Datasheet IDT74FST1616209PV, IDT74FST1616209PF, IDT74FST1616209PA Datasheet (Integrated Device Technology)

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Integrated Device Technology, Inc.
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
FEATURES:
• Bus switches provide zero delay paths
• Extended commercial range of –40°C to +85°C
• Low switch on-resistance: FST163xxx – 4
• TTL-compatible input and output levels
• Available in SSOP, TSSOP and TVSOP
IDT74FST163209
ADVANCE INFORMATION
9-BIT BUS EXCHANGE SWITCH
or source capability. Thus they generate little or no noise of their own while providing a low resistance path for an external driver. These devices connect input and output ports through an n-channel FET. When the gate-to-source junction of this FET is adequately forward-biased the device conducts and the resistance between input and output ports is small. With­out adequate bias on the gate-to-source junction of the FET, the FET is turned off, therefore with no VCC applied, the device has hot insertion capability.
The low on-resistance and simplicity of the connection between input and output ports reduces the delay in this path to close to zero.
The FST163209 provides four 9-bit TTL- compatible ports that support 2 way bus exchange. The S
0-2 pins control the
bus exchange and switch enable functions.
PIN DESCRIPTION
Pin Names I/O Description
A
1, A2
B
1, B2
I/O Buses A
1, A2
, B
1, B2
S
0-2
I Control Pins for Mux and Switch
Enable Functions
3510 drw 01
3510 tbl 01
DESCRIPTION:
The FST163209 belongs to IDT's family of Bus switches. Bus switch devices perform the function of connecting or isolating two ports without providing any inherent current sink
FUNCTIONAL BLOCK DIAGRAM
1A1
S
0
S
1
1
B
1
1 of 9 Channels
Flow Control
1B2
1
A
2
S
2
COMMERCIAL TEMPERATURE RANGE SEPTEMBER 1996
1996 Integrated Device Technology, Inc. DSC-3510/1
1
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2
IDT74FST163209 9-BIT BUS EXCHANGE SWITCH COMMERCIAL TEMPERATURE RANGE
ABSOLUTE MAXIMUM RATINGS
(1)
PIN CONFIGURATION
CAPACITANCE
(1)
FUNCTION TABLE
SSOP/
TSSOP/TVSOP
TOP VIEW
5
6 7 8 9 10
1 2
3 4
46 45 44
43 42 41
40 39
38 37
GND
1A1
1
A
2
GND
2A1
2
A
2
V
CC
3
A
1
3
A
2
1
B
1
1
B
2
2
B
1
2
B
2
GND
3B2
GND
S
1
S
2
4A1
11 12
47
48
4A2
4
B
1
4
B
2
17
18 19 20 21
22
13 14
15 16
34 33 32
31 30 29
28 27
26 25
8A2
5
A
2
GND
6A1
5
A
1
6
A
2
7
A
1
7
A
2
GND
8A1
GND
6B1
6
B
2
7
B
1
7
B
2
GND
8B1
8
B
2
5
B
1
5
B
2
SO48-1 SO48-2 SO48-3
9A1
23 24
35
36
9A2
9
B
1
9
B
2
S
0
3
B
1
S2 S1 S0 A1 A2 Function
L L L Z Z Disconnect LLHB1 ZA1 to B1 LHLB2 ZA1 to B2
LHHZB1 A2 to B1 HLLZB2 A2 to B2 H L H Z Z Disconnect HHLB1 B2 A1 to B1, A2 to B2 HHHB2 B1 A1 to B2, A2 to B1
3510 drw 02
3510 tbl 04
Symbol Description Max. Unit
VTERM
(2)
Terminal Voltage with Respect to GND
–0.5 to +7.0 V
TSTG Storage Temperature –65 to +150 °C IOUT Maximum Continuous Channel
Current
128 mA
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RAT­INGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating condiitions for ex­tended periods may affect reliability.
2. V
CC, Control and Switch terminals.
3510 tbl 02
Symbol Parameter Conditions
(2)
Typ. Unit
CIN Control Input Capacitance 4 pF CI/O
Switch Input/Output Capacitance
Switch Off
pF
3510 tbl 03
NOTES:
1. Capacitance is characterized but not tested
2. T
A = 25°C, f = 1MHz, VIN = 0V, VOUT = 0V
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IDT74FST163209 9-BIT BUS EXCHANGE SWITCH COMMERCIAL TEMPERATURE RANGE
3
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE
Following Conditions Apply Unless Otherwise Specified: Commercial: TA = –40°C to +85°C, VCC = 5.0V ±10%
NOTES:
1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at V
CC = 5.0V, +25°C ambient.
3. Not more than one output should be tested at one time. Duration of the test should not exceed one second.
4. Measured by voltage drop between ports at indicated current through the switch.
3510 tbl 05
Symbol Parameter Test Conditions
(1)
Min. Typ.
(2)
Max. Unit
VIH Input HIGH Voltage Guaranteed Logic HIGH for Control Inputs 2.0 V VIL Input LOW Voltage Guaranteed Logic LOW for Control Inputs 0.8 V II H Input HIGH Current VCC = Max. VI = VCC ——±1µA II L Input LOW Voltage VI = GND ±1 IOZH High Impedance Output Current VCC = Max. VO = VCC ——±1µA IOZL (3-State Output pins) VO = GND ±1 IOS Short Circuit Current VCC = Max., VO = GND
(3)
300 mA VIK Clamp Diode Voltage VCC = Min., IIN = –18mA –0.7 –1.2 V RON Switch On Resistance
(4)
VCC = Min. VIN = 0.0V 4 7 ION = 64mA
VCC = Min. VIN = 0.0V 4 7 ION = 30mA VCC = Min. VIN = 2.4V 6 15
ION = 15mA IOFF Input/Output Power Off Leakage VCC = 0V, VIN or VO 4.5V ±1 µA ICC Quiescent Power Supply Current VCC = Max., VIN = GND or VCC 0.1 3 µA
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IDT74FST163209 9-BIT BUS EXCHANGE SWITCH COMMERCIAL TEMPERATURE RANGE
POWER SUPPLY CHARACTERISTICS
NOTES:
1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at V
CC = 5.0V, +25°C ambient.
3. Per TTL driven input (V
IN = 3.4V). All other inputs at VCC or GND.
4. This parameter is not directly testable, but is derived for use in Total Power Supply Calculations.
5. Values for these conditions are examples of the I
CC formula. These limits are guaranteed but not tested.
6. I
C = IQUIESCENT + IINPUTS + IDYNAMIC
IC = ICC + ICC DHNT + ICCD (fiN) I
CC = Quiescent Current
I
CC = Power Supply Current for a TTL High Input (VIN = 3.4V)
D
H = Duty Cycle for TTL Inputs High
N
T = Number of TTL Inputs at DH
ICCD = Dynamic Current Caused by an Input Transition Pair (HLH or LHL) f
i = Input Frequency
N = Number of Switches Toggling at fi All currents are in milliamps and all frequencies are in megahertz.
SWITCHING CHARACTERISTICS OVER OPERATING RANGE
Following Conditions Apply Unless Otherwise Specified: Commercial: T
A = –40°C to +85°C, VCC = 5.0V ±10%
Symbol Parameter Test Conditions
(1)
Min. Typ.
(2)
Max. Unit
ICC Quiescent Power Supply Current
TTL Inputs HIGH
VCC = Max. V
IN = 3.4V
(3)
0.5 1.5 mA
ICCD Dynamic Power Supply
Current
(4)
VCC = Max. Outputs Open
VIN = VCC VIN = GND
—3040µA/
MHz/ Enable Pin Toggling 50% Duty Cycle
Switch
IC Total Power Supply Current
(6)
VCC = Max. Outputs Open 3 Select Pins Toggling
V
IN = VCC
VIN = GND
2.7 3.6 mA
(9 Switches Toggling) fi = 10MHz 50% Duty Cycle
V
IN = 3.4
V
IN = GND
3.5 5.9
3510 tbl 06
Symbol Description Condition
(1)
Min.
(2)
Typ. Max. Unit
tPLH tPHL
Data Propagation Delay A to B, B to A
(3,4)
CL = 50pF R
L = 500
0.25 ns
tBX Switch Multiplex Delay
S to A, B
1.5 6.5 ns
tPZH tPZL
Switch Turn on Delay S to A, B
1.5 6.5 ns
tPHZ tPLZ
Switch Turn off Delay S to A, B
1.5 7 ns
|QCI| Charge Injection, Typical
(5,7)
1.5 pC
|QDCI| Charge Injection, Typical
(6,7)
0.5
NOTES:
1. See test circuit and waveforms.
2. Minimum limits guaranteed but not tested.
3. This parameter is guaranteed by design but not tested.
4. The bus switch contributes no propagation delay other than the RC delay of the on resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 2.5ns for 50pF load. Since this time is constant and much smaller than the rise/fall times of typical driving signals, it adds very little propagation delay to the system. Propagation delay on the bus switch when used in a system is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side.
5. Measured at switch turn off, load = 50 pF in parallel with 10 M scope probe, V
IN = 0.0 volts.
6. Measured at switch turn off through bus multiplexer, (e.g.- A
1 to B1 = >A1 to B2), load = 50 pF in parallel with 10 M scope probe, VIN at A = 0.0 volts. Charge
injection is reduced because the injection from the turn off of the A to C switch is compensated by the turn on of the B to C switch.
7. Characterized parameter. Not 100% tested.
3510 tbl 07
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IDT74FST163209 9-BIT BUS EXCHANGE SWITCH COMMERCIAL TEMPERATURE RANGE
5
TEST CIRCUITS AND WAVEFORMS TEST CIRCUITS FOR ALL OUTPUTS
SWITCH POSITION
ENABLE AND DISABLE TIMES
PROPAGATION DELAY
PULSE WIDTH
SET-UP, HOLD AND RELEASE TIMES
Test
Switch
Disable Low
Enable Low
Closed
All Other Tests
Open
Open Drain
DEFINITIONS:
C
L= Load capacitance: includes jig and probe capacitance.
R
T = Termination resistance: should be equal to ZOUT of the Pulse
Generator.
NOTES:
1. Diagram shown for input Control Enable-LOW and input Control Disable­HIGH
2. Pulse Generator for All Pulses: Rate 1.0MHz; t
F ≤ 2.5ns; tR 2.5ns
3510 lnk 03
3510 lnk 04
3510 lnk 05
Pulse
Generator
R
T
D.U.T.
V
CC
V
IN
C L
V
OUT
50pF
500
500
7.0V
3V
1.5V 0V
3V
1.5V 0V
3V
1.5V 0V
3V
1.5V
0V
DATA
INPUT
TIMING
INPUT
ASYNCHRONOUS CONTROL
PRESET
CLEAR
ETC.
SYNCHRONOUS CONTROL
tSU
tH
tREM
tSU
tH
HIGH-LOW-HIGH
PULSE
LOW-HIGH-LOW
PULSE
tW
1.5V
1.5V
SAME PHASE
INPUT TRANSITION
3V
1.5V 0V
1.5V
V
OH
tPLH
OUTPUT
OPPOSITE PHASE
INPUT TRANSITION
3V
1.5V 0V
tPLH tPHL
tPHL
VOL
CONTROL
INPUT
3V
1.5V 0V
3.5V
0V
OUTPUT
NORMALLY
LOW
OUTPUT
NORMALLY
HIGH
SWITCH CLOSED
SWITCH OPEN
VOL
0.3V
0.3V
t
PLZtPZL
tPZH tPHZ
3.5V
0V
1.5V
1.5V
ENABLE DISABLE
VOH
PRESET
CLEAR
CLOCK ENABLE
ETC.
3510 lnk 06
3510 lnk 07
3510 lnk 08
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IDT74FST163209 9-BIT BUS EXCHANGE SWITCH COMMERCIAL TEMPERATURE RANGE
Integrated Device Technology, Inc.
2975 Stender Way, Santa Clara, CA 95054-3090 Telephone: (408) 727-6116 FAX 408-492-8674
Integrated Device Technology, Inc. reserves the right to make changes to the specifications in this data sheet in order to improve design or performance and to supply the best possible product.
ORDERING INFORMATION
3510 drw 08
IDT XX
Temp. Range
16 XX
Device Type
X
Package
74 –40°C to +85°C
PV PA PF
163209
Shrink Small Outline Package (SO48-1) Thin Shrink Small Outline Package (SO48-2) Thin Very Small Outline Package (SO48-3)
9-Bit Bus Exchange Switch
FST
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