Datasheet HSMR-CL25 Datasheet (AVAGO)

HSMR-CL25

0.25mm Blue Leadframe-Based Surface Mount ChipLED

Data Sheet

Description

The HSMR-CL25 series of parts is designed with an ultra
small form factor to allow this miniaturization. The HSMR­CL25 series is the thinnest available top emitting package
in the market with high brightness InGaN die technology.
The leadframe construction of this package allows the
part to transfer heat from the package, thus it is able to
survive temperature conditions of -40°C to 85°C despite its
small size.

The target applications are Keypad backlighting, Push
button backlighting and Status indicators.

The target markets are Mobile Handsets, Communications,
Oce Automation, Industrial and Commercial
automations, Home Market appliances, Networking,
Medical Instruments, and Mobile Computing. This product
is competitively priced, and production is geared towards
short lead times and ample capacity.

Features

• Small size top ring

• Small 1.6 (L) x 0.8 (W) x 0.25 (H) mm package

• Compatible with IR Reow

• High brightness using InGaN die technology

• Available in 8mm Tape on 7” (178 mm) Diameter Reels

Advantages

• High package thermal dissipation capability due to the

superior package leadframe design

• Small footprint to overcome space count

• Low thickness to overcome space constrains

• Short lead times and competitive pricing

CAUTION: HSMR-CL25 LEDs are Class 1B ESD sensitive per JESD22-A114C.01. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.

1

Package Dimensions

Notes:

1. All dimensions are in millimeters.

2. Tolerance is ±0.1mm unless otherwise specied.

Device Selection Guide

Package Dimension (mm) Die Technology Colors Testing Current (mA) Parts per Reel Package Description

1.6 (L) x 0.8 (W) x 0.25 (H) InGaN Blue 5 4000 Untinted, Non-Diused

Absolute Maximum Ratings at TA = 25°C

Parameter HSMR-CL25 Units

DC Forward Current

Power Dissipation 39 mW

Reverse Voltage (IR = 100mA)

LED Junction Temperature 95 °C

Operating Temperature Range -40 to +85 °C

Storage Temperature Range -40 to +85 °C

Soldering Temperature See reow soldering prole

Notes:

1. Derate linearly as shown in Figure 4.

[1]

10 mA

5 V

(Refer to Figures 7 & 8 )

2

Electrical Characteristics at TA = 25°C

Forward Voltage VF (Volts)

@ IF =5mA

Part Number

[1]

Reverse Breakdown

VR (Volts) @ IR = 100mA

Min.

Thermal Resistance

Rq

(°C/W)

J-PIN

Typ.Typ. Max.

HSMR-CL25 2.85 3.15 5 300

Notes:

1. Vf tolerance : ±0.1V

Optical Characteristics at TA = 25°C

Luminous Intensity IV

@ 5mA

Part Number

HSMR-CL25 11.2 18 469 473 120

Notes:

1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED
package.

2. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.

3. q

is the o-axis angle where the luminous intensity is ½ the peak intensity.

1/2

Light Intensity (IV) Bin Limits

Intensity (mcd)

Bin ID

L 11.20 18.00

M 18.00 28.50

N 28.50 45.00

Tolerance : ±15%

Minimum Maximum

[1]

(mcd)

Peak Wavelength

lpeak (nm)

Typ.

Color Bin Limits

Bin ID

Tolerance : ±1nm

Dominant Wavelength

[2]

ld

(nm)

Typ.

Viewing Angle

[3]

(°)

Typ.Min. Typ.

Dominant Wavelength (nm)

Minimum Maximum

B 465.0 470.0
C 470.0 475.0

Forward Voltage (VF) Bin Limits

Bin ID

1 2.55 2.75
2 2.75 2.95
3 2.95 3.15

Tolerance : ±0.1V

Minimum Maximum

Forward Voltage (V)

3

Figure 1. Relative intensity vs. wavelength

0

10

20

30

40

50

60

70

80

90

100

400 450 500 550 600 650 700

WAVELENGTH - nm

RELATIVE INTENSITY - %

0.1

1

10

100

2.0 2.5 3.0 3.5 4.0

FORWARD VOLTAGE - V

FORWARD CURRENT - mA

0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0 2 4 6 8 10

DC FORWARD CURRENT - mA

RELATIVE LUMINOUS INTENSITY

(NORMALIZED AT 5 mA)

0

2

4

6

8

10

12

0 20 40 60 80 100

DC FORWARD CURRENT - mA

RELATIVE LUMINOUS INTENSITY

(NORMALIZED AT 5 mA)

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1

-90 -60 -30 0 30 60 90

ANGULAR DISPLACEMENT - DEGREES

NORMALIZED INTENSITY

0.8 (0.031)

0.8

(0.031)

0.7

(0.028)

0.8

(0.031)

Figure 2. Forward voltage vs. forward current

Figure 3. Luminous intensity vs. forward current

Figure 5. Radiation Pattern

4

Figure 4. Maximum forward current vs. ambient temperature

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specied.

Figure 6. Recommended soldering land pattern.

Figure 7. Recommended reow soldering prole

TEMPERATURE

TIME

10 SEC. MAX.

230oC MAX.

140-160oC

4oC/SEC MAX.

OVER 2 MIN.

4oC/SEC MAX.

-3oC/SEC MAX.

10.50 ± 1.0 (0.413 ± 0.039)

59.60 ± 1.00

(2.346 ± 0.039)

∅ 20.20 MIN.

(∅ 0.795 MIN.)

6

PS

178.40 ± 1.00

(7.024 ± 0.039)

3.0 ± 0.5

(0.118 ± 0.020)

4.0 ± 0.5

(0.157 ± 0.020)

5.0 ± 0.5

(0.197 ± 0.020)

∅ 13.1 ± 0.5

(∅ 0.516 ± 0.020)

8.0 ± 1.0 (0.315 ± 0.039)

100 SEC. MAX.

TIME

TEMPERATURE

(Acc. to J-STD-020C)

-6

˚C/

SEC. MAX.

255 - 260

˚C

10 - 30 SEC.

60 - 120 SEC.

3

˚C/

SEC. MAX.

3

˚C/

SEC. MAX.

217

˚C

200

˚C

150

˚C

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

CATHODE SIDE

PRINTED LABEL

USER FEED DIRECTION

x

x

x

x

x

Figure 9. Reeling orientation.

Figure 8. Recommended Pb-free reow soldering prole.

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specied.

Figure 10. Reel dimensions.

5

Figure 11. Tape Dimensions

END START

THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.

MOUNTED WITH
COMPONENTS

THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.

MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.

PART NUMBER

DIM. A

DIM. B

DIM. C

HSMR-CL25 1.75 (0.069) 0.88 (0.035) 0.40 (0.016)

± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)

Figure 12. Tape leader and trailer dimensions.

Reow Soldering:

For more information on reow soldering, refer to
Application Note AN-1060, Surface Mounting SMT LED
Indicator Components.

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.

AV01-0704EN - December 28, 2006

Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved.. Obsoletes AV01-0509EN

Storage Condition:

5 to 30°C @ 60%RH max.

Baking is required before mounting, if:

1. Humidity Indicator Card is > 10% when read at 23 ± 5°C.

2. Device expose to factory conditions <30°C/60%RH more
than 168 hours.

Recommended baking condition:

60±5°C for 20 hours.