Datasheet ICX088AK Datasheet (Sony)

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ICX088AK

E97707A99

Diagonal 4.5mm (Type 1/4) CCD Image Sensor for NTSC Color Video Cameras

Description

The ICX088AK is an interline CCD solid-state image sensor suitable for NTSC color digital video cameras. This chip supports DV standard SD mode, and can drive at 13.5MHz.

High sensitivity, wide dynamic range and low dark current are achieved through the adoption of Super HAD CCD technology. In addition, high resolution is achieved through the adoption of Ye, Cy, Mg and G complementary color mosaic filters.

This chip features a field period readout system and an electronic shutter with variable charge-storage time.

The package is a 14-pin DIP (Plastic), and both top and bottom surface reference can be assured at the same time.

Features

• Supports DV standard SD mode (13.5MHz)

• High resolution, high sensitivity and wide dynamic range

• Low dark current and low smear

• Excellent antiblooming characteristics

• Supply voltage: 12V

• Horizontal register drive amplitude: 2.7 to 3.6V

• No voltage adjustment (Reset gate and substrate bias are not adjusted.)

• Continuous variable-speed shutter

• Recommended range of exit pupil distance: –20 to –100mm

• Ye, Cy, Mg and G complementary color mosaic filters on chip

• 14-pin high precision plastic package (both top and bottom surface reference possible)

Device Structure

• Interline CCD image sensor

• Image size: Diagonal 4.5mm (Type 1/4)

• Total number of pixels: 766 (H) × 508 (V) approx. 390K pixels

• Total number of effective pixels: 724 (H) × 494 (V) approx. 360K pixels

• Chip size: 4.60mm (H) × 3.97mm (V)

• Unit cell size: 5.05µm (H) × 5.55µm (V)

• Optical black: Horizontal (H) direction: Front 2 pixels, rear 40 pixels

Vertical (V) direction: Front 12 pixels, rear 2 pixels

• Number of dummy bits: Horizontal 20

Vertical 1 (even fields only)

• Substrate material: Silicon

Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

14 pin DIP (Plastic)

Pin 1

Pin 8

Optical black position

(Top View)

∗

Super HAD CCD is a registered trademark of Sony Corporation. Super HAD CCD is a CCD that drastically improves sensitivity by introducing newly developed semiconductor technology by Sony Corporation into Sony's high-performance HAD (Hole-Accumulation Diode) sensor.

AAA AAA AAA

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ICX088AK

Against φSUB

Against GND

Against VL

Between input clock pins

Storage temperature Operating temperature

Block Diagram and Pin Configuration

(Top View)

Note) : Photo sensor

OUT

GND

Vφ

GND

φSUB

SUB

φRG

Hφ

Horizontal Register

Vertical Register

Mg Ye G

Mg Ye

G Cy Mg

Note)

Pin No.

1 2 3 4 5 6 7

Vφ4 Vφ3 Vφ2 Vφ1 VL GND VOUT

Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Protective transistor bias GND Signal output

9 10 11 12 13 14

VDD GND φSUB CSUB φRG Hφ1 Hφ2

Supply voltage GND Substrate clock Substrate bias

∗1

Reset gate clock Horizontal register transfer clock Horizontal register transfer clock

Symbol Description

Pin Description

Absolute Maximum Ratings

–40 to +8

–50 to +15 –50 to +0.3 –40 to +0.3

–25 to

–0.3 to +18

–10 to +18

–10 to +5 –0.3 to +28 –0.3 to +15

to +15

–5 to +5 –13 to +13 –30 to +80 –10 to +60

V V V V V V V V V V V V

V °C °C

VDD, VOUT, φRG – φSUB Vφ1, Vφ3 – φSUB Vφ2, Vφ4, VL – φSUB Hφ1, Hφ2, GND – φSUB CSUB – φSUB VDD, VOUT, φRG, CSUB – GND Vφ1, Vφ2, Vφ3, Vφ4 – GND Hφ1, Hφ2 – GND Vφ1, Vφ3 – VL Vφ2, Vφ4, Hφ1, Hφ2, GND – VL Voltage difference between vertical clock input pins Hφ1 – Hφ2 Hφ1, Hφ2 – Vφ4

Item Ratings Unit Remarks

∗2

+24V (Max.) when clock width < 10µs, clock duty factor < 0.1%.

∗1

DC bias is generated within the CCD, so that this pin should be grounded externally through a capacitance of 0.1µF.

∗2

Pin No. Symbol Description

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ICX088AK

Clock Voltage Conditions

Item

Readout clock voltage

VVT VVH1, VVH2 VVH3, VVH4 VVL1, VVL2,

VVL3, VVL4 VφV VVH3 – VVH VVH4 – VVH VVHH VVHL VVLH VVLL VφH VHL VφRG VRGLH – VRGLL VRGL – VRGLm VφSUB

11.64 –0.05

–0.2

–6.85

5.95 –0.25 –0.25

2.7

–0.05

2.7

17.3

12.0 0 0

–6.5

6.5

3.3 0

3.3

18.5

12.36

0.05

–6.15

6.9

0.1

0.3

3.6

0.05

3.6

0.4

0.5

19.3

V V V

V V

V V V V V V V V V V V V

1 2 2

2 2

2 2 2 2 2 2 3 3 4 4 4 5

VVH = (VVH1 + VVH2)/2

VVL = (VVL3 + VVL4)/2 VφV = VVHn – VVLn (n = 1 to 4)

High-level coupling High-level coupling Low-level coupling Low-level coupling

Low-level coupling Low-level coupling

Horizontal transfer clock voltage

Reset gate clock voltage

Substrate clock voltage

Vertical transfer clock voltage

Symbol Min. Typ. Max. Unit

Waveform

diagram

Remarks

Bias Conditions

Item Supply voltage Protective transistor bias Substrate clock Reset gate clock

VDD VL

φSUB φRG

11.64

12.0

∗1 ∗2 ∗2

12.36

Symbol Min. Typ. Max. Unit Remarks

DC Characteristics

Item Supply current IDD 5.0 mA

Symbol Min. Typ. Max. Unit Remarks

∗1

VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL power supply for the V driver should be used.

∗2

Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated within the CCD.

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ICX088AK

Clock Equivalent Circuit Constant

Item

Capacitance between vertical transfer clock and GND

CφV1, CφV3 CφV2, CφV4 CφV12, CφV34 CφV23, CφV41 CφV13 CφV24 CφH1, CφH2 CφHH CφRG CφSUB R1, R2, R3, R4 RGND RφH RH2

680 470 330 270

82 75 47 47

180

82 15 12 30

pF pF pF pF pF pF pF pF pF pF

Ω Ω Ω

kΩ

Capacitance between vertical transfer clocks

Capacitance between horizontal transfer clock and GND Capacitance between horizontal transfer clocks Capacitance between reset gate clock and GND Capacitance between substrate clock and GND Vertical transfer clock series resistor Vertical transfer clock ground resistor Horizontal transfer clock series resistor Horizontal transfer clock ground resistor

Symbol Min. Typ. Max. Unit Remarks

RφH RφH

Hφ2Hφ1

CφH1 CφH2

CφHH

Vφ1

CφV12

Vφ2

Vφ4 Vφ3

CφV34

CφV23CφV41

CφV13

CφV24

CφV1 CφV2

CφV4 CφV3

RGND

Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit

RH2

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ICX088AK

Drive Clock Waveform Conditions (1) Readout clock waveform

(2) Vertical transfer clock waveform

II II

100%

90%

10%

VVT

tr twh tf

φM

Vφ1 Vφ3

Vφ2 Vφ4

VVHH

VVH

VVHL

VVHH

VVHL

VVH1

VVL1

VVLH

VVLL

VVL

VVHH

VVH3

VVHL

VVH

VVHH

VVHL

VVL3

VVL

VVLL

VVLH

VVHH VVHH

VVH

VVHL

VVH2

VVLH

VVL2

VVLL

VVL

VVHH VVHH

VVHL

VVH4

VVHL

VVH

VVL

VVLH

VVLL

VVL4

VVH = (VVH1 + VVH2)/2 VVL = (VVL3 + VVL4)/2 VφV = VVHn – VVLn (n = 1 to 4)

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ICX088AK

twh tftr

90%

10%

twl

Hφ1

two

Hφ2

VRGL

VRGLL

VRGLH

twl

RGH

RG waveform

VRGLm

tr twh tf

Point A

(3) Horizontal transfer clock waveform

Cross-point voltage for the Hφ1 rising side of the horizontal transfer clocks Hφ1 and Hφ2 waveforms is VCR. The overlap period for twh and twl of horizontal transfer clocks Hφ1 and Hφ2 is two.

(4) Reset gate clock waveform

VφH

VφRG

VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL.

VRGL = (VRGLH + VRGLL) /2

Assuming VRGH is the minimum value during the interval twh, then:

VφRG = VRGH – VRGL.

Negative overshoot level during the falling edge of RG is VRGLm.

(5) Substrate clock waveform

90%

100%

10%

SUB

tr twh tf

φM

(A bias generated within the CCD)

VφSUB

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ICX088AK

Clock Switching Characteristics

Item

Readout clock

Vertical transfer clock

Reset gate clock

Substrate clock

Vφ1, Vφ2, Vφ3, Vφ4

Hφ1 Hφ2 Hφ1 Hφ2

φRG

φSUB

1.58

25 25

2.0

1.78

28 28

5.36

2.96

252528

5.36 51

0.5

9 9

0.01

0.01 3

12 12

0.5

9 9

0.01

0.01 3

250

12 12

0.5

µs

During readout

During CXD1267AN used

tf ≥ tr – 2ns Vφ

H = 2.7V

∗1

During drain charge

Symbol

twh

Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.

twl tr tf

Unit Remarks

Horizontal

transfer clock

During imaging

During parallel-serial conversion

Item

Horizontal transfer clock

Hφ1, Hφ2

25 28 ns

Symbol

two

Min. Typ. Max.

Unit Remarks

Spectral Sensitivity Characteristics (excludes both lens characteristics and light source characteristics)

0.0

0.2

0.4

0.6

0.8

1.0

400 450 500 550 600 650 700

Wave Length [nm]

Relative Response

∗1

The cross-point voltage (VCR) for the Hφ1 rising side of the Hφ1 and Hφ2 waveforms must be at least VφH/2 [V].

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ICX088AK

Zone Definition of Video Signal Shading

494 (V)

1010

724 (H)

H 8

Effective pixel region

lgnored region

Zone 0, I

Zone II, II'

Measurement System

CCD C.D.S

LPF1

LPF2

AMP

CCD signal output

Y signal output

Chroma signal output

(3dB down 6.3MHz)

(3dB down 1MHz)

[∗Y]

[∗C]

[∗A]

Note) Adjust the amplifier gain so that the gain between [∗A] and [∗Y], and between [∗A] and [∗C] equals 1.

Image Sensor Characteristics (Ta = 25°C)

Item

Sensitivity

Sensitivity ratio

Saturation signal Smear

Video signal shading

Uniformity between video signal channels

Dark signal Dark signal shading Flicker Y Flicker R-Y Flicker B-Y Line crawl R Line crawl G Line crawl B Line crawl W Lag

S RMgG RYeCy Ysat Sm

SHy

∆Sr ∆Sb

Ydt ∆Ydt Fy Fcr Fcb Lcr Lcg Lcb Lcw Lag

390

0.93

1.15 800

480

0.009

1.35

1.48

0.015 20 25 10 10

2 1 2 5 5 3 3 3 3

0.5

% % % %

% mV mV

1 2 2 3 4 5 5 6 6 7 8 9 9

9 10 10 10 10 11

Ta = 60°C

Zone 0 and I Zone 0 to II'

Ta = 60°C Ta = 60°C

Symbol Min. Typ. Max. Unit Measurement method Remarks

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ICX088AK

Image Sensor Characteristics Measurement Method

Measurement conditions

1) In the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions.

2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value of Y signal output or chroma signal output of the measurement system.

Color coding of this image sensor & Composition of luminance (Y) and chroma (color difference) signals

As shown in the left figure, fields are read out. The charge is mixed by pairs such as A1 and A2 in the A field. (pairs such as B in the B field) As a result, the sequence of charges output as signals from the horizontal shift register (Hreg) is, for line A1, (G + Cy), (Mg + Ye), (G + Cy), and (Mg + Ye).

These signals are processed to form the Y signal and chroma (color difference) signal. The Y signal is formed by adding adjacent signals, and the chroma signal is formed by subtracting adjacent signals. In other words, the approximation:

Y= {(G + Cy) + (Mg + Ye)} x 1/2

= 1/2 {2B + 3G +2R}

is used for the Y signal, and the approximation:

R – Y = {(Mg + Ye) – (G + Cy)}

= {2R – G}

is used for the chroma (color difference) signal. For line A2, the signals output from Hreg in sequence are

(Mg + Cy), (G + Ye), (Mg + Cy), (G + Ye).

The Y signal is formed from these signals as follows:

Y= {(G + Ye) + (Mg + Cy)} x 1/2

= 1/2 {2B + 3G +2R} This is balanced since it is formed in the same way as for line A1. In a like manner, the chroma (color difference) signal is approximated as follows:

–(B – Y) = {(G + Ye) – (Mg + Cy)}

= – {2B – G} In other words, the chroma signal can be retrieved according to the sequence of lines from R – Y and –(B – Y) in alternation. This is also true for the B field.

Cy Ye

Hreg

Color Coding Diagram

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ICX088AK

Definition of standard imaging conditions

1) Standard imaging condition I: Use a pattern box (luminance 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity.

2) Standard imaging condition II: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm.

3) Standard imaging condition III: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens (exit pupil distance –33mm) with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm.

1. Sensitivity Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/250s, measure the Y signal (Ys) at the center of the screen and substitute the value into the following formula.

S = Ys × [mV]

2. Sensitivity ratio Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, and then measure the Mg signal output (SMg [mV]) and G signal output (SG [mV]), and Ye signal output (SYe [mV]) and Cy signal output (SCy [mV]) at the center of the screen with frame readout method. Substitute the values into the following formula.

RMgG = SMg/SG RYeCy = SYe/SCy

3. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 10 times the intensity with average value of the Y signal output, 200mV, measure the minimum value of the Y signal.

4. Smear Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity to 500 times the intensity with average value of the Y signal output, 200mV. When the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value YSm [mV] of the Y signal output and substitute the value into the following formula.

5. Video signal shading Set to standard imaging condition III. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the Y signal output is 200mV. Then measure the maximum (Ymax [mV]) and minimum (Ymin [mV]) values of the Y signal and substitute the values into the following formula.

SHy = (Ymax – Ymin)/200 × 100 [%]

6. Uniformity between video signal channels Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, and then measure the maximum (Crmax, Cbmax [mV]) and minimum (Crmin, Cbmin [mV]) values of the R – Y and B – Y channels of the chroma signal and substitute the values into the following formula.

∆Sr = | (Crmax – Crmin)/200 | × 100 [%] ∆Sb = | (Cbmax – Cbmin)/200 | × 100 [%]

250

Sm =

× 100 [%] (1/10V method conversion value)

× ×

200

YSm

500

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ICX088AK

7. Dark signal Measure the average value of the Y signal output (Ydt [mV]) with the device ambient temperature 60°C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference.

8. Dark signal shading After measuring 7, measure the maximum (Ydmax [mV]) and minimum (Ydmin [mV]) values of the Y signal output and substitute the values into the following formula.

∆Ydt = Ydmax – Ydmin [mV]

9. Flicker

1) Fy Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, and then measure the difference in the signal level between fields (∆Yf [mV]). Then substitute the value into the following formula.

Fy = (∆Yf/200) × 100 [%]

2) Fcr, Fcb Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, insert an R and B filter, and then measure both the difference in the signal level between fields of the chroma signal (∆Cr, ∆Cb) as well as the average value of the chroma signal output (CAr, CAb). Substitute the values into the following formula.

Fci = (∆Ci/CAi) × 100 [%] (i = r, b)

10. Line crawls Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal output is 200mV, and then insert a white subject and R, G, and B filters and measure the difference between Y signal lines for the same field (∆Ylw, ∆Ylr, ∆Ylg, ∆Ylb [mV]). Substitute the values into the following formula.

Lci = (∆Yli/200) × 100 [%] (i = w, r, g, b)

11. Lag Adjust the Y signal output value generated by strobe light to 200mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Ylag). Substitute the value into the following formula.

Lag = (Ylag/200) × 100 [%]

Ylag (lag)Y signal output 200mV

Light

FLD

Strobe light

timing

Output

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ICX088AK

Drive Circuit

–6.5V

3.3/16V

2SK523

100

100k

1/35V

22/16V

CXD1267AN

22/20V

12V

SUB

XV2

XV1

XSG1

XV3

XSG2

XV4

ICX088

(BOTTOM VIEW)

CCD OUT

3.9k

0.01

3.3/20V

0.1 1M

2200p

0.1

8 9

10 11

12 13 14

GND φSUB

SUB

φRG Hφ

Hφ

OUT

GND

Vφ

Hφ2

Hφ1

φRG

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ICX088AK

Drive Timing Chart (Vertical Sync)

FLD

BLK

CCD

OUT

CLP

520

525

260

265

270

275

280

493

494

524

6 2

5 1

494

493

6 2

5 1

6 2

5 1

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ICX088AK

858

504 528

546

528

552

528

540

570

510 564

504 528

546

528

552

528

540

570

510 564

( odd field )

( even field )

16 32

8 24

Drive Timing Chart (Readout)

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ICX088AK

Drive Timing Chart (Horizontal Sync)

Dummy bit

Ignored region

Effective region

Ignored region

Effective OB

717

718

724

328

24 48

400

16 56

–6–30

SUB

CLP

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ICX088AK

Notes on Handling

1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material.

Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.

2) Soldering a) Make sure the package temperature does not exceed 80°C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W

soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.

c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering

tool, use a thermal controller of the zero cross On/Off type and connect it to ground.

3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should

dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized

air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when

moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for

electrostatic protection. Do not reuse the tape.

4) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more

than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the packege.)

b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the

package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive.

Compressive strength

50N

Cover glass

Plastic package

50N

1.2Nm

Torsional strength

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ICX088AK

c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated

voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution.

d) The notch of the package is used for directional index, and that can not be used for reference of fixing.

In addition, the cover glass and seal resin may overlap with the notch of the package.

e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be

generated by the fragments of resin.

f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-

acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference)

5) Others a) Do not expose to strong light (sun rays) for long periods, color filters will be discolored. When high

luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the image-plane may become excessive and discolor of the color filter will possibly be accelerated. In such a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-off mode should be properly arranged. For continuous using under cruel condition exceeding the normal using condition, consult our company.

b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or

usage in such conditions.

c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD

characteristics.

d) This package has 2 kinds of internal structure. However, their package outline, optical size, and strength

are the same.

The cross section of lead frame can be seen on the side of the package for structure A.

Structure A Structure B

Chip

Metal plate (lead frame)

Package

Cross section of lead frame

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ICX088AK

PACKAGE STRUCTURE

2.5

7.0

2.5

1.0

0.5

5.0 14

5.0

8.9

10.0 ± 0.1

8.9

10.0 ± 0.1

10.16

0° to 9°

0.25

1.7

7.0

2.5

1.0

3.35 ± 0.15

2.6

3.5 ± 0.3

1.27

0.3

0.46

1.27

14 pin DIP (400mil)

0.3

1. “A” is the center of the effective image area.

2. The two points “B” of the package are the horizontal reference.

The point “B'” of the package is the vertical reference.

3. The bottom “C” of the package, and the top of the cover glass “D” are the height reference.

4. The center of the effective image area relative to “B” and “B'” is (H, V) = (5.0, 5.0) ± 0.15mm.

5. The rotation angle of the effective image area relative to H and V is ± 1°.

6. The height from the bottom “C” to the effective image area is 1.41 ± 0.10mm.

The height from the top of the cover glass “D” to the effective image area is 1.94 ± 0.15mm.

7. The tilt of the effective image area relative to the bottom “C” is less than 25µm.

The tilt of the effective image area relative to the top “D” of the cover glass is less than 25µm.

8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5.

9. The notch of the package is used only for directional index, that must not be used for reference

of fixing.

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE WEIGHT

Plastic

GOLD PLATING

42 ALLOY

0.6g

Package Outline Unit: mm