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Surface Mount Flip Chip LEDs
Technical Data
H
HSMX-H670 Series
HSMX-H690 Series
Features
• Improved Reliability
Through Elimination of
Internal Wire Bond
• -40 to 85°C Operating
Temperature Range
• Small Size
• Industry Standard Footprint
• Diffused Optics
• Compatible with IR
Solder Process
• Four Colors Available
• Available in 8 mm Tape on 7"
(178 mm) Diameter Reels
Applications
• Keypad Backlighting
• LCD Backlighting
• Symbol Backlighting
• Front Panel Indicator
Description
The HSMX-H670 and HSMX-H690
introduce a revolutionary concept
to the world of LEDs. The internal
flip chip construction eliminates
the wire bond between the chip
and printed circuit board.
Consequently as a result of the
robust construction, product
reliability is greatly improved.
The HSMX-H670 and HSMX-H690
are available in four colors. The
HSMX-H670 adheres to the
industry standard 2.0 x 1.25 mm
footprint and is intended for
designs where space is limited.
The small size, low 1.1 mm profile
and wide viewing angle make these
LEDs excellent for backlighting
applications and front panel
illumination. The HSMX-H690
adheres to the 1.6 x 0.8 mm
industry standard footprint. The
low 0.6 mm profile make this
excellent for designs where
space is limited.
Both packages are compatible
with IR and convective reflow
soldering processes.
Device Selection Guide
High
Footprint Efficiency
[1][2]
(mm)
1.6 x 0.8 x 0.6 HSMS-H690 HSMD-H690 HSMY-H690 HSMG-H690
2.0 x 1.25 x 1.1 HSMS-H670 HSMD-H670 HSMY-H670 HSMG-H670
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
Red Orange Yellow Green
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Package Dimensions
0.40
(0.016)
HSMX-H670 Series
CATHODE MARK
POLARITY
2.00
(0.079)
1.10
1.27
(0.050)
0.50 (0.020)
0.40 (0.016)
0.48 (0.019)
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TOLERANCE, UNLESS OTHERWISE SPECIFIED, ± 0.1 mm (± 0.004 INCH).
3. THE LEADS ARE GOLD PLATED; PLATING THICKNESS IS: GOLD – 0.05
MICRONS, NICKEL – 3 MICRONS, COPPER –18 MICRONS.
(0.043)
1.25
(0.049)
HSMX-H690 Series
POLARITY
1.00
0.30
0.80
1.60
BOTTOMSIDE CATHODE MARK
0.60
TOPSIDE
CATHODE
MARK
Absolute Maximum Ratings at T
= 25°C
A
Parameter HSMX-H670 HSMX-H690 Units
DC Forward Current
[1]
20 20 mA
Power Dissipation 50 50 mW
Reverse Voltage (IR = 100 µA) 5 5 V
Operating Temperature Range -40 to +85 -40 to +85 °C
Storage Temperature Range
Notes:
1. Derate linearly as shown in Figure 4 for temperatures above 25°C.
2. Maximum temperature for tape and reel packaging is 60°C.
[2]
-40 to +85 -40 to +85 °C
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Optical Characteristics at T
= 25°C
A
Luminous Color, Viewing Luminous
Intensity Peak Dominant Angle Efficacy
IV (mcd) Wavelength Wavelength 2θ
Part @ IF = 20 mA
[1]
λ
(nm) λ
peak
[2]
(nm) Degrees
d
1/2
[3]
η
v
(lm/W)
Number Color Min. Typ. Typ. Typ. Typ.
HSMS-H6X0 High
Efficiency 1.6 5.0 639 626 165 145
Red
HSMD-H6X0 Orange 1.6 4.0 606 604 165 380
HSMY-H6X0 Yellow 1.6 5.0 584 586 165 500
HSMG-H6X0 Green 4.0 9.0 566 571 165 595
Notes:
1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the
mechanical axis of the lamp package.
2. The dominant wavelength λd is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
1/2
Electrical Characteristics at T
= 25°C
A
Forward Reverse Capacitance
Voltage Breakdown C (pF), Thermal
VF (Volts) VR (Volts) VF = 0, Resistance
Part @ IF = 20 mA @ I
= 100 µA f = 1 MHz Rθ
R
J-PIN
Number Color Typ. Max. Min. Typ.
HSMS-H670 High Efficiency 2.0 2.6 5 6 250
HSMS-H690 Red
HSMD-H670 Orange 2.0 2.6 5 5 250
HSMD-H690
HSMY-H670 Yellow 2.1 2.6 5 5 250
HSMY-H690
HSMG-H670 Green 2.3 2.6 5 5 250
HSMG-H690
(°C/W)
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Green Color Bins
Bin ID Minimum (nm) Maximum (nm) Notes
A 561.0 565.0
B 564.0 568.0
C 567.0 571.0
D 570.0 574.0
E 573.0 577.0
F 561.0 568.0 Bin A & Bin B
G 564.0 571.0 Bin B & Bin C
H 567.0 574.0 Bin C & Bin D
J 570.0 577.0 Bin D & Bin E
[1]
Yellow Color Bins
[1]
Bin ID Minimum (nm) Maximum (nm) Notes
A 581.5 585.0
B 584.0 587.5
C 586.5 590.0
D 589.0 592.5
E 581.5 587.5 Bin A & Bin B
F 584.0 590.0 Bin B & Bin C
G 586.5 592.5 Bin C & Bin D
H 591.5 595.0
J 594.0 597.5
Luminous Intensity Bin Limits
[1]
Bin ID Minimum (med) Maximum (med)
A 0.10 0.20
B 0.16 0.32
C 0.25 0.50
D 0.40 0.80
E 0.63 1.25
F 1.00 2.00
G 1.60 3.20
H 2.50 5.00
J 4.00 8.00
K 6.30 12.50
L 10.00 20.00
M 16.00 32.00
N 25.00 50.00
P 40.00 80.00
Q 63.00 125.00
R 100.00 200.00
S 160.00 320.00
T 250.00 500.00
U 400.00 800.00
V 630.00 1250.00
W 1000.00 2000.00
X 1600.00 3200.00
Y 2500.00 5000.00
Note:
1. Bin categories are established for classification of products. Products may not be available in all bin categories.
Please contact your Hewlett-Packard representative for information on currently available bins.
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1.0
10° 100°40° 70°20° 60° 80°30° 50° 90°
NORMALIZED INTENSITY
ANGLE
0°
10°
20°
30°
40°
50°
60°
70°
80°
90°
1.0
.6
.8
.2
.4
0.5
GREEN
ORANGE
HIGH EFFICIENCY RED
RELATIVE INTENSITY
0
500 550 600 650 700 750
YELLOW
WAVELENGTH – nm
Figure 1. Relative Intensity vs. Wavelength.
20
YELLOW
ORANGE
15
HER
GREEN
10
5
– FORWARD CURRENT – mA
F
I
0
1.0 1.5 2.0 2.5 3.0
– FORWARD VOLTAGE – V
V
F
1.2
1.0
0.8
0.6
0.4
(NORMALIZED AT 20 mA)
0.2
RELATIVE LUMINOUS INTENSITY
0
0 5 10 15 20
I
– DC FORWARD CURRENT – mA
DC
Figure 2. Forward Current vs. Forward Voltage.
40
35
30
25
20
15
10
– FORWARD CURRENT – mA
5
F
I
0
0 20406080100
T
– AMBIENT TEMPERATURE – °C
A
Figure 4. Maximum DC Current vs. Ambient
Temperature.
Figure 3. Relative Luminous Intensity vs. DC Forward
Current.
Figure 5. Intensity vs. Angle.
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10 SEC. MAX.
230°C MAX.
140-160°C
TEMPERATURE
OVER 2 MIN.
4°C/SEC. MAX.
TIME
4°C/SEC. MAX.
Figure 6. Recommended Reflow Soldering Profile.
USER FEED DIRECTION
0.8 (0.031)
0.80 0.80
0.85
HSMX-H690 SERIES
1.1 (0.043)
1.25
(0.049)
1.1
(0.043)
1.25
(0.049)
HSMX-H670 SERIES
Figure 7. Recommended Solder Patterns.
PRINTED LABEL
Figure 8. Reeling Orientation.
NOTE:
ALL DIMENSIONS IN MILLIMETERS (INCHES).
CATHODE SIDE
21.0
(0.83)
2.0
(0.08)
LABEL
Figure 9. Reel Dimensions.
180
Ø
(7.08)
60.0
Ø
(2.36)
13.0
Ø
(0.51)
1.5
TYP.
(0.06)
60°60°
13.0
(0.51)
10.0
(0.39)
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1.50 + 0.10
0
Ø
(0.059 + 0.004)
0
USER FEED
DIRECTION
DIMENSIONS IN MILLIMETERS (INCHES)
HSMX-H670 SERIES 2.40 (0.094) 1.60 (0.064)
HSMX-H690 SERIES 1.98 (0.078) 1.02 (0.040)
TABLE 1
DIM. A
(SEE TABLE 1)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 ± 0.10
(0.157 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
Figure 10. Tape Dimensions.
END START
CATHODE
(0.069 ± 0.004)
DIM. A
± 0.10 (0.004)
1.30 ± 0.10
(0.051 ± 0.004)
1.75 ± 0.10
3.50 ± 0.05
(0.138 ± 0.002)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
± 0.10 (0.004)PART NUMBER
CARRIER TAPE
COVER TAPE
0.20 ± 0.05
(0.008 ± 0.002)
THERE SHALL BE A
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
Figure 11. Tape Leader and Trailer Dimensions.
Convective IR Reflow Soldering
For information on IR reflow
soldering, refer to Application
Note 1060, Surface Mounting
SMI LED Indicator
Components.
150 mm-360 mm
(5.9 - 14.2 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
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H
For technical assistance or the location of
your nearest Hewlett-Packard sales office,
distributor or representative call:
Americas/Canada: 1-800-235-0312 or
408-654-8675
Far East/Australasia: (65) 290-6305
Japan: (81 3) 3331-6111
Europe: Call your local HP sales office
listed in your telephone directory. Ask for
a Components representative.
Data subject to change.
Copyright © 1996 Hewlett-Packard Co.
Printed in U.S.A. 5965-1521E (5/96)
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