Datasheet IDT72021L40GB, IDT72021L40JB, IDT72021L50G, IDT72021L50GB, IDT72021L50J Datasheet (Integrated Device Technology Inc)

Integrated Device Technology, Inc.

MILITARY AND COMMERCIAL TEMPERATURE RANGES DECEMBER 1996

1996 Integrated Device Technology, Inc. DSC-2677/7

5.09 1

FEATURES:

• First-In/First-Out Dual-Port memory

• Bit organization
– IDT72021—1K x 9
– IDT72031—2K x 9
– IDT72041—4K x 9

• Ultra high speed
– IDT72021—25ns access time
– IDT72031—35ns access time
– IDT72041—35ns access time

• Easily expandable in word depth and/or width

• Asynchronous and simultaneous read and write

• Functionally equivalent to IDT7202/03/04 with Output
Enable (OE) and Almost Empty/Almost Full Flag (

AEF

)

• Four status flags: Full, Empty, Half-Full (single device
mode), and Almost Empty/Almost Full (7/8 empty or 7/8
full in single device mode)

• Output Enable controls the data output port

• Auto-retransmit capability

• Available in 32-pin DIP and PLCC

• Military product compliant to MIL-STD-883, Class B

• Industrial temperature range (-40

o

C to +85oC) is avail

able, tested to military electrical specifications

DESCRIPTION:

IDT72021/031/041s are high-speed, low-power, dual-port
memory devices commonly known as FIFOs (First-In/First­Out). Data can be written into and read from the memory at
independent rates. The order of information stored and ex­tracted does not change, but the rate of data entering the FIFO
might be different than the rate leaving the FIFO. Unlike a
Static RAM, no address information is required because the
read and write pointers advance sequentially. The IDT72021/
031/041s can perform asynchronous and simultaneous read
and write operations. There are four status flags, (HF, FF, EF,

AEF

) to monitor data overflow and underflow. Output Enable
(OE) is provided to control the flow of data through the output
port. Additional key features are Write (W), Read (R), Retrans­mit (RT), First Load (FL), Expansion In (XI) and Expansion Out
(XO). The IDT72021/031/041s are designed for those appli­cations requiring data control flags and Output Enable (OE) in
multiprocessing and rate buffer applications.

The IDT72021/031/041s are fabricated using IDT’s CMOS
technology. Military grade product is manufactured in compli­ance with the latest version of MIL-STD-883, Class B, for high
reliability systems.

IDT72021
IDT72031
IDT72041

CMOS ASYNCHRONOUS FIFO WITH
RETRANSMIT
1K x 9, 2K x 9, 4K x 9

W

R

XI

2677 drw 01

WRITE

CONTROL

WRITE

POINTER

READ

POINTER

RESET

LOGIC

READ

CONTROL

FLAG

LOGIC

EXPANSION

LOGIC

DATA INPUT

(D

0–D8)

RAM

ARRAY
1024 x 9
2048 x 9
4096 x 9

1
2

DATA OUTPUTS

(Q

0–Q8)

THREE-

STATE

BUFFERS

1024/
2048/

4096

AEF

EF
FF

FL/RT

XO/HF

RS

OE

The IDT logo is a registered trademark of Integrated Device Technology, Inc.
FAST is a trademark of National Semiconductor Co.

FUNCTIONAL BLOCK DIAGRAM

For latest information contact IDT's web site at www.idt.com or fax-on-demand at 408-492-8391.

5.09 2

MILITARY AND COMMERCIAL TEMPERATURE RANGES

IDT72021, IDT72031, IDT72041
CMOS ASYNCHRONOUS FIFO WITH RETRANSMIT 1K x 9, 2K x 9, 4K x 9

PIN CONFIGURATIONS

PIN DESCRIPTIONS

Symbol Name I/O Description

D

0–D8 Inputs I Data inputs for 9-bit wide data.

RS

Reset I When RS is set LOW, internal READ and WRITE pointers are set to the first location of the RAM

array. HF and FF go HIGH, and

AEF

and

EF

go LOW. A reset is required before an initial WRITE

after power-up. R and W must be HIGH during RS cycle.

W

Write I When WRITE is LOW, data can be written into the RAM array sequentially, independent of

READ. In order for WRITE to be active, FF must be HIGH. When the FIFO is full (FF-LOW),
the internal WRITE operation is blocked.

R

Read I When READ is LOW, data can be read from the RAM array sequentially, independent of

WRITE. In order for READ to be active, EF must be HIGH. When the FIFO is empty (EF-LOW),
the internal READ operation is blocked. The three-state output buffer is controlled by the read
signal and the external output control

(OE

).

FL/RT

First Load/ I This is a dual-purpose input. In the single device configuration (XI grounded), activating

retransmit (FL/RT-LOW) will set the internal READ pointer to the first location. There is no effect
on the WRITE pointer. R and W must be HIGH before setting FL/RT LOW. Retransmit is not
compatible with depth expansion. In the depth expansion configuration, FL/RT-LOW indicates
the first activated device.

XI

Expansion In I In the single device configuration, XI is grounded. In depth expansion or daisy chain expansion,

XI

is connected to XO (expansion out) of the previous device.

OE

Output Enable I When OE is set HIGH, the data flow through the three-state output buffer is inhibited regardless

of an active READ operation. A read operation does increment the read pointer in this situation.
When OE is set LOW, Q

0-Q8 are still in a HIGH impedance condition if no READ occurs. For

a complete READ operation with data appearing on Q

0-Q8, both

R

and OE should be asserted

LOW.

FF

Full Flag O When FF goes LOW, the device is full and further WRITE operations are inhibited. When

FF

is HIGH, the device is not full.

EF

Empty Flag O When EF goes LOW, the device is empty and further READ operations are inhibited. When

EF

is HIGH, the device is not empty.

AEF

Almost-Empty/ O When

AEF

is LOW, the device is empty to 1/8 full or 7/8 to completely full. When

AEF

is HIGH,

the device is greater than 1/8 full, but less than 7/8 full.

XO/HF

Expansion Out/ O This is a dual purpose output. In the single device configuration (XI grounded), the device is

more than half full when HF is LOW. In the depth expansion configuration (XO connected to

XI

of the next device), a pulse is sent from XO to XI when the last location in the RAM array is

filled.

Q

0–Q8 Outputs O Data outputs for 9-bit wide data.

Retransmit

Almost-Full Flag

Half-Full Flag

2677 tbl 01

PLCC TOP VIEW

DIP TOP VIEW

D

2

5

D

1

6

D

0

7

XI

8

AEF

9

FF

10

Q

0

11

Q

1

12

Q

2

13

D

6

D

7

FL/RT
RS
OE
EF
XO/HF

Q

7

Q

6

29
28
27
26
25
24
23
22
21

4

3 2132 31 30

14 15 16 17 18 19 20

Q3

Q8

GND

GND

R

Q

4

Q5

D3

D8

W

V

CC

VCCD4D5

INDEX

J32-1

2677 drw 03

VCC
D4

D5

D6

D7

FL/RT
RS
OE

XO/HF

EF

Q

7

Q6
Q5

Q4

R

GND

V

CC

W

D

8

D3
D2
D1
D0

XI

AEF

FF

Q

0

Q1
Q2

Q3
Q8

GND

1
2

3
4

5
6
7
8
9
10

11
12
13
14
15
16

32
31

30
29

28
27
26
25
24

23
22
21
20
19
18
17

D32-1

2677 drw 02

5.09 3

MILITARY AND COMMERCIAL TEMPERATURE RANGES

IDT72021, IDT72031, IDT72041
CMOS ASYNCHRONOUS FIFO WITH RETRANSMIT 1K x 9, 2K x 9, 4K x 9

RECOMMENDED DC
OPERATING CONDITIONS

Symbol Parameter Min. Typ. Max. Unit

V

CCM Military Supply 4.5 5.0 5.5 V

Voltage

V

CCC Commercial 4.5 5.0 5.5 V

Supply Voltage
GND Supply Voltage 0 0 0 V
V

IH Input High Voltage 2.0 — — V

Commercial
V

IH Input High Voltage 2.2 — — V

Military
V

IL

(1)

Input Low Voltage — — 0.8 V

Commercial and

Military

NOTE: 2677 tbl 05

1. 1.5V undershoots are allowed for 10ns once per cycle.

STATUS FLAG

Number of Words in FIFO

1K 2K 4K

FF AEF HF EF

00 0HLHL

1-127 1-255 1-511 H L H H
128-512 256-1024 512-2048 HHHH
513-896 1025-1792 2049-3584 H H L H

897-1023 1793-2047 3585-4095 H L L H

1024 2048 4096 L L L H

CAPACITANCE (TA = +25°C, f = 1.0 MHz)

Symbol Parameter

(1)

Condition Max. Unit

C

IN Input Capacitance V IN = 0V 10 pF

C

OUT Output Capacitance VOUT = 0V 10 pF

NOTE: 2677 tbl 03

1. These parameters are sampled and not 100% tested.

2677 tbl l 02

ABSOLUTE MAXIMUM RATINGS

(1)

Symbol Rating Com’l. Mil. Unit

V

TERM Terminal Voltage –0.5 to +7.0 –0.5 to +7.0 V

with Respect
to GND

T

A Operating 0 to +70 –55 to +125 °C

Temperature

T

BIAS Temperature –55 to +125 –65 to +135 °C

Under Bias

T

STG Storage –55 to +125 –65 to +155 °C

Temperature

I

OUT DC Output 50 50 mA

Current

NOTE: 2677 tbl 04

1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS
may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions
above those indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliabilty.

5.09 4

MILITARY AND COMMERCIAL TEMPERATURE RANGES

IDT72021, IDT72031, IDT72041
CMOS ASYNCHRONOUS FIFO WITH RETRANSMIT 1K x 9, 2K x 9, 4K x 9

DC ELECTRICAL CHARACTERISTICS — IDT72021

(Commercial: VCC = 5.0V±10%, TA = 0°C to +70°C; Military: V CC = 5V±10%, TA = –55°C to +125°C)

IDT72021 IDT72021 IDT72021 IDT72021

Commercial Military Commercial Military

t

A =25,35ns tA =30,40ns tA =50ns tA =50ns

Symbol Parameter Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit

I

LI

(1)

Input Leakage Current –1 — 1 –10 — 10 –1 — 1 –10 — 10 µA
(Any Input)

I

LO

(2)

Output Leakage Current –10 — 10 –10 — 10 –10 — 10 –10 — 10 µA

V

OH Output Logic “1” Voltage 2.4 — — 2.4 — — 2.4 — — 2.4 — — V

I

OH = –2mA

V

OL Output Logic “0” Voltage — — 0.4 — — 0.4 — — 0.4 — — 0.4 V

I

OL = 8mA

I

CC1

(3,4)

Active Power Supply — — 120 — — 140 — 50 80 — 70 100 mA
Current

I

CC2

(3)

Standby Current — — 12 — — 20 — 5 8 — 8 15 mA
(R = W = RS = FL/RT = V

IH)

I

CC3

(3)

Power Down Current — — 500 — — 900 — — 500 — — 900 µA
(All Input = V

CC – 0.2V)

2677 tbl 06

DC ELECTRICAL CHARACTERISTICS — IDT72031, IDT72041

(Commercial: VCC = 5.0V±10%, TA = 0°C to +70°C; Military: VCC = 5V±10%, TA = –55°C to +125°C)

IDT72031 IDT72031

IDT72041 IDT72041
Commercial Military
t

A =35,50ns tA =40,50ns

Symbol Parameter Min. Typ. Max. Min. Typ. Max. Unit

I

LI

(1)

Input Leakage Current (Any Input) –1 — 1 –10 — 10 µA

I

LO

(2)

Output Leakage Current –10 — 10 –10 — 10 µA

V

OH Output Logic “1” Voltage IOUT = –2mA 2.4 — — 2.4 — — V

V

OL Output Logic “0” Voltage IOUT = 8mA — — 0.4 — — 0.4 V

I

CC1

(3,5)

Active Power Supply Current — 75 120 — 100 150 mA

I

CC2

(3)

Standby Current (R = W = RS = FL/RT = VIH)—812—1225mA

I

CC3

(3)

Power Down Current (All Input = VCC – 0.2V) — — 2 — — 4 mA

NOTES: 2677 tbl 07

1. Measurements with 0.4 ≤ VIN ≤ VCC.

2.R ≥ V

IH, 0.4 ≤ VOUT ≤ VCC.

3. I

CC measurements are made with

OE

= HIGH.

4. Tested at f = 20MHz.

5. Tested at f = 15.3 MHz.

5.09 5

MILITARY AND COMMERCIAL TEMPERATURE RANGES

IDT72021, IDT72031, IDT72041
CMOS ASYNCHRONOUS FIFO WITH RETRANSMIT 1K x 9, 2K x 9, 4K x 9

AC ELECTRICAL CHARACTERISTICS — IDT72021

(1)

(Commercial: VCC = 5.0V±10%, TA = 0°C to +70°C; Military: VCC = 5V±10%, TA = –55 °C to +125°C)

Com’l Mil. Com’l Mil. Com’l & Mil.

72021L25 72021L30 72021L35 72021L40 72021L50

Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Unit

f

S Shift Frequency — 28.5 — 25 — 22.2 — 20 — 15 MHz

t

RC

R

Cycle Time 35 — 40 — 45 — 50 — 65 — ns

t

A Access Time — 25 — 30 — 35 — 40 — 50 ns

t

RR

R

Recovery Time 10 — 10 — 10 — 10 — 15 — ns

t

RPW

R

Pulse Width

(2)

25 — 30 — 35 — 40 — 50 — ns

t

RLZ

R

Pulse LOW to Data Bus at Low-Z

(3)

5—5—5 — 5—10—ns

t

WLZ

W

Pulse HIGH to Data Bus at Low-Z

(3,4)

5—5—5 — 5—5—ns

t

DV Data Valid from

R

Pulse HIGH 5 — 5 — 5 — 5 — 5 — ns

t

RHZ

R

Pulse HIGH to Data Bus at High-Z

(3)

— 18 — 20 — 20 — 25 — 30 ns

t

WC

W

Cycle Time 35 — 40 — 45 — 50 — 65 — ns

t

WPW

W

Pulse Width

(2)

25 — 30 — 35 — 40 — 50 — ns

t

WR

W

Recovery Time 10 — 10 — 10 — 10 — 15 — ns

t

DS Data Set-up Time 15 — 18 — 18 — 20 — 30 — ns

t

DH Data Hold Time 0 — 0 — 0 — 0 — 5 — ns

t

RSC

RS

Cycle Time 35 — 40 — 45 — 50 — 65 — ns

t

RS

RS

Pulse Width

(2)

25 — 30 — 35 — 40 — 50 — ns

t

RSS

RS

Set-up Time 25 — 30 — 35 — 40 — 50 — ns

t

RSR

RS

Recovery Time 10 — 10 — 10 — 10 — 15 — ns

t

RTC

RT

Cycle Time 35 — 40 — 45 — 50 — 65 — ns

t

RT

RT

Pulse Width

(2)

25 — 30 — 35 — 40 — 50 — ns

t

RTR

RT

Recovery Time 10 — 10 — 10 — 10 — 15 — ns

t

RSF1

RS

to EF and

AEF

LOW — 35 — 40 — 45 — 50 — 65 ns

t

RSF2

RS

to HF and FF HIGH — 35 — 40 — 45 — 50 — 65 ns

t

REF

R

LOW to EF LOW — 25 — 30 — 30 — 35 — 45 ns

t

RFF

R

HIGH to FF HIGH — 25 — 30 — 30 — 35 — 45 ns

t

RPE

R

Pulse Width After EF HIGH 25 — 30 — 35 — 40 — 50 — ns

t

WEF

W

HIGH to EF HIGH — 25 — 30 — 30 — 35 — 45 ns

t

WFF

W

LOW to EF LOW — 25 — 30 — 30 — 35 — 45 ns

t

WHF

W

LOW to HF LOW — 35 — 40 — 45 — 50 — 65 ns

t

RHF

R

HIGH to HF HIGH — 35 — 40 — 45 — 50 — 65 ns

t

WPF

W

Pulse Width after FF HIGH 25 — 30 — 35 — 40 — 50 — n s

t

RF

R

HIGH to Transitioning

AEF

— 35 — 40 — 45 — 50 — 65 ns

t

WF

W

LOW to Transitioning

AEF

— 35 — 40 — 45 — 50 — 65 ns

t

OEHZ

OE

HIGH to High-Z (Disable)

(3)

0 12 0 15 0 17 0 20 0 25 ns

t

OELZ

OE

LOW to Low-Z (Enable)

(3)

0 12 0 15 0 17 0 20 0 25 ns

t

AOE

OE

LOW Data Valid (Q0–Q8) — 15 — 18 — 20 — 25 — 30 ns

NOTES: 2677 tbl 08

1. Timings referenced as in AC Test Conditions.

2. Pulse widths less than minimum value are not allowed.

3. Values guaranteed by design, not currently tested.

4. Only applies to read data flow-through mode.

5.09 6

MILITARY AND COMMERCIAL TEMPERATURE RANGES

IDT72021, IDT72031, IDT72041
CMOS ASYNCHRONOUS FIFO WITH RETRANSMIT 1K x 9, 2K x 9, 4K x 9

AC ELECTRICAL CHARACTERISTICS — IDT72031, IDT72041

(1)

(Commercial: VCC = 5.0V±10%, TA = 0°C to +70°C; Military: VCC = 5V±10%, TA = –55 °C to +125°C)

Com'l Mil. Com'l and Mil.

72031L35 72031L40 72031L50
72041L35 72041L40 72041L50

Symbol Parameter Min. Max. Min. Max. Min. Max. Unit

f

S Shift Frequency — 22.2 — 20 — 15 MHz

t

RC

R

Cycle Time 45 — 50 — 65 — ns

t

A Access Time — 35 — 40 — 50 ns

t

RR

R

Recovery Time 10 — 10 — 15 — ns

t

RPW

R

Pulse Width

(2)

35 — 40 — 50 — ns

t

RLZ

R

Pulse LOW to Data Bus at Low-Z

(3)

5—5—10—ns

t

WLZ

W

Pulse HIGH to Data Bus at Low-Z

(3,4)

5—5—5—ns

t

DV Data Valid from

R

Pulse HIGH 5 — 5 — 5 — ns

t

RHZ

R

Pulse HIGH to Data Bus at High-Z

(3)

— 20 — 25 — 30 ns

t

WC

W

Cycle Time 45 — 50 — 65 — ns

t

WPW

W

Pulse Width

(2)

35 — 40 — 50 — ns

t

WR

W

Recovery Time 10 — 10 — 15 — ns

t

DS Data Set-up Time 18 — 20 — 30 — ns

t

DH Data Hold Time 0 — 0 — 5 — ns

t

RSC

RS

Cycle Time 45 — 50 — 65 — ns

t

RS

RS

Pulse Width

(2)

35 — 40 — 50 — ns

t

RSS

RS

Set-up Time 35 — 40 — 50 — ns

t

RSR

RS

Recovery Time 10 — 10 — 15 — ns

t

RTC

RT

Cycle Time 45 — 50 — 65 — ns

t

RT

RT

Pulse Width

(2)

35 — 40 — 50 — ns

t

RTR

RT

Recovery Time 10 — 10 — 15 — ns

t

RSF1

RS

to EF and

AEF

LOW — 45 — 50 — 65 ns

t

RSF2

RS

to HF and FF HIGH — 45 — 50 — 65 ns

t

REF

R

LOW to EF LOW — 30 — 35 — 45 ns

t

RFF

R

HIGH to FF HIGH — 30 — 35 — 45 ns

t

RPE

R

Pulse Width After EF HIGH 35 — 40 — 50 — ns

t

WEF

W

HIGH to EF HIGH — 30 — 35 — 45 ns

t

WFF

W

LOW to EF LOW — 30 — 35 — 45 ns

t

WHF

W

LOW to HF LOW — 45 — 50 — 65 ns

t

RHF

R

HIGH to HF HIGH — 45 — 50 — 65 ns

t

WPF

W

Pulse Width after FF HIGH 35 — 40 — 50 — ns

t

RF

R

HIGH to Transitioning

AEF

— 45 — 50 — 65 ns

t

WF

W

LOW to Transitioning

AEF

— 45 — 50 — 65 ns

t

OEHZ

OE

HIGH to High-Z (Disable)

(3)

017020025ns

t

OELZ

OE

LOW to Low-Z (Enable)

(3)

017020025ns

t

AOE

OE

LOW Data Valid (Q0–Q8) — 20 — 25 — 30 ns

NOTES: 2677 tbl 09

1. Timings referenced as in AC Test Conditions.

2. Pulse widths less than minimum value are not allowed.

3. Values guaranteed by design, not currently tested.

4. Only applies to read data flow-through mode.

5.09 7

MILITARY AND COMMERCIAL TEMPERATURE RANGES

IDT72021, IDT72031, IDT72041
CMOS ASYNCHRONOUS FIFO WITH RETRANSMIT 1K x 9, 2K x 9, 4K x 9

AC TEST CONDITIONS

Input Pulse Levels GND to 3.0V
Input Rise/Fall Times 5ns
Input Timing Reference Levels 1.5V
Output Reference Levels 1.5V
Output Load See Figure 1

2677 tbl 10

NOTES:

1.EF, FF, HF, and

AEF

may change status during Reset, but flags will be valid at t

RSC.

2.W and R = V

IH around the rising edge of

RS

.

Figure 2. Reset

Figure 3. Asynchronous Write and Read Operation

NOTE:

1. Assume OE is asserted LOW.

t RSC

t

t RSS

tRSS

t RSF1

RS

W

R

AEF, EF

HF, FF

t

RSR

2677 drw 05

t RSF2

RS

tA

R

tRC

DATA OUT VALID DATA OUT VALID

tRPW

tRLZ tDV

tA

tRHZ

tRR

tWC

t WRtWPW

DATA IN VALID DATA IN VALID

tDS tDH

Q0 –Q8

D0 –D8

2677 drw 06

W

2677 drw 04

30pF*

1.1K

5V

TO

OUTPUT

PIN

680Ω

or equivalent circuit

Figure 1. Output Load

* Includes scope and jig capacitances.

5.09 8

MILITARY AND COMMERCIAL TEMPERATURE RANGES

IDT72021, IDT72031, IDT72041
CMOS ASYNCHRONOUS FIFO WITH RETRANSMIT 1K x 9, 2K x 9, 4K x 9

Figure 4. Full Flag From Last Write to First Read

Figure 5. Empty Flag From Last Read to First Write

Figure 6. Retransmit

NOTE:

1. Assume OE is asserted LOW.

LAST WRITE

R

IGNORED

WRITE

FIRST READ ADDITIONAL

READS

FIRST

WRITE

W

FF

t

WFF

t

RFF

2677 drw 07

LAST READ

W

IGNORED

READ

FIRST WRITE ADDITIONAL

WRITES

FIRST
READ

EF

R

tREF tWEF

2677 drw 08

VALID VALID

tA

DATA OUT

(1)

tRTC

tRT

RT

W,R

AEF, HF, EF, FF

t

RTR

FLAG VALID

2677 drw 09

5.09 9

MILITARY AND COMMERCIAL TEMPERATURE RANGES

IDT72021, IDT72031, IDT72041
CMOS ASYNCHRONOUS FIFO WITH RETRANSMIT 1K x 9, 2K x 9, 4K x 9

Figure 7. Empty Flag Timing

Figure 9. Almost-Empty/Almost-Full Flag and Half-Full Timings

Figure 8. Full Flag Timing

EF

W

R

t WEF

tRPE

2677 drw 10

FF

R

W

tRFF

t

WPF

2677 drw 11

Figure 10. Output Enable and Read Operation Timings

Figure 9. Almost-Empty/Almost-Full Flag and Half-Full Timings

W

tRHF

(7/8 FULL)

ALMOST–EMPTY

(1/8 FULL–1)

HALF–FULL

(1/2)

tWHF

tWF

HALF–FULL + 1

ALMOST–FULL (7/8 FULL + 1)

HALF–FULL (1/2)

(7/8 FULL)

ALMOST–EMPTY (1/8 FULL–1)

(1/8 FULL)

tRF

R

HF

AEF

2677 drw 12

AEF

Q0-8

OE

DATA 1

SECOND READ BY
CONTROLLING

OE

TERMINATE READ CYCLE

HIGH IMPEDANCE

R

DATA 1

t

RC

tRR

tDV

tOEHZ

tOELZ

tAOE

tA

tRLZ

2677 drw 13

5.09 10

MILITARY AND COMMERCIAL TEMPERATURE RANGES

IDT72021, IDT72031, IDT72041
CMOS ASYNCHRONOUS FIFO WITH RETRANSMIT 1K x 9, 2K x 9, 4K x 9

R

W

XO

2677 drw 14

WRITE TO

LAST PHYSICAL

LOCATION

t

XOL

t

XOH

READ FROM

LAST PHYSICAL

LOCATION

t

XOL

t

XOH

Figure 11. Expansion Out

W

XI

R

2677 drw 15

WRITE TO

FIRST PHYSICAL

LOCATION

READ FROM

FIRST PHYSICAL

LOCATION

t XIS

t XIRt XI

t XIS

Figure 12. Expansion In

OPERATING CONFIGURATIONS

SINGLE DEVICE CONFIGURATION

The IDT72021/031/041 is in the Single Device
Configuration when the Expansion In (XI) control input is
grounded (see Figure 13).

WRITE (W)

DATA IN (D)

FULL FLAG (FF)

RESET (RS)

9

READ (R)

9

DATA OUT (Q)
EMPTY FLAG (EF)

RETRANSMIT (RT)

OUTPUT ENABLE (OE)

EXPANSION IN (XI)

HF AEF

2677 drw 16

IDT

72021/031/041

(HALF–FULL FLAG)

Figure 13. Block Diagram of Single 1K/2K/4K x 9 FIFO

5.09 11

MILITARY AND COMMERCIAL TEMPERATURE RANGES

IDT72021, IDT72031, IDT72041
CMOS ASYNCHRONOUS FIFO WITH RETRANSMIT 1K x 9, 2K x 9, 4K x 9

WIDTH EXPANSION CONFIGURATION

Word width may be increased simply by connecting the
corresponding input control signals of multiple devices. Sta­tus flags (EF, FF, HF, and

AEF

) can be detected from any one

Figure 14. Block Diagram of 1K/2K/4K x 18 FIFO Memory Used in Width Expansion Configuration

DATA IN (D)

IDT

72021/031/041

IDT

72021/031/041

WRITE (W)

FULL FLAG (FF)

RESET (RS)

OUTPUT ENABLE (OE)
READ (R)
EMPTY FLAG (EF)
RETRANSMIT (RT)

DATA OUT (Q)

XI XI

9918

9

18

AEF HF

2677 drw 17

AEF HF

9

NOTE:

1. Flag detection is accomplished by monitoring the FF, EF, HF and

AEF

signals on either (any) device used in the width expansion configuration. Do

not connect any output signals together.

DEPTH EXPANSION (DAISY CHAIN) MODE

The IDT72021/031/041 can easily be adapted to applica­tions when the requirements are for greater than 1K/2K/4K
words. Figure 15 demonstrates Depth Expansion using three
IDT72021/031/041s. Any depth can be attained by adding
additional devices. The IDT72021/031/041 operates in the
Depth Expansion configuration when the following conditions
are met:

1. The first device must be designed by grounding the First

Load (FL) control input.

2. All other devices must have FL in the HIGH state.

3. The Expansion Out (XO) pin of each device must be tied

to the Expansion In (XI) pin of the next device. See
Figure 15.

4. External logic is needed to generate a composite Full

Flag (FF) and Empty Flag (EF). This requires the ORing
of all EFs and ORing of all FFs (i.e. all must be set to
generate the correct composite FF or EF). See
Figure 15.

5. The Retransmit (RT) function and Half-Full Flag (HF) are

not available in the Depth Expansion Mode. For addi­tional information refer to Tech Note 9: “Cascading
FIFOs or FIFO Modules”.

COMPOUND EXPANSION MODE

The two expansion techniques described above can be
applied together in a straight forward manner to achieve large
FIFO arrays (see Figure 16).

BIDIRECTIONAL MODE

Applications which require data buffering between two
systems (each system capable of Read and Write operations)
can be achieved by pairing IDT72021/031/041s as shown in
Figure 17. Care must be taken to assure that the appropriate
flag is monitored by each system (i.e., FF is monitored on the
device where W is used; EF is monitored on the device where

R

is used). Both Depth Expansion and Width Expansion may

be used in this mode.

DATA FLOW-THROUGH MODES

Two types of flow-through modes are permitted: a read
flow-through and write flow-through mode. For the read flow­through mode (Figure 18), the FIFO permits the reading of a
single word after writing one word of data into an empty FIFO.
The data is enabled on the bus in (t

WEF + tA) ns after the rising

edge of W, called the first write edge. It remains on the bus until
the R line is raised from LOW-to-HIGH, after which the bus
would go into a three-state mode after tRHZ ns. The EF line
would have a pulse showing temporary deassertion and then
would be asserted. In the interval of time that R was LOW,
more words can be written to the FIFO (the subsequent writes
after the first write edge will be deassert the Empty Flag);
however, the same word (written on the first write edge),
presented to the output bus as the read pointer, would not be
incremented when R was LOW. On toggling R, the other
words that are written to the FIFO will appear on the output bus
as in the read cycle timings.

device. Figure 14 demonstrates an 18-bit word width by using
two IDT72021/031/041 devices. Any word width can be at­tained by adding additional IDT72021/031/041s.

5.09 12

MILITARY AND COMMERCIAL TEMPERATURE RANGES

IDT72021, IDT72031, IDT72041
CMOS ASYNCHRONOUS FIFO WITH RETRANSMIT 1K x 9, 2K x 9, 4K x 9

TABLE I—RESET AND RETRANSMIT

Single Device Configuration/Width Expansion Mode

Inputs Internal Status Outputs

Mode

RS RT XI

Read Pointer Write Pointer

EF FF HF AEF

Reset 0 X 0 Location Zero Location Zero 0 1 1 0
Retransmit 1 0 0 Location Zero Unchanged X X X X

Read/Write 1 1 0 Increment

(1)

Increment

(1)

XXXX

NOTE: 2677 tbl 11

1. Pointer will increment if flag is HIGH.

TABLE II—RESET AND FIRST LOAD TRUTH TABLE

Depth Expansion/Compound Expansion Mode

Inputs Internal Status Outputs

Mode

RS FL XI

Read Pointer Write Pointer

EF FF

Reset First Device 0 0 (1) Location Zero Location Zero 0 1
Reset All Other Devices 0 1 (1) Location Zero Location Zero 0 1

Read/Write 1 X (1) X X X X

NOTE: 2677 tbl 12

1.XI is connected to XO of previous device. See Figure 15. RS = Reset Input FL/RT = First Load/Retransmit, EF = Empty Flag Output, FF = Flag Full Output,

XI

= Expansion Input, HF = Half-Full Flag Output,

AEF

= Almost Empty/Almost Full Flag.

In the write flow-through mode (Figure 18), the FIFO
permits the writing of a single word of data immediately after
reading one word of data from a full FIFO. The R line causes
the FF to be deasserted but the W line, being LOW causes it
to be asserted again in anticipation of a new data word. On the
rising edge of W, the new word is loaded in the FIFO. The

W

line must be toggled when FF is not asserted to write new data
in the FIFO and to increment the write pointer.

For additional information refer to Tech Note 8: “Operating
FIFOs on Full and Empty Boundary Conditions” and Tech
Note 6: “Designing with FIFOs”.

IDT

72021/

031/041

D

W

IDT

72021/

031/041

IDT

72021/

031/041

FF

FF

FF

EF

FL

FL

EF

EF

FL

XO

XI

XO

XI

RS

FULL

EMPTY

V

CC

R

2677 drw 18

9

9

99

XI

XO

9

Q

TRUTH TABLES

Figure 15. Block Diagram of 3K/6K/12K x 9 FIFO Memory (Depth Expansion)

NOTE:

1. IDT only guarantees depth expansion with identical IDT part numbers and speed.

5.09 13

MILITARY AND COMMERCIAL TEMPERATURE RANGES

IDT72021, IDT72031, IDT72041
CMOS ASYNCHRONOUS FIFO WITH RETRANSMIT 1K x 9, 2K x 9, 4K x 9

Figure 16. Compound FIFO Expansion

NOTE:

1. Assume OE is asserted LOW.

IDT72021/

031/041

DEPTH

EXPANSION

BLOCK

IDT72021/

031/041

DEPTH

EXPANSION

BLOCK

IDT72021/

031/041

DEPTH

EXPANSION

BLOCK

R, W, RS

•••

•••

•••

2677 drw 19

Q0–QN

D0–DN

NOTES:

1. For depth expansion block see section od Depth Expansion and Figure 15.

2. For Flag detection see section on Width Expansion and Figure 14.

Figure 18. Read Data Flow-Through Mode

2677 drw 21

DATA OUT VALID

t RPE

t REF

t WEF

t WLZ

t A

EF

R

W

DATA

IN

DATAOUT

(1)

Figure 17. Bidirectional FIFO Mode

IDT

7201A

RB
EFB
HFB

WA

FFA

WB

FFB

SYSTEM A SYSTEM B

QB 0-8

DB 0-8Q

A 0-8

2677 drw 20

RA
HFA
EFA

IDT

72021/

031/041

DA 0-8

AEF

IDT

72021/

031/041

AEF

5.09 14

MILITARY AND COMMERCIAL TEMPERATURE RANGES

IDT72021, IDT72031, IDT72041
CMOS ASYNCHRONOUS FIFO WITH RETRANSMIT 1K x 9, 2K x 9, 4K x 9

Figure 19. Write Data Flow-Through Mode

ORDERING INFORMATION

NOTE:

1. Assume OE is asserted LOW.

2677 drw 22

t

A

R

DATA OUT VALID

DATA IN VALID

t

DS

t

DH

t

WFF

t

WPF

t

RFF

DATA

IN

W

FF

DATA

OUT

(1)

IDT XXXXX

Device Type

X

Speed

X

Power

X

PackageXProcess/

Temperature

Range

Blank
B

D
J

L

72021
72031
72041

25
30
35
40
50

2677 drw 23

Commercial (0°C to+70°C)
Military (–55

°

C to+125°C)

Compliant to MIL-STD-883, Class B

CERDIP
Plastic Leaded Chip Carrier

72021–Com’l. Only
72021–Mil. Only
72021/031/041–Com’l. Only
72021/031/041–Mil. Only
72021/031/041–Com'l & Mil.

Low Power

1024 x 9-Bit FIFO
2048 x 9-Bit FIFO
4096 x 9-Bit FIFO

Access Time (tA)
Speed in Nanoseconds