Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6506
Issued Date : 1994.03.25
Revised Date : 2002.02.08
Page No. : 1/3
HSB1426
PNP EPITAXIAL PLANAR TRANSISTOR
Description
DC-DC Converter
Features
• Low Collector to Emitter Saturation Voltage
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 750 mW
TO-92
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage........................................................................................ -20 V
VCEO Collector to Emitter Voltage..................................................................................... -20 V
VEBO Emitter to Base Voltage............................................................................................. -6 V
IC Collector Current ............................................................................................................. -3 A
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -20 - - V IC=-50uA, IE=0
BVCEO -20 - - V IC=-1mA, IB=0
BVEBO -6 - - V IE=-10uA, IC=0
ICBO - - -100 nA VCB=-20V, IE=0
IEBO - - -100 nA VEB=-5V, IC=0
*VCE(sat) - - -500 mV IC=-2A, IB=-0.1A
*hFE 82 - 390 VCE=-2V, IC=-100mA
fT - 240 - MHz VCE=-2V, IC=-500mA, f=100MHz
Cob - 35 - pF VCB=-10V, IE=0, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE1
Rank P Q R
Range 82-180 120-270 180-390
HSB1426 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6506
Issued Date : 1994.03.25
Revised Date : 2002.02.08
Page No. : 2/3
1000
125oC
100
hFE
10
1 10 100 1000 10000
25oC
75oC
hFE @ VCE=2V
Collector Current - IC (mA)
Capacit ance & Reverse-Biased Volt age
100
Cob
Current Gain & Coll ector Current
1000
Sat urati on Voltage & C ol lector C urrent
75oC
100
Saturation Voltage (mV)
125oC
10
1 10 100 1000 10000
1000
100
Collector Current - IC (mA)
Cutoff Frequency & Collector Cu rrent
VCE=2V
CE(sat)
V
25oC
@ IC=20I
B
10
Capacitance (p F)
1
0.1 1 10 100
Reverse- Biased Voltage ( V)
Safe Operating Area
10000
1000
(mA)
C
100
Collector Current-I
10
PT=1ms
PT=100ms
PT=1s
10
Cutoff Frequency (MHz)...
1
10 100 1000
Collec tor Current-IC (mA)
Power Derating
800
700
600
500
400
300
200
Power Dis s ip ation-PD (mW)
100
1
1 10 100
Forwar d Voltage- VCE (V)
0
0 50 100 150 200
Ambient Temperatur e - Ta (oC)
HSB1426 HSMC Product Specification
Page 3
HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6506
Issued Date : 1994.03.25
Revised Date : 2002.02.08
Page No. : 3/3
A
α2
B
31
2
Marking:
HB
S
412
6
Date Code Control Code
Rank
α3
C
D
H
I
α1
G
Style: Pin 1.Emitter 2.Collector 3.Base
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSB1426 HSMC Product Specification
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