Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. :HSP200204
Issued Date : 1998.01.06
Revised Date : 2002.03.26
Page No. : 1/3
HSA733SP
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HSA733 is designed for use in driver stage of AF amplifier.
Features
• High hFE and Excellent Linearity: 200 Typ. hFE(VCE=6.0,IC=1.0mA)
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature........................................................................................... -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................... 250 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage........................................................................................ -60 V
VCEO Collector to Emitter Voltage..................................................................................... -50 V
VEBO Emitter to Base Voltage............................................................................................. -5 V
IC Collector Current....................................................................................................... -100 mA
IB Base Current............................................................................................................... -20 mA
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -60 - - V IC=-100uA
BVCEO -50 - - V IC=-1mA
BVEBO -5 - - V IE=-10uA
ICBO - - -0.1 uA VCB=-60V, IC=0
IEBO - - -0.1 uA VEB=-5V, IC=0
*VCE(sat) - -0.18 -0.3 V IC=-100mA, IB=-10mA
VBE(on) -0.55 -0.62 -0.7 V IC=-1mA, VCE=-6V
*hFE 90 200 600 VCE=-6V, IC=-1mA
fT 100 180 - MHz IC=-1mA, VCE=-6V
Cob - 4.5 6.0 pF IE=0, VCB=-10V, f=1MHz
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE1
Rank R Q P K
Range 90-180 135-270 200-400 300-600
HSA733SP HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. :HSP200204
Issued Date : 1998.01.06
Revised Date : 2002.03.26
Page No. : 2/3
1000
Current Gain & Collector Current
125oC
25oC
100
hFE
hFE @ VCE=6V
10
0.1 1 10 100 1000
1000
Collec tor Cur rent -IC (mA)
ON Voltage & Collector Curren t
25oC
75oC
75oC
1000
Sat ur ation Voltage & Collector Cur rent
75oC
100
25oC
Satur ation Volta ge ( m V)
10
0.1 1 10 100 1000
Collec tor Cur rent -IC (mA)
125oC
CE(sat)
V
@ IC=10I
B
125oC
ON Voltage (mV)
100
0.1 1 10 100 1000
Collec tor Cur rent -IC (mA)
BE(ON)
V
@ VCE=6V
HSA733SP HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92SP Dimension
Spec. No. :HSP200204
Issued Date : 1998.01.06
Revised Date : 2002.03.26
Page No. : 3/3
Style: Pin 1.Emitter 2.Collector 3.Base
E
F
3
A
2
D
1
G
DIM
B
3-Lead TO-92SP Plastic Package, HSMC Package Code: SP
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
C
DIM
Min. Max. Min. Max.
A 0.1450 0.1650 3.70 4.20 E 0.0160 0.0240 0.41 0.61
B 0.1063 0.1300 2.70 3.30 F - *0.0150 - *0.38
C 0.5000 - 12.7 - G 0.0800 0.1050 2.03 2.67
D - *0.1000 - *2.54
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
*: Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem e nt of patents, or applic ati on assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSA733SP HSMC Product Specification
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