Datasheet ICX054BL Datasheet (Sony)

Page 1

Description

The ICX054BL is an interline CCD solid-state image sensor suitable for EIA B/W video cameras. Compared with the current product ICX054AL, sensitivity is improved drastically through the adoption of Super HAD CCD technology.

This chip features a field period readout system, and an electronic shutter with variable charge-storage time.

Features

• High sensitivity (+4dB at F8, +2dB at F1.2 compared with ICX054AL)

• High saturation signal (+1dB compared with ICX054AL)

• Low smear and low dark current

• Excellent antiblooming characteristics

• Continuous variable-speed shutter

• Horizontal register: 5V drive

• Reset gate: 5V drive

Device Structure

• Interline CCD image sensor

• Image size: Diagonal 6mm (Type 1/3)

• Number of effective pixels: 510 (H) × 492 (V) approx. 250K pixels

• Number of total pixels: 537 (H) × 505 (V) approx. 270K pixels

• Chip size: 6.00mm (H) × 4.96mm (V)

• Unit cell size: 9.6µm (H) × 7.5µm (V)

• Optical black: Horizontal (H) direction: Front 2 pixels, Rear 25 pixels

Vertical (V) direction: Front 12 pixels, Rear 1 pixel

• Number of dummy bits: Horizontal 16

Vertical 1 (even field only)

• Substrate material: Silicon

– 1 –

ICX054BL

E98223A99

Diagonal 6mm (Type 1/3) CCD Image Sensor for EIA B/W Video Cameras

Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

16 pin DIP (Plastic)

Pin 1

Pin 9

Optical black position

(Top View)

∗

Super HAD CCD is a registered trademark of Sony Corporation. Super HAD CCD is a CCD that drastically improves sensitivity by introducing newly developed semiconductor technology by Sony Corporation into Sony's high-performance HAD (Hole-Accumulation Diode) sensor.

AAA AAA AAA

Page 2

– 2 –

ICX054BL

Substrate voltage SUB – GND

VDD, VOUT, VSS – GND

Supply voltage

VDD, VOUT, VSS – SUB Vφ1, Vφ2, Vφ3, Vφ4 – GND

Vertical clock input voltage

Vφ1, Vφ2, Vφ3, Vφ4 – SUB Voltage difference between vertical clock input pins Voltage difference between horizontal clock input pins Hφ1, Hφ2 – Vφ4 Hφ1, Hφ2, RG, VGG – GND Hφ1, Hφ2, RG, VGG – SUB VL – SUB Vφ1, Vφ2, Vφ3, Vφ4, VDD, VOUT – VL RG – VL VGG, Vss, Hφ1, Hφ2 – VL Storage temperature Operating temperature

Pin No. Symbol Description Pin No. Symbol Description

1 2 3 4 5 6 7 8

Vφ4 Vφ3 Vφ2 Vφ1 GND VGG VSS VOUT

Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock GND Output amplifier gate bias Output amplifier source Signal output

9 10 11 12 13 14 15 16

VDD GND SUB VL RG NC Hφ1 Hφ2

Output amplifier drain supply GND Substrate (Overflow drain) Protective transistor bias Reset gate clock

Horizontal register transfer clock Horizontal register transfer clock

Pin Description

14 15

Note

Note) : Photo sensor

OUT

GND

Vφ

GND

SUB

Hφ

Horizontal register

Vertical register

Block Diagram and Pin Configuration

(Top View)

Item

–0.3 to +55 –0.3 to +18

–55 to +10 –15 to +20

to +10 to +15

to +17 –17 to +17 –10 to +15 –55 to +10

–65 to +0.3 –0.3 to +30 –0.3 to +24 –0.3 to +20

–30 to +80 –10 to +60

V V V V V V V V V V V V V

V °C °C

∗1

Ratings Unit Remarks

Absolute Maximum Ratings

∗1

+27V (Max.) when clock width < 10µs, clock duty factor < 0.1%.

Page 3

– 3 –

ICX054BL

Item

VDD VGG

VSS VSUB

∆VSUB VRGL ∆VRGL VL

14.55

1.75

9.0 –3

1.0 –3

15.0

2.0

∗2

15.45

2.25

18.5 +3

4.0 +3

V V

±5%

∗1

Symbol Min. Typ. Max. Unit Remarks

Bias Conditions

DC Characteristics

Grounded with

680Ω resistor

Item Output amplifier drain current Input current Input current

IDD IIN1 IIN2

µAµA∗3

∗4

Symbol Min. Typ. Max. Unit Remarks

Output amplifier drain voltage Output amplifier gate voltage

Output amplifier source Substrate voltage adjustment range

Fluctuation range after substrate voltage adjustment Reset gate clock voltage adjustment range Fluctuation range after reset gate clock voltage adjustment Protective transistor bias

∗1

Indications of substrate voltage (VSUB) · reset gate clock voltage (VRGL) setting value. The setting values of substrate voltage and reset gate clock voltage are indicated on the back of the image sensor by a special code. Adjust substrate voltage (VSUB) and reset gate clock voltage (VRGL) to the indicated voltage. Fluctuation range after adjustment is ±3%.

VSUB code one character indication VRGL code one character indication ↑ ↑

VRGL code VSUB code

Code and optimal setting correspond to each other as follows.

VRGL code Optimal setting 1.0 1.5 2.0 2.5 3.0 3.5 4.0

4 5

VSUB code Optimal setting

9.0 9.5

10.0 10.511.0 11.5 12.0 12.5 13.0 13.5 14.014.5 15.0 15.5 16.0 16.5 17.017.5 18.018.5

E f G

h J K L

N P

U V W X

<Example> “5L” → VRGL = 3.0V

VSUB = 12.0V

∗2

VL setting is the VVL voltage of the vertical transfer clock waveform.

∗3

1) Current to each pin when 18V is applied to VDD, VOUT, Vss and SUB pins, while pins that are not tested are grounded.

2) Current to each pin when 20V is applied sequentially to Vφ1, Vφ2, Vφ3 and Vφ4 pins, while pins that are not tested are grounded. However, 20V is applied to SUB pin.

3) Current to each pin when 15V is applied sequentially to RG, Hφ1, Hφ2 and VGG pins, while pins that are not tested are grounded. However, 15V is applied to SUB pin.

4) Current to VL pin when 30V is applied to Vφ1, Vφ2, Vφ3, Vφ4, VDD and VOUT pins or when, 24V is applied to RG pin or when, 20V is applied to VGG, Vss, Hφ1 and Hφ2 pins, while VL pin is grounded. However, GND and SUB pins are left open.

∗4

Current to SUB pin when 55V is applied to SUB pin, while pins that are not tested are grounded.

Page 4

– 4 –

ICX054BL

Item

Readout clock voltage

VVT VVH1, VVH2 VVH3, VVH4 VVL1, VVL2,

VVL3, VVL4 VφV |VVH1 – VVH2| VVH3 – VVH VVH4 – VVH VVHH VVHL VVLH VVLL VφH VHL VφRG V

RGLH –

RGLL

VφSUB

14.55 –0.05

–0.2 –9.0

7.8

–0.25 –0.25

4.75

–0.05

4.5

22.5

15.0 0 0

–8.5

8.5

5.0 0

5.0

23.5

15.45

0.05

0.05 –8.0

9.05

0.1

0.5

5.25

0.05

5.5

0.8

24.5

V V V

V V

V V V V V V V V V V V V

1 2 2

2 2

2 2 2 2 2 2 2 3 3 4 4 5

VVH = (VVH1+VVH2) /2

VVL = (VVL3 + VVL4) /2 VφV = VVHn – VVLn (n = 1 to 4)

High-level coupling High-level coupling Low-level coupling Low-level coupling

∗1

Low-level coupling

Horizontal transfer clock voltage

Reset gate clock voltage

Substrate clock voltage

Vertical transfer clock voltage

Symbol Min. Typ. Max. Unit

Waveform

diagram

Remarks

Item

Reset gate clock voltage

Symbol VRGL

VφRG

–0.2

8.5

9.0

0.2

9.5

V V

4 4

Min. Typ. Max. Unit

Waveform

diagram

Remarks

Clock Voltage Conditions

∗1

The reset gate clock voltage need not be adjusted when reset gate clock is driven when the specifications are as given below. In this case, the reset gate clock voltage setting indicated on the back of the image sensor has not significance.

Page 5

– 5 –

ICX054BL

Clock Equivalent Circuit Constant

Item

Capacitance between vertical transfer clock and GND

CφV1, CφV3 CφV2, CφV4 CφV12, CφV34 CφV23, CφV41 CφV13 CφV24

CφH1, CφH2

CφHH

CφRG

CφSUB R1, R3

R2, R4 RGND RφH RφRG

1500

820 470 230 150 230

320

100

15 10 40

pF pF pF pF pF pF

Ω Ω Ω Ω Ω

Capacitance between vertical transfer clocks

Vertical transfer clock series resistor

Vertical transfer clock ground resistor Horizontal transfer clock series resistor Reset gate clock series resistor

Symbol Min. Typ. Max. Unit Remarks

RφH RφH

Hφ2Hφ1

CφH1 CφH2

CφHH

Vφ1

CφV12

Vφ2

Vφ4 Vφ3

CφV34

CφV23CφV41

CφV13

CφV24

CφV1 CφV2

CφV4 CφV3

RGND

Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit

RφRG

RGφ

Cφ

Reset gate clock equivalent circuit

Capacitance between horizontal transfer clock and GND

Capacitance between horizontal transfer clocks

Capacitance between reset gate clock and GND

Capacitance between substrate clock and GND

Page 6

– 6 –

ICX054BL

VVH = (VVH1 + VVH2)/2 VVL = (VVL3 + VVL4)/2 VφV = VVHn – VVLn (n = 1 to 4)

Vφ1 Vφ3

Vφ2 Vφ4

VVHH

VVH

VVHL

VVHH

VVHL

VVH1

VVL1

VVLH

VVLL

VVL

VVHH

VVH3

VVHL

VVH

VVHH

VVHL

VVL3

VVL

VVLL

VVLH

VVHH VVHH

VVH

VVHL

VVH2

VVLH

VVL2

VVLL

VVL

VVHH VVHH

VVHL

VVH4

VVHL

VVH

VVL

VVLH

VVLL

VVL4

Drive Clock Waveform Conditions

(1) Readout clock waveform

(2) Vertical transfer clock waveform

II II

100%

90%

10%

VVT

tr twh tf

φM

Page 7

– 7 –

ICX054BL

(3) Horizontal transfer clock waveform

tr twh tf

90%

10%

twl

Vφ

VHL

(4) Reset gate clock waveform

Point A

twl

Vφ

VRGH

VRGL + 0.5V V

RGL

10%

RGLH

RG waveform

RGLL

Hφ1 waveform

twhtr tf

VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL.

VRGL = (VRGLH + VRGLL)/2

Assuming VRGH is the minimum value during the interval twh, then:

VφRG = VRGH – VRGL

Page 8

– 8 –

ICX054BL

(5) Substrate clock waveform

90%

100%

10%

SUB

tr twh tf

φM

VφSUB

Clock Switching Characteristics

Item

Readout clock Vertical transfer

clock Horizontal

transfer clock Horizontal

transfer clock Reset gate clock

Substrate clock

VT Vφ1, Vφ2,

Vφ3, Vφ4 H

SUB

2.3

1.5

2.5

5.6

2.0

387542

5.6

0.5

0.012

6.5

0.5

0.015

∗2

0.5

0.012

4.5

0.25

0.5

µs

During readout

∗1

During imaging

During parallelserial conversion

During drain charge

Symbol

twh

Min. Typ.

Max.

Min. Typ.

Max.

Min. Typ.

Max.

Min. Typ.

Max.

twl tr tf

Unit Remarks

∗1

When vertical transfer clock driver CXD1267AN is used.

∗2

tf ≥ tr – 2ns.

Page 9

– 9 –

ICX054BL

Image Sensor Characteristics (Ta = 25°C)

Item Sensitivity Saturation signal Smear

Video signal shading

Dark signal Dark signal shading Flicker Lag

S Vsat Sm

Vdt ∆Vdt F Lag

750 800

900

0.002 0.007 20 25

2 1 2

0.5

mV mV

% %

% mV mV

1 2 3 4 4 5 6 7 8

Ta = 60°C

Zone 0, I

Zone 0 to II' Ta = 60°C Ta = 60°C

Symbol Min. Typ. Max. Unit Measurement method Remarks

Zone Definition of Video Signal Shading

492 (V)

810

510 (H)

H 8

Effective pixel region

Ignored region

Zone 0, I

Zone II, II'

Page 10

– 10 –

ICX054BL

Image Sensor Characteristics Measurement Method

Measurement conditions

1) In the following measurements, the substrate voltage and the reset gate clock voltage are set to the values indicated on the device, and the device drive conditions are at the typical values of the bias and clock voltage conditions.

2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black (OB) level is used as the reference for the signal output, and the value measured at point [∗A] in the drive circuit example is used.

Definition of standard imaging conditions

1) Standard imaging condition I: Use a pattern box (luminance 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and image at F8. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity.

2) Standard imaging condition II: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm.

1. Sensitivity

Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/250s, measure the signal output (Vs) at the center of the screen and substitute the value into the following formula.

S = Vs × [mV]

2. Saturation signal

Set to standard imaging condition II. After adjusting the luminous intensity to 10 times the intensity with average value of the signal output, 200mV, measure the minimum value of the signal output.

3. Smear

Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity to 500 times the intensity with average value of the signal output, 200mV. When the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value VSm [mV] of the signal output and substitute the value into the following formula.

4. Video signal shading

Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the signal output is 200mV. Then measure the maximum (Vmax [mV]) and minimum (Vmin [mV]) values of the signal output and substitute the values into the following formula.

SH = (Vmax – Vmin)/200 × 100 [%]

5. Dark signal

Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60°C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference.

250

Sm =

× 100 [%] (1/10V method conversion value)

× ×

200

VSm

500

Page 11

– 11 –

ICX054BL

Vlag (lag)Signal output 200mV

Light

FLD

SG1

Strobe light

timing

Output

6. Dark signal shading After measuring 5, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark signal output and substitute the values into the following formula.

∆Vdt = Vdmax – Vdmin [mV]

7. Flicker

Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the signal output is 200mV, and then measure the difference in the signal level between fields (∆Vf [mV]). Then substitute the value into the following formula.

F = (∆Vf/200) × 100 [%]

8. Lag

Adjust the signal output value generated by strobe light to 200mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following formula.

Lag = (Vlag/200) × 100 [%]

Page 12

– 12 –

ICX054BL

15V

XSUB

XV2

XV1

XSG1

XV3

XSG2

XV4

Hφ2Hφ1

10k

100k

10/16V

0.1

47k

2SA1175

0.01

CCD OUT

–8.5V

3.3/16V

47/6.3V

680

100

3.9k

2SK523

180k27k

1/6.3V

1M1500p

0.01

3.3/20V

100k

1/35V

22/16V

22/20V

CXD1267AN

1 2 3 4 5 6 8

16 15 14

13 12 11 10 9

ICX054

(BOTTOM VIEW)

Hφ

SUB

GND

Vφ

GND

OUT

[*A]

VSUB

0.1

Drive Circuit

Page 13

– 13 –

ICX054BL

Spectral Sensitivity Characteristics

(Includes lens characteristics, excludes light source characteristics)

900800700600500

Wave Length [nm]

Relative Response

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.0

0.1

1000400

Sensor Readout Clock Timing Chart

2.02.51.51.2

0.3

38.1

2.5

Unit: µs

V1 V2 V3 V4

Odd Field

V1 V2 V3 V4

Even Field

Page 14

– 14 –

ICX054BL

2 4 6

2 4 6 8

1 3 5

1 3 5 7

2 4

2 4 6

1 3 1 3 5

492

491

492

491

520

525

260

265

270

275

280

FLD

BLK

SG1

SG2

CCD

OUT

CLP1

Drive Timing Chart (Vertical sync)

Page 15

– 15 –

ICX054BL

BLK

XSHP

XSHD

CLP1

SUB

500

505

510

Drive Timing Chart (Horizontal sync)

Page 16

– 16 –

ICX054BL

Notes on Handling

1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material.

Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.

2) Soldering a) Make sure the package temperature does not exceed 80°C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W

soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.

c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering

tool, use a thermal controller of the zero cross On/Off type and connect it to ground.

3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should

dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized

air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when

moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for

electrostatic protection. Do not reuse the tape.

4) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more

than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.)

b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the

package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive.

Compressive strength

50N

Cover glass

Plastic package

50N

1.2Nm

Torsional strength

Page 17

– 17 –

ICX054BL

c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated

voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution.

d) The notch of the package is used for directional index, and that can not be used for reference of fixing.

In addition, the cover glass and seal resin may overlap with the notch of the package.

e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be

generated by the fragments of resin.

f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-

acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference)

5) Others a) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition

exceeding the normal using condition, consult our company.

b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or

usage in such conditions.

c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD

characteristics.

Page 18

– 18 –

ICX054BL

PACKAGE STRUCTURE

0.3

16pin DIP (450mil)

2.5

8.4

0.5

1.2

5.7

6.1

10.3

12.2 ± 0.1

9.5

11.4 ± 0.1

11.43

0.25

0° to 9°

2-R0.5

2.5

11.6

9.2

2.5

1.2

3.35 ± 0.15

3.1

1.27

3.5 ± 0.3

0.46

0.3

1.27

0.69

(For the first pin only)

1. “A” is the center of the effective image area.

2. The two points “B” of the package are the horizontal reference.

The point “B'” of the package is the vertical reference.

3. The bottom “C” of the package, and the top of the cover glass “D”

are the height reference.

4. The center of the effective image area relative to “B” and “B'”

is (H, V) = (6.1, 5.7) ± 0.15mm.

5. The rotation angle of the effective image area relative to H and V is ± 1°.

6. The height from the bottom “C” to the effective image area is 1.41 ± 0.10mm.

The height from the top of the cover glass “D” to the effective image area is 1.94 ± 0.15mm.

7. The tilt of the effective image area relative to the bottom “C” is less than 50µm.

The tilt of the effective image area relative to the top “D” of the cover glass is less than 50µm.

8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5.

9. The notches on the bottom of the package are used only for directional index, they must

not be used for reference of fixing.

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE WEIGHT

Plastic

GOLD PLATING

42 ALLOY

0.9g

Package Outline Unit: mm