Datasheet ICS9250F-09-T Datasheet (ICST)

General Description Features

ICS9250-09

Integrated
Circuit
Systems, Inc.

Block Diagram

Frequency Timing Generator for PENTIUM II Systems

9250-09 Rev J 1/21/00

Pin Configuration

56-pin SSOP

 Generates the following system clocks:

- 4 CPU clocks ( 2.5V, 100/133MHz)

- 8 PCI clocks, including 1 free-running (3.3V, 33MHz)

- 2 CPU/2 clocks (2.5V, 50/66MHz)

- 3 IOAPIC clocks (2.5V, 16.67MHz)

- 4 Fixed frequency 66MHz clocks(3.3V, 66MHz)

- 2 REF clocks(3.3V, 14.318MHz)

- 1 USB clock (3.3V, 48MHz)

 Efficient power management through PD#, CPU_STOP#

and PCI_STOP#.

 0.5% typical down spread modulation on CPU, PCI,

IOAPIC, 3V66 and CPU/2 output clocks.

 Uses external 14.318MHz crystal.

The ICS9250-09 is a main clock synthesizer chip for
Pentium II based systems using Rambus Interface DRAMs.
This chip provides all the clocks required for such a system
when used with a Direct Rambus Clock Generator(DRCG)
chip such as the ICS9211-01.

Spread Spectrum may be enabled by driving the SPREAD#
pin active. Spread spectrum typically reduces system EMI
by 8dB to 10dB. This simplifies EMI qualification without
resorting to board design iterations or costly shielding. The
ICS9250-09 employs a proprietary closed loop design, which
tightly controls the percentage of spreading over process
and temperature variations.

The CPU/2 clocks are inputs to the DRCG.

Key Specification

 CPU Output Jitter: <250ps
 CPU/2 Output Jitter. <250ps
 IOAPIC Output Jitter: <500ps
 48MHz, 3V66, PCI Output Jitter: <500ps
 Ref Output Jitter. <1000ps
 CPU Output Skew: <175ps
 CPU/2 Output Skew. <175ps
 IOAPIC Output Skew <250ps
 PCI Output Skew: <500ps
 3V66 Output Skew <250ps
 CPU to 3V66 Output Offset: 0.0 - 1.5ns (CPU leads)
 3V66 to PCI Output Offset: 1.5 - 4.0ns (3V66 leads)
 CPU to IOAPIC Output Offset 1.5 - 4.0ns (CPU leads)

ICS reserves the right to make changes in the device data identified in
this publication without further notice. ICS advises its customers to
obtain the latest version of all device data to verify that any
information being relied upon by the customer is current and accurate.

2

ICS9250-09

Pin Descriptions

Pin number Pin name Type Description

1 GN DREF PWR Gnd pin for R EF clocks
2, 3 REF(0:1) OUT 14.318MH z reference clock outputs at 3.3V
4 VDDREF PWR Power pin for REF clocks

5 X1 IN XTAL_IN 14.318MHz crystal input
6 X2 OUT XTAL _OUT Cr ystal output
7, 13, 19 GNDPCI PWR Gnd pin for PCICLKs

8 PCICLK_F OUT

Free running PCI clock at 3.3V. Synchronous to CPU clocks. Not affected
by the PCI_STOP# input.

9, 11, 12, 14, 15,
17, 18

PCICLK[1:7] OUT PC I clock outputs at 3.3V. Synchronous to CPU clocks.

10, 16 VDDPCI PWR 3.3Volts power pin for PCICLKs
20, 24 GND66 P WR Gnd pin for 3V66 outputs

21, 22, 25, 26 3V66[0:3] OUT

66MHz outputs at 3.3V. These outputs are stopped when CPU_S TOP# is
driven active..

23, 27 VDD66 PWR power pin for the 3V66 clocks.
28 SEL 133/100# IN

This selects the frequency fo r the CPU and CPU/2 outputs. High =

133MHz, Low=100MHz
29 G ND48 PWR G round pin for the 48M Hz output
30 48M Hz OUT Fixed 48MHz clock output. 3.3V
31 V DD48 PWR P o wer pin for the 48MHz output.
32, 33 SEL[0:1] IN F unction select pins. See truth table for details.

34 S P READ # IN

Enables spread spectrum when active(Low). modulates all the CP U, PCI,

IOAP IC, 3V66 and CPU/2 clocks. Does not affect the REF and 48MHz

clocks. 0.5% down spread modulation.

35 PD# IN

This asyn chronous input powers down the chip when drive active(Lo w).

The internal PLLs are disabled and all the output clocks are held at a Low

state.
36 CPU_STOP# IN

This asychronous input halts the CPUCLK[0:3] and the 3V66[0:3] clocks at

l

ogic "0" when driven active( Low). Does not affect the CPU/2 clocks.

37 PCI_STOP# IN

This asynchronous input halts the PCICLK[1:7] at logic"0" when driven

active(Low). PCICLK_F is not affected by this input.
38 G NDCOR PWR Ground pin for the PLL core

39 V DDCOR PWR P ower pin for the PLL core. 3.3V
43, 47 VDDLCPU PWR Pow er pin for the CP UCLKs. 2.5V
40, 44 GNDLCPU PWR Ground pin for the CPU C LKs

41, 42, 45, 46 CPUCLK[0:3] OUT

Host bus clock output at 2.5V. 133MHz or 100MHz depending on the state

of the SEL 133/100MHz.
48 GNDLCPU/2 PWR Ground pin for the CPU/2 clocks.

49, 50 CPU/2[0:1] OUT

2.5V clock outputs at 1/2 CPU frequency. 66MHz or50MHz depending on

the state of the SEL 133/100# input pin.
51 V DDLCPU/2 PWR Power pin for the CPU /2 clocks. 2.5V
52 G NDLIOAPIC PWR Ground pin for the IOAPIC outputs.

53, 54, 55 IOAPIC[0:2] OUT

IOAPIC clocks at 2.5V. Synchronous with CPUCLKs but fixed at

16.67MHz.

56 V DDLIOAP IC PWR Pow er pin for the IO APIC outputs. 2.5V.

3

ICS9250-09

Frequency Select:

Note:

1. TCLK is a test clock driven on the x1 input during test mode.

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Power Management Features:

Note:

1. LOW means outputs held static LOW as per latency requirement next page.

2. On means active.

3. PD# pulled Low, impacts all outputs including REF and 48 MHz outputs.

4. All 3V66 as well as all CPLU clocks should stop cleanly when CPU_STOP# is pulled LOW.

5. CPU/2, IOAPIC, REF, 48 MHz signals are not controlled by the CPU_STOP# functionality and are enabled all in all conditions
except PD# = LOW

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4

ICS9250-09

Power Management Requirements:

Note:

1. Clock on/off latency is defined in the number of rising edges of free running PCICLKs between the clock disable goes low/
high to the first valid clock comes out of the device.

2. Power up latency is when PWR_DWN# goes inactive (high to when the first valid clocks are dirven from the device.

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CPU_STOP# Timing Diagram

CPU_STOP# is an asynchronous input to the clock synthesizer. It is used to turn off the CPU and 3V66 clocks for low power
operation. CPU_STOP# is asserted asynchronously by the external clock control logic with the rising edge of free running PCI
clock (and hence CPU clock) and must be internally synchronized to the external output. All other clocks will continue to run
while the CPU clocks are disabled. The CPU clocks must always be stopped in a low state and started in such a manner as to
guarantee that the high pulse width is a full pulse. ONLY one rising edge of PCICLK_F is allowed after the clock control logic
switched for both the CPU and 3V66 outputs to become enabled/disabled.

Notes:

1. All timing is referenced to the internal CPUCLK.

2. The internal label means inside the chip and is a reference only. This
in fact may not be the way that the control is designed.

3. CPU_STOP# signal is an input singal that must be made synchronous
to free running PCICLK_F

4. 3V66 clocks also stop/start before

5. PD# and PCI_STOP# are shown in a high state.

6. Diagrams shown with respect to 133MHz. Similar operation when CPU
is 100MHz

5

ICS9250-09

PCI_STOP# Timing Diagram

PCI_STOP# is an input to the clock synthesizer and must be made synchronous to the clock driver PCICLK_F output. It is used
to turn off the PCI clocks for low power operation. PCI clocks are required to be stopped in a low state and started such that a
full high pulse width is guaranteed. ONLY one rising edge of PCICLK_F is allowed after the clock control logic switched for the
PCI outputs to become enabled/disabled.

Notes:

1. All timing is referenced to CPUCLK.

2. PCI_STOP# signal is an input signal which must be made synchronous to PCICLK_F output.

3. Internal means inside the chip.

4. All other clocks continue to run undisturbed.

5. PD# and CPU_STOP# are shown in a high state.

6. Diagrams shown with respect to 133MHz. Similar operation when CPU is 100MHz.

6

ICS9250-09

PD# Timing Diagram

The power down selection is used to put the part into a very low power state without turning off the power to the part. PD# is
an asynchronous active low input. This signal needs to be synchronized internal to the device prior to powering down the clock
synthesizer.

Internal clocks are not running after the device is put in power down. When PD# is active low all clocks need to be driven to a
low value and held prior to turning off the VCOs and crystal. The power up latency needs to be less than 3 mS. The power down
latency should be as short as possible but conforming to the sequence requirements shown below. PCI_STOP# and CPU_STOP#
are considered to be don't cares during the power down operations. The REF and 48MHz clocks are expected to be stopped in
the LOW state as soon as possible. Due to the state of the internal logic, stopping and holding the REF clock outputs in the
LOW state may require more than one clock cycle to complete.

Notes:

1. All timing is referenced to the Internal CPUCLK (defined as inside the ICS9250 device).

2. As shown, the outputs Stop Low on the next falling edge after PD# goes low.

3. PD# is an asynchronous input and metastable conditions may exist. This signal is synchronized inside this part.

4. The shaded sections on the VCO and the Crystal signals indicate an active clock.

5. Diagrams shown with respect to 133MHz. Similar operation when CPU is 100MHz.

7

ICS9250-09

Absolute Maximum Ratings

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0 V

Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND 0.5 V to V

DD

+0.5 V

Ambient Operating Temperature . . . . . . . . . . . . 0°C to +70°C

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . 65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are
stress specifications only and functional operation of the device at these or any other conditions above those listed in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods
may affect product reliability.

Group Offset

Group Offset Measurement Loads Measure Points

CPU to 3V66 0.0-1.5ns CPU leads CPU @ 20pF, 3V66 @ 30pF CPU @1.25V, 3V66 @ 1.5V

3V66 to PCI 1.5-4.0ns 3V66 leads 3V66 @ 30pF, PCI @ 30pF 3V66 @ 1.5V, PCI @ 1.5V

CPU to IOAPIC 1.5-4.0ns CPU leads CPU @ 20pF, IOAPIC @ 20pF CPU @1.25V, IOAPIC @ 1.5V

N ote: 1. All offsets are to be measured at rising edges.

E

lectrical Characteristics - Input /Suppl y/Common Out put Parameters

TA = 0 - 70º C; Supply Voltage VDD = 3.3 V +/-5%, V

DDL

= 2 .5 V +/-5% ( u n less ot herw ise sta ted )

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Input High Voltage V

I

H

2V

DD

+0.3 V

I npu t Low Voltag e V

I

L

V

S

S

-0.3 0.8 V

Input High Current I

I

H

V

I

N

= V

DD

0.1 5

µ

A

Input Low Current I

I

L1

V

I

N

= 0 V; Inputs with no pull-up r e sistors - 5 2. 0

µ

A

Input Low Current I

I

L2

V

I

N

= 0 V; Inputs with pull -up r esistors -200 -100

µ

A

Operating I

DD3.3OP100

Select @ 100MHz; Max discrete cap loads 68 180

Supply Current I

DD3.3OP133

Select @ 133MHz; Max discrete cap loads 80

Power Down

Supply Current

Input frequency F

i

VDD = 3.3 V 12 14.318 16 MHz

C

I

N

Logic Inputs 5 pF

C

I

NX

X1 & X2 pi ns 27 36 45 p F

Transition Time

1

T

Trans

To 1st crossing of tar get Fr eq. 3 ms

Settling Time

1

T

S

From 1st cross i ng t o 1 % t arget Fr e q. 1 ms

Clk Stabilization

1

T

Stab

From VDD = 3.3 V to 1% target Freq.

3ms

1

Gua ranteed by design, not 100% tested in pr oduction.

Input Capa c ita nc e

1

I

DD3.3PDCL

= 0 pF; PWRDWN# = 0

uA20062

mA

Electrical Characterist ics - Input/ Supply/Com m on O utput Paramet e rs

TA = 0 - 70º C; Supply Voltage VDD = 3.3 V +/-5%, V

DDL

= 2.5 V +/-5% (unless otherwise stated)

PARAMETER SY MBOL CONDITIONS MIN TY P MAX UNITS

Operating I

DD2.5OP 66

Se l e ct @ 100MHz; Max d iscr e t e cap loads

19 25

Supply Cur rent

I

DD2.5OP100

Se l e ct @ 133MHz; Max d iscr e t e cap loads

22 40

1

Guarantee d by design, n ot 100% t ested in production.

mA

8

ICS9250-09

Ele ctrical C haracteristics - CP UCLK

TA = 0 - 70º C; VDD = 3.3 V +/-5%, V

DDL

= 2.5 V +/-5%; CL = 20 pF (unl ess ot he rw i se stated)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Output High Voltage V

OH2B

IOH = -12.0 mA 2 2.2 V

Output Low Voltage V

OL2B

IOL = 12 mA 0.3 0. 4 V

O utput High Curre nt I

OH2B

VOH = 1 .7 V - 35 -19 mA

Ou tput Low C urr e nt I

OL2B

VOL = 0.7 V 19 27 mA

Rise Time t

r2B

1

VOL = 0.4 V, VOH = 2 .0 V 0.4 1.2 1.6 ns

Fall Time t

f2B

1

VOH = 2.0 V, VOL = 0 .4 V 0.4 1.25 1.6 ns

Duty Cycle d

t2B

1

VT = 1.25 V 454855%

Skew t

sk2B

1

VT = 1.25 V 80 175 ps

Jitter, One Sigma t

j1σ2B

1

VT = 1.25 V 20 150 ps

Jitter, Absolute t

jabs2B

1

VT = 1.25 V -2 50 61 +250 ps

Jitter, Cycle-to-cycle

t

jcyc-cyc2B

1

VT = 1.25 V

150 250 ps

1

G ua rante e d by de sign, not 100% tested in produ c t i on.

Ele ctrical C h aracteristics - C PU/ 2

TA = 0 - 70º C; VDD = 3.3 V +/-5%, V

DDL

= 2.5 V +/-5%; CL = 20 pF (unl ess ot he rw i se stated)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Output High Voltage V

OH2B

IOH = -12.0 mA 2 2.3 V

Output Low Voltage V

OL2B

IOL = 12 mA 0.3 0. 4 V

O utput High Curre nt I

OH2B

VOH = 1 .7 V - 35 -19 mA

Ou tput Low C urr e nt I

OL2B

VOL = 0.7 V 19 27 mA

Rise Time t

r2B

1

VOL = 0.4 V, VOH = 2 .0 V 0.4 1.1 1.6 ns

Fall Time t

f2B

1

VOH = 2.0 V, VOL = 0.4 V 0.4 1 1.6 ns

Duty Cycle d

t2B

1

VT = 1.25 V 454855%

Jitter, One Sigma t

j1σ2B

1

VT = 1.25 V 20 150 ps

Jitter, Absolute t

jabs2B

1

VT = 1.25 V -2 50 70 +250 ps

Jitter, Cycle-to-cycle

t

jcyc-cyc2B

1

VT = 1.25 V

100 250 ps

1

G ua rante e d by de sign, not 100% tested in produ c t i on.

9

ICS9250-09

Ele ctrical Charact eristics - 3 V6 6

TA = 0 - 70º C; VDD = 3.3 V +/-5%, V

DDL

= 2.5 V +/-5%; CL =30 pF

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Output High Voltage V

OH1

IOH = -11 mA 2.4 3.1 V

Output Low Voltage V

OL1

IOL = 9.4 mA 0.25 0.4 V

Ou tput High Cu rrent I

OH1

VOH = 2.0 V -60 -22 mA

O ut put Low Current I

OL1

VOL = 0.8 V 25 44 mA

Rise Time

1

t

r1

VOL = 0.4 V , VOH = 2.4 V 0.5 1.6 2 ns

Fall Time

1

t

f1

VOH = 2.4 V, VOL = 0.4 V 0.5 1.3 2 ns

Duty Cycle

1

d

t1

VT = 1.5 V 45 48 55 %

Skew

1

t

sk1

VT = 1.5 V 120 175 ps

Jitter, One Sigma

1

t

j1σ1

VT = 1.5 V 43 150 ps

Jitter, Absolute

1

t

jabs1

VT = 1.5 V -250 100 250 ps

Jitter, Cycle-to-cycle

1

t

jcyc-cyc1VT

= 1.5 V

150 500 ps

1

Guarantee d by design, not 1 00% tested in pr o duc t ion.

Electrical Characteristics - PCICLK

TA = 0 - 70º C; VDD = 3.3 V +/-5%, V

DDL

= 2.5 V +/-5%; CL = 60 pF for PCI0 & PCI1, CL = 30 pF for other PCIs

PARAMETER SYMBOL CONDITIONS MIN TY P MAX UNITS

O utput High Vol ta g e V

OH1

IOH = -11 mA 2.4 3.1 V

Output Low Voltage V

OL1

IOL = 9.4 mA 0.2 0.4 V

Ou tput High C urr e nt I

OH1

VOH = 2.0 V -60 -22 mA

Output Low Current I

OL1

VOL = 0.8 V 25 45 mA

Rise Time

1

t

r1

VOL = 0.4 V, VOH = 2.4 V 0.5 1.7 2 ns

Fall Time

1

t

f1

VOH = 2.4 V , VOL = 0.4 V 0.5 1.6 2 ns

Duty Cycle

1

d

t1

VT = 1.5 V 45 50 55 %

Skew

1

t

sk1

VT = 1.5 V 360 500 ps

Jitter, One Sigm a

1

t

j1σ1

VT = 1.5 V 18 150 ps

Jitter, Absolute

1

t

jabs1

VT = 1.5 V -250 80 250 ps

Jitter, Cycle-to-cycle

1

t

jcyc-cyc1

VT = 1.5 V

155 500 ps

1

Guarantee d by de sign, not 100% t e sted in production.

10

ICS9250-09

Ele ctrical C h aracteristics - 48MHz, REF

TA = 0 - 70º C; VDD = 3.3 V +/-5%, V

DDL

= 2.5 V +/-5%; CL = 20 pF (unl ess ot he rw i se stated)

PARAMETER SYMBOL CONDITIONS MIN TY P MAX UNITS

O utput High Vol ta g e V

OH5

IOH = -12 mA 2.6 2.9 V

Output Low Voltage V

OL5

IOL = 9 mA 0.3 0.4 V

Ou tput High C urr e nt I

OH5

VOH = 2.0 V -35 -22 mA

Output Low Current I

OL5

VOL = 0.8 V 17 23 mA

Rise Time

1

t

r5

VOL = 0.4 V, VOH = 2.4 V , 48MHz 2 4 ns

Fall Time

1

t

f5

VOH = 2.4 V , VOL = 0.4 V , 48MHz 2 4 ns

Duty Cycle

1

d

t5

VT = 1.5 V, 48MHz 45 50 55 %

Rise Time

1

t

r5

VOL = 0.4 V, VOH = 2.4 V, REF 2.2 4 ns

Fall Time

1

t

f5

VOH = 2.4 V, VOL = 0.4 V, REF 1.9 4 ns

Duty Cycle

1

d

t5

VT = 1.5 V, REF 45 52 55 %

Jitter, Cycle-to-cycle

1

t

jcyc-cyc5

VT = 1.5 V, 48MHz 200 500 ps

Jitter, Cycle-to-cycle

1

t

jcyc-cyc5

VT = 1.5 V , REF

800 1000 ps

1

Guarantee d by de sign, not 100% t e sted in production.

Electrical Characteristics - IOAPIC

TA = 0 - 70º C; VDD = 3.3 V +/-5%, V

DDL

= 2.5 V +/-5%; CL = 20 pF (unl ess ot he rw i se stated)

PARAMETER SYMBOL CONDITIONS MIN TY P MAX UNITS

O utput High Vol ta g e V

OH4BIOH

= -12 mA 2 2.23 V

Output Low Voltage V

OL4BIOL

= 12 mA 0.3 0.4 V

Ou tput High C urr e nt I

OH4B

VOH = 1.7 V -36 -16 mA

Output Low Current I

OL4B

VOL = 0.7 V 19 26 mA

Rise Time

1

T

r4B

VOL = 0.4 V, VOH = 2.0 V 0.4 1.3 1.6 ns

Fall Time

1

T

f4B

VOH = 2.0 V , VOL = 0.4 V 0.4 1.25 1.6 ns

Duty Cycle

1

D

t4B

VT = 1.25 V 45 49 55 %

Jitter, One Sigm a

1

T

j1σ4B

VT = 1.25 V 14 150 ps

Jitter, Absolute

1

T

jabs4B

VT = 1.25 V -250 65 250 ps

Jitter, Cycle-to-cycle

1

t

jcyc-cyc4BVT

= 1.25 V

87 50 0 ps

1

Guarantee d by de sign, no t 100% t e sted in production.

11

ICS9250-09

C3

1

Clock Load

C1

C1

2

56

55

54

53

52

51

50

49

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

1

2

3

4

5

6

7

8

Ferrite
Bead

VDD

C2

22µF/20V

Tantalum

Ferrite
Bead

VDD

C2

22µF/20V

Tantalum

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

= Routed Power

= Ground Connection Key (component side copper)

= Ground Plane Connection

= Power Route Connection

= Solder Pads

= Clock Load

3.3V Power Route

3.3V Power Route

2.5V Power Route

Connections to VDD:

General Layout Precautions:

1) Use a ground plane on the top routing
layer of the PCB in all areas not used
by traces.

2) Make all power traces and ground
traces as wide as the via pad for lower
inductance.

Notes:

1 All clock outputs should have

provisions for a 15pf capacitor
between the clock output and series
terminating resistor. Not shown in all
places to improve readability of
diagram.

2 Optional crystal load capacitors are

recommended. They should be
included in the layout but not inserted
unless needed.

12

ICS9250-09

ICS reserves the right to make changes in the device data identified in
this publication without further notice. ICS advises its customers to
obtain the latest version of all device data to verify that any
information being relied upon by the customer is current and accurate.

LOBMYSSNOISNEMIDNOMMOCSNOITAIRAVDN

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A590.201.011.DA027.527.037.65

1A800.210.610.
2A780.090.490.

B800.-5310.

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DsnoitairaVeeS
E192.592.992.

eCSB520.0
H593.-024.

h010.310.610.
L020.-040.
NsnoitairaVeeS

µ

°0- °8

56 Pin 300 mil SSOP Package

“For current dimensional specifications, see JEDEC 95.”

.093
DIA. PIN (Optional)

D/2

E/2

BOTTOM VIEW

A

2

SEE
DETAIL “A”

-E-

c

END VIEW

H

Pin 1

TOP VIEW

Index
Area

PARTING LINE

L

DETAIL “A”

A

1

-e-

B

A

SIDE VIEW

-C-

-D-

SEATING
PLANE

.004

C

Ordering Information

ICS9250yF-09-T

Designation for tape and reel packaging

Pattern Number (2 or 3 digit number for parts with ROM code patterns)

Package Type

F=SSOP

Revision Designator (will not correlate with datasheet revision)

Device Type (consists of 3 or 4 digit numbers)

Prefix

ICS, AV = Standard Device

Example:

ICS XXXX y F - PPP - T

Dimensions in inches