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HI-SINCERITY
MICROELECTRONICS CORP.
HSD468
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HSD468 is designed for general purpose low frequency power
amplifier applicati ons.
Spec. No. : HE6535
Issued Date : 1992.11.25
Revised Date : 2002.02.08
Page No. : 1/4
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature...................................................................................... 150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 900 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage......................................................................................... 25 V
VCEO Collector to Emitter Voltage...................................................................................... 20 V
VEBO Emitter to Base Voltage.............................................................................................. 5 V
IC Collector Current .............................................................................................................. 1 A
TO-92
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 25 - - V IC=10uA, IE=0
BVCEO 20 - - V IC=1mA, IB=0
BVEBO 5 - - V IE=10uA, IC=0
ICBO - - 1 uA VCB=20V, IE=0
*VCE(sat) - - 500 mV IC=0.8A, IB=80mA
VBE(on) - - 1 V VCE=2V, IC=500mA
*hFE 85 - 240 VCE=2V, IC=500mA
fT - 190 - MHz VCE=2V, IC=500mA
Cob - 22 - pF VCB=10V, f=1MHz, IE=0
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classification of hFE
Rank B C
Range 85-170 120-240
HSD468 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6535
Issued Date : 1992.11.25
Revised Date : 2002.02.08
Page No. : 2/4
1000
125oC
100
hFE
10
1 10 100 1000
25oC
Collector Current-IC (mA)
75oC
hFE @ VCE=2V
ON Voltage & Collector Current
1000
75oC
Cur rent G ain & C o llector Current
1000.0
CE(sat)
V
100.0
Saturation Voltage (mV)
125oC
10.0
0.1 1 10 100 1000
B
@ IC=10I
25oC
Collector Current- IC (mA)
75oC
Cutoff Frequency & Ic
1000
VCE=2V
Sat urati on Voltage & Coll ector Cu rrent
25oC
ON Voltage ( m V)
100
125oC
BE(ON)
V
@ VCE=2V
0.1 1 10 100 1000
Collector Current-IC (mA)
Capacitance & Rev erse-Biased Voltage
100
10
Capacitance (pF)
Cob
100
Cutoff Frequency (MHz)...
10
1 10 100 1000
Collector Current (mA)
Safe Operati ng Area
10000
1000
(mA)
C
100
Collector Curr ent - I
PT=1ms
PT=100m s
PT=1s
10
1
0.1 1 10 100 1000
Reverse Biased Volt age ( V)
1
1 10 100
Forwar d Vol tage-Vce (V)
HSD468 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6535
Issued Date : 1992.11.25
Revised Date : 2002.02.08
Page No. : 3/4
1000
900
800
700
600
500
400
300
PD , Powe r Dissipation (mW)
200
100
0
0 20 40 60 80 100 120 140 160
Ta , Case Temperat ure (° C)
Tempera ture Profile for Dip Soldering
300
250
200
C)
o
Power Temperature Derating
10+/-2 sec
260
240
220
200
180
C)
o
160
140
120
100
Temperature(
80
60
40
20
0
0 50 100 150 200 250 300
10+/-2 sec
40+/-20 sec
150+/-30
Time(sec)
IR Reflow Profile
150
Temperature(
100
120+/-20 sec
50
0
0 50 100 150 200 250 300 350
Time(sec)
HSD468 HSMC Product Specification
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HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6535
Issued Date : 1992.11.25
Revised Date : 2002.02.08
Page No. : 4/4
A
α2
B
31
2
Marking:
HD
S
648
Date Code Control Code
Rank
α3
C
D
H
I
α1
G
Style: Pin 1.Emitter 2.Collector 3.Base
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSD468 HSMC Product Specification
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