Datasheet HSMA5817, HSMA5818, HSMA5819 Datasheet (HSMC)

HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : Preliminary Data
Issued Date : 2000.01.15
Revised Date : 2001.05.01
Page No. : 1/3

HSMA5817

1.0 AMP. SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS

thru

HSMA5819

Features

Low Forward Voltage Drop

•

High Current Capability

•

High Reliability

•

High Surge Current Capability

•

Mechanical Data

Cases: SMA Molded Plastic
Epoxy: UL 94V-0 rate flame retardant
Lead: Axial leads, solderable per MIL-STD-202, Method 208 guaranteed
Polarity: Color band denotes cathode end
High temperature soldering guaranteed: 250°C/10 seconds/.375"(9.5mm) lead lengths at 5 lbs.,
(2.3kg) tension, Weight:0.33gram

Maximum Ratings and Electrical Characteristics

Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz,
resistive or inductive load. For capacitive load, derate current by 20%.

Type Number HSMA5817 HSMA5818 HSMA5819 Units
Maximum Recurrent Peak Reverse Voltage 20 30 40 V

Maximum RMS Voltage 14 21 28 V
Maximum DC Blocking voltage 20 30 40 V
Maximum Average Forward Rectified Current
See Fig.1
Peak Forward Surge Current, 8.3ms Single
Half Sine-wave Superimposed on Rated
Load(JEDEC method)
Maximum Instantaneous Forward Voltage
@1.0A

Maximum D.C. Reverse Current
Rated DC Blocking Voltage

Ty pical Ther mal Resi stance
Operating Junction Temperature Range T
Storage Temperature Range T

Notes: 1.Pulse Test with PW=300 usec, 1% Duty Cycle

2. Measured on P.C. Board with 0.2x0.2”(5.0x5.0mm) Copper Pad Areas.

(Note 1)

(Note 2)

STG

at

RθJA

J

0.45 0.55 0.60 V

0.5(@TA=25°C)

10(@TA=100°C) 5.0(@TA=100°C)

-65 to +125 -65 to +150

1.0 A

40 A

88

-65 to +150

mA
mA
C/W

°

C

°

C

°

HSMA5817, HSMA5818, HSMA5819 HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

Characteristics Curve

Spec. No. : Preliminary Data
Issued Date : 2000.01.15
Revised Date : 2001.05.01
Page No. : 2/3

HSMA5817, HSMA5818, HSMA5819 HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

SMA/DO-214AC Dimension

Spec. No. : Preliminary Data
Issued Date : 2000.01.15
Revised Date : 2001.05.01
Page No. : 3/3

A

B

C

D

E

F

H

G

DIM

Inches Millimeters Inches M illimeters

Min. Max. Min. Max.

DIM

Min. Max. Min. Max.
A 0.5000 0.0642 1.27 1.63 E 0.0299 0.0598 0.76 1.52
B 0.0901 0.1150 2.29 2.92 F 0.0039 0.0079 0.10 0.20
C 0.1575 0.1811 4.00 4.60 G 0.1890 0.2201 4.80 5.59
D 0.0783 0.1028 1.99 2.61 H 0.0059 0.0122 0.15 0.31

Notes :

1.Dimension and tolerance based on our Spec. dated Mar. 6,2000.

2.Controlling dimension : millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing method, please contact your l ocal HSMC sales office.

*:Typical

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

•

HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or appl ication assistance.

Head Office And Factory :

•

Head Office

Tel : [phone] Fax : [phone]

•

Factory 1 :

Tel : [phone]~5 Fax : [phone]

HSMA5817, HSMA5818, HSMA5819 HSMC Product Specification

(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C