Datasheet HSMS-280x Datasheet (AVAGO)

HSMS-280x

COMMON

CATHODE

#4

UNCONNECTED

PAIR

COMMON

ANODE

#3

SERIES

#2

SINGLE

#0

1 2

3

3 4

RING

QUAD

3 4

BRIDGE

QUAD

3 4

1 2

3

1 2

3

1 2

3

COMMON

CATHODE

#4

UNCONNECTED

PAIR

#5

COMMON

ANODE

#3

SERIES

#2

SINGLE

#0

1 2

3

1 2

3 4

BRIDGE

QUAD

#8

1 2

3 4

1 2

3

1 2

3

1 2

3

COMMON

CATHODE QUAD

M

UNCONNECTED

TRIO

L

BRIDGE

QUAD

P

COMMON

ANODE QUAD

N

RING

QUAD

R

1 2 3

6 5 4

HIGH ISOLATION

UNCONNECTED PAIR

K

1 2 3

6 5 4

1 2 3

6 5 4

1 2 3

6 5 4

1 2 3

6 5 4

1 2 3

6 5 4

Surface Mount RF Schottky Barrier Diodes

Data Sheet

Description/Applications

These Schottky diodes are specically designed for both
analog and digital applications. This series oers a wide

Features

• Surface Mount Packages

• High Breakdown Voltage

range of specications and package congurations to
give the designer wide exibility. The HSMS‑280x series
of diodes is optimized for high voltage applications.

Note that Avago’s manufacturing techniques assure that
dice found in pairs and quads are taken from adjacent sites
on the wafer, assuring the highest degree of match.

• Low FIT (Failure in Time) Rate*

• Six‑sigma Quality Level

• Single, Dual and Quad Versions

• Tape and Reel Options Available

• Lead‑free

* For more information see the Surface Mount Schottky Reliability

Data Sheet.

Package Lead Code Identication, SOT-323 (Top View) Package Lead Code Identication, SOT-363 (Top View)

Package Lead Code Identication, SOT-23/SOT-143 (Top View)

Pin Connections and Package Marking, SOT-363

GUx

1

2

3

6

5

4

Notes:

1. Package marking provides orientation and identication.

2. See “Electrical Specications” for appropriate package marking.

ESD WARNING:
Handling Precautions Should Be Taken To Avoid Static Discharge.

Absolute Maximum Ratings

[1]

TC = 25°C

Symbol Parameter Unit SOT-23/SOT-143 SOT-323/SOT-363

I

f

P

IV

T

j

T

stg

θ

jc

Notes:

1. Operation in excess of any one of these conditions may result in permanent damage to the device.

2. TC = +25°C, where TC is dened to be the temperature at the package pins where contact is made to the circuit board.

Electrical Specications TA = 25°C, Single Diode

Part
Number

[4]

HSMS

2800 A0 0 Single

2802 A2 2 Series

2803 A3 3 Common Anode

2804 A4 4 Common Cathode

2805 A5 5 Unconnected Pair

2808 A8 8 Bridge Quad

280B A0 B Single

280C A2 C Series

280E A3 E Common Anode

280F A4 F Common Cathode

280K AK K

280L AL L Unconnected Trio

280M H M Common Cathode Quad

280N N N Common Anode Quad

280P AP P Bridge Quad

280R O R Ring Quad

Test Conditions IR = 10 mA IF = 1 mA VF = 0 V

Notes:

1. DVF for diodes in pairs and quads in 15 mV maximum at 1 mA.

2. DCTO for diodes in pairs and quads is 0.2 pF maximum.

3. Eective Carrier Lifetime (t) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.

4. See section titled “Quad Capacitance.”

5. RD = RS + 5.2 Ω at 25°C and If = 5 mA.

Forward Current (1 µs Pulse) Amp 1 1

Peak Inverse Voltage V Same as V

BR

Junction Temperature °C 150 150

Storage Temperature °C -65 to 150 -65 to 150

Thermal Resistance

[2]

°C/W 500 150

[3]

Package
Marking

Code

Lead
Code Conguration

High Isolation
Unconnected Pair

Minimum

Breakdown

Voltage

VBR (V)

[4]

70 410 1.0 @ 15 200 @ 50 2.0 35

Maximum

Forward

Voltage
VF (mV)

Maximum

Forward

Voltage

VF (V) @ IF (mA)

Maximum

Reverse

Leakage

IR (nA) @ VR (V)

Same as V

Maximum

Capacitance

CT (pF)

f = 1 MHz

BR

Typical

Dynamic

Resistance

[5]

RD (Ω)

IF = 5 mA

2

Quad Capacitance

C

1

C

2

C

4

C

3

A

B

C

j

R

j

R

S

Rj =

8.33 X 10-5 nT
Ib + I

s

where
Ib = externally applied bias current in amps
Is = saturation current (see table of SPICE parameters)
T = temperature, °K
n = ideality factor (see table of SPICE parameters)

Note:
To effectively model the packaged HSMS-280x product,
please refer to Application Note AN1124.

RS = series resistance (see Table of SPICE parameters)

Cj = junction capacitance (see Table of SPICE parameters)

Capacitance of Schottky diode quads is measured using
an HP4271 LCR meter. This instrument eectively isolates
individual diode branches from the others, allowing
accurate capacitance measurement of each branch or
each diode. The conditions are: 20 mV R.M.S. voltage at 1
MHz. Avago denes this measurement as “CM”, and it is
equivalent to the capacitance of the diode by itself. The
equivalent diagonal and adjacent capacitances can then
be calculated by the formulas given below.

In a quad, the diagonal capacitance is the capacitance
between points A and B as shown in the gure below.
The diagonal capacitance is calculated using the follow‑
ing formula

C1 x C2 C3 x C

C

DIAGONAL

= _______ + _______

C1 + C2 C3 + C

4

4

The equivalent adjacent capacitance is the capacitance
between points A and C in the gure below. This capaci‑
tance is calculated using the following formula

1

C

ADJACENT

1 1 1

–– + –– + ––
C2 C3 C

= C1 + ____________

4

This information does not apply to cross‑over quad
diodes.

Linear Equivalent Circuit, Diode Chip

SPICE Parameters

Parameter Units HSMS-280x

B

V

C

J0

E

G

I

BV

I

S

N 1.08

R

S

P

B

P

T

M 0.5

V 75

pF 1.6

eV 0.69

A E‑5

A 3.00E‑08

Ω 30

V 0.65

2

3

Typical Performance, TC = 25°C (unless otherwise noted), Single Diode

0 0.1 0.30.2 0.5 0.60.4 0.80.7 0.9

I

F

– FORWARD CURRENT (mA)

VF – FORWARD VOLTAGE (V)

Figure 1. Forward Current vs. Forward Voltage
at Temperatures.

0.01

10

1

0.1

100

TA = +125C
T

A

= +75C

T

A

= +25C

T

A

= –25C

Figure 2. Reverse Current vs. Reverse Voltage
at Temperatures.

0 10 20 30 5040

I

R

– REVERSE CURRENT (nA)

VR – REVERSE VOLTAGE (V)

1

1000

100

10

100,000

10,000

TA = +125C
T

A

= +75C

T

A

= +25C

Figure 3. Dynamic Resistance vs. Forward
Current.

0.1 1 100

R

D

– DYNAMIC RESISTANCE ()

IF – FORWARD CURRENT (mA)

10

1

10

1000

100

Figure 4. Total Capacitance vs. Reverse
Voltage.

0 10 20 30 5040

C

T

– CAPACITANCE (pF)

VR – REVERSE VOLTAGE (V)

0

1.5

1

0.5

2

VF - FORWARD VOLTAGE (V)

Figure 5. Typical Vf Match, Pairs and Quads.

30

10

1

0.3

30

10

1

0.3

I

F

- FORWARD CURRENT (mA)

V

F

- FORWARD VOLTAGE DIFFERENCE (mV)

0.2 0.4 0.6 0.8 1.0 1.2 1.4

IF (Left Scale)

VF (Right Scale)

4

Applications Information Introduction —

0.026

0.039

0.079

0.022

Dimensions in inches

0.026

0.079

0.018

0.039

Dimensions in inches

Product Selection

Avago’s family of Schottky products provides unique
solutions to many design problems.

The rst step in choosing the right product is to select the
diode type. All of the products in the HSMS‑280x family
use the same diode chip, and the same is true of the
HSMS‑281x and HSMS‑282x families. Each family has a dif‑
ferent set of characteristics which can be compared most
easily by consulting the SPICE parameters in Table 1.

A review of these data shows that the HSMS‑280x family
has the highest breakdown voltage, but at the expense of
a high value of series resistance (Rs). In applications which
do not require high voltage the HSMS‑282x family, with a
lower value of series resistance, will oer higher current
carrying capacity and better performance. The HSMS‑281x
family is a hybrid Schottky (as is the HSMS‑280x), oering
lower 1/f or icker noise than the HSMS‑282x family.

In general, the HSMS‑282x family should be the designer’s
rst choice, with the ‑280x family reserved for high voltage
applications and the HSMS‑281x family for low icker
noise applications.

Figure 6. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323
Products.

Assembly Instructions

SOT-363 PCB Footprint

A recommended PCB pad layout for the miniature SOT‑
363 (SC‑70, 6 lead) package is shown in Figure 7 (dimen‑
sions are in inches). This layout provides ample allowance
for package placement by automated assembly equip‑
ment without adding parasitics that could impair the
performance.

Assembly Instructions

SOT-323 PCB Footprint

A recommended PCB pad layout for the miniature SOT‑
323 (SC‑70) package is shown in Figure 6 (dimensions
are in inches). This layout provides ample allowance for
package placement by automated assembly equipment
without adding parasitics that could impair the perfor‑
mance.

Table 1. Typical SPICE Parameters

Parameter Units HSMS-280x HSMS-281x HSMS-282x

B

V

C

J0

E

G

I

BV

I

S

N 1.08 1.08 1.08

R

S

PB (VJ) V 0.65 0.65 0.65

PT (XTI) 2 2 2

M 0.5 0.5 0.5

5

V 75 25 15

pF 1.6 1.1 0.7

eV 0.69 0.69 0.69

A 1 E‑5 1 E‑5 1 E‑4

A 3 E‑8 4.8 E‑9 2.2 E‑8

Ω 30 10 6

Figure 7. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363
Products.

25

Time

Temperature

Tp

T

L

tp

t

L

t 25° C to Peak

Ramp-up

ts

Ts

min

Ramp-down

Preheat

Critical Zone
T

L

to Tp

Ts

max

SMT Assembly

Reliable assembly of surface mount components is a
complex process that involves many material, process, and
equipment factors, including: method of heating (e.g., IR
or vapor phase reow, wave soldering, etc.) circuit board
material, conductor thickness and pattern, type of solder
alloy, and the thermal conductivity and thermal mass of
components. Components with a low mass, such as the
SOT package, will reach solder reow temperatures faster
than those with a greater mass.

Avago’s SOT diodes have been qualied to the time‑
temperature prole shown in Figure 8. This prole is
representative of an IR reow type of surface mount as‑
sembly process.

After ramping up from room temperature, the circuit
board with components attached to it (held in place
with solder paste) passes through one or more preheat

zones. The preheat zones increase the temperature of the
board and components to prevent thermal shock and
begin evaporating solvents from the solder paste. The
reow zone briey elevates the temperature suciently
to produce a reow of the solder.

The rates of change of temperature for the ramp‑up and
cool‑down zones are chosen to be low enough to not
cause deformation of the board or damage to compo‑
nents due to thermal shock. The maximum temperature
in the reow zone (T

) should not exceed 260°C.

MAX

These parameters are typical for a surface mount assem‑
bly process for Avago diodes. As a general guideline, the
circuit board and components should be exposed only
to the minimum temperatures and times necessary to
achieve a uniform reow of solder.

Figure 8. Surface Mount Assembly Prole.

Lead-Free Reow Prole Recommendation (IPC/JEDEC J-STD-020C)

Reow Parameter Lead-Free Assembly

Average ramp‑up rate (Liquidus Temperature (T

Preheat Temperature Min (T

Ts(max) to TL Ramp‑up Rate 3°C/second max

Time maintained above: Temperature (TL) 217°C

Peak Temperature (TP) 260 +0/‑5°C

Time within 5 °C of actual Peak temperature (tP) 20‑40 seconds

Ramp‑down Rate 6°C/second max

Time 25 °C to Peak Temperature 8 minutes max

Note 1: All temperatures refer to topside of the package, measured on the package body surface

6

to Peak) 3°C/ second max

S(max)

) 150°C

S(min)

Temperature Max (T

Time (min to max) (tS) 60‑180 seconds

Time (tL) 60‑150 seconds

) 200°C

S(max)

Part Number Ordering Information

e

B

e2

e1

E1

C

E

XXX

L

D

A

A1

Notes:
XXX-package marking
Drawings are not to scale

DIMENSIONS (mm)

MIN.

0.79

0.000

0.30

0.08

2.73

1.15

0.89

1.78

0.45

2.10

0.45

MAX.

1.20

0.100

0.54

0.20

3.13

1.50

1.02

2.04

0.60

2.70

0.69

SYMBOL

A

A1

B
C
D

E1

e
e1
e2

E

L

e

B

e1

E1

C

E

XXX

L

D

A

A1

Notes:
XXX-package marking
Drawings are not to scale

DIMENSIONS (mm)

MIN.

0.80

0.00

0.15

0.08

1.80

1.10

1.80

0.26

MAX.

1.00

0.10

0.40

0.25

2.25

1.40

2.40

0.46

SYMBOL

A

A1

B
C
D

E1

e

e1

E
L

1.30 typical

0.65 typical

No. of

Part Number

HSMS‑280x‑TR2G 10000 13” Reel

HSMS‑280x‑TR1G 3000 7” Reel

HSMS‑280x‑BLKG 100 antistatic bag

x = 0, 2, 3, 4, 5, 8, B, C, E, F, K, L, M, N, P, R

Devices Container

Package Dimensions

Outline 23 (SOT-23)

Outline SOT-323 (SC-70 3 Lead)

7

USER
FEED
DIRECTION

COVER TAPE

CARRIER

TAPE

REEL

Note: "AB" represents package marking code.
"C" re

presents date code.

END VIEW

8 mm

4 mm

TOP VIEW

ABC ABC ABC ABC

Note: "AB" represents package marking code.
"C" represents date code.

END VIEW

8 mm

4 mm

TOP VIEW

ABC ABC ABC ABC

END VIEW

8 mm

4 mm

TOP VIEW

Note: "AB" represents package marking code.
"C" represents date code.

ABC ABC ABC ABC

Package Dimensions (Continued)

e

B

e2

B1

e1

E1

C

E

XXX

L

D

A

A1

Notes:
XXX-package marking
Drawings are not to scale

DIMENSIONS (mm)

MIN.

0.79

0.013

0.36

0.76

0.086

2.80

1.20

0.89

1.78

0.45

2.10

0.45

MAX.

1.097

0.10

0.54

0.92

0.152

3.06

1.40

1.02

2.04

0.60

2.65

0.69

SYMBOL

A

A1

B

B1

C
D

E1

e
e1
e2

E

L

E

HE

D

e

A1

b

A

A2

L

c

DIMENSIONS (mm)

MIN.

1.15

1.80

1.80

0.80

0.80

0.00

0.15

0.08

0.10

MAX.

1.35

2.25

2.40

1.10

1.00

0.10

0.30

0.25

0.46

SYMBOL

E
D

HE

A
A2
A1

e

b

c

L

0.650 BCS

Outline 143 (SOT-143)

Outline SOT-363 (SC-70 6 Lead)

Device Orientation

For Outline SOT-143

8

For Outlines SOT-23, -323

For Outline SOT-363

Tape Dimensions and Product Orientation

9° MAX

A

0

P

P

0

D

P

2

E

F

W

D

1

Ko

8° MAX

B

0

13.5° MAX

t1

DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)

LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER

A

0

B

0

K

0

P
D

1

3.15 ± 0.10

2.77 ± 0.10

1.22 ± 0.10

4.00 ± 0.10

1.00 + 0.05

0.124 ± 0.004

0.109 ± 0.004

0.048 ± 0.004

0.157 ± 0.004

0.039 ± 0.002

CAVITY

DIAMETER
PITCH
POSITION

D
P

0

E

1.50 + 0.10

4.00 ± 0.10

1.75 ± 0.10

0.059 + 0.004

0.157 ± 0.004

0.069 ± 0.004

PERFORATION

WIDTH
THICKNESS

Wt18.00 + 0.30 - 0.10

0.229 ± 0.013

0.315 + 0.012 - 0.004

0.009 ± 0.0005

CARRIER TAPE

CAVITY TO PERFORATION
(WIDTH DIRECTION)

CAVITY TO PERFORATION
(LENGTH DIRECTION)

F

P

2

3.50 ± 0.05

2.00 ± 0.05

0.138 ± 0.002

0.079 ± 0.002

DISTANCE
BETWEEN
CENTERLINE

W

F

E

P

2

P

0

D

P

D

1

DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)

LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER

A

0

B

0

K

0

P
D

1

3.19 ± 0.10

2.80 ± 0.10

1.31 ± 0.10

4.00 ± 0.10

1.00 + 0.25

0.126 ± 0.004

0.110 ± 0.004

0.052 ± 0.004

0.157 ± 0.004

0.039 + 0.010

CAVITY

DIAMETER
PITCH
POSITION

D
P

0

E

1.50 + 0.10

4.00 ± 0.10

1.75 ± 0.10

0.059 + 0.004

0.157 ± 0.004

0.069 ± 0.004

PERFORATION

WIDTH
THICKNESS

Wt18.00 + 0.30 - 0.10

0.254 ± 0.013

0.315+ 0.012 - 0.004

0.0100 ± 0.0005

CARRIER TAPE

CAVITY TO PERFORATION
(WIDTH DIRECTION)

CAVITY TO PERFORATION
(LENGTH DIRECTION)

F

P

2

3.50 ± 0.05

2.00 ± 0.05

0.138 ± 0.002

0.079 ± 0.002

DISTANCE

A

0

9° MAX 9° MAX

t

1

B

0

K

0

For Outline SOT-23

For Outline SOT-143

9

Tape Dimensions and Product Orientation

P

P

0

P

2

F

W

C

D

1

D

E

A

0

An

t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS)

An

B

0

K

0

DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)

LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER

A

0

B

0

K

0

P
D

1

2.40 ± 0.10

2.40 ± 0.10

1.20 ± 0.10

4.00 ± 0.10

1.00 + 0.25

0.094 ± 0.004

0.094 ± 0.004

0.047 ± 0.004

0.157 ± 0.004

0.039 + 0.010

CAVITY

DIAMETER
PITCH
POSITION

D
P

0

E

1.55 ± 0.05

4.00 ± 0.10

1.75 ± 0.10

0.061 ± 0.002

0.157 ± 0.004

0.069 ± 0.004

PERFORATION

WIDTH
THICKNESS

W
t

1

8.00 ± 0.30

0.254 ± 0.02

0.315 ± 0.012

0.0100 ± 0.0008

CARRIER TAPE

CAVITY TO PERFORATION
(WIDTH DIRECTION)

CAVITY TO PERFORATION
(LENGTH DIRECTION)

F

P

2

3.50 ± 0.05

2.00 ± 0.05

0.138 ± 0.002

0.079 ± 0.002

DISTANCE

FOR SOT-323 (SC70-3 LEAD) An 8°C MAX

FOR SOT-363 (SC70-6 LEAD) 10°C MAX

ANGLE

WIDTH
TAPE THICKNESS

C
T

t

5.4 ± 0.10

0.062 ± 0.001

0.205 ± 0.004

0.0025 ± 0.00004

COVER TAPE

For Outlines SOT-323, -363

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. Obsoletes 5989-4020EN
AV02-0533EN - May 28

, 2009