V
2703 tbl
2703 tbl 07
DC ELECTRICAL CHARACTERISTICS
(VCC = 5.0V ±10%, TA = 0°C to +70°C)
Symbol Parameter Test Conditions Min. Max. Unit
|I
LI| Input Leakage VCC = Max.; VIN = GND to VCC —80µA
(Address and Control) |ILI| Input Leakage (Data) VCC = Max.; VIN = GND to VCC —10µA |ILO| Output Leakage VCC = Max.; CS = VIH, VOUT = GND to VCC —10µA VOL Output LOW VCC = Min., IOL = 8mA 0.4 V V
OH Output HIGH VCC = Min., IOH = –4mA 2.4 V
Page 4
IDT7MP4045/7MP4145 256K x 32 CMOS STATIC RAM MODULE COMMERCIAL TEMPERATURE RANGE
15.2 4
AC ELECTRICAL CHARACTERISTICS
(VCC = 5V ±10%, TA = 0°C to +70°C)
’4045SxxZ, ’4045/4145SxxM
–15 –20 Symbol Parameter Min. Max. Min. Max. Unit Read Cycle
tRC Read Cycle Time 15 20 ns tAA Address Access Time 15 20 ns tACS Chip Select Access Time 15 20 ns tCLZ
(1)
Chip Select to Output in Low-Z 3 5 ns tOE Output Enable to Output Valid 8 10 ns tOLZ
(1)
Output Enable to Output in Low-Z 0 0 ns tCHZ
(1)
Chip Deselect to Output in High-Z 8 10 ns tOHZ
(1)
Output Disable to Output in High-Z 8 10 ns tOH Output Hold from Address Change 3 3 ns tPU
(1)
Chip Select to Power-Up Time 0 0 ns tPD
(1)
Chip Deselect to Power-Down Time 15 20 ns
Write Cycle
tWC Write Cycle Time 15 20 ns tCW Chip Select to End-of-Write 12 15 ns tAW Address Valid to End-of-Write 12 15 ns tAS Address Set-up Time 0 0 ns tWP Write Pulse Width 12 15 ns tWR Write Recovery Time 0 0 ns tWHZ
(1)
Write Enable to Output in High-Z 8 13 ns tDW Data to Write Time Overlap 10 12 ns tDH Data Hold from Write Time 0 0 ns t
OW
(1)
Output Active from End-of-Write 0 0 ns
NOTE: 2703 tbl 11
1. This parameter is guaranteed by design but not tested.
Page 5
15.2 5
IDT7MP4045/7MP4145 256K x 32 CMOS STATIC RAM MODULE COMMERCIAL TEMPERATURE RANGE
TIMING WAVEFORM OF READ CYCLE NO. 1
(1)
TIMING WAVEFORM OF READ CYCLE NO. 2
(1,2,4)
TIMING WAVEFORM OF READ CYCLE NO. 3
(1,3,4)
OE
t
AA
t
OH
ADDRESS
t
RC
CS
DATA
OUT
t
ACS
t
OHZ
(5)
t
CHZ
(5)
t
OLZ
(5)
2703 drw 07
t
CLZ
(5)
t
OE
2703 drw 08
t
AA
t
OH
t
OH
DATA
OUT
ADDRESS
t
RC
DATA VALID
PREVIOUS DATA VALID
2703 drw 06
tACS
tCHZ
DATAOUT
CS
(5)
tCLZ
(5)
NOTES:
1.WE is HIGH for Read Cycle.
2. Device is continuously selected. CS = V
IL.
3. Address valid prior to or coincident with CS transition LOW.
4.OE = V
IL.
5. Transition is measured ±200mV from steady state. This parameter is guaranteed by design, but not tested.
Page 6
IDT7MP4045/7MP4145 256K x 32 CMOS STATIC RAM MODULE COMMERCIAL TEMPERATURE RANGE
15.2 6
CS
2703 drw 10
tAW
tAS tWR
tDW
DATA
IN
ADDRESS
tWC
WE
tWP
tDH
DATA
OUT
tWHZ
(6)
(4)
(4)
(7)
tOW
OE
(6)
tOHZ
tOHZ
(6)
DATA VALID
(6)
TIMING WAVEFORM OF WRITE CYCLE NO. 1 (
WEWE CONTROLLED)
(1, 2, 3, 7)
CS
2703 drw 11
t
AW
t
AS
t
WR
t
DW
DATA
IN
ADDRESS
t
WC
WE
t
CW
t
DH
DATA VALID
TIMING WAVEFORM OF WRITE CYCLE NO. 2 (
CSCS CONTROLLED)
(1, 2, 3, 5)
NOTES:
1.WE or CS must be HIGH during all address transitions.
2. A write occurs during the overlap (t
WP) of a LOW
CS
and a LOW WE.
3. t
WR is measured from the earlier of
CS
or WE going HIGH to the end of write cycle.
4. During this period, I/O pins are in the output state, and input signals must not be applied.
5. If the CS LOW transition occurs simultaneously with or after the WE LOW transition, the outputs remain in a high-impedance state.
6. Transition is measured ±200mV from steady state with a 5pF load (including scope and jig). This parameter is guaranteed by design, but not tested.
7. If OE is LOW during a WE controlled write cycle, the write pulse width must be the larger of t
WP or (tWHZ + tDW) to allow the I/O drivers to turn off and data
to be placed on the bus for the required t
DW. If
OE
is HIGH during a WE controlled write cycle, this requirement does not apply and the write pulse can
be as short as the specified t
WP.
Page 7
15.2 7
IDT7MP4045/7MP4145 256K x 32 CMOS STATIC RAM MODULE COMMERCIAL TEMPERATURE RANGE
PACKAGE DIMENSIONS 7MP4045 ZIP VERSION
2703 drw 13
7MP4045 SIMM VERSION
2703 drw 12
0.585 MAX.
3.640
3.660
FRONT VIEW
BACK VIEW
0.015
0.025
0.100 TYP.
0.125
0.190
0.250 TYP.
0.050 TYP.
0.100 TYP.
0.365 MAX.
PIN 1
SIDE VIEW
PIN 1
COMPONENT AREA
COMPONENT AREA
0.365 MAX.
0.050 TYP.
FRONT VIEW
BACK VIEW
SIDE VIEW
PIN 1
PIN 1
0.630 MAX.
0.240
0.260
0.390
0.410
0.250 TYP.
3.580
3.588
3.840
3.860
0.045
0.055
COMPONENT AREA
COMPONENT AREA
Page 8
IDT7MP4045/7MP4145 256K x 32 CMOS STATIC RAM MODULE COMMERCIAL TEMPERATURE RANGE
15.2 8
ORDERING INFORMATION
7MP4145 SIMM VERSION
2703 drw 16
0.350 MAX.
0.050 TYP.
FRONT VIEW
BACK VIEW
SIDE VIEW
PIN 1
PIN 1
0.640
0.660
0.240
0.260
0.390
0.410
0.250 TYP.
3.974
3.994
4.240
4.260
0.045
0.055
0.070
0.090
X
Power
X
Speed
X
Package
X
Process/ Temperature Range
Blank
Commercial (0
°
C to +70°C)
ZMFR-4 ZIP (Zig-Zag In-line vertical Package,
7MP4045 only)
FR-4 SIMM (Single In-line Memory Module)
15 20
XXXXX
Device Type
IDT
Speed in Nanoseconds
S
Standard Power
7MP4045 7MP4145
256K x 32 Static RAM Module 256K x 32 Static RAM Module
2703 drw 14
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