Datasheet IDT7187L25DB, IDT7187L35DB, IDT7187L35L22B, IDT7187L45DB, IDT7187L55DB Datasheet (Integrated Device Technology Inc)

...
Integrated Device Technology, Inc.
CMOS STATIC RAM 64K (64K x 1-BIT)
IDT7187S IDT7187L
FEATURES:
• High speed (equal access and cycle time) — Military: 25/35/45/55/70/85ns (max.)
• Battery backup operation—2V data retention (L version only)
• JEDEC standard high-density 22-pin ceramic DIP, 22-pin leadless chip carrier
• Produced with advanced CMOS high-performance technology
• Separate data input and output
• Input and output directly TTL-compatible
• Military product compliant to MIL-STD-883, Class B
FUNCTIONAL BLOCK DIAGRAM
A
DESCRIPTION:
The IDT7187 is a 65,536-bit high-speed static RAM organized as 64K x 1. It is fabricated using IDT’s high­performance, high-reliability CMOS technology. Access times as fast as 25ns are available.
Both the standard (S) and low-power (L) versions of the IDT7187 provide two standby modes—ISB and ISB1. ISB provides low-power operation; ISB1 provides ultra-low-power operation. The low-power (L) version also provides the capa­bility for data retention using battery backup. When using a 2V battery, the circuit typically consumes only 30µW.
Ease of system design is achieved by the IDT7187 with full asynchronous operation, along with matching access and cycle times. The device is packaged in an industry standard 22-pin, 300 mil ceramic DIP, or 22-pin leadless chip carriers.
Military grade product is manufactured in compliance with the latest revision of MIL-STD-883, Class B, making it ideally suited to military temperature applications demanding the highest level of performance and reliability.
DATA
A
A
A
A
A
A
CS
IN
WE
ROW
SELECT
65,536-BIT
MEMORY ARRAY
COLUMN I/O
AAAAAAA
V
CC
GND
DATA
2986 drw 01
OUT
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
MILITARY TEMPERATURE RANGE AUGUST 1996
1996 Integrated Device Technology, Inc. 2986/7 For latest information contact IDT's web site at www.idt.com or fax-on-demand at 408-492-8391.
6.2
1
IDT7187S/L CMOS STATIC RAM 64K (64K x 1-BIT) MILITARY TEMPERATURE RANGE
PIN CONFIGURATIONS
0
1
A0
2
A1
3
A2
4
A3
5
A4
6
A
5
A6 A7
DATA
OUT
WE
GND CS
D22-1
7 8 9 10 11
22 21
20 19
18 17 16 15 14 13 12
VCC A15 A14 A13 A12 A11 A10 A9 A8 DATAIN
2986 drw 02
INDEX
A2 A3
A4
A5 A6 A7
DATAOUT
1
A
2
3 4
5
L22-1
6 7 8 9
10 11 12 13
WE
A
1
GND
VCC
22 21
CS
15
A
20 19 18 17
16 15 14
IN
2986 drw 03
DATA
A14 A13 A12 A11 A10 A A8
9
DIP
TOP VIEW
PIN DESCRIPTIONS
Name Description
A
0–A15 Address Inputs
CS
WE
V
CC Power
DATA
IN Data Input
DATA
OUT Data Output
GND Ground
Chip Select
Write Enable
2986 tbl 01
22-PIN LCC
TOP VIEW
CS
CS
(1)
WE
WE
Output Power
TRUTH TABLE
Mode
Standby H X High-Z Standby
Read L H D
OUT Active
Write L L High-Z Active
NOTE: 2986 tbl 02
1. H = VIH, L = VIL, X = don't care.
6.2 2
IDT7187S/L CMOS STATIC RAM 64K (64K x 1-BIT) MILITARY TEMPERATURE RANGE
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol Rating Com’l. Mil. Unit
V
TERM Terminal Voltage –0.5 to +7.0 –0.5 to +7.0 V
with Respect
to GND
T
A Operating 0 to +70 –55 to +125 °C
Temperature
T
BIAS Temperature –55 to +125 –65 to +135 °C
Under Bias
T
STG Storage –55 to +125 –65 to +150 °C
Temperature
P
T Power Dissipation 1.0 1.0 W
I
OUT DC Output 50 50 mA
Current
NOTE: 2986 tbl 03
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
CAPACITANCE (TA = +25°C, F = 1.0MHZ)
Symbol Parameter
C
IN Input Capacitance VIN = 0V 8 pF
C
OUT Output Capacitance VOUT = 0V 8 pF
NOTE: 2986 tbl 04
1. This parameter is determined by device characterization, but is not production tested.
(1)
Conditions Max. Unit
RECOMMENDED DC OPERATING CONDITIONS
Symbol Parameter Min. Typ. Max. Unit
V
CC Supply Voltage 4.5 5.0 5.5 V
G
ND Supply Voltage 0 0 0 V
V
IH Input High Voltage 2.2 6.0 V
V
IL Input Low Voltage –0.5
NOTE: 2986 tbl 05
1. VIL (min.) = –3.0V for pulse width less than 20ns, once per cycle.
(1)
0.8 V
RECOMMENDED OPERATING TEMPERATURE AND SUPPLY VOLTAGE
Grade Temperature GND VCC
Military –55°C to +125°C 0V 5V ± 10%
Commercial 0°C to +70°C 0V 5V ± 10%
2986 tbl 06
DC ELECTRICAL CHARACTERISTICS
(VCC = 5.0V ± 10%)
IDT7187S IDT7187L
Symbol Parameter Test Condition Min. Max. Min. Max. Unit
|I
LI| Input Leakage Current VCC = Max., MIL. 10 5 µA
V
IN = GND to VCC COM’L. 5 2
|I
LO| Output Leakage Current VCC = Max.,
V
OUT = GND to VCC COM’L. 5 2
V
OL Output Low Voltage IOL = 10mA, VCC = Min. 0.5 0.5 V
I
OL = 8mA, VCC = Min. 0.4 0.4
V
OH Output High Voltage IOH = –4mA, VCC = Min. 2.4 2.4 V
CS
= VIH, MIL. 10 5 µ A
2986 tbl 07
6.2 3
IDT7187S/L CMOS STATIC RAM 64K (64K x 1-BIT) MILITARY TEMPERATURE RANGE
DC ELECTRICAL CHARACTERISTICS
(1)
(VCC = 5V ± 10%, VLC = 0.2V, VHC = VCC - 0.2V)
7187S25 7187S35 7187S45 7187S55/70 7187S85 7187L25 7187L35 7187L45 7187L55/70 7187L85
Symbol Parameter Power Com’l. Mil. Com’l. Mil. Com’l. Mil. Com’l. Mil. Com’l. Mil. Unit
CC1 Operating Power S 105 105 105 105 105 mA
I
Supply Current
CS
= V
IL, Outputs Open L 85 85 85 85 85
VCC = Max., f = 0
ICC2 Dynamic Operating S 130 120 120 120 120 mA
Current
CS
= V
IL, Outputs Open L 110 100 95 90 90
VCC = Max., f = fMAX
ISB Standby Power Supply S 55 50 50 50 50 mA
Current (TTL Level)
CS
V
IH, VCC = Max., L 50 40 35 30/28 28
Outputs Open, f = fMAX
ISB1 Full Standby Power S 20 20 20 20 20 mA
Supply Current (CMOS Level) CS V V
CC=Max., VIN VHC or
V
IN VLC, f = 0
NOTES: 2986 tbl 08
1. All values are maximum guaranteed values.
2. At f = f
MAX address and data inputs are cycling at the maximum frequency of read cycles of 1/tRC. f = 0 means no input lines change.
(2)
(2)
(2)
HC, L 1.5 1.5 1.5 1.5 1.5
(2)
DATA RETENTION CHARACTERISTICS OVER ALL TEMPERATURE RANGES
(L Version Only) VHC = VCC - 0.2V, VLC = 0.2V
(1)
Typ.
V
CC @VCC @
Symbol Parameter Test Condition Min. 2.0v 3.0V 2.0V 3.0V Unit
DR VCC for Data Retention 2.0 V
V
CCDR Data Retention Current MIL. 10 15 600 900 µA
I
COM’L. 10 15 150 225
(3)
t
CDR
(3)
tR
(3)
LI|
|I
NOTES: 2986 tbl 09
1. TA = +25°C.
RC = Read Cycle Time.
2. t
3. This parameter is guaranteed, but not tested.
Chip Deselect to Data Retention Time V
Operation Recovery Time tRC
CS
VHC 0————ns
IN VHC or VLC
(2)
————ns
Input Leakage Current 2 2 µA
Max.
LOW VCC DATA RETENTION WAVEFORM
DATA
RETENTION
MODE
VCC
tCDR
4.5V
DR ≥2V
V
4.5V
tR
CS
V
IH
DR
V
6.2 4
VIH
2986 drw 04
IDT7187S/L CMOS STATIC RAM 64K (64K x 1-BIT) MILITARY TEMPERATURE RANGE
AC TEST CONDITIONS
Input Pulse Levels GND to 3.0V Input Rise/Fall Times 5ns Input Timing Reference Levels 1.5V Output Reference Levels 1.5V AC Test Load See Figures 1 and 2
2986 tbl 10
5V
480
5pF*
2986 drw 06
DATA
5V
480
OUT
255
Figure 1. AC Test Load Figure 2. AC Test Load
30pF*
2986 drw 05
*Includes scope and jig capacitances
DATA
OUT
255
(for t
HZ, tLZ, tWZ and tOW)
AC ELECTRICAL CHARACTERISTICS (VCC = 5.0V ± 10%, All Temperature Ranges)
7187S25 7187S35/45 7187L25 7187L35/45
(1) (1)
7187S55 7187L55
Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Unit
Read Cycle
tRC Read Cycle Time 25 35/45 55 70 85 ns tAA Address Access Time 25 35/45 — 55 70 85 ns tACS Chip Select Access Time 25 35/45 — 55 70 85 ns tOH Output Hold from Address Change 5 5 5 5 5 ns
(2)
tLZ tHZ tPU
PD
t
NOTES: 2986 tbl 11
1. –55°C to +125°C temperature range only.
2. This parameter guaranteed but not tested.
Output Selection to Output in Low-Z 5 5 5 5 5 ns
(2)
Chip Deselect to Output in High-Z 12 17/20 — 30 30 40 ns
(2)
Chip Select to Power-Up Time 0 0 0 0 0 ns
(2)
Chip Deselect to Power-Down Time 20 30/35 — 35 35 40 ns
(1) (1)
7187S70
7187L70
(1) (1)
7187S85 7187L85
(1) (1)
6.2 5
IDT7187S/L CMOS STATIC RAM 64K (64K x 1-BIT) MILITARY TEMPERATURE RANGE
TIMING WAVEFORM OF READ CYCLE NO. 1
ADDRESS
tAA
tOH
DATA
OUT
PREVIOUS DATA VALID
TIMING WAVEFORM OF READ CYCLE NO. 2
CS
(4)
tLZ
DATAOUT
tPU
V
CC
SUPPLY
CURRENT
ICC ISB
(1,2)
(1,3)
tACS
tRC
tRC
(5)
(5)
DATA VALID
DATA VALID
2986 drw 07
(4)
HZ
t
HIGH
IMPEDANCE
tPD
2986 drw 08
NOTES:
1.WE is HIGH for Read cycle.
2.CS is LOW for Read cycle.
3. Address valid prior to or coincident with CS transition LOW.
4. Transition is measured ±200mV from steady state voltage with specified loading in Figure 2.
5. All Read cycle timings are referenced from the last valid address to the first transitioning address.
AC ELECTRICAL CHARACTERISTICS (VCC = 5.0V ± 10%, All Temperature Ranges)
7187S25 7187S35/45 7187L25 7187L35/45
(1) (1)
7187S55 7187L55
Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Unit
Write Cycle
tWC Write Cycle Time 25 — 35/45 55 70 85 ns tCW Chip Select to End-of-Write 20 — 25/40 50 55 65 ns tAW Address Valid to End-of-Write 20 — 25/40 50 55 65 ns tAS Address Set-up Time 0 0 0 0 0 ns tWP Write Pulse Width 20 — 20/25 35 40 45 ns tWR Write Recovery Time 0 0 0 0 0 ns tDW Data Valid to End-of-Write 15 — 15/25 25 30 35 ns tDH Data Hold Time 5 5 5 5 5 ns
(2)
tWZ
OW
t
NOTES: 2986 tbl 12
1. –55°C to +125°C temperature range only.
2. This parameter guaranteed but not tested.
Write Enable to Output in High-Z 12 15/30 — 30 30 40 ns
(2)
Output Active from End-of-Write 0 0 0 0 0 ns
(1) (1)
7187S70 7187L70
(1) (1)
7187S85 7187L85
(1) (1)
6.2 6
IDT7187S/L CMOS STATIC RAM 64K (64K x 1-BIT) MILITARY TEMPERATURE RANGE
TIMING WAVEFORM OF WRITE CYCLE NO. 1 (
t
WEWE CONTROLLED TIMING)
WC
(1,2,3,4)
ADDRESS
t
AW
CS
t
t
AS
WP
t
WR
WE
(5)
t
WZ
DATA
OUT
t
DW
DATA
IN
NOTES:
1.WE or CS must be HIGH during all address transitions.
2. A write occurs during the overlap (t
WR is measured from the earlier of
3. t
4. If the CS LOW transition occurs simultaneously with or after the WE LOW transition, the outputs remain in the high-impedance state.
5. Transition is measured ±200mV from steady state with a 5pF load (including scope and jig).
WP) of a LOW
CS
or WE going HIGH to the end of the write cycle.
CS
and a LOW WE.
VALID DATA
t
DH
t
OW
(5)
2986 drw 09
TIMING WAVEFORM OF WRITE CYCLE NO. 2 (
CSCS CONTROLLED TIMING)
(1,2,4)
tWC
ADDRESS
tAW
CS
(3)
ASt t
tCW
tWR
WE
tDW
DATAIN
NOTES:
1.WE or CS must be HIGH during all address transitions.
2. A write occurs during the overlap (t
WR is measured from the earlier of
3. t
4. If the CS LOW transition occurs simultaneously with or after the WE LOW transition, the outputs remain in the high-impedance state.
5. Transition is measured ±200mV from steady state with a 5pF load (including scope and jig).
WP) of a LOW
CS
or WE going HIGH to the end of the write cycle.
CS
and a LOW WE.
VALID DATA
tDH
2986 drw 10
6.2 7
IDT7187S/L CMOS STATIC RAM 64K (64K x 1-BIT) MILITARY TEMPERATURE RANGE
ORDERING INFORMATION
IDT7187 Device
Type
X
PowerXXSpeedXPackage
X
Process/
Temperature
Range
B
D L22
25 35 45 55 70 85
S L
Military (–55°C to +125°C) Compliant to MIL-STD-883, Class B
300 mil Ceramic DIP (D22-1) Leadless Chip Carrier (L22-1)
Speed in nanoseconds
Standard Power Low Power
2989 drw 11
6.2 8
Loading...