128K x 8 3.3V SYNCHRONOUS SRAM
WITH ZBT AND FLOW-THROUGH
OUTPUT
ADVANCE
INFORMATION
IDT71V509
FEATURES:
• 128K x 8 memory configuration
• High speed - 66 MHz (9 ns Clock-to-Data Access)
• Flow-Through Output
• No dead cycles between Write and Read Cycles
• Low power deselect mode
• Single 3.3V power supply (±5%)
• Packaged in 44-lead SOJ
DESCRIPTION:
The IDT71V509 is a 3.3V high-speed 1,024,576-bit synchronous SRAM organized as 128K x 8. It is designed to
eliminate dead cycles when turning the bus around between
reads and writes, or writes and reads. Thus, it has been given
the name ZBT, or Zero Bus Turnaround.
Addresses and control signals are applied to the SRAM
FUNCTIONAL BLOCK DIAGRAM
Address
DQ
during one clock cycle, and one clock cycle later its associated
data cycle occurs, be it read or write.
The IDT71V509 contains data, address, and control signal
registers. Output Enable is the only asynchronous signal, and
can be used to disable the output at any time.
A Clock Enable (
CEN
) pin allows operation of the IDT71V509
to be suspended as long as necessary. All synchronous
inputs are ignored when
CEN
is high. A Chip Select (CS) pin
allows the user to deselect the device when desired. If CS is
high, no new memory operation is initiated, but any pending
data transfers (reads and writes) will still be completed.
The IDT71V509 utilizes IDT's high-performance 3.3V CMOS
process, and is packaged in a JEDEC Standard 400-mil 44lead small outline J-lead plastic package (SOJ) for high board
density.
Address
Control
(WE, CS,
Clock
CEN
SRAM
DQ
)
Input Register
DQ
Clk
Control Logic
OE
Control
Gate
DIDO
Mux
Data
Sel
3618 drw 01
The IDT logo is a registered trademark and CacheRAM, Zero Bus Turnaround and ZBTare trademarks of Integrated Device Technology, Inc.
Pentium is a trademark of Intel Corp.
PowerPC is a trademark of International Business Machines, Inc.
5. Pin 36 does not need to be connected directly to VDD, as long as it is ≥ VIH.
3618 drw 02
PIN DEFINITIONS
TOP VIEW
(1)
SymbolPin FunctionI/OActiveDescription
A
0-A16Address InputsIN/ASynchronous Address inputs. The address is registered on every rising edge
of CLK if
CEN
and CS are both low.
CLKClockIN/AThe clock input. Except for OE, all input and output timing references for the
device are with respect to the rising edge of CLK.
CEN
Clock EnableILOWSynchronous clock enable input. When
CEN
is sampled high, the other
synchronous inputs are ignored, and outputs remain unchanged. When
is sampled low, the IDT71V509 operates normally.
CS
Chip SelectILOWSynchronous chip select input. When CS is sampled low, the device operates
normally. When CS is sampled high, no read or write operation is initiated,
and the I/O bus is tri-stated the next cycle. CS is ignored if
CEN
is high at
the same rising edge of CLK.
WE
Write EnableILOWSynchronous write enable. If WE is sampled low, a write is initiated at the
address that is registered at that time. If WE is sampled high, a read is initiated
at the address that is registered at that time. WE is ignored when either
or CS is sampled high.
OE
Output EnableILOWAsynchronous output enable. When OE is high, the I/O bus goes high
impedance. OE must be low to read data from the IDT71V509.
I/O
0-I/O7Data Input/Output I/ON/ASynchronous data input/output (I/O) pins. Both the data input path and data
output path are registered and triggered by the rising edge of CLK.
DDPower SupplyN/AN/A3.3V power supply pins.
V
V
SSGroundN/AN/AGround pins.
CEN
CEN
11.32
Page 3
IDT71V509
128K X 8 3.3V SYNCHRONOUS SRAM WITH ZBT AND FLOW-THROUGH OUTPUTCOMMERCIAL TEMPERATURE RANGE
FUNCTIONAL TIMING DIAGRAM
CYCLE
CLOCK
ADDRESS
(A0 - A16)
CONTROL
(CS,
CEN, WE
DATA
(I/O0 - I/O7)
n+29
A29
C29
)
D28
TYPICAL OPERATION -
n+30
A30
C30
D29
CSCS AND
n+31
A31
C31
D30
CEN
ARE LOW
CEN
n+32
A32
C32
D31
n+33
A33
C33
D32
n+34
A34
C34
D33
n+35
A35
C35
D34
n+36
A36
C36
D35
n+37
A37
C37
D36
3618 drw 03
CycleAddress
WE
WE
CSCSCEN
CENOEOE
I/OComments
nA0HLL?D-1?
n+1A1LLLLD0Data Out
n+2A2HLLXD1Data In
n+3A3LLLLD2Data Out
n+4A4HLLXD3Data In
n+5A5LLLLD4Data Out
n+6A6HLLXD5Data In
n+7A7LLLLD6Data Out
n+8A8HLLXD7Data In
n+9A9LLLLD8Data Out
n+10A10HLLXD9Data In
n+11A11HLLLD10Data Out
n+12A12LLLLD11Data Out
n+13A13LLLXD12Data In
n+14A14HLLXD13Data In
n+15A15HLLLD14Data Out
n+16A16HLLLD15Data Out
n+17A17LLLLD16Data Out
n+18A18LLLXD17Data In
n+19A19LLLXD18Data In
n+20A20HLLXD19Data In
n+21A21HLLLD20Data Out
11.33
Page 4
IDT71V509
128K x 8 3.3V SYNCHRONOUS SRAM WITH ZBT AND FLOW-THROUGH OUTPUTCOMMERCIAL TEMPERATURE RANGE
READ OPERATION
CycleAddress
WE
WE
CSCSCEN
CENOEOE
I/OComments
nA0HLLXXAddress and Control meet setup
n+1XXXXLD0Contents of Address A0 Read Out
H = High; L = Low; X = Don’t Care; ? = Don’t Know; Z = High Impedance3618 tbl 02
WRITE OPERATION
CycleAddress
nA0LLLXXAddress and Control meet setup
n+1XXXLXD0New Data Drives SRAM Inputs
H = High; L = Low; X = Don’t Care; ? = Don’t Know; Z = High Impedance3618 tbl 03
WE
WE
CSCSCEN
CENOEOE
I/OComments
READ OPERATION WITH CLOCK ENABLE USED
CycleAddress
nA0HLLXXAddress and Control meet setup
n+1XXXHLD0Contents of Address A0 Read Out
n+2A2HLLLD0Contents of Address A0 Read Out
n+3XXXHLD2Contents of Address A2 Read Out
n+4XXXHLD2Contents of Address A2 Read Out
n+5A5HLLLD2Contents of Address A2 Read Out
n+6A6HLLLD5Contents of Address A5 Read Out
n+7 A7?LLLD6Contents of Address A6 Read Out
H = High; L = Low; X = Don’t Care; ? = Don’t Know; Z = High Impedance3618 tbl 04
WE
WE
CSCSCEN
CENOEOE
I/OComments
WRITE OPERATION WITH CLOCK ENABLE USED
CycleAddress
nA0LLLXXAddress and Control meet setup
n+1XXXHXXClock Ignored at n+1 to n+2 Low-to-High
n+2A2LLLXD0New Data Drives SRAM Inputs
n+3XXXHXXClock Ignored at n+3 to n+4 Low-to-High
n+4XXXHXXClock Ignored at n+4 to n+5 Low-to-High
n+5A5LLLXD2New Data Drives SRAM Inputs
n+6A6LLLXD5New Data Drives SRAM Inputs
n+7A7?LLXD6New Data Drives SRAM Inputs
H = High; L = Low; X = Don’t Care; ? = Don’t Know; Z = High Impedance3618 tbl 05
WE
WE
CSCSCEN
CENOEOE
I/OComments
11.34
Page 5
IDT71V509
128K X 8 3.3V SYNCHRONOUS SRAM WITH ZBT AND FLOW-THROUGH OUTPUTCOMMERCIAL TEMPERATURE RANGE
READ OPERATION WITH CHIP SELECT USED
CycleAddress
WE
WE
CSCSCEN
CENOEOE
I/OComments
nXXHLX?Deselected
n+1XXHLXZDeselected
n+2A2HLLXZAddress and Control meet setup
n+3XXHLLD2Deselected, Contents of Address A2 Read Out
n+4A4HLLXZAddress and Control meet setup
n+5XXHLLD4Deselected, Contents of Address A4 Read Out
n+6XXHLXZDeselected
n+7A7HLLXZAddress and Control meet setup
n+8XXHLLD7Deselected, Contents of Address A7 Read Out
n+9XXHLXZDeselected
H = High; L = Low; X = Don’t Care; ? = Don’t Know; Z = High Impedance3618 tbl 06
WRITE OPERATION WITH CHIP SELECT USED
CycleAddress
nXXHLX?Deselected
n+1XXHLXZDeselected
n+2A2LLLXZAddress and Control meet setup
n+3XXHLXD2Deselected, New Data Drives SRAM Inputs
n+4A4LLLXZAddress and Control meet setup
n+5XXHLXD4Deselected, New Data Drives SRAM Inputs
n+6XXHLXZDeselected
n+7A7LLLXZAddress and Control meet setup
n+8XXXLXD7Deselected, New Data Drives SRAM Inputs
n+9XXXLXZDeselected
H = High; L = Low; X = Don’t Care; ? = Don’t Know; Z = High Impedance3618 tbl 07
WE
WE
CSCSCEN
CENOEOE
I/OComments
11.35
Page 6
IDT71V509
128K x 8 3.3V SYNCHRONOUS SRAM WITH ZBT AND FLOW-THROUGH OUTPUTCOMMERCIAL TEMPERATURE RANGE
ABSOLUTE MAXIMUM RATINGS
(1)
SymbolRatingCom’l.Unit
(2)
V
TERM
Terminal Voltage with–0.5 to +4.6V
Respect to GND
(3)
V
TERM
Terminal Voltage with –0.5 to VDD+0.5V
Respect to GND
T
AOperating Temperature0 to +70°C
BIASTemperature Under Bias–55 to +125°C
T
STGStorage Temperature–55 to +125°C
T
P
TPower Dissipation1.0W
I
OUTDC Output Current50mA
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM
RATINGS may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other
conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
DD and Input terminals only.
2. V
3. I/O terminals.
RECOMMENDED DC OPERATING
CONDITIONS
SymbolParameterMin. Typ.Max. Unit
VDDSupply Voltage3.135 3.33.465V
VSSSupply Voltage000V
VIHInput High Voltage - Inputs2.0—4.6V
VIHInput High Voltage - I/O2.0—VDD+0.3 V
ILInput Low Voltage–0.3
V
NOTE:
IL (min.) = –1.5V for pulse width less than 5 ns, once per cycle.
1. V
(1)
—0.8V
CAPACITANCE
(TA = +25°C, f = 1.0MHz, SOJ package)
SymbolParameter
INInput CapacitanceVIN = 3dV6pF
C
I/OI/O CapacitanceVOUT = 3dV7pF
C
NOTE:
1. This parameter is guaranteed by device characterization, but not production tested.
(1)
ConditionsMax.Unit
DC ELECTRICAL CHARACTERISTICS OVER THE OPERATING
TEMPERATURE AND SUPPLY VOLTAGE RANGE
SymbolParameterTest ConditionMin.Max.Unit
LI|Input Leakage CurrentVDD = Max., VIN = 0V to VDD—5µA
|I
LO|Output Leakage Current
|I
OLOutput Low VoltageIOL = 5 mA, VDD = Min.—0.4V
V
V
OHOutput High VoltageIOH = –5 mA, VDD = Min.2.4—V
CS
≥ VIH, VOUT = 0V to VDD, VDD = Max.—5µA
(VDD = 3.3V ±5%)
DC ELECTRICAL CHARACTERISTICS OVER THE OPERATING
TEMPERATURE AND SUPPLY VOLTAGE RANGE
SymbolParameterTest Condition71V509S66 71V509S50 Unit
DDOperating Power
I
Supply CurrentV
ISBStandby Power
Supply CurrentV
ISB1Full Standby Power
Supply CurrentV
NOTES:
1. All values are maximum guaranteed values.
2. At f = f
MAX, address inputs are switching at 1/tCYC and CLK is cycling at 1/tCYC; f=0 means no input signals are changing.
CS
≤ VIL, Outputs Open, VDD = Max.,150120mA
IN ≥ VIH or ≤ VIL, f = fMAX
CS
≥ VIH, Outputs Open, VDD = Max.,5045mA
IN ≥ VIH or ≤ VIL, f = fMAX
CS
≥ VHD, Outputs Open, VDD = Max.,1010mA
IN ≥ VHD or ≤ VLD, f = 0
(2)
(1)
(VDD = 3.3V ±5%, VHD = VDD - 0.2V, VLD = 0.2V)
(2)
(2)
11.36
Page 7
IDT71V509
128K X 8 3.3V SYNCHRONOUS SRAM WITH ZBT AND FLOW-THROUGH OUTPUTCOMMERCIAL TEMPERATURE RANGE
AC ELECTRICAL CHARACTERISTICS
(VDD = 3.3V ±5%, TA = 0 to 70°C)
IDT71V509S66IDT71V509S50
SymbolParameterMin.Max.Min.Max.Unit
Clock Parameters
fMAXClock Frequency—66—50MHz
CYCClock Cycle Time15—20—ns
t
CHClock High Pulse Width5—6—ns
t
CLClock Low Pulse Width5—6—ns
t
Output Parameters
tCDClock High to Valid Data—9—10ns
CDCClock High to Data Change2—2—ns
t
(1)
t
CLZ
(1)
CHZ
t
OEOutput Enable Access Time—6—7ns
t
(1)
t
OLZ
(1)
OHZ
t
Clock High to Output Active2—2—ns
Clock High to Data High-Z2526ns
Output Enable Low to Data Active0—0—ns
Output Enable High to Data High-Z—5—6ns