The ICS670-01 is a high speed, low phase noise
Zero Delay Buffer (ZDB) which integrates ICS’
proprietary analog/digital Phase Locked Loop
(PLL) techniques. Part of ICS’ ClockBlocks
family, the zero delay feature means that the rising
edge of the input clock aligns with the rising edges
of the outputs, giving the appearance of no delay
through the device. There are two identical outputs
on the chip. The FBCLK should be used to
connect to the FBIN. Each output has its own
output enable pin.
™
• Packaged in 16 pin SOIC
• Clock inputs from 5 to 160 MHz (see page 2)
• Patented PLL with the lowest phase noise
• Output clocks up to 160 MHz at 3.3 V
• 15 selectable on-chip multipliers
• Power down mode available
• Low phase noise: -124 dBc/Hz at 10 kHz
• Output Enable function tri-states outputs
ICS670-01
The chip is ideal for synchronizing outputs in a
large variety of systems, from personal computers
to data communications to video. By allowing offchip feedback paths, the ICS670-01 can eliminate
the delay through other devices. The 15 different
on-chip multipliers work in a variety of
applications. For other multipliers, including
fractional multipliers, see the ICS527.
Block Diagram
ICLK
FBIN
S3:S0
Phase
Detector,
Charge
Pump, and
Loop Filter
Voltage
Controlled
Oscillator
4
• Low jitter 15 ps one sigma
• Full swing CMOS outputs with 25 mA drive
capability at TTL levels
• Advanced, low power, sub-micron CMOS process
• Industrial temperature version available
• 3.3 V or 5 V operation
OE1
ROM-
Based
Multi
liers
Output
Buffer
Output
Buffer
FBCLK
CLK2
External feedback from FBCLK is recommended.
MDS 670-01 B1Revision 100900 Printed 11/15/00
Integrated Circuit Systems • 525 Race Street • San Jose •CA•95126•(408) 295-9800tel•http://www.icst.com
0=connect directly to ground
1=connect directl to VDD
NumberName TypeDescription
1VDDPConnect to +3.3V or +5V. Must match other VDDs.
2VDDPConnect to +3.3V or +5V. Must match other VDDs.
3VDDPConnect to +3.3V or +5V. Must match other VDDs.
4CLK2OClock output from VCO. Output frequency equals the input frequency times multiplier.
5OE2IOutput clock enable 2. Tri-states the clock 2 output when low.
6FBCLKOClock ouput from VCO. Output frequency equals the input frequency times multiplier.
7
8FBINCIFeedback clock input.
9ICLKCIClock input. Connect to a 5 - 160 MHz clock.
10S3IMultiplier select pin 3. Determines outputs per table above. Internal pull-up.
11S2IMultiplier select pin 2. Determines outputs per table above. Internal pull-up.
12S1IMultiplier select pin 1. Determines outputs per table above. Internal pull-up.
13S0IMultiplier select pin 0. Determines outputs per table above. Internal pull-up.
14GNDPConnect to ground.
15GNDPConnect to ground.
16GNDPConnect to ground.
OE1IOutput clock enable 1. Tri-states the feedback clock output when low.
Key: I = Input with internal pull-up resistor; O = output; P = power supply connection; CI = clock input.
MDS 670-01 B2Revision 100900 Printed 11/15/00
Integrated Circuit Systems • 525 Race Street • San Jose •CA•95126•(408) 295-9800tel•http://www.icst.com
Page 3
ICS670-01
V
V
Low Phase Noise Zero Delay Buffer and Multiplier
Electrical Specifications
ParameterConditionsMinimumTypicalMaximumUnits
ABSOLUTE MAXIMUM RATINGS (note 1)
Supply voltage, VDDReferenced to GND7V
Inputs and Clock OutputsReferenced to GND-0.5VDD+0.5V
Ambient Operating Temperature070°C
Ambient Operating Temperature, ICS670M-01I Industrial temperature-4085°C
Soldering TemperatureMax of 10 seconds260°C
Storage temperature-65150°C
DC CHARACTERISTICS (VDD = 3.3 V unless noted)
Operating Voltage, VDD 3.05.5V
Input High Voltage, VIH2V
Input Low Voltage, VIL0.8V
Output High Voltage, VOH, CMOS levelIOH=-4mAVDD-0.4V
Output High Voltage, VOHIOH=-12mA2.4V
Output Low Voltage, VOLIOL=12mA0.4V
Operating Supply Current, IDD No Load35mA
Short Circuit CurrentEach output±50mA
Internal Pull-up ResistorOE, select pins200kΩ
Input CapacitanceOE, select pins5pF
AC CHARACTERISTICS (VDD = 3.3
Input Frequency (see table on page 2)Depends on multiplier5160MHz
Output Frequencyat 3.3V or 5V160MHz
Output Clock Rise Time0.8 to 2.0V, no load1.5ns
Output Clock Fall Time0.8 to 2.0V, no load1.5ns
Output Clock Duty CycleAt VDD/2455055%
Input to output skew, rising edgesNote 2±100ps
Maximum Absolute Jitter, short term±45ps
Maximum Jitter, one sigma15ps
Phase Noise, relative to carrier, 125 MHz (x5)100 Hz offset-110dBc/Hz
Phase Noise, relative to carrier, 125 MHz (x5)1 kHz offset-122dBc/Hz
Phase Noise, relative to carrier, 125 MHz (x5)10 kHz offset-121dBc/Hz
Phase Noise, relative to carrier, 125 MHz (x5)100 kHz offset-117dBc/Hz
unless noted)
Notes:1. Stresses beyond those listed under Absolute Maximum Ratings could cause permanent damage to the device. Prolonged
exposure to levels above the operating limits but below the Absolute Maximums may affect device reliability.
2. Rising edge of ICLK compared with rising edge of CLK2, with FBCLK connected to FBIN, and 15 pF load on CLK2.
See the graph on page 4 for skew versus frequency and loading.
MDS 670-01 B3Revision 100900 Printed 11/15/00
Integrated Circuit Systems • 525 Race Street • San Jose •CA•95126•(408) 295-9800tel•http://www.icst.com
Page 4
300
p
ICS670-01
Low Phase Noise Zero Delay Buffer and Multiplier
200
100
0
02 55075100125150
-100
Skew (ps)
-200
-300
-400
CL = 20 pF
CL = 10 pF
CLK2 Frequency (MHz)
Figure 1.ICS670-01 skew from ICLK to CLK2, with change in load capacitance.
VDD = 3.3 V.
Adjusting Input/Output Skew
The data in Figure 1 can be used to adjust individual circuit characteristics and achieve the minimum
possible skew between ICLK and CLK2. With a 125 MHz output, for example, having a total load
capacitance of 15 pF will result in nearly zero skew between ICLK and CLK2. Note that the load
capacitance includes board trace capacitance, input capacitance of the load being driven by the ICS670-01,
and any additional ca
acitors connected to CLK2.
0
-20
-40
-60
-80
Phase Noise (dBc/Hz)
-100
-120
-140
10.0E+0100.0E+01.0E+310.0E+3100.0E+31.0E+610.0E+6
Offset from Carrier (Hz)
Figure 2.Phase Noise of ICS670-01 at 125 MHz out, 25 MHz clock input.
VDD = 3.3 V.
MDS 670-01 B4Revision 100900 Printed 11/15/00
Integrated Circuit Systems • 525 Race Street • San Jose •CA•95126•(408) 295-9800tel•http://www.icst.com
Page 5
ICS670-01
p
S
S
Low Phase Noise Zero Delay Buffer and Multiplier
External Components Selection
The ICS670-01 requires a minimum number of external components for proper operation. Decoupling
capacitors of 0.01 µF should be connected between VDD and GND, as close to the part as possible. A
series termination resistor of 33 Ω may be used for each clock out
Package Outline and Package Dimensions
(
For current dimensional specifications, see JEDEC Publication No. 95.)
ICS670M-01ICS670M-01tubes16 pin narrow SOIC0 to 70 °C
ICS670M-01TICS670M-01tape and reel16 pin narrow SOIC0 to 70 °C
ICS670M-01IICS670M-01Itubes16 pin narrow SOIC-40 to 85 °C
ICS670M-01ITICS670M-01Itape and reel16 pin narrow SOIC-40 to 85 °C
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its
use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is
intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary
environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does
not authorize or warrant any ICS product for use in life support devices or critical medical instruments.
MDS 670-01 B5Revision 100900 Printed 11/15/00
Integrated Circuit Systems • 525 Race Street • San Jose •CA•95126•(408) 295-9800tel•http://www.icst.com
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