Datasheet IC62VV25616L-100B, IC62VV25616L-100BI, IC62VV25616L-100T, IC62VV25616L-100TI, IC62VV25616L-55B Datasheet (ICSI)

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IC62VV25616L IC62VV25616LL
Document Title
256Kx16 bit 1.8V and Ultra Low Power CMOS Static RAM
Revision History
Revision No History Draft Date Remark
The attached datasheets are provided by ICSI. Integrated Circuit Solution Inc reserve the right to change the specifications and products. ICSI will answer to your questions about device. If you have any questions, please contact the ICSI offices.
Integrated Circuit Solution Inc. 1
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IC62VV25616L IC62VV25616LL
256K x 16 1.8V ULTRA LOW POWER CMOS STATIC RAM
FEATURES
• High-speed access times: 55, 70, 100 ns
CMOS low power operation I
CC1=10mA (typical)* operating
I
SB2=1µA (typical)* CMOS standby
* Typical values are measured at V
A=25°C
T
CC=1.8V,
• TTL compatible interface levels
• Single 1.65V-2.2V Vcc power supply
• Fully static operation: no clock or refresh required
• Three state outputs
• Data control for upper and lower bytes
• Industrial temperature available
• Available in the 44-pin TSOP-2 and 48-pin 6*8mm TF-BGA
FUNCTIONAL BLOCK DIAGRAM
DESCRIPTION
The ICSI IC62VV25616L and IC62VV25616LL are low-power,
4.194,304 bit static RAMs organized as 262,144 words by 16 bits. They are fabricated using ICSI's high-performance CMOS technology. This highly reliable process coupled with innova­tive circuit design techniques, yields high-performance and low power consumption devices.
When CE is HIGH (deselected) or both LB and UB are HIGH, the device assumes a standby mode at which the power dissipation can be reduced by using CMOS input levels.
Easy memory expansion is provided by using Chip Enable Output and Enable inputs, CE and OE. The active LOW Write Enable (WE) controls both writing and reading of the memory. A data byte allows Upper Byte (UB) and Lower Byte (LB) access.
The IC62VV25616L and IC62VV25616LL are packaged in the JEDEC standare 44-pin TSOP-2 and 48-pin 6*8mm TF-BGA.
A0-A17
VCC GND
I/O0-I/O7
Lower Byte
I/O8-I/O15
Upper Byte
CE OE
WE
UB
LB
ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2001, Integrated Circuit Solution Inc.
DECODER
I/O
DATA
CIRCUIT
CONTROL
CIRCUIT
256K x 16
MEMORY ARRAY
COLUMN I/O
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IC62VV25616L IC62VV25616LL
PIN CONFIGURATIONS
44-Pin TSOP-2
1
A4
2
A3
3
A2
4
A1
5
A0
6
CE
7
I/O0
8
I/O1
9
I/O2
10
I/O3
11
Vcc
I/O4 I/O5 I/O6 I/O7
WE A16 A15 A14 A13 A12
12 13 14 15 16 17 18 19 20 21 22
GND
48-Pin TF-BGA (TOP View)
44
A5
43
A6
42
A7
41
OE
40
UB
39
LB
38
I/O15
37
I/O14
36
I/O13
35
I/O12
34
GND
33
Vcc
32
I/O11
31
I/O10
30
I/O9
29
I/O8
28
NC
27
A8
26
A9
25
A10
24
A11
23
A17
A B C D
E F
G H
1 2 3 4 5 6
A1
LB
I/O
I/O
GND
Vcc
I/O
I/O
NC
8
9
14
15
OE
UB A3
I/O10A5
I/O
11
I/O
12
I/O
13
NC
A8
A0
A17
NC
A14
A12
A9
A4
A6
A7
A16
A15
A13
A10
A2
CE I/O
I/O1I/O
I/O
3
I/O
4
I/O
5
WE
A11 NC
N/C
Vcc
GND
I/O
I/O
0
2
6
7
PIN DESCRIPTIONS
A0-A17 Address Inputs I/O0-I/O15 Data Input/Output
CE Chip Enable Input OE Output Enable Input WE Write Enable Input
LB Lower-byte Control (l/O0-I/O7) UB Upper-byte Control (l/O8-I/O15)
NC No Connection Vcc Power GND Ground
TRUTH TABLE
I/O PIN
Mode
WEWE
WE
WEWE
Not Selected X H X X X High-Z High-Z Stand by
Output Disabled H L H X X High-Z High-Z Active
Read H L L L H DOUT High-Z Active
Write L L X L H DIN High-Z Active
CECE
CE
CECE
OEOE
OE
OEOE
LBLB
LB
LBLB
UBUB
UB I/O0/-I/O7 I/O8-I/O15 Power
UBUB
X L X H H High-Z High-Z Stand by
X L X H H High-Z High-Z Stand by
H L L H L High-Z DOUT HLLLL DOUT DOUT
L L X H L High-Z DIN LLXLL DIN DIN
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IC62VV25616L IC62VV25616LL
OPERATING RANGE
Range Ambient Temperature VCC
Commercial 0°C to +70°C 1.65V- 2.2V Industrial –40°C to +85°C 1.65V - 2.2V
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol Parameter Value Unit
VTERM Terminal Voltage with Respect to GND –0.5 to Vcc + 0.4 V TBIAS Temperature Under Bias –40 to +85 °C VCC Vcc related to GND –0.3 to +4.0 V TSTG Storage Temperature –65 to +150 °C PT Power Dissipation 1.0 W
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol Parameter Test Conditions Min. Max. Unit
VOH Output HIGH Voltage IOH = –0.1 mA 1.4 V
VOL Output LOW Voltage IOL = 0.1 mA 0.2 V
(1)
VIH VIL
(2)
Input HIGH Voltage 1.4 VCC + 0.2 V
Input LOW Voltage –0.2 0.4 V ILI Input Leakage GND VIN VCC –1 1 µA ILO Output Leakage GND VOUT VCC, OUTPUTS DISABLED –1 1 µA
Notes:
1. VIH(max.) = VCC+2.0V for pulse width less than 10 ns.
IL(min.) = –2.0V for pulse width less than 10 ns.
2. V
CAPACITANCE
(1)
Symbol Parameter Conditions Max. Unit
CIN Input Capacitance VIN = 0V 6 pF COUT Output Capacitance VOUT = 0V 8 pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
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IC62VV25616L IC62VV25616LL
AC TEST CONDITIONS
Parameter Unit
Input Pulse Level 0.4V to 1.4V Input Rise and Fall Times 5 ns Input Reference Level 0.9V
Output Reference Level 0.9V Output Load See Figures 1
AC TEST LOADS
OUTPUT
100 pF or 30PF (for 55ns)
Including
jig and
scope
1 TTL
OUTPUT
5 pF
Including
jig and
scope
1 TTL
Figure 1 Figure 2
IC62VV25616L POWER SUPPLY CHARACTERISTICS
(1)
(Over Operating Range)
-55 -70 -100
Symbol Parameter Test Conditions Min. Max. Min. Max. Min. Max. Unit
ICC1 Vcc Dynamic Operating VCC = 1.8V, Com. 20 15 10 mA
Supply Current IOUT = 0 mA, f = fMAX Ind. 20 15 10
ICC2 Vcc Dynamic Operating VCC =1.8V, Com . 2 2 2 mA
Supply Current IOUT = 0 mA, f = 1MHZ Ind.—2—2—2
ISB2 CMOS Standby VCC = Max., Other inputs= 0 - VCC Com. 35 35 35 µA
Current (CMOS Inputs) 1) CE ≥ VCC – 0.2V (CE controlled) Ind. 50 50 50
2) LB/ UB ≥ VCC – 0.2V (LB/ UB controlled)
Note:
1. At f = f
MAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
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IC62VV25616L IC62VV25616LL
IC62VV25616LL POWER SUPPLY CHARACTERISTICS
(1)
(Over Operating Range)
-55 -70 -100
Symbol Parameter Test Conditions Typ
(2)
. Max. Typ
(2)
. Max. Typ
(2)
. Max. Unit
ICC1 Vcc Dynamic Operating VCC = 1.8V, CE ≤ VIL Com. 20 10 15 7 10 mA
Supply Current IOUT = 0 mA, f = fMAX Ind. 20 10 15 7 10
ICC2 Vcc Dynamic Operating VCC = 1.8V, CE ≤ VIL Com. —2 —2 —2 mA
Supply Current IOUT = 0 mA, f = 1MHZ Ind.—2—2—2
ISB2 CMOS Standby VCC = Max., Other inputs= 0 - VCC Com. 2 10 2 10 2 10 µA
Current (CMOS Inputs) 1) CE ≥ VCC – 0.2V (CE controlled) Ind. 15 15 15
2) LB/ UB ≥ VCC – 0.2V (LB/ UB controlled)
Note:
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
2. Typical values are measured at Vcc=1.8V, Ta=25°C, and are not guaranteed or tested.
READ CYCLE SWITCHING CHARACTERISTICS
(1)
(Over Operating Range)
-55 -70 -100
Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
tRC Read Cycle Time 55 70 100 ns tAA Address Access Time 55 70 100 ns tOHA Output Hold Time 10 10 15 ns tACE CE Access Time 55 70 100 ns tDOE OE Access Time 30 35 50 ns
(2)
tHZOE tLZOE tHZCE tLZCE
OE to High-Z Output 20 25 30 ns
(2)
OE to Low-Z Output 5 5 5 ns
(2)
CE to High-Z Output 0 20 0 25 0 30 ns
(2)
CE to Low-Z Output 10 10 10 ns
tBA LB, UB Access Time 55 70 100 ns tHZB LB, UB o High-Z Output 0 25 0 25 0 35 ns tLZB LB. UB to Low-Z Output 0 0 0 ns
Notes:
1. Test conditions assume signal transition times of 5 ns or less, input pulse levels of 0.4V to 1.4V and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
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IC62VV25616L IC62VV25616LL
AC TEST LOADS
READ CYCLE NO.1
ADDRESS
D
OUT
AC WAVEFORMS READ CYCLE NO. 2
(1,2)
(Address Controlled) (CE = OE = VIL, UB or LB = VIL)
t
RC
t
AA
t
OHA
PREVIOUS DATA VALID
(1,3)
(OE Controlled)
t
DATA VALID
OHA
t
RC
ADDRESS
t
AA
OE
t
DOE
t
CE
t
LZCE
LZOE
t
ACE
LB, UB
t
BA
t
OUT
D
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CE, UB, or LB = V
3. Address is valid prior to or coincident with CE LOW transitions.
HIGH-Z
LZB
IL.
DATA VALID
t
HZOE
t
HZCE
t
HZB
t
OHA
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IC62VV25616L IC62VV25616LL
WRITE CYCLE SWITCHING CHARACTERISTICS
(1,2)
(Over Operating Range)
-55 -70 -100
Symbol Parameter Min. Max. Min. Max. Min. Max Unit
tWC Write Cycle Time 55 70 100 ns tSCE CE to Write End 50 65 80 ns tAW Address Setup Time to Write End 50 65 80 ns tHA Address Hold from Write End 0 0 0 ns tSA Address Setup Time 0 0 0 ns tPWB LB, UB Valid to End of Write 45 60 80 ns tPWE WE Pulse Width 45 55 80 ns tSD Data Setup to Write End 25 30 40 ns tHD Data Hold from Write End 0 0 0 ns
(3)
tHZWE tLZWE
Notes:
1. Test conditions assume signal transition times of 5 ns or less, input pulse levels of 0.4V to 1.4V and output loading specified in Figure 1.
2. The internal write time is defined by the overlap of CE LOW, and UB or LB, and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the Write.
3. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
WE LOW to High-Z Output 30 30 40 ns
(3)
WE HIGH to Low-Z Output 5 5 5 ns
AC WAVEFORMS
CE
WE
UB, LB
D
OUT
D
(1,2)
(CE Controlled)
IN
t
SA
DATA UNDEFINED
t
WC
VALID ADDRESS
t
SCS
t
AW
t
PWE
t
PBW
t
HZWE
HIGH-Z
t
SD
DATAIN VALID
t
HD
t
LZWE
t
HA
WRITE CYCLE NO. 1
ADDRESS
Notes:
1. WRITE is an internally generated signal asserted during an overlap of the LOW states on the CE and WE inputs and at least one of the LB and UB inputs being in the LOW state.
2. WRITE = (CE) [ (
LB) = (UB) ] (WE).
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IC62VV25616L IC62VV25616LL
WRITE CYCLE NO. 2 (WE Controlled)
t
WC
ADDRESS
LOW
CE
WE
t
SA
UB, LB
D
OUT
D
IN
DATA UNDEFINED
WRITE CYCLE NO. 3 (UB / LB Controlled)
VALID ADDRESS
t
AW
t
PWE
t
PBW
t
HZWE
HIGH-Z
t
SD
DATAIN VALID
t
t
HD
t
LZWE
HA
ADDRESS
CE
WE
UB, LB
OUT
D
D
LOW
DATA UNDEFINED
IN
t
HZWE
t
t
SD
WC
t
WORD 2
t
WC
ADDRESS 1 ADDRESS 2
t
SA
t
HA
t
SA
t
PBW
WORD 1
HIGH-Z
t
t
SD
DATAIN
VALID
HD
PBW
DATAIN
VALID
t
LZWE
t
t
HD
HA
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IC62VV25616L IC62VV25616LL
DATA RETENTION SWITCHING CHARACTERISTICS
Symbol Parameter Test Condition Min. Max. Unit
VDR Vcc for Data Retention See Data Retention Waveform 1.0 2.2 V
I
DR Data Retention Current Vcc = 1.2V, CE
tSDR Data Retention Setup Time See Data Retention Waveform 0 ns tRDR Recovery Time See Data Retention Waveform 5 ns
DATA RETENTION WAVEFORM (CE or LB/UB Controlled)
Vcc – 0.2V Com. (-L) 15 µA
Com. (-LL) 6
Ind. (-L) 20
Ind. (-LL) 8
V
CC
1.65V
1.4V V
DR
CE, LB/UB
GND
t
SDR
Data Retention Mode
CE V
CC
- 0.2V
t
RDR
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IC62VV25616L IC62VV25616LL
ORDERING INFORMATION Commercial Range: 0°C to +70°C
Industrial Range: -40°C to +85°C
Speed (ns) Order Part No. Package
55 IC62VV25616L-55T TSOP-2
IC62VV25616L-55B 6*8mm TF-BGA
70 IC62VV25616L-70T TSOP-2
IC62VV25616L-70B 6*8mm TF-BGA
100 IC62VV25616L-100T TSOP-2
IC62VV25616L-100B 6*8mm TF-BGA
ORDERING INFORMATION Commercial Range: 0°C to +70°C
Speed (ns) Order Part No. Package
55 IC62VV25616LL-55T TSOP-2
IC62VV25616LL-55B 6*8mm TF-BGA
70 IC62VV25616LL-70T TSOP-2
IC62VV25616LL-70B 6*8mm TF-BGA
100 IC62VV25616LL-100T TSOP-2
IC62VV25616LL-100B 6*8mm TF-BGA
Speed (ns) Order Part No. Package
55 IC62VV25616L-55TI TSOP-2
IC62VV25616L-55BI 6*8mm TF-BGA
70 IC62VV25616L-70TI TSOP-2
IC62VV25616L-70BI 6*8mm TF-BGA
100 IC62VV25616L-100TI TSOP-2
IC62VV25616L-100BI 6*8mm TF-BGA
Industrial Range: -40°C to +85°C
Speed (ns) Order Part No. Package
55 IC62VV25616LL-55TI TSOP-2
IC62VV25616LL-55BI 6*8mm TF-BGA
70 IC62VV25616LL-70TI TSOP-2
IC62VV25616LL-70BI 6*8mm TF-BGA
100 IC62VV25616LL-100TI TSOP-2
IC62VV25616LL-100BI 6*8mm TF-BGA
Integrated Circuit Solution Inc.
HEADQUARTER:
NO.2, TECHNOLOGY RD. V, SCIENCE-BASED INDUSTRIAL PARK,
HSIN-CHU, TAIWAN, R.O.C.
TEL: 886-3-5780333
Fax: 886-3-5783000
BRANCH OFFICE:
7F, NO. 106, SEC. 1, HSIN-TAI 5TH ROAD,
HSICHIH TAIPEI COUNTY, TAIWAN, R.O.C.
TEL: 886-2-26962140
FAX: 886-2-26962252
http://www.icsi.com.tw
Integrated Circuit Solution Inc. 11
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