Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 2000.12.21
Revised Date : 2001.03.23
Page No. : 1/3
HTL295I
PNP EPITAXIAL PLANAR TRANSIST OR
Description
The HTL295I is designed for high voltage low power switching
applications especially for use in telephone and telecommunication
circuits.
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature..................................................................................... 150 °C Maximum
Maximum Power Dissipation
•
Total Power Dissipation (Ta=25°C)...................................................................................... 1 W
Maximum Voltages and Currents (Ta=25°C)
•
VCBO Collector to Base Voltag e..................................................................................... -500 V
VCEO Collector to Emitter Voltage .................................................................................. -500 V
VEBO Emitter to Base Voltage ............................................................................................ -6 V
IC Collector Current ..................................................................................................... -250 mA
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -500 - - V IC=-100uA, IE=0
BVCEO -500 - - V IC=-1mA, IB=0
BVEBO -6 - - V IE=-10uA
ICBO - - -1 uA VCB=-500V, IE=0
ICES - - -10 uA VCE=-500V, IB=0
IEBO - - -0.2 uA VEB=-6V, IC=0
*VCE(sat)1 - - -500 mV IC=-10mA, IB=-1mA
*VCE(sat)2 - - -2 V IC=-50mA, IB=-5mA
*VCE(sat)3 -3 V IC=-80mA, IB=-4mA
*VBE(sat) - - -750 mV IC=-10mA, IB=-1m A
*hFE1 50 - - VCE=-10V, IC=-1mA
*hFE2 60 - 250 VCE=-10V, IC=-20mA
*hFE3 50 - - VCE=-10V, IC=-80mA
fT 10 - - MHz VCE=-20V, IE=-10mA, f=1MHz
Cob - - 30 pF VCB=-20V, f=1MHz, IE=0
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HTL295I HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : Preliminary Data
Issued Date : 2000.12.21
Revised Date : 2001.03.23
Page No. : 2/3
1000
100
hFE
10
0.1 1 10 100 1000
hFE @ VCE=10V
Collector Current-IC (mA)
Saturation Volt age & Coll ector Current
1000
Current Gain & Collector Current
BE(sat)
V
@ IC=10I
B
100000
10000
1000
CE(sat)
V
Saturation Voltage (mV)
100
10
1 10 100 1000
Collector Current-IC (mA)
@ IC=20I
B
CE(sat)
V
Capacitance & Reverse-Biased Volt age
100
Cob
Sasturation Voltage & Collector Current
@ IC=10I
B
Saturation Voltage (mV)
100
1 10 100 1000
10
(A)
1
C
0.1
Collector Current-I
Collector Current-IC (mA)
Safe Operating Area
PT=1mS
PT=100mS
PT=1S
10
Capac itanc e (pF)
1
0.1 1 10 100
1.2
1
0.8
0.6
0.4
PD(W) , Power Dissipation
0.2
Reverse Biased Volt a ge ( V)
Power Derating
0.01
1 10 100 1000
Forwar d Biased Vol tage-VCE (V)
0
0 50 100 150 200
Ta(oC) , Ambient T em peratu r e
HTL295I HSMC Product Specification
Page 3
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-251 Dimension
Spec. No. : Preliminary Data
Issued Date : 2000.12.21
Revised Date : 2001.03.23
Page No. : 3/3
A
C
B
HSMC Logo
D
Part Number
Date Code
HTL
295I
Product Series
Ink Mark
F G
Style : Pin 1.Base 2.Collector 3.Emitter
3
I
Marking :
E
K
2
H
1
J
3-Lead TO-251 Plastic Package
DIM
HSMC Packa
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
e Code : I
DIM
Min. Max. Min. Max.
A 0.0177 0.0217 0.45 0.55 G 0.2559 - 6.50 B 0.0354 0.0591 0.90 1.50 H - *0.1811 - *4.60
C 0.0177 0.0236 0.45 0.60 I - 0.0354 - 0.90
D 0.0866 0.0945 2.20 2.40 J - 0.0315 - 0.80
E 0.2520 0.2677 6.40 6.80 K 0.2047 0.2165 5.20 5.50
F 0.2677 0.2835 6.80 7.20
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated May. 24,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
*:Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
HTL295I HSMC Product Specification
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
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