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Integrated Circuit Solution, Inc.1
AHSR024-0A 09/12/2001
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IC61LV12816
128K x 16 HIGH-SPEED CMOS STATIC RAM
WITH 3.3V SUPPLY
FEATURES
• High-speed access time: 8, 10, 12, and 15 ns
• CMOS low power operation
• TTL and CMOS compatible interface levels
• Single 3.3V ± 10%power supply
• Fully static operation: no clock or refresh
required
• Three state outputs
• Data control for upper and lower bytes
• Industrial temperature available
FUNCTIONAL BLOCK DIAGRAM
DESCRIPTION
The ICSI IC61LV12816 is a high-speed, 2,097,152-bit static
RAM organized as 131,072 words by 16 bits. It is fabricated
using ICSI's high-performance CMOS technology. This highly
reliable process coupled with innovative circuit design
techniques, yields access times as fast as 8 ns with low power
consumption.
When CE is HIGH (deselected), the device assumes a standby
mode at which the power dissipation can be reduced down with
CMOS input levels.
Easy memory expansion is provided by using Chip Enable and
Output Enable inputs, CE and OE. The active LOW Write
Enable (WE) controls both writing and reading of the memory.
A data byte allows Upper Byte (UB) and Lower Byte (LB)
access.
The IC61LV12816 is packaged in the JEDEC standard 44-pin
400mil SOJ, 44-pin 400mil TSOP-2, and 48-pin 6*8mm TFBGA.
Commercial0°C to +70°C3.3V ± 10%
Industrial–40°C to +85°C3.3V ± 10%
OEOutput Enable Input
WEWrite Enable Input
LBLower-byte Control (I/O0-I/O7)
UBUpper-byte Control (I/O8-I/O15)
NCNo Connection
VccPower
GNDGround
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol ParameterValueUnit
VCCPower Supply Voltage Relative to GND–0.5 to 4.0V
VTERMTerminal Voltage with Respect to GND–0.5 to Vcc+0.5V
TSTGStorage Temperature–65 to +150°C
TBIASTemperature Under Bias:Com.–65 to +85°C
Ind.–45 to +90°C
PTPower Dissipation2.0W
IOUTDC Output Current (LOW)+20mA
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of
0 to 3.0V and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
AC TEST CONDITIONS
ParameterUnit
Input Pulse Level0V to 3.0V
Input Rise and Fall Times3 ns
Input and Output Timing1.5V
and Reference Level
Output LoadSee Figures 1 and 2
Notes:
1. The Vcc operating range for 8 ns is 3.3V +10%, -5%.
tWCWrite Cycle Time8—10—12—15—ns
tSCECE to Write End7—8—8—10—ns
tAWAddress Setup Time7—8—8—10—n s
to Write End
tHAAddress Hold from Write End0—0—0—0—ns
tSAAddress Setup Time0—0—0—0—ns
tPWBLB, UB Valid to End of Write7—8—9—10—ns
(4)
tPWE
WE Pulse Width7—8—9—10—ns
tSDData Setup to Write End4.5—5—6—7—ns
tHDData Hold from Write End0—0—0—0—ns
(2)
tHZWE
tLZWE
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V
and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
3. The internal write time is defined by the overlap of CE LOW and UB or LB, and WE LOW. All signals must be in valid states to
initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the
rising or falling edge of the signal that terminates the write.
4.Tested with OE Hith.
WE LOW to High-Z Output—3—4—5—6ns
(2)
WE HIGH to Low-Z Output0—0—0—0—ns
8Integrated Circuit Solution, Inc.
AHSR024-0A 09/12/2001
IC61LV12816
AC WAVEFORMS
WRITE CYCLE NO. 1
(1 ,2)
(CE Controlled, OE is HIGH or LOW)
t
WC
1
ADDRESS
t
SA
CE
WE
UB, LB
OUT
D
D
IN
Notes:
1. WRITE is an internally generated signal asserted during an overlap of the LOW states on the CE and WE inputs and at least
one of the LB and UB inputs being in the LOW state.
2. WRITE = (CE)
[ (LB) = (UB) ] (WE).
DATA UNDEFINED
VALID ADDRESS
t
SCE
t
AW
t
PWE1
t
PWE2
t
PWB
t
HZWE
HIGH-Z
t
SD
DATAIN VALID
t
t
HD
t
LZWE
HA
2
3
4
5
6
7
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IC61LV12816
WRITE CYCLE NO. 2
(1)
(WE Controlled. OE is HIGH During Write Cycle)
t
WC
ADDRESS
OE
CE
WE
UB, LB
D
OUT
D
WRITE CYCLE NO. 3
VALID ADDRESS
LOW
t
AW
t
PWE1
t
SA
t
DATA UNDEFINED
IN
(WE Controlled. OE is LOW During Write Cycle)
HZWE
t
PWB
HIGH-Z
t
SD
DATAIN VALID
t
HA
t
LZWE
t
HD
ADDRESS
OE
CE
WE
UB, LB
D
OUT
D
IN
LOW
LOW
t
SA
DATA UNDEFINED
t
WC
VALID ADDRESS
t
AW
t
PWE2
t
t
HZWE
PWB
HIGH-Z
t
SD
DATAIN VALID
t
HA
t
LZWE
t
HD
10Integrated Circuit Solution, Inc.
AHSR024-0A 09/12/2001
IC61LV12816
WRITE CYCLE NO. 4
ADDRESS
(1,3)
(LB, UB Controlled, Back-to-Back Write)
t
WC
ADDRESS 1ADDRESS 2
t
WC
1
OE
t
SA
CE
LOW
t
HA
t
WE
t
PWB
UB, LB
t
HZWE
OUT
D
Notes:
1. The internal Write time is defined by the overlap of CE = LOW, UB and/or LB = LOW, and WE = LOW. All signals must be
in valid states to initiate a Write, but any can be deasserted to terminate the Write. The
referenced to the rising or falling edge of the signal that terminates the Write.
2. Tested with OE HIGH for a minimum of 4 ns before WE = LOW to place the I/O in a HIGH-Z state.
3. WE may be held LOW across many address cycles and the LB, UB pins can be used to control the Write function.
DATA UNDEFINED
D
IN
t
SD
WORD 1
HIGH-Z
DATA
VALID
IN
SA
t
PWB
WORD 2
t
HD
t
SD
DATA
IN
VALID
t
HA
t
LZWE
t
HD
tSA, tHA, tSD, and tHD timing is
2
3
4
5
6
7
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IC61LV12816
ORDERING INFORMATION
Commercial Range: 0°C to +70°C