Datasheet ICX258AL Datasheet (Sony)

Page 1

ICX258AL

Diagonal 6mm (Type 1/3) CCD Image Sensor for EIA B/W Video Cameras

Description

The ICX258AL is an interline CCD solid-state image sensor suitable for EIA B/W video cameras with a diagonal 6mm (Type 1/3) system. Compared with the current product ICX058CL, basic characteristics such as sensitivity, smear, dynamic range and S/N are improved drastically from visible light region to near infrared light region through the adoption of EXview HAD CCDTMtechnology.

This chip features a field period readout system and an electronic shutter with variable charge-storage time.

Features

• Sensitivity in near infrared light region

(+8dB compared with the ICX058CL, λ = 945nm)

• High sensitivity (+7dB compared with the ICX058CL, no IR cut filter)

• Low smear (–20dB compared with the ICX058CL)

• High D range (+4dB compared with the ICX058CL)

• High S/N

• High resolution and low dark current

• Excellent antiblooming characteristics

• Continuous variable-speed shutter

• No voltage adjustment

(Reset gate and substrate bias are not adjusted.)

• Reset gate: 5V drive

• Horizontal register: 5V drive

Device Structure

• Interline CCD image sensor

• Image size: Diagonal 6mm (Type 1/3)

• Number of effective pixels: 768 (H) × 494 (V) approx. 380K pixels

• Total number of pixels: 811 (H) × 508 (V) approx. 410K pixels

• Chip size: 6.00mm (H) × 4.96mm (V)

• Unit cell size: 6.35µm (H) × 7.40µm (V)

• Optical black: Horizontal (H) direction : Front 3 pixels, rear 40 pixels

Vertical (V) direction : Front 12 pixels, rear 2 pixels

• Number of dummy bits: Horizontal 22

Vertical 1 (even fields only)

• Substrate material: Silicon

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E99524A99

Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

Pin 1

Pin 9

Optical black position

(Top View)

∗

EXview HAD CCD is a trademark of Sony Corporation. EXview HAD CCD is a CCD that drastically improves light efficiency by including near infrared light region as a basic structure of HAD (Hole-Accumulation-Diode) sensor.

16 pin DIP (Plastic)

AAA AAA AAA

Page 2

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ICX258AL

Block Diagram and Pin Configuration

(Top View)

Vφ

GND

φSUB

φRG

Hφ

GND

OUT

Hφ

Note)

Horizontal Register

Vertical Register

Note) : Photo sensor

Pin No.

1 2 3 4 5 6 7 8

Vφ4 Vφ3 Vφ2 Vφ1 GND NC NC VOUT

Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock GND

Signal output

9 10 11 12 13 14 15 16

VDD GND φSUB VL φRG NC Hφ1 Hφ2

Supply voltage GND Substrate clock Protective transistor bias Reset gate clock

Horizontal register transfer clock Horizontal register transfer clock

Symbol Description Pin No. Description

Pin Description

Symbol

Absolute Maximum Ratings

∗1

+24V (Max.) when clock width < 10µs, clock duty factor < 0.1%.

Against φSUB

Against GND

Against VL

Between input clock pins

Storage temperature Operating temperature

–40 to +8

–50 to +15 –50 to +0.3 –40 to +0.3 –0.3 to +20

–10 to +18

–10 to +6 –0.3 to +28 –0.3 to +15

to +15

–6 to +6 –14 to +14 –30 to +80 –10 to +60

V V V V V V V V V V V

V °C °C

VDD, VOUT, φRG – φSUB Vφ1, Vφ3 – φSUB Vφ2, Vφ4, VL – φSUB Hφ1, Hφ2, GND – φSUB VDD, VOUT, φRG – GND Vφ1, Vφ2, Vφ3, Vφ4 – GND Hφ1, Hφ2 – GND Vφ1, Vφ3 – VL Vφ2, Vφ4, Hφ1, Hφ2, GND – VL Voltage difference between vertical clock input pins Hφ1 – Hφ2 Hφ1, Hφ2 – Vφ4

Item Ratings Unit Remarks

∗1

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ICX258AL

Bias Conditions

Clock Voltage Conditions

Item

Readout clock voltage

VVT VVH1, VVH2 VVH3, VVH4 VVL1, VVL2,

VVL3, VVL4 VφV VVH3 – VVH VVH4 – VVH VVHH VVHL VVLH VVLL VφH VHL

VφRG VRGLH – VRGLL

VRGL – VRGLm VφSUB

14.55 –0.05

–0.2 –8.0

6.3 –0.25 –0.25

4.75

–0.05

4.5

21.0

15.0 0 0

–7.0

7.0

5.0 0

5.0

22.0

15.45

0.05

0.05 –6.5

8.05

0.1

0.3

5.25

0.05

5.5

0.4

0.5

23.5

V V V

V V

V V V V V V V V

V V

1 2 2

2 2

2 2 2 2 2 2 3 3

4 4

4 5

VVH = (VVH1 + VVH2)/2

VVL = (VVL3 + VVL4)/2 VφV

= VVHn – VVLn (n = 1 to 4)

High-level coupling High-level coupling Low-level coupling Low-level coupling

Input through 0.1µF capacitance

Low-level coupling Low-level coupling

Horizontal transfer clock voltage

Reset gate clock voltage

Substrate clock voltage

Vertical transfer clock voltage

Symbol Min.

Typ. Max.

Unit

Waveform

diagram

Remarks

DC Characteristics

Item

Supply current

IDD 4 6 mA

Symbol Min. Typ. Max. Unit Remarks

Item

Supply voltage Protective transistor bias Substrate clock Reset gate clock

VDD VL

φSUB φRG

14.55

15.0

∗1 ∗2 ∗2

15.45 V

Symbol Min. Typ. Max. Unit Remarks

∗1

VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL power supply for the V driver should be used.

∗2

Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated within the CCD.

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ICX258AL

RφH

Hφ2

Hφ1

CφH1 CφH2

CφHH

Vφ1

CφV12

Vφ2

Vφ4

Vφ3

CφV34

CφV23CφV41

CφV13

CφV24

CφV1 CφV2

CφV4 CφV3

RGND

Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit

RφRG

RGφ

Cφ

Reset gate clock equivalent circuit

Item

Capacitance between vertical transfer clock and GND

CφV1, CφV3 CφV2, CφV4 CφV12, CφV34 CφV23, CφV41 CφV13 CφV24

CφH1, CφH2

CφHH

CφRG

CφSUB R1, R3

R2, R4 RGND RφH RφRG

1200 1000

820 330 100 100

270

82 120 100

pF pF pF pF pF pF

Ω Ω Ω Ω Ω

Capacitance between vertical transfer clocks

Capacitance between horizontal transfer clock and GND

Capacitance between horizontal transfer clocks

Capacitance between reset gate clock and GND

Capacitance between substrate clock and GND

Vertical transfer clock series resistor

Vertical transfer clock ground resistor Horizontal transfer clock series resistor Reset gate clock series resistor

Symbol Min. Typ. Max. Unit Remarks

Clock Equivalent Circuit Constant

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ICX258AL

Drive Clock Waveform Conditions (1) Readout clock waveform

(2) Vertical transfer clock waveform

II II

100%

90%

10%

VVT

tr twh tf

φM

Vφ1 Vφ3

Vφ2 Vφ4

VVHH

VVH

VVHL

VVHH

VVHL

VVH1

VVL1

VVLH

VVLL

VVL

VVHH

VVH3

VVHL

VVH

VVHH

VVHL

VVL3

VVL

VVLL

VVLH

VVHH VVHH

VVH

VVHL

VVH2

VVLH

VVL2

VVLL

VVL

VVHH VVHH

VVHL

VVH4

VVHL

VVH

VVL

VVLH

VVLL

VVL4

VVH = (VVH1 + VVH2)/2 VVL = (VVL3 + VVL4)/2 VφV = VVHn – VVLn (n = 1 to 4)

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ICX258AL

tr twh tf

90%

10%

twl

Vφ

VHL

(3) Horizontal transfer clock waveform

Point A

twl

Vφ

VRGH

VRGL

VRGLH

RG waveform

RGLL

Hφ1 waveform

twhtr tf

Vφ

H/2 [V]

VRGLm

(4) Reset gate clock waveform

VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL.

VRGL = (VRGLH + VRGLL)/2

Assuming VRGH is the minimum value during the interval twh, then:

VφRG = VRGH – VRGL

Negative overshoot level during the falling edge of RG is VRGLm.

(5) Substrate clock waveform

90%

100%

10%

SUB

tr twh tf

φM

VφSUB

(A bias generated within the CCD)

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ICX258AL

Clock Switching Characteristics

Item

Readout clock Vertical transfer

clock

Reset gate clock

Substrate clock

VT Vφ1, Vφ2,

Vφ3, Vφ4 Hφ1

Hφ2 Hφ1 Hφ2

φRG

φSUB

2.3

26 26

1.5

2.5

28.5

5.38

1.8

262628.5

28.5

5.38 51

0.5

6.5

0.01

0.01 3

9.5

0.5

6.5

0.01

0.01 3

250

9.5

0.5

µs

During readout

∗1

∗2

During drain charge

Symbol

twh

Min. Typ.

Max.

Min. Typ.

Max.

Min. Typ.

Max.

Min. Typ.

Max.

twl tr tf

Unit Remarks

∗1

When vertical transfer clock driver CXD1267AN is used.

∗2

tf ≥ tr – 2ns, and the cross-point voltage (VCR) for the Hφ1 rising side of the Hφ1 and Hφ2 waveforms must be at least VφH/2 [V].

Horizontal

transfer clock

During imaging

During parallel-serial conversion

Item

Horizontal transfer clock

Hφ1, Hφ2

22 26 ns

∗3

Symbol

two

Min. Typ. Max.

Unit Remarks

∗3

The overlap period for twh and twl of horizontal transfer clocks Hφ1 and Hφ2 is two.

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ICX258AL

494 (V)

1414

768 (H)

H 8

Effective pixel region

Ignored region

Zone 0, I

Zone II, II'

Image Sensor Characteristics (Ta = 25°C)

Item Sensitivity 1 Sensitivity 2 Saturation signal Smear

Video signal shading

Dark signal Dark signal shading Flicker Lag

S1 S2 Vsat Sm

Vdt ∆Vdt F Lag

720 2200 1000

1000 3200

–115 –98

20 25

2 1 2

0.5

mV mV mV

% mV mV

1 2 3 4 5 5 6 7 8 9

Ta = 60°C

Zone 0 and I Zone 0 to II' Ta = 60°C Ta = 60°C

Symbol Min. Typ. Max. Unit Measurement method Remarks

Zone Definition of Video Signal Shading

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ICX258AL

Image Sensor Characteristics Measurement Method

Measurement conditions

1) In the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions.

2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black (OB) level is used as the reference for the signal output, and the value measured at point [∗A] in the drive circuit example is used.

Definition of standard imaging conditions

1) Standard imaging condition I: Use a pattern box (luminance: 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and image at F8. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity.

2) Standard imaging condition II: Indicate the state which removes an IR cut filter of standard imaging condition I.

3) Standard imaging condition III: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm.

1. Sensitivity 1 Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of

1/250s, measure the signal output (Vs1) at the center of the screen and substitute the value into the following formula.

2. Sensitivity 2 Set to standard imaging condition II. After selecting the electronic shutter mode with a shutter speed of

1/1000s, measure the signal output (Vs2) at the center of the screen and substitute the value into the following formula.

3. Saturation signal Set to standard imaging condition III. After adjusting the luminous intensity to 10 times the intensity with the average value of the signal output, 200mV, measure the minimum value of the signal output.

4. Smear Set to standard imaging condition III. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity to 500 times the intensity with average value of the signal output, 200mV. When the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value YSm [mV] of the signal output and substitute the value into the following formula.

S1 = Vs1 ×

[mV]

250

S2 = Vs2 ×

[mV]

1000

Sm = 20 × log

[dB] (1/10V method conversion value)

× ×

500

200

VSm

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ICX258AL

5. Video signal shading Set to standard imaging condition III. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the signal output is 200mV. Then measure the maximum (Vmax [mV]) and minimum (Vmin [mV]) values of the signal output and substitute the values into the following formula.

SH = (Vmax – Vmin)/200 × 100 [%]

6. Dark signal Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60°C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference.

7. Dark signal shading After measuring 6, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark signal output and substitute the values into the following formula.

∆Vdt = Vdmax – Vdmin [mV]

8. Flicker Set to standard imaging condition III. Adjust the luminous intensity so that the average value of the signal output is 200mV, and then measure the difference in the signal level between fields (∆Vf [mV]). Then substitute the value into the following formula.

F = (∆Vf/200) × 100 [%]

9. Lag Adjust the signal output value generated by strobe light to 200mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following formula.

Lag = (Vlag/200) × 100 [%]

Vlag (lag)

Signal output 200mV

Light

FLD

Strobe light

timing

Output

Page 11

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ICX258AL

CXD1267AN

22/16V

0.1

–7.0V

3.3/16V

1/35V

0.1

ICX258

(BOTTOM VIEW)

14 13 12 11 10 9

1 2 3 4 5 6 7

Hφ

φRG

φSUB

GND

Vφ

GND

OUT

22/20V

CCD OUT

15V

XSUB

XV2

XV1

XSG1

XV3

XSG2

XV4

Hφ

Hφ2

2200p

100k

3.3/20V

0.01

100

3.9k

2SK523

[

∗

1516

Drive Circuit

Page 12

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ICX258AL

0.2

0.4

0.6

0.8

1.0

400 500 600 700 800 900 1000

Wave Length [nm]

Relative Response

0.1

0.3

0.5

0.7

0.9

unit : µs

Odd Field

Even Field

V1 V2

V3 V4

2.5

2.5 2.5 2.5

1.6

33.5

0.2

Spectral Sensitivity Characteristics

(excludes both lens characteristics and light source characteristics)

Sensor Readout Clock Timing Chart

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ICX258AL

FLD

BLK

CCD

OUT

520

525

260

265

270

275

280

493

494

1 3 5

2 4 6

1 3 5

2 4 6

494

493

Drive Timing Chart (Vertical Sync)

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ICX258AL

760

768

BLK

SUB

Drive Timing Chart (Horizontal Sync)

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ICX258AL

Notes on Handling

1) Static charge prevention

CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material.

Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.

2) Soldering a) Make sure the package temperature does not exceed 80°C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W

soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.

c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering

tool, use a thermal controller of the zero cross On/Off type and connect it to ground.

3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should

dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized

air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when

moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for

electrostatic protection. Do not reuse the tape.

4) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more

than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.)

Compressive strength

50N

Cover glass

Plastic package

50N

1.2Nm

Torsional strength

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ICX258AL

b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the

package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive.

c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated

voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution.

d) The notch of the package is used for directional index, and that can not be used for reference of fixing.

In addition, the cover glass and seal resin may overlap with the notch of the package.

e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be

generated by the fragments of resin.

f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-

acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference)

5) Others

a) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition

exceeding the normal using condition, consult our company.

b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or

usage in such conditions.

c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD

characteristics.

d) This CCD image sensor has sensitivity in the near infrared area. Its focus may not match in the same

condition under visible light /near infrared light because of aberration. Incident light component of long wavelength which transmits the silicon substrate may have bad influence upon image.

Page 17

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ICX258AL

Package Outline Unit: mm

PACKAGE STRUCTURE

0.3

16pin DIP (450mil)

2.5

8.4

0.5

1.2

5.7

6.1

10.3

12.2 ± 0.1

9.5

11.4 ± 0.1

11.43

0.25

0° to 9°

2-R0.5

2.5

11.6

9.2

2.5

1.2

3.35 ± 0.15

3.1

1.27

3.5 ± 0.3

0.46

0.3

1.27

0.69

(For the first pin only)

1. “A” is the center of the effective image area.

2. The two points “B” of the package are the horizontal reference.

The point “B'” of the package is the vertical reference.

3. The bottom “C” of the package, and the top of the cover glass “D”

are the height reference.

4. The center of the effective image area relative to “B” and “B'”

is (H, V) = (6.1, 5.7) ± 0.15mm.

5. The rotation angle of the effective image area relative to H and V is ± 1°.

6. The height from the bottom “C” to the effective image area is 1.41 ± 0.10mm.

The height from the top of the cover glass “D” to the effective image area is 1.94 ± 0.15mm.

7. The tilt of the effective image area relative to the bottom “C” is less than 50µm.

The tilt of the effective image area relative to the top “D” of the cover glass is less than 50µm.

8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5.

9. The notches on the bottom of the package are used only for directional index, they must

not be used for reference of fixing.

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE WEIGHT

Plastic

GOLD PLATING

42 ALLOY

0.9g