Datasheet ICS9147F-12 Datasheet (ICST)

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Integrated Circuit Systems, Inc.
Pentium/ProTM System and Cyrix Clock Chip
General Description Features
The ICS9147-12 is a Clock Synthesizer chip for Pentium and PentiumPro plus Cyrix CPU based Desktop/Notebook systems that will provide all necessary clock timing.
Features include four CPU, seven PCI and eight SDRAM clocks. Three reference outputs are available equal to the crystal frequency, plus the IOAPIC output powered by VDDL. Additionally, the device meets the Pentium power-up stabilization, which requires that CPU and PCI clocks be stable within 2ms after power-up.
High drive PCICLK and SDRAM outputs typically provide greater than 1 V/ns slew rate into 30 pF loads. CPUCLK outputs typically provide better than 1V/ns slew rate into 20pF loads while maintaining 50 ±5% duty cycle. The REF clock outputs typically provide better than 0.5V/ns slew rates.
The ICS9147-12 accepts a 14.318MHz reference crystal or clock as its input and runs on a 3.3V supply.
Generates system clocks for CPU, IOAPIC, SDRAM,
PCI, plus 14.318 MHz REF(0:2), USB, Plus Super I/O  Supports single or dual processor systems  Supports Intel 60, 66.8MHz, Cyrix 55, 75MHz plus 83.3
and 68MHz (Turbo of 66.6) speeds.  Synchronous clocks skew matched to 250ps window on
CPU, SDRAM and 500ps window on PCI clocks  CPU clocks to PCI clocks skew 1-4ns (CPU early)  Two fixed outputs, 48MHz and 24 MHz  Separate 2.5V and 3.3V supply pins
- 2.5V or 3.3V output: CPU, IOAPIC
- 3.3V outputs: SDRAM, PCI, REF, 48/24 MHz  No power supply sequence requirements  48 pin 300 mil SSOP
ICS9147-12
Block Diagram
Pin Configuration
48-Pin SSOP
Power Groups
VDD1 = REF (0:2), X1, X2 VDD2 = PCICLK_F, PCICLK (0:5) VDD3 = SDRAM (0:7), VDD4 = 48MHz, 24MHz VDDL = IOAPIC, CPUCLK (0:3)
9147-12 Rev A 072597P
Pentium is a trademark on Intel Corporation.
ICS reserves the right to make changes in the device data identified in this publication without further notice. ICS advises its customers to obtain the latest version of all device data to verify that any information being relied upon by the customer is current and accurate.
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Pin Descriptions
PIN NUMBER PIN NAME TYPE DESCRIPTION
1
2 REF0 OUT Reference clock output
3, 10, 17, 24, 31,
31, 37, 43
4X1 IN 5 X2 OUT Crystal output, includes internal load cap to GND.
6, 20, N/C - Pins are not internally connected
7, 15 VDD2 PWR Supply for PCICLK_F, and PCICLK (0:5)
8 PCICLK_F OUT Free running PCI clock
9, 11, 12, 13, 14, 16 PCICLK (0:5) OUT PCI clocks
18 FS0 IN Frequenc y select 0 inpu t 19 FS1 IN Frequenc y select 1 inpu t 21 VDD4 PWR Supply for 48MHz and 24MHz clocks 22 48MHz OUT 48MHz driver output for USB clock 23 24MHz OUT 24MHz driver output for Super I/O clock
25, 28,34 VDD3 PWR Supply for SDRAM (0:7),
26, 27, 29, 30,
32, 33, 35, 36 38, 39, 41, 42 CPUCLK (0:3) OUT CPUCLK clock output, powered by VDDL
40, 46 VDDL PWR Supply for CPUCLK (0:3) & IOAPIC
44 PD# IN 45 IOAPIC OUT IOAPIC clock output, powered by VDDL at crystal frequency
47 REF2 OUT Ref erence clock outpu t. 48 VDD1 PWR Supply for REF (0:2), X1, X2
FS2 IN Latched input for frequency select2 REF1 OUT Reference clock output
GND PWR Ground (common)
Crystal or refer ence input, nomi nally 14.318 M Hz. Includes internal load cap to GND and fee dback resistor from X2.
1
1
SDRAM (0:7) OUT SDRAMs clock at CPU sp eed
Power down stops all clocks low and d isables oscillator and internal VCO’s.
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ICS9147-12
1
Note 1: Internal pull-up resistor of nomimally 100K to 120K at 3.3V on indicated inputs.
Note 2: The PD# input pin has a protection diode clamp to the VDDL power supply. If VDDL is not connected to VDD, (ie
VDDL=2.5V, VDD=3.3V) then this input must have a series resistor if the logic high is connected to VDD. This input series resistor provides current limit for the clamp diode. For a pullup to VDD it should be 1Kohm or more from the PD# pin to VDD. If the PD# pin is being driven by logic powered by 3.3V, then a 100 series resistor will be suffcient.
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Functionality
VDD = 3.3V ±5%, V Crystal (X1, X2) = 14.31818 MHz
= 2.5V ±5% or 3.3V ±5%, TA = 0 to 70°C
DDL
ICS9147-12
FS2 FS1 FS0
0 0 0 83.3 1/2 CPU 0 0 1 75 30 0 1 0 83.3 33.3 0 1 1 68.5 1/2 CPU 1 0 0 55 1/2 CPU 1 0 1 75 1/2 CPU 1 1 0 60 1/2 CPU 1 1 1 66.8 1/2 CPU
CPUCLK, SDRAM
(MHz)
Power Management Functionality
PD#
0 Stopped Low Stopped Low Stopped Low Off Off
1 Running Running Running Running Running
CPUCLK
Outputs
PCICLK(0:5)
Outputs
PCICLK_ F,
REF,
24/48MHz
and SDRAM
PCICLK
(MHz)
Crystal
OSC
VCO
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Technical Pin Function Descriptions
ICS9147-12
VDD(1,2,3,4)
This is the power supply to the internal core logic of the device as well as the clock output buffers for REF(0:2), PCICLK, 48/24MHz and SDRAM(0:7).
This supply operates at 3.3 volts. Clocks from the listed buffer that it supplies will have a voltage swing from Ground to this level. For the actual guaranteed high and low voltage levels for the Clocks, please consult the DC parameter table in this data sheet.
VDDL
This is the power supply for the CPUCLK and IOAPIC output buffers. The voltage level for these outputs may be 2.5 or 3.3 volts. Clocks from the buffers that each supplies will have a voltage swing from Ground to this level. For the actual guaranteed high and low voltage levels of these Clocks, please consult the DC parameter table in this Data Sheet.
GND
This is the power supply ground (common or negative) return pin for the internal core logic and all the output buffers.
X1
This input pin serves one of two functions. When the device is used with a Crystal, X1 acts as the input pin for the reference signal that comes from the discrete crystal. When the device is driven by an external clock signal, X1 is the device input pin for that reference clock. This pin also implements an internal Crystal loading capacitor that is connected to ground. See the data tables for the value of this capacitor. Also includes feedback resistor from X2.
X2
This Output pin is used only when the device uses a Crystal as the reference frequency source. In this mode of operation, X2 is an output signal that drives (or excites) the discrete Crystal. The X2 pin will also implement an internal Crystal loading capacitor that is connected to ground. See the Data Sheet for the value of this capacitor.
CPUCLK (0:3)
These Output pins are the Clock Outputs that drive processor and other CPU related circuitry that requires clocks which are in tight skew tolerance with the CPU clock. The voltage swing of these Clocks is controlled by the Voltage level applied to the VDDL2 pin of the device. See the Functionality Table for a list of the specific frequencies that are available for these Clocks and the selection codes to produce them.
SDRAM(0:7)
These Output Clocks are use to drive Dynamic RAMs and are low skew copies of the CPU Clocks. The voltage swing of the SDRAMs output is controlled by the supply voltage that is applied to VDD3 of the device, operating at 3.3 volts.
48MHz
This is a fixed frequency Clock output at 48MHz that is typically used to drive USB devices.
24MHz
This pin is a fixed frequency clock output typically used to drive Super I/O devices.
IOAPIC
This Output is a fixed frequency Output Clock that runs at the Reference Input (typically 14.31818MHz) . Its voltage level swing is controlled by VDDL and may operate at 2.5 or
3.3volts.
REF(0:2)
The REF Outputs are fixed frequency Clocks that run at the same frequency as the Input Reference Clock X1 or the Crystal (typically 14.31818MHz) attached across X1 and X2.
PCICLK_F
This Output is equivalent to PCICLK(0:5) and is FREE RUNNING.
PCICLK (0:5)
These Output Clocks generate all the PCI timing requirements for a Pentium/Pro based system. They conform to the current PCI specification. They run at 1/2 CPU frequency, or CPU/
2.5; see frequency table.
FS0,1,2
These Input pins control the frequency of the Clocks at the CPU, PCICLK and SDRAM output pins. See frequency table. The level of FS2 is latched at power-on, defined by a series resistor (typically 10K ohm) to VDD or GND.
PD#
This input pin stops all clocks in the low state and powers down the oscillator and VCOs.
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ICS9147-12
Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0 V
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND 0.5 V to VDD +0.5 V
Ambient Operating Temperature . . . . . . . . . . . . 0°C to +70°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . 65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only and functional operation of the device at these or any other conditions above those listed in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.
Electrical Characteristics at 3.3V
VDD = 3.0  3.7 V, TA = 0  70° C unless otherwise stated
DC Characteristics
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS Input Low Voltage VIL Latched inputs an d Fulltime inputs - - 0.2VDD V Input High Voltage V IH Latched inputs an d Fulltime inputs 0.7VDD - - V Input Low C urrent IIL VIN = 0V (F ulltime inputs) -28 .0 -1 0.5 - µA
Input High C urrent IIH VIN=VDD (Fulltime inputs) -5.0 - 5.0 µA
Output Low Current
Output High Current
Output Low Current
Output High Current
Output Low Voltage
Output High Voltage
Output Low Voltage
Output High Voltage
Supply Curre nt IDD @66 .6 MHz; all outputs u nloaded - 120 180 m A Supply Current IDDPD Power Down 300 500 µ A
Note 1: Parameter is guaranteed by design and characterization. Not 100% tested in production.
IOL1a
IOL1b VOL = 0.8V; CPU; VDDL = 2.5V 19.0 30.0 mA IOH1a IOH1b VOH = 2.0V; CPU; VDDL = 2.5V -12.5 -9.5 mA
IOL2a
IOL2b IOH2a
IOH2b VOH = 2.0V; IOAPIC; VDDL = 2.5V -13.0 -4.0 mA VOL1a
VOL1b IOL = 10mA; CPU; VDDL = 2.5V 0.3 0.4 V VOH1a VOH1b IOH = -10mA; CPU; VDDL = 2.5V 1.95 2.1 V VOL2a
VOL2b VOH2a
VOH2b
VOL = 0.8V; CPU, SDRAM, 48MHz; VDDL = 3.3V
VOH = 2.0V; CPU, SDRAM, 48MHz; VDDL = 3.3V
VOL = 0.8V; 24, PCI, REF, IOAPIC; VDDL = 3.3V VOL = 0.8V; IOAPIC; VDDL = 2.5V VOH = 2.0V for IOAPIC, P CI, REF, 24MHz at VDDL = 3.3V
IOL = 10mA; CPU, SDRAM, 48MHz; VDDL = 3.3V
IOH = -10mA; CPU, SDRAM, 48MHz; VDDL = 3.3V
IOL = 10m A; for IOAPIC , PCI, REF, 24MHz at VDDL= 3.3V IOL = 10m A; PCI, REF, IOAPIC; VDDL = 2.5V IOH = -10m A; for IOAP IC, PCI, REF, 24MHz at VDDL = 3.3V IOH = -10mA; IOAPIC; VDDL = 2.5V
19.0 30.0 - mA
- -26.0 -16.0 mA
16.0 25 .0 - mA
16.0 25 .0 mA
- -40.0 -14.0 mA
-0.30.4V
2.4 2.8 - V
-0.30.4V
0.3 0.4 V
2.4 2.8 - V
1.6 2.1 - V
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Electrical Characteristics at 3.3V
VDD = 3.0  3.7 V, TA = 0  70° C unless otherwise stated
AC Characteristics
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX U NITS
Rise Time Rise Time
Fall Time Rise Time Fall Time Rise Time Fall Time
Rise Time Rise Time Fall Time Rise Time Fall Time
Duty Cycle Jitter, Cycle to Cycle
Jitter, One Sigma Jitter, Absolute
Jitter Absolute Jitter, One Sigma
Jitter, Absolute Input Frequency
Logic Input Capacitance Crystal Oscillator Capacitance
Power-on Time Clock Skew Clock Skew
Clock Skew Clock Skew
Clock Skew
Note 1: Parameter is guaranteed by design and characterization. Not 100% tested in production. Note 2: Includes VDDL = 2.5V Note 3: VDD3 = 3.3V
1
1
1,3
1
1
1
1
1,3
1
1,3
1
1
1
1
1, 2
1, 2
1
1
1
1
1
1
1
1
1
1
1,2
1
Tr1a Tr1b
Tf1 20 pF load, 2.0 to 0.8V CPU, 48MHz; - 0.8 1.4 ns Tr2 30pF load SDRAM 0.8 to 2.0V - 1.0 1.6 ns Tf2 30pF load SDRAM 2.0 to 0.8V - 0.9 1.5 ns Tr3 30pF load PCI 0. 8 to 2.0V - 1.2 2.0 ns Tf3 30pF load PCI 2. 0 to 0.8V - 1.1 1.9 ns
Tr4
Tr4a
Tf4 Tr5 Tf5
Dt 20pF load @ VOUT=1 .4V 45 50 55 %
Tjc-c CPU, VDDL = 3.0 to 3.7V 250 300 ps Tj1s1
Tjab1
Tjab1a PCI; Load=30pF -500 - 500 ps
Tj1s2 Tjab2
Fi 12.0 14.318 16.0 MHz
CIN Logic input pins - 5 - pF
CINX X1, X2 pins - 18 - pF
ton Tsk1 Tsk2
Tsk2 PCI to PCI; Load= 20pF; @1.4 V - 300 500 ps Tsk3
Tsk4
20pF load, 0. 8 to 2.0V CPU, 48MHz; VDD = 3.3V 20pF load, 0. 8 to 2.0V CPU; VDDL @ 2.5V
20pF load, 0. 8 to 2.0V 24MHz, REF (1:2) & IOAPIC 45pF load, 0. 8 to 2.0V , IOAPI C with VDDL = 2.5V 20pF load, 2. 0 to 0.8V 24MHz, REF (1:2) & IOAPIC Load = 45pF 0.8 to 2.0V REF0 VDD = 3.3V Load = 45pF 2.0 to 0.8V, REF0 VDD = 3.3V
CPU; Load=20pF, SDRAM & BUS Clocks Lo ad = 30pF CPU; Load=20pF, SDRAM & PCI Clocks Loa d = 30pF
REF (1:2), 48/24MHz Load=20pF, REF0 C
L = 45pF
REF (1:2), 48/24MHz Load=20pF, REF0 C
L = 45pF
From VDD=1.6V to 1st crossing of
66.6 MHz VDD supply ram p < 40ms CPU to CPU; Load=20pF; @1.4V (Same VDD) SDRAM to SDRAM; Load=30pF @ 1.4V
CPU(20pF) to PCI (30pF); @1.4V (CPU is early) SDRAM (30 pF @3.3V) t o CPU (20pF @2.5V) (2.5V CPU is late)
ICS9147-12
-0.91.5ns
-1.52.0ns
- 0.83 1.4 ns
-2.22.6 ns
- 0.81 1.3 ns
1.6 2.0 ns
1.6 2.0 ns
- 50 150 ps
-250 - 250 ps
- 1 3 %
-5 2 5 %
- 2.5 4.5 ms
- 150 250 ps
- 150 250 ps
1 2.6 4 ns
250 400 ps
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Shared Pin Operation ­Input/Output Pins
Pins 1 and 2 on the ICS9147-12 serves as dual signal functions to the device. During initial power-up, it acts as an input pin. The logic level (voltage) that is present on this pin at this time is read and stored into a 4-bit internal data latch. At the end of Power-On reset, (see AC characteristics for timing values), the device changes the mode of operations for this pin to an output function. In this mode the pin produces the specified buffered clocks to external loads.
To program (load) the internal configuration register for this pin, a resistor is connected to either the VDD (logic 1) power supply or the GND (logic 0) voltage potential. A 10 Kilohm(10K) resistor is used to provide both the solid CMOS programming voltage needed during the power-up programming period and to provide an insignificant load on the output clock during the subsequent operating period.
ICS9147-12
Figs. 1 and 2 show the recommended means of implementing this function. In Fig. 1 either one of the resistors is loaded onto the board (selective stuffing) to configure the devices internal logic. Figs. 2a and b provide a single resistor loading option where either solder spot tabs or a physical jumper header may be used.
These figures illustrate the optimal PCB physical layout options. These configuration resistors are of such a large ohmic value that they do not effect the low impedance clock signals. The layouts have been optimized to provide as little impedance transition to the clock signal as possible, as it passes through the programming resistor pad(s).
Fig. 1
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ICS9147-12
Fig. 2a
Fig. 2b
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ICS9147-12
SYMBOL COMMON DIMENSIO NS VARIATIONS D N
MIN. NOM. MAX. MIN. NOM. MAX.
A .095 .101 .110 AC .620 .625 .630 48 A1 .008 .012 .016 AD .720 .725 .730 56 A2 .088 .090 .092
B .008 .010 .0135
C .005 .006 .0085
D See Variations
E .292 .296 .299
e0.025 BSC
H .400 .406 .410
h .010 .013 .016 L .024 .032 .040 N See Variations
X .085 .093 .100
Ordering Information
ICS9147F-12
Example:
ICS XXXX F - PPP
Pattern Number (2 or 3 digit number for parts with ROM code patterns)
Package Type
F=SSOP
Device Type (consists of 3 or 4 digit numbers)
Prefix
ICS, AV = Standard Device
SSOP Package
This table in inches
ICS reserves the right to make changes in the device data identified in this publication without further notice. ICS advises its customers to obtain the latest
9
version of all device data to verify that any information being relied upon by the customer is current and accurate.
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