The HV518 is designed for vacuum fluorescent or
DC plasma applications where it can serve as a
segment, digit or matrix display driver. Each device has
32 outputs, 32 latches and a 32-bit cascadable Shift
register.
Serial data enters the Shift register on the low-to-high
transition of the clock input. With latch enable (
high, parallel data is transferred to the output buffers
through a 32-bit latch. When
stored in the latch. When strobe (STR) is low, all
outputs are enabled. If the strobe is high, all outputs are
low.
†Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions above those
indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: Duty cycle is limited by the total power dissipated in the package.
2: For operations above 25°C ambient, derate linearly to 85°C at 20 mW/°C.
RECOMMENDED OPERATING CONDITIONS
Electrical Specifications: TA = 25°C unless otherwise indicated.
ParameterSym.Min.Typ.Max.UnitConditions
Logic Supply VoltageV
High-voltage Supply VoltageV
High-level Input VoltageV
Low-level Input VoltageV
High-level Output CurrentI
Low-level Output CurrentI
Clock Frequencyf
Pulse Duration, Clock Hight
Pulse Duration, Clock Lowt
Setup Time, Data before Clockt
Hold Time, Data after Clockt
Operating Ambient TemperatureT
........................................................................................................... –0.5V to +90V
PP
DD
PP
OH
OL
CLK
W(CKH)
W(CKL)
SU
4.5—5.5V
8—80V
3.5——VVDD = 4.5V (See Figure 3-1.)
IH
IL
——1VVDD = 4.5V (See Figure 3-1.)
–25——mA
——2mA
——6MHzVDD = 4.5V (See Figure 3-1.)
83——nsVDD = 4.5V
83——nsVDD = 4.5V
75——nsVDD = 4.5V
H
A
75——nsVDD = 4.5V
–40—+85°C
DS20005847A-page 4 2017 Microchip Technology Inc.
Page 5
HV518
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Over recommended operating conditions unless otherwise indicated
ParameterSym.Min.Typ. Max. UnitConditions
Supply CurrentI
Quiescent Supply CurrentI
Supply CurrentI
HVIN Operating Current
LVIN Operating Current
HV Output
Serial Output4.54.95VVDD = 5V, IOH = –20 µA
HV Output
Serial Output—0.060.8VIOL = 20 µA
Logic Input Current HighI
Logic Input Current LowI
DD
DDQ
PP
V
OH
V
OL
IH
IL
Note 1: The power dissipation is determined by the number of output at ON state and their duty cycles. The total
power must not exceed the allowable package power dissipation.
——10mAVDD = 5V, fCH = 6 MHz
——0.5mAVDD = 5.5V, VIN = 0V
——12mAOutputs high, TA = –40°C
—710mAOutputs high, TA = 0°C to +85°C
——500µAOutputs low
70——VIOH = –25mA
——5VIOL = 1 mA
—0.11µAVIH = V
DD
—–0.1–1µAVIL = 0V
SWITCHING CHARACTERISTICS
Electrical Specifications: VPP = 80V, CL = 50 pF and TA = 25°C unless otherwise noted.
Legend: XX...XProduct Code or Customer-specific information
YYear code (last digit of calendar year)
YYYear code (last 2 digits of calendar year)
WWWeek code (week of January 1 is week ‘01’)
NNNAlphanumeric traceability codePb-free JEDEC
®
designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ()
can be found on the outer packaging for this package.
Note:In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
not include the corporate logo.
3
e
XXXXXXXXXXX
YYWWNNN
HV518P
1736532
40-lead PDIP
Example
e3
e
3
4.0PACKAGE MARKING INFORMATION
4.1Packaging Information
44-lead PLCCExample
XXXXXXXXXX
e3
YYWWNNN
HV518PJ
e
3
1742874
3
e
DS20005847A-page 12 2017 Microchip Technology Inc.
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
JEDEC Registration MS-018, Variation AC, Issue A, June, 1993.
† This dimension differs from the JEDEC drawing.
Drawings not to scale.
.150 MAX
.048/.042 x 45
O
1
.075 MAX
6
40
D
D1
E1 E
Top View
Horizontal Side View
View B
A
A2
A1
Seating
Plane
e
b
Note 1
(Index Area)
.056/.042 x 45
O
.020max
(3 Places)
.020 MIN
Vertical Side View
View B
Note 2
44
b1
Base
Plane
R
Notes:
1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEHDPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURU
a printed indicator.
2. $FWXDOVKDSHRIWKLVIHDWXUHPD\YDU\
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
DS20005847A-page 14 2017 Microchip Technology Inc.
Page 15
APPENDIX A:REVISION HISTORY
Revision A (October 2017)
• Converted Supertex Doc# DSFP-HV518 to Microchip DS20005847A
(blank)=27/Tube for a PJ Package
M903=500/Reel for a PJ Package
XX
Package
-
X - X
Environmental
Media Type
Options
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
DS20005847A-page 16 2017 Microchip Technology Inc.
Page 17
Note the following details of the code protection feature on Microchip devices:
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
•Microchip products meet the specification contained in their particular Microchip Data Sheet.
•Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•Microchip is willing to work with the customer who is concerned about the integrity of their code.
•Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
QUALITYMANAGEMENTS
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.