JEDEC revolutionary pinout (center power/GND) for
reduced noise
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◆
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Commercial (0°C to +70°C) and Industrial (–40°C to
+85°C) temperature options
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Equal access and cycle times
— Industrial and Commercial: 15/20ns
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One Chip Select plus one Output Enable pin
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Bidirectional inputs and outputs directly
LVTTL-compatible
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Low power consumption via chip deselect
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Available in 32-pin 400 mil Plastic SOJ.
Functional Block Diagram
3.3V CMOS Static RAM
1 Meg (128K x 8-Bit)
Revolutionary Pinout
Description
The IDT71V124 is a 1,048,576-bit high-speed static RAM organized as 128K x 8. It is fabricated using IDT’s high-performance, highreliability CMOS technology. This state-of-the-art technology, combined with innovative circuit design techniques, provides a costeffective solution for high-speed memory needs. The JEDEC center
power/GND pinout reduces noise generation and improves system
performance.
The IDT71V124 has an output enable pin which operates as fast as
7ns, with address access times as fast as 15ns available. All bidirectional inputs and outputs of the IDT71V124 are LVTTL-compatible and
operation is from a single 3.3V supply. Fully static asynchronous
circuitry is used; no clocks or refreshes are required for operation.
The IDT71V124 is packaged in 32-pin 400 mil Plastic SOJ.
IDT71V124, 3.3V CMOS Static RAM
1 Meg (128K x 8-Bit), Revolutionary Pinout Commercial and Industrial Temperature Ranges
Pin Configuration
Absolute Maximum Ratings
(1)
A
A
A
A
CS
I/O
I/O
V
DD
GND
I/O
I/O
WE
A
A
A
A
0
A
1
2
3
0
1
2
3
4
5
6
7
1
2
3
4
5
6
SO32-3
7
8
9
10
11
12
1320
1419
1518
16
32
31
30
29
28
27
26
25
24
23
22
21
17
SOJ
16
A
15
A
14
A
13
OE
I/O
I/O
GND
V
DD
I/O
I/O
A
12
A
11
A
10
A
9
A
8
3484 drw 02
7
6
5
4
Top View
Truth Table
CSOEWEI/OFunction
LLHDATA
LXLDATA
LHHHigh-ZOutput Disabled
HXXHigh-ZDeselected – St andby (I
(3)
XXHigh-ZDeselected – Standby (I
V
HC
NOTES:
1. H = VIH, L = VIL, x = Don't care.
2. VLC = 0.2V, VHC = VDD –0.2V.
3. Other inputs ≥VHC or ≤VLC.
(1,2)
OUT
Read Data
IN
Write Dat a
SB
)
PART IN
SB1
3484 tbl 01
Capacitance
(TA = +25°C, f = 1.0MHz, SOJ package)
SymbolParameter
C
IN
Input CapacitanceVIN = 3dV8pF
C
I/O
I/O C apacitanceV
NOTE:
1. This parameter is guaranteed by device characterization, but is not production
tested.
(1)
OBSOLESCENCE
ConditionsMax.Unit
ORDER 71V124SA
OUT
= 3dV8pF
3484 tbl 03
FOR NEW DESIGNS
SymbolRatingValueUnit
V
TERM
(2)
Te rm in a l V o lt a ge wi t h
–0.5 to +4. 1
(2)
Respect to GND
T
A
T
BIAS
T
STG
P
T
I
OUT
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliabilty.
2. VTERM must not exceed VDD + 0.5V.
Operating Temperature0 to +70
Temp e rature Und er B ias–55 to + 125
Storage Temperature–55 to +125
Po we r Di ss i p atio n0.5W
DC Output Current50mA
Recommended Operating
Temperature and Supply Voltage
GradeTemperatureGNDV
Commercial0° C to +70°C0VSe e B elo w
Indus trial–40°C to +85° C0VSee B e lo w
)
Recommended DC Operating
Conditions
SymbolParameterMin.Typ.Max.Unit
DDSupp ly Vol tage3.03.33.6V
V
GNDGround000V
V
IHInp ut Hi g h Vo l tag e2.0
V
ILInpu t Lo w Vo l tag e–0. 3
NOTE:
1. VIL (min.) = –1V for pulse width less than 5ns, once per cycle.
____
VDD +0.3V
(1)
____
V
o
o
o
3484 t bl 02
DD
3484 tbl 02a
0.8V
3484 tbl 04
C
C
C
DC Electrical Characteristics
(VDD = 3.3V ± 10%, Commercial and Industrial Temperature Ranges)
SymbolParameterTest Condition
|I
LI|In put Leakage C urrentVDD = Max., VIN = GND to VDD
1. A write occurs during the overlap of a LOW CS and a LOW WE.
2. OE is continuously HIGH. During a WE controlled write cycle with OE LOW, tWP must be greater than or equal to tWHZ + tDW to allow the I/O drivers to turn off and data to be
placed on the bus for the required tDW. If OE is HIGH during a WE controlled write cycle, this requirement does not apply and the minimum write pulse is the specified tWP.
3. During this period, I/O pins are in the output state, and input signals must not be applied.
4. If the CS LOW transition occurs simultaneously with or after the WE LOW transition, the outputs remain in a high impedance state. CS must be active during the tCW write
period.
5. Transition is measured ±200mV from steady state.
(1,4)
3484 drw 08
6.42
6
IDT71V124, 3.3V CMOS Static RAM
T
1 Meg (128K x 8-Bit), Revolutionary Pinout Commercial and Industrial Temperature Ranges
Ordering Information
ID
71V124
Device
Type
S
PowerXXSpeedXPackage
X
Process/
Temperature
Range
Blank
I
Y400-milSOJ(SO32-3)
15
20
Commerc ial (0°C to +70°C)
Industrial (-40°C to +85°C)
Speed in nanoseconds
3484 drw 09
PART IN
OBSOLESCENCE
ORDER 71V124SA
FOR NEW DESIGNS
6.42
7
IDT71V124, 3.3V CMOS Static RAM
1 Meg (128K x 8-Bit), Revolutionary Pinout Commercial and Industrial Temperature Ranges
Datasheet Document History
11/1/99Updated to new format
Pg. 2Expressed commercial and industrial temperature ranges on DC Electrical table
Pg. 2Added Recommended Operating Temperature and Supply Voltage table
Pg. 4Expressed commercial and industrial ranges on AC Electrical table
Pg. 4Revised footnotes and notes on AC Electrical table
Pg. 6Revised footnotes on Write Cycle No. 1 diagram
Pg. 8Added datasheet document history
08/30/00Part in obsolescence; order part 71V124SA. See PDN# S-0004
PART IN
OBSOLESCENCE
CORPORATE HEADQUARTERSfor SALES:for Tech Support:
2975 Stender Way800-345-7015 or 408-727-6116sramhelp@idt.com
Santa Clara, CA 95054fax: 408-492-8674800-544-7726, x4033
ORDER 71V124SA
FOR NEW DESIGNS
www.idt.com
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
8
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