Datasheet IC61LV256-10J, IC61LV256-10JI, IC61LV256-10T, IC61LV256-10TI, IC61LV256-12J Datasheet (ICSI)

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IC61LV256
Document Title
32K x 8 Hight Speed SRAM with 3.3V
Revision History
Revision No History Draft Date Remark
0A Initial Draft April 19,2002
Integrated Circuit Solution Inc. 1
AHSR027-0A 04/19/2002
IC61LV256
32K x 8 HIGH SPEED CMOS STATIC RAM
FEATURES
• High-speed access times:
-- 8, 10, 12, 15 ns
• Automatic power-down when chip is deselected
• CMOS low power operation
-- 345 mW (max.) operating
-- 7 mW (max.) CMOS standby
• TTL compatible interface levels
• Single 3.3V power supply
• Fully static operation: no clock or refresh required
• Three-state outputs
FUNCTIONAL BLOCK DIAGRAM
DESCRIPTION
The ICSI IC61LV256 is a very high-speed, low power, 32,768-word by 8-bit static RAM. It is fabricated using ICSI's high-performance CMOS technology. This highly reliable pro­cess coupled with innovative circuit design techniques, yields access times as fast as 8 ns maximum.
When CE is HIGH (deselected), the device assumes a standby mode at which the power dissipation is reduced to 600 µW (typical) with CMOS input levels.
Easy memory expansion is provided by using an active LOW Chip Enable (CE). The active LOW Write Enable (WE) controls both writing and reading of the memory.
The IC61LV256 is available in the JEDEC standard 28-pin, 300mil SOJ and the 8*13.4mm TSOP-1 package.
A0-A14
VCC
GND
I/O0-I/O7
CE OE WE
ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2000, Integrated Circuit Solution Inc.
DECODER
I/O
DATA
CIRCUIT
CONTROL
CIRCUIT
256 X 1024
MEMORY ARRAY
COLUMN I/O
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PIN CONFIGURATION
28-Pin SOJ
A7 A6 A5 A4 A3 A2 A1 A0
1 2 3 4 5 6 7 8 9 10 11 12 13 14
A14 A12
I/O0 I/O1 I/O2
GND
PIN DESCRIPTIONS
28 27 26 25 24 23 22 21 20 19 18 17 16 15
VCC WE A13 A8 A9 A11 OE A10 CE I/O7 I/O6 I/O5 I/O4 I/O3
PIN CONFIGURATION
8x13.4mm TSOP-1
OE
A11
A9 A8
A13
WE
VCC
A14 A12
A7 A6 A5 A4 A3
TRUTH TABLE
22 23 24 25 26 27 28 1 2 3 4 5 6 7
21 20 19 18 17 16 15 14 13 12 11 10
A10 CE I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A0
9
A1
8
A2
A0-A14 Address Inputs
CE Chip Enable Input OE Output Enable Input WE Write Enable Input
I/O0-I/O7 Input/Output
Mode
WEWE
WE
WEWE
Not Selected X H X High-Z ISB1, ISB2 (Power-down)
Output Disabled H L H High-Z ICC Read H L L DOUT ICC Write L L X DIN ICC
CECE
OEOE
CE
OE I/O Operation Vcc Current
CECE
OEOE
Vcc Power GND Ground
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol Parameter Value Unit
VCC Power Supply Voltage Relative to GND –0.5 to +4.6 V VTERM Terminal Voltage with Respect to GND –0.5 to +4.6 V TBIAS Temperature Under Bias Com. –10 to +85 °C
Ind. –45 to +90 TSTG Storage Temperature –65 to +150 °C PD Power Dissipation 1 W IOUT DC Output Current ±20 mA
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
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IC61LV256
OPERATING RANGE
Range Ambient Temperature Speed VCC
Commercial 0°C to +70°C 8, 10, 12 3.3V, +10%, –5%
15 3.3V ± 10%
Industrial –40°C to +85°C All 3.3V + 10%, –5%
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol Parameter Test Conditions Min. Max. Unit
VOH Output HIGH Voltage VCC = Min., IOH = –4.0 mA 2.4 V VOL Output LOW Voltage VCC = Min., IOL = 8.0 mA 0.4 V VIH Input HIGH Voltage 2.2 VCC + 0.3 V VIL Input LOW Voltage I
LI Input Leakage GND ≤ VIN VCC Com. –1 1 µA
ILO Output Leakage GND VOUT ≤ VCC, Outputs Disabled Com. –1 1 µA
Notes:
IL (min.) = –0.3V (DC); VIL (min.) = –2.0V (pulse width 2.0 ns).
1. V V
IH (max.) = VCC + 0.5V (DC); VIH (max.) = Vcc + 2.0V (pulse width 2.0 ns).
2. Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
(1)
–0.3 0.8 V
Ind. –5 5
Ind. –5 5
POWER SUPPLY CHARACTERISTICS
(1)
(Over Operating Range)
-8 ns -10 ns -12 ns -15 ns
Sym. Parameter Test Conditions
Min. Max. Min. Max. Min. Max. Min. Max. Unit
ICC Vcc Dynamic Operating VCC = Max., CE = VIL Com. 1 20 11 0 10 0 9 0mA
Supply Current IOUT = 0 mA, f = fMAX Ind. 130 120 110 100
ISB1 TTL Standby Current VCC = Max., Com. 2 5—25—25—25mA
(TTL Inputs) VIN = VIH or VIL Ind. 3 0—30—30—30
CE ≥ VIH, f = 0
ISB2 CMOS Standby VCC = Max., Com. 2 2 2 2 m A
Current (CMOS Inputs) CE VCC – 0.2V, Ind. 5 5 5 5
VIN ≥ VCC – 0.2V, or VIN ≤ 0.2V, f = 0
Notes:
1. At f = f
CAPACITANCE
MAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
(1,2)
Symbol Parameter Conditions Max. Unit
CIN Input Capacitance VIN = 0V 6 pF COUT Output Capacitance VOUT = 0V 5 pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: T
A = 25°C, f = 1 MHz, Vcc = 3.3V.
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READ CYCLE SWITCHING CHARACTERISTICS
(1)
(Over Operating Range)
-8 ns -10 ns -12 ns -15 ns
Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Unit
tRC Read Cycle Time 8 10 12 15 ns tAA Address Access Time 8 10 12 15 ns tOHA Output Hold Time 2 2 2 2 ns tACE CE Access Time 8 10 12 15 ns tDOE OE Access Time 4 5 6 7 ns
(2)
tLZOE tHZOE tLZCE tHZCE tPU tPD
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±200 mV from steady-state voltage. Not 100% tested.
3. Not 100% tested.
OE to Low-Z Output 0 0 0 0 ns
(2)
OE to High-Z Output 4 5 5 6 ns
(2)
CE to Low-Z Output 3 3 3 3 ns
(2)
CE to High-Z Output 4 5 6 7 ns
(3)
CE to Power-Up 0 0 0 0 ns
(4)
CE to Power-Down 8 10 12 15 ns
AC TEST CONDITIONS
Parameter Unit
Input Pulse Level 0V to 3.0V Input Rise and Fall Times 3 ns Input and Output Timing 1.5V
and Reference Levels Output Load See Figures 1 and 2
AC TEST LOADS
319
3.3V
OUTPUT
30 pF
Including
jig and
scope
353
OUTPUT
3.3V
5 pF
Including
jig and
scope
319
353
Figure 1. Figure 2.
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IC61LV256
AC WAVEFORMS
READ CYCLE NO. 1
ADDRESS
D
OUT
READ CYCLE NO. 2
ADDRESS
OE
(1,2)
PREVIOUS DATA VALID
(1,3)
t
RC
t
AA
t
OHA
DATA VALID
t
RC
t
AA
t
OHA
t
OHA
t
DOE
t
CE
t
LZCE
OUT
D
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CE = V
3. Address is valid prior to or coincident with CE LOW transitions.
HIGH-Z
LZOE
t
ACE
IL.
DATA VALID
t
HZCE
t
HZOE
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WRITE CYCLE SWITCHING CHARACTERISTICS
(1,2)
(Over Operating Range)
-8 ns -10 ns -12 ns -15 ns
Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Unit
tWC Write Cycle Time 8 10 12 15 ns tSCE CE to Write End 7 8 8 10 ns tAW Address Setup Time 7 8 8 10 ns
to Write End
tHA Address Hold 0 0 0 0 ns
from Write End
tSA Address Setup Time 0 0 0 0 ns
(4)
tPWE
WE Pulse Width 7 10 12 15 ns
tSD Data Setup to Write End 4.5 5 6 7 ns tHD Data Hold from Write End 0 0 0 0 ns
(3)
tHZWE tLZWE
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and output loading specified in Figure 1.
2. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the Write.
3. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
4. Tested with OE HIGH.
WE LOW to High-Z Output 3.5 4 6 7 ns
(3)
WE HIGH to Low-Z Output 0 0 0 0 ns
AC WAVEFORMS
WRITE CYCLE NO. 1
ADDRESS
CE
WE
OUT
D
D
IN
(CE Controlled, OE is HIGH or LOW)
t
WC
VALID ADDRESS
t
SA
t
DATA UNDEFINED
t
AW
HZWE
t
PWE1
t
PWE2
t
SCE
(1 )
HIGH-Z
t
SD
DATAIN VALID
t
HA
t
LZWE
t
HD
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IC61LV256
WRITE CYCLE NO. 2
ADDRESS
OE
LOW
D
CE
WE
OUT
DIN
(WE Controlled, OE is HIGH During Write Cycle)
t
WC
VALID ADDRESS
t
AW
t
PWE1
t
SA
DATA UNDEFINED
t
HZWE
HIGH-Z
t
SD
(1,2)
DATAIN VALID
t
HA
t
LZWE
t
HD
WRITE CYCLE NO. 3
ADDRESS
LOW
OE
CE
LOW
WE
OUT
D
DIN
(WE Controlled, OE is LOW During Write Cycle)
t
WC
VALID ADDRESS
t
AW
t
PWE2
t
SA
DATA UNDEFINED
t
HZWE
HIGH-Z
t
SD
DATAIN VALID
(1)
t
HA
t
LZWE
t
HD
Notes:
1. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the Write.
2. I/O will assume the High-Z state if OE
> VIH.
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IC61LV256
ORDERING INFORMATION Commercial Range: 0°C to +70°C
Speed (ns) Order Part No. Package
8 IC61LV256-8T 8*13.4mm TSOP-1
IC61LV256-8J 300mil SOJ
10 IC61LV256-10T 8*13.4mm TSOP-1
IC61LV256-10J 300mil SOJ
12 IC61LV256-12T 8*13.4mm TSOP-1
IC61LV256-12J 300mil SOJ
15 IC61LV256-15T 8*13.4mm TSOP-1
IC61LV256-15J 300mil SOJ
ORDERING INFORMATION Industrial Range: –40°C to +85°C
Speed (ns) Order Part No. Package
8 IC61LV256-8TI 8*13.4mm TSOP-1
IC61LV256-8JI 300mil SOJ
10 IC61LV256-10TI 8*13.4mm TSOP-1
IC61LV256-10JI 300mil SOJ
12 IC61LV256-12TI 8*13.4mm TSOP-1
IC61LV256-12JI 300mil SOJ
15 IC61LV256-15TI 8*13.4mm TSOP-1
IC61LV256-15JI 300mil SOJ
Integrated Circuit Solution Inc.
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http://www.icsi.com.tw
Integrated Circuit Solution Inc. 9
AHSR027-0A 04/19/2002
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