Datasheet HSMA-T425, HSMA-T525, HSMA-T625, HSMA-T725, HSMJ-T425 Datasheet (HP)

Surface Mount High
Performance AlInGaP LED
Indicators

H

Technical Data

Features

• Outstanding LED Material
Efficiency

• Exceptional Light Output
Over a Wide Range of Drive
Currents

• Colors: 590 nm Amber, 603
nm Orange, and 615 nm
Reddish-Orange

• Compatible with Automatic
Placement Equipment

• Compatible with Convective
IR, Vapor Phase Reflow, and
TTW Solder Processes

• Packaged in 12 mm or 8 mm
Tape on 7" or 13" Diameter
Reels

• EIA Standard Package

• Low Package Profile

• Non-diffused Package
Excellent for Backlighting
and Coupling to Light Pipes

Description

The LED material used in these
devices is the very efficient
absorbing Substrate aluminum
indium gallium phosphide (AS
AlInGaP), capable of producing
high light output over a wide
range of drive currents.

These solid state surface mount
indicators are designed with a flat
top and sides to be easily handled
by automatic placement equip­ment. A glue pad is provided for
adhesive mounting processes.
They are compatible with
convective IR and vapor phase
reflow soldering, through the
wave (TTW) soldering, and
conductive epoxy attachment
processes.

The package size and configura­tion conform to the EIA-535

SunPower Series
HSMA-TX25
HSMD-TX25
HSMJ-TX25

BAAC standard specification for
case size 3528 tantalum
capacitors. The folded leads
permit dense placement and
provide an external solder joint
for ease of inspection.

These devices are non-diffused,
providing high intensity for
applications such as backlighting,
light pipe illumination, and front
panel indication.

Device Selection Guide

Amber Orange Reddish-Orange

λd = 590 nm λd = 603 nm λd = 615 nm Description

HSMA-T425 HSMD-T425 HSMJ-T425 12 mm Tape, 7" Reel, 2000 Devices
HSMA-T525 HSMD-T525 HSMJ-T525 12 mm Tape, 13" Reel, 8000 Devices
HSMA-T625 HSMD-T625 HSMJ-T625 8 mm Tape, 7" Reel, 2000 Devices
HSMA-T725 HSMD-T725 HSMJ-T725 8 mm Tape, 13" Reel, 8000 Devices

5964-9352E

1-199

Package Dimensions

3.5 ± 0.2

(0.138 ± 0.008)

2.8 ± 0.2

(0.110 ± 0.008)

0.7

(0.028)

0.8 ± 0.3

(0.031 ± 0.012)

(2 PLACES)

MIN.

(0.087)

3.1

(0.122)

(0.004)

NOM.

2.2

0.1

1.3

(0.050)

MIN.

NOM.

NOM.

Tape and Reel Specifications

Hewlett Packard surface mount
LEDs are packaged tape and reel
in accordance with EIA-481A,

Taping of Surface Mount

2.7
NOM.

(0.106)

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).

2. THE LEADS ARE COPPER ALLOY, 85% Sn/15% Pb PLATING.

CATHODE NOTCH

1.9 ± 0.2

(0.075 ± 0.008)

2.2 ± 0.1

(0.087 ± 0.004)

Components for Automatic
Placement. This packaging

system is compatible with tape­fed automatic pick and place
systems. Each reel is sealed in a

vapor barrier bag for added
protection. Bulk packaging in
vapor barrier bags is available
upon special request.

1-200

CATHODE

PITCH: 4 mm (0.157 IN.)

CARRIER TAPE WIDTH:
12 mm (0.472 IN.) OR 8 mm (0.315 IN.)

USER FEED
DIRECTION

HEWLETT

hp

PACKARD

REEL DIAMETER:
178 mm (7 IN.) OR 330 mm (13 IN.)

Absolute Maximum Ratings at T

DC Forward Current
Peak Forward Current

[1,4,5]

............................................................ 50 mA

[2]

........................................................... 200 mA

= 25°C

A

Average Forward Current ........................................................... 45 mA

(at I

= 200 mA, f ≥ 1 KHz)

PEAK

Transient Forward Current (10 µs Pulse)

[2]

[3]

.............................. 500 mA

Reverse Voltage (IR = 100 µA)......................................................... 5 V

LED Junction Temperature ............................................................ 95°C

Operating Temperature Range....................................... -40°C to +85°C

Storage Temperature Range .......................................... -40°C to +85°C

Reflow Soldering Temperatures

Convective IR ...................... 235°C Peak, above 183°C for 90 seconds

Vapor Phase ........................................................215°C for 3 minutes

Notes:

1. Derate linerally as shown in Figure 4.

2. Refer to Figure 5 to establish pulsed operating conditions.

3. The transient peak current is the maximum non-recurring peak current the device can
withstand without damaging the LED die and wire bonds.

4. Drive currents between 5 mA and 30 mA are recommended for best long term
performance.

5. Operation at currents below 5 mA is not recommended, please contact your Hewlett­Packard sales representative.

Optical Characteristics at T

= 25°C

A

Luminous Color, Viewing

Intensity Peak Dominant Angle Luminous

IV (mcd) Wavelength Wavelength 2 θ

Part @ 10 mA λ

(nm) λ

PEAK

[1]

(nm) Degrees

d

1/2

[2]

Number Min. Typ. Typ. Typ. Typ. (lm/w)

HSMA-TX25 10 25 592 590 120 480
HSMD-TX25 10 25 607 603 120 370
HSMJ-TX25 10 25 621 615 120 263

Notes:

1. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the device.

2. θ

is the off-axis angle where the luminous intensity is 1/2 the peak intensity.

1/2

Electrical Characteristics at T

= 25°C

A

Speed of

Forward Reverse Capacitance Response

Voltage Breakdown C (pF) τs (ns)

VF (Volts) VR (Volts) VF = 0, Thermal Time Constant

Part @ IF = 10 mA @ I

Number Typ. Max. Min. Typ. Typ. Rθ

= 100 µA f = 1 MHz Resistance e

R

(°C/W) Typ.

J-PIN

HSMA-TX25 1.9 2.4 5 25 40 180 13
HSMD-TX25 1.9 2.4 5 25 40 180 13
HSMJ-TX25 1.9 2.4 5 25 40 180 13

Efficacy

η

v

-t/τ

s

1-201

1.0
AMBER

ORANGE

REDDISH
ORANGE

200
180

160
140
120

0.5

100

80

RELATIVE INTENSITY

0

550 594 600 650 700

607 621

WAVELENGTH – nm

60
40

– FORWARD CURRENT – mA

F

20

I

0

1.0

1.5 2.0

VF – FORWARD VOLTAGE – V

Figure 1. Relative Intensity vs. Wavelength. Figure 2. Forward Current vs.

Forward Voltage.

2.5

3.0

5.0

4.0

3.0

2.0

(NORMALIZED AT 20 mA)

1.0

RELATIVE LUMINOUS INTENSITY

0

0

IF – DC FORWARD CURRENT – mA

20 40

10 30 50

Figure 3. Relative Luminous Intensity
vs. Forward Current.

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

NORMALIZED INTENSITY

0.2

0.1

0

100 90

80 70 60 50 40 20 10 030 10 20 30 40 50 60 70 80 90 100

θ – ANGULAR DISPLACEMENT – DEGREES

50
45

40
35

Rθ

= 439° C/W

30
25

20
15

– FORWARD CURRENT – mA

10

F

I

J-A

Rθ

= 244° C/W

J-A

5
0

10 30 50 70 9055110

0

40 80

20 60 100

TA – AMBIENT TEMPERATURE – °C

Figure 4. Maximum Forward Current
vs. Ambient Temperature. Derating
Based on T

Max = 95°C.

J

60

50

40

30

20

– AVERAGE CURRENT – mA

10

AVG

I

0

f > 300 Hz

f > 100 Hz

50

100 200

I

– PEAK FORWARD CURRENT – mA

PEAK

f > 1 KHz

150

Figure 5. Maximum Average Current
vs. Peak Forward Current.

Figure 6. Relative Intensity vs.
Angular Displacement.

1-202

Recommended Printed Circuit Board Attachment Pad Geometries

INFRARED/VAPOR PHASE

REFLOW SOLDERING

4.45

(0.175)

1.65

(0.065)

CONDUCTIVE ATTACHMENT

4.45

(0.175)

1.65

(0.065)

0.64 (0.025) SQ.

CENTERED HOLE

2.41

(0.095)

2.41

(0.095)

COMPONENT LOCATION

ON PAD

COMPONENT LOCATION

ON PAD

NOTE: ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).

Convective IR Reflow Soldering

For information on convective IR
reflow soldering, refer to the
Supplement to Application Note
1060, Surface Mounting SMT

LED Components.

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