Datasheet AV9342F-T, ICS9342F-T Datasheet (ICST)

Page 1
Integrated Circuit Systems, Inc.
ICS9342
Third party brands and names are the property of their respective owners.
9342 Rev E 9/06/00
Pin Configuration
48-Pin 300mil SSOP
Power PC System Clock
Output Features:
12- CPUs @ 3.3V, up to 146MHz
1- PCIREF @ 3.3V, up to 73MHz
1 - OUT 3.3V, 64MHz
1 - OUT/2 3.3V, OUT/2MHz
2 - REF @ 3.3V, 14.318MHz
Features:
Up to 146MHz frequency support
Support power management: CPU, PCI stop and power down mode.
Spread spectrum for EMI control (0 to -0.5%, ± 0.25%).
Uses external 14.318MHz crystal
FS pins for frequency select
Support for industrial temperature range (-40C° to 85C°)
Key Specifications:
CPU Output Skew: <200ps
CPU - PCI Output Skew: <500ps
CPU Output Jitter: <150ps
PCI Output Jitter: <500ps
133MHz Clock Generator and Integrated Buffer for PowerPC™
VDDREF
REF1 REF0
GNDREF
X1 X2
*PD#
*CPU-STOP#
VDD
GND
*PCI_STOP#
*SS_EN#
VDDPCI PCIREF GNDPCI
*FS0 *FS1
*FS2 VDDFP GNDFP
*TEST#/OUT
*BOOST#/OUT_DIV2
*PDFP#
VDDA
OUTSEL1* VDDCPU GNDCPU CPU0 CPU1 CPU2 VDDCPU GNDCPU CPU3 CPU4 CPU5 VDDCPU GNDCPU CPU6 CPU7 CPU8 VDDCPU GNDCPU CPU9 CPU10 CPU11 VDDCPU GNDCPU OUTSEL0*
ICS9342
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
* Internal pull-up resistor of 120K to VDD
on indicated inputs.
Functionality
Block Diagram
SS_EN#
OUTSEL (1:0)
PLL2
PLL1
Spread
Spectrum
OUT
OUT/DIV2
CPUCLK (11:0)
12
2
PCIREF
X1
X2
XTAL OSC
CPU
DIVDER
PCI
DIVDER
Stop
Stop
FS (2:0)
PD#
PDFP#
TEST#
BOOST#
Control
Logic
Config.
Reg.
/ 2
REF (1:0)
TSET2SF1SF0SF
UPC
zHM
ICP
zHM
FER
zHM
1111 33.33133.33813.41 1110 00.00133.33813.41 1101 33.3833.33813.41 1100 66.6633.33813.41 1011 33.33166.66813.41 1010 00.00166.66813.41 1001 33.3866.66813.41 1000 66.6666.66813.41
ICS reserves the right to make changes in the device data identified in this publication without further notice. ICS advises its customers to obtain the latest version of all device data to verify that any information being relied upon by the customer is current and accurate.
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ICS93 42
Third party brands and names are the property of their respective owners.
Pin Configuration
General Description
The ICS9342 generates all clocks required for high speed PowerPC RISC microprocessor systems. With a zero delay buffer chip such as the ICS9112-17 multiple PCI clock outputs can be generated in phase with PCIREF.
Spread Spectrum may be enabled by driving the SS_EN# pin low. Spread spectrum typically reduces system EMI by 8dB to 10dB. This simplifies EMI qualification without resorting to board design iterations or costly shielding. The ICS9342 employs a proprietary closed loop design, which tightly controls the percentage of spreading over process and temperature variations.
PIN NUMBER PIN NAME TYPE DESCRIPTION
1 VDDREF PWR Ref(1:0), XTAL power supply, nominal 3.3V
2,3 REF[1:0] OU T 14.318 MHz reference clocks
4 GNDREF PWR Ground pin for the REF outputs 5 X1 IN Crystal input,nominally 14.318M H z. 6 X2 OUT Crystal output, nominally 14.318MHz. 7 PD # IN Pow ers down chip, active low . 8 CPU_STOP# IN Stops all CPUCLKs [11:0] at logic 0 level, when input low
9 VDD PWR 3.3V power for the digital core. 10 GND PWR Ground pin for the digital core. 11 PCI_STO P# IN Drives P CIREF to logic 0 level, when input low
12 SS_EN# IN
Spread spectrum is turned on by driving this input low and turned off by drivin
g
it high. 13 VDDPCI PWR Power supply for PCIREF, nominal 3.3V. 14 PCIREF OU T Reference clock for PCI Zero Delay Buffer. 15 GNDPCI PWR Ground pin for PCIREF.
18, 17, 16 FS (2:0) IN Frequency select pins.
19 VDDFP PWR 3.3V power for the Fixed PLL core. 20 GNDFP PER Ground pin for the Fixed PLL core.
OUT OUT 3.3V OUT reference clock.
TEST# IN
Logic input to select over clocking or under clocking frequencies. (latched in
p
ut)
OUT_DIV2 OUT 3.3V 1/2 frequency OUT reference clock.
BOOST# IN Logic input to select normal or test mode frequencies. (latched input)
23 PDFP# IN
Powers down Fixed PLL. When driven to low, OUT and OUT_DIV2 clocks will be sto
pp
ed
24 VDDA PWR 3.3V power for the PLL core
48, 25 OUTSEL(1:0) IN Frequency select pins for OUT and OUT_DIV2 clocks. 26, 31, 36, 41, 46 GNDCPU PWR Ground pin for CPU clocks. 27, 32, 37, 42, 47 VDDCPU PWR 3.3V power supply for CPU clocks.
21
22
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ICS93 42
Third party brands and names are the property of their respective owners.
Frequency Selection
1LES_TUO0LES_TUO
TUO
)zHM(
2VID_TUO
)zHM(
FER
)zHM(
118442813.41
100402813.41
014623813.41
0084#84813.41
#TSOOB#TSET2SF1SF0SF
UPC
zHM
ICP
zHM
FER
zHM
EULAV/EPYTSS
delbaneSSfI
X 1 111 33.33133.33813.41daerpSnwoD%5.0-ot0 X1110 00.00133.33813.41daerpSnwoD%5.0-ot0 X1101 33.3833.33813.41daerpSnwoD%5.0-ot0 X1100 66.6633.33813.41daerpSnwoD%5.0-ot0 X1011 33.33166.66813.41daerpSnwoD%5.0-ot0 X1010 00.00166.66813.41daerpSnwoD%5.0-ot0 X1001 33.3866.66813.41daerpSnwoD%5.-ot0 X 1 000 66.6666.66813.41daerpSnwoD%5.0-ot0
1 0 111 26.6416.63813.41daerpSretneC%52.0+ 10110 99.9016.63813.41daerpSretneC%52.0+ 10101 85.196.63813.41daerpSretneC%52.0+ 10100 13.376.63813.41daerpSretneC%52.0+ 10011 26.6413.37813.41daerpSretneC%52.0+ 10010 99.9013.37813.41daerpSretneC%52.0+ 10001 85.193.37813.41daerpSretneC%52.0+
1 0 000 13.373.37813.41daerpSretneC%52.0+ 0 0 111 89.91100.03813.41daerpSretneC%52.0+ 00110 00.0900.03813.41daerpSretneC%52.0+ 00101 39.4700.03813.41daerpSretneC%52.0+ 00100 8/feR=ICP,4/feR=UPC,edoMtseT 00011 89.91100.06813.41daerpSretneC%52.0+ 00010 00.0900.06813.41daerpSretneC%52.0+ 00001 39.4700.06813.41daerpSretneC%52.0+ 0 0 000 stuptuolla,etatsirT
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ICS93 42
Third party brands and names are the property of their respective owners.
Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0 V
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND –0.5 V to V
DD
+0.5 V
Ambient Operating Temperature . . . . . . . . . . . . . -40°C to +85°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only and functional operation of the device at these or any other conditions above those listed in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.
Electrical Characteristics - Input/Supply/Common Output Parameters
TA = 0 - 70º C; Sup p ly Voltage VDD = 3.3 V +/-5% (unles s otherwise stated)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Input High Voltage V
IH
2V
DD
+0.3 V
Input Low Voltage V
IL
VSS-0.3 0.8 V
Input High Current I
IH
VIN = V
DD
0.1 5
µ
A
Input Low C u rrent I
IL1
VIN = 0 V; Inputs with no pull-up resistors -5 2.0
µ
A
Input Low C u rrent I
IL2
VIN = 0 V; Inputs with pull-up resistors -200 -100
µ
A
I
DD3.3OP 66
Select @ 66MHz; Max discrete cap loads 134 175
Operating I
DD3.3OP 83
Select @ 83MHz; Max discrete cap loads 165 200
Supply Current I
DD3.3OP1 00
Select @ 100MHz; Max discrete cap loads 198 225
I
DD3.3OP1 33
Select @ 133MHz; Max discrete cap loads 254 300
Power Down
Supply Current
Input frequency F
i
VDD = 3.3 V 12 14.318 16 MHz
C
IN
Logic Inputs 5 pF
C
INX
X1 & X2 pins 13.5 18 22.5 pF
Transition Time
1
T
Tran s
To 1st crossing of target Freq. 3 ms
Settling Time
1
T
S
From 1st crossing to 1% target Freq. 1 ms
Clk Stabilization
1
T
STAB
From VDD = 3.3 V to 1% target Freq. 3 ms
Skew
1
t
CPU -PCI
VT = 1.5 V 190 500 ps
Input Capacitance
1
mA
PD# = 0I
DD3.3PD
313 400
µ
A
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Electrical Characteristics - PCI
TA = 0 - 70º C; VDD = 3.3 V +/-5%; CL =30 pF
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Output Impedance R
DSP1
1
VO = V
DD
*(0.5) 12 21 55
Output Impedance R
DSN1
1
VO = V
DD
*(0.5) 12 21.2 55
Output High Voltage V
OH1
IOH = -11 mA 2.4
Output Low Voltage V
OL1
IOL = 9.4 mA 0.17 0.4 V
Output High Current I
OH1
VOH = 2.0 V -60 -22 mA
Output Low Current I
OL1
VOL = 0.8 V 25 47 mA
Rise Time
1
t
r1
VOL = 0.4 V, VOH = 2.4 V 0.5 1 2 ns
Fall Time
1
t
f1
VOH = 2.4 V, VOL = 0.4 V 0.5 0.9 2 ns
Duty Cycle
1
d
t1
VT = 1.5 V 45 50 55 %
Jitter, Cycle-to-cycle
1
t
jcyc-cyc1
VT = 1.5 V
170 500 ps
1
Guaranteed by design, not 100% tested in production.
Electrical Characteristics - CP U
TA = 0 - 70º C; VDD = 3.3 V +/-5%; CL = 20 pF (unless otherwise stated)
PARAM ETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Output Impedance R
DSP2B
1
VO = VDD*(0.5) 13.5 20 45
Output Impedance R
DSN2B
1
VO = VDD*(0.5) 13.5 29 45
Output High Voltage V
OH2B
IOH = -8.0 mA 2 2.4 V
Output Low Voltage V
OL2B
IOL = 12 mA 0.32 0.4 V
Output High Current I
OH2B
VOH =1.7 V -37 -16 mA
Output Low Current I
OL2B
VOL = 0.7 V 19 26 mA
Rise Time t
r2B
1
VOL = 0.4 V, VOH = 2.4 V 1.13 2 ns
Fall Time t
f2B
1
VOH = 2.4 V, VOL = 0.4 V 1.27 2 ns VT = 1.5 V; Cpu@ 66M, 83M, 100M 45 52 56 VT = 1.5 V; Cpu@133M & 146.6M 51 56 60
Skew t
sk2B
1
VT = 1.5 V 187 200 ps VT = 1.5 V; Normal 95 150 VT = 1.5 V; Spread, CPU = 91.58MHz 143 200 VT = 1.5 V; Spread, CPU remaining freq. 143 175
1
Guaranteed by design, not 100% tested in production.
Duty Cycle d
t2B
1
%
Jitter, Cycle-to-cycle
tj
cyc-cyc2B
1
ps
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ICS93 42
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Electrical Ch aracteristics - REF, OUT, OUT/2
TA = 0 - 70º C; VDD = 3.3 V +/-5%; CL = 20 pF (unless otherwise stated)
SYMBOL CONDITIONS MIN TYP M A X UNITS
R
DSP5
1
VO = VDD*(0.5) 20 34 60
R
DSN5
1
VO = VDD*(0.5) 20 31 60
V
OH5
IOH = -12 mA 2.4 2.9 V
V
OL5
IOL = 10 mA 0.33 0.4 V
I
OH5
VOH = 2.0 V -30 -20 mA
I
OL5
VOL = 0.8 V 16 23 mA
Rise Time
1
t
r5
VOL = 0.4 V, VOH = 2.4 V; OUT 1.5 1.8 4 ns
Fall Time
1
t
f5
VOH = 2.4 V, VOL = 0.4 V; OUT 1.5 2 4 n s
Duty Cycle
1
d
t5
VT = 1.5 V; OUT 45 52 55 %
Rise Time
1
t
r5
VOL = 0.4 V, VOH = 2.4 V; OUT/2 1.5 2.2 4 ns
Fall Time
1
t
f5
VOH = 2.4 V, VOL = 0.4 V; OUT/2 1.5 2.1 4 ns
Duty Cycle
1
d
t5
VT = 1.5 V; OUT/2 45 50 55 %
Rise Time
1
t
r5
VOL = 0.4 V, VOH = 2.4 V; REF 1.5 2.7 4 ns
Fall Time
1
t
f5
VOH = 2.4 V, VOL = 0.4 V; REF 1.5 2.8 4 ns
Duty Cycle
1
d
t5
VT = 1.5 V; REF 45 50 55 %
t
jcyc-cyc5
VT = 1.5 V; OUT, OUT/2 280 500 ps
t
jcyc-cyc5
VT = 1.5 V; REF
450 1000 ps
1
Guaranteed by design, not 100% tested in production.
Jitter, Cycle-to-cycle1
Jitter, Cycle-to-cycle
1
PARAM ETER
Output Low Voltage
Output High Current
Output High Voltage
Output Impedance
REF
OUT
OUT/2
Output Low Current
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Fig. 1
Shared Pin Operation ­Input/Output Pins
The I/O pins designated by (input/output) on the ICS9342 serve as dual signal functions to the device. During initial power-up, they act as input pins. The logic level (voltage) that is present on these pins at this time is read and stored into a 5-bit internal data latch. At the end of Power-On reset, (see AC characteristics for timing values), the device changes the mode of operations for these pins to an output function. In this mode the pins produce the specified buffered clocks to external loads.
To program (load) the internal configuration register for these pins, a resistor is connected to either the VDD (logic 1) power supply or the GND (logic 0) voltage potential. A 10 Kilohm (10K) resistor is used to provide both the solid CMOS programming voltage needed during the power-up programming period and to provide an insignificant load on the output clock during the subsequent operating period.
Via to VDD
Clock trace to load
Series Term. Res.
Programming Header
Via to Gnd
Device Pad
2K
8.2K
Figure 1 shows a means of implementing this function when a switch or 2 pin header is used. With no jumper is installed the pin will be pulled high. With the jumper in place the pin will be pulled low. If programmability is not necessary, than only a single resistor is necessary. The programming resistors should be located close to the series termination resistor to minimize the current loop area. It is more important to locate the series termination resistor close to the driver than the programming resistor.
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ICS93 42
Third party brands and names are the property of their respective owners.
#DP#PFDP2VID_TUO,1TUOFER,ICP,UPC
11 GNINNURGNINNUR
10 DEPPOTSGNINNUR
01 DEPPOTSDEPPOTS
00 DEPPOTSDEPPOTS
Power Management
PD# Timing Diagram
The power down selection is used to put the part into a very low power state without turning off the power to the part. PD# is an asynchronous active low input. This signal needs to be synchronized internal to the device prior to powering down the clock synthesizer.
Internal clocks are not running after the device is put in power down. When PD# is active low all clocks need to be driven to a low value and held prior to turning off the VCOs and crystal. The power up latency needs to be less than 3 mS. The power down latency should be as short as possible but conforming to the sequence requirements shown below. The REF and OUT clocks are expected to be stopped in the LOW state as soon as possible. Due to the state of the internal logic, stopping and holding the REF clock outputs in the LOW state may require more than one clock cycle to complete.
Notes:
1. All timing is referenced to the Internal CPU (defined as inside the ICS9342 device).
2. As shown, the outputs Stop Low on the next falling edge after PD# goes low.
3. PD# is an asynchronous input and metastable conditions may exist. This signal is synchronized inside this part.
4. The shaded sections on the VCO and the Crystal signals indicate an active clock.
5. Diagrams shown with respect to 133MHz. Similar operation when CPU is 100MHz.
CPU
PCIREF
VCO
Crystal
PD#
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ICS93 42
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PCI_STOP# Timing Diagram
PCI_STOP# is an input to the clock synthesizer. It is used to turn off the PCIREF clock for low power operation. PCIREF clock is required to be stopped in a low state and started such that a full high pulse width is guaranteed.
Notes:
1. All timing is referenced to CPUCLK.
2. Internal means inside the chip.
3. All other clocks continue to run undisturbed.
4. PD# and CPU_STOP# are shown in a high state.
CPUCLK
(internal)
(internal)
(externall)
PCICLK
PCI_STOP#
CPU_STOP#
PD#
PCIREF
CPU_STOP# Timing Diagram
CPU_STOP# is an asynchronous input to the clock synthesizer. It is used to turn off the CPU clocks for low power operation. CPU_STOP# is asserted asynchronously by the external clock control logic with the rising edge of free running PCI clock (and hence CPU clock) and must be internally synchronized to the external output. All other clocks will continue to run while the CPU clocks are disabled. The CPU clocks must always be stopped in a low state and started in such a manner as to guarantee that the high pulse width is a full pulse.
Notes:
1. All timing is referenced to the internal CPUCLK.
2. The internal label means inside the chip and is a reference only. This in fact may not be the way that the control is designed.
3. PD# and PCI_STOP# are shown in a high state.
CPUCLK
(internal)
(internal)
(externall)
PCICLK
PCI_STOP#
CPU_STOP#
PD#
CPUCLK
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ICS93 42
Third party brands and names are the property of their respective owners.
Ordering Information
ICS9342yF-T
Designation for tape and reel packaging Pattern Number (2 or 3 digit number for parts with ROM code patterns) Package Type
F=SSOP
Revision Designator (will not correlate with datasheet revision)
Device Type (consists of 3 or 4 digit numbers) Prefix
ICS, AV = Standard Device
Example:
ICS XXXX y F - PPP - T
MIN MA X MIN MA X
A 2.413 2.794 .095 .110
A1 0.203 0.406 .008 .016
b 0.203 0.343 .008 .0135 c 0.127 0.254 .005 .010 D E 10.033 10.668 .395 .420
E1 7.391 7.595 .291 .299
e 0.635 BASIC 0.025 BASIC h 0.381 0.635 .015 .025 L 0.508 1.016 .020 .040 N
α
VARIATIONS
MIN MA X MIN MA X
28 9.398
9.652
.370 .380
34 11.303
11.557
.445 .455
48 15.748
16.002
.620 .630
56 18.288
18.542
.720 .730
64 20.828
21.082
.820 .830
SYMBOL
SEE VARIATIONS
SEE VARIATIONS
In Millimeters
COMMON DIMENSIONS
In Inc he s
COMMON DIMENSIONS
SEE VARIATIONS
N
D mm.
D (inch)
SEE VARIATIONS
ICS reserves the right to make changes in the device data identified in this publication without further notice. ICS advises its customers to obtain the latest version of all device data to verify that any information being relied upon by the customer is current and accurate.
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