Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
HSA733
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HSA733 is designed for use in driver stage of AF amplifier
applications.
Spec. No. : HE6507
Issued Date : 1992.12.16
Revised Date : 2002.03.26
Page No. : 1/4
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperatur e............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 250 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Volt ag e........................................................................................ -60 V
VCEO Collector to Emitter Voltage..................................................................................... -50 V
VEBO Emitter to Base Voltage............................................................................................. -5 V
IC Collector Current ...................................................................................................... -100 mA
IB Base Current .............................................................................................................. -20 mA
TO-92
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -60 - - V IC=-100uA, IE=0
BVCEO -50 - - V IC=-1mA, IB=0
BVEBO -5 - - V IE=-10uA, IC=0
ICBO - - -0.1 uA VCB=-60V, IE=0
IEBO - - -0.1 uA VEB=-5V, IC=0
*VCE(sat) - -0.18 -0.3 V IC=-100mA, IB=-10mA
VBE(on) -0.55 -0.62 -0.7 V VCE=-6V, IC=-1mA
*hFE 90 200 600 VCE=-6V, IC=-1mA
fT 100 180 - MHz VCE=-6V, IC=-10mA
Cob - 4.5 6 pF VCB=-10V, f=1MHz, IE=0
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE1
Rank R Q P K
Range 90-180 135-270 200-400 300-600
HSA733 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6507
Issued Date : 1992.12.16
Revised Date : 2002.03.26
Page No. : 2/4
1000
Cur ren t Ga in & C ollector Cu rrent
125oC
25oC
100
hFE
hFE @ VCE=6V
10
0.1 1 10 100 1000
1000
75oC
Collector Current-IC (mA)
ON Voltage & Collector Current
25oC
75oC
1000
75oC 125oC
100
25oC
Satur ation Voltag e (mV)
10
CE(sat)
V
0.1 1 10 100 1000
B
@ IC=10I
Collec tor Current-IC (mA)
Cutoff Frequancy & Collector Current
1000
Sat urati on Voltage & C ol lector C urrent
100
VCE=6V
125oC
ON Voltage (mV)
100
0.1 1 10 100 1000
Collector Current-IC (mA)
BE(ON)
V
@ VCE=6V
Capacitan ce & Reverse-Biased Voltage
10
Cob
Capacitance (pF)
10
Cutoff Frequ ance (MHz)...
1
1 10 100
10000
PT=1ms
PT=100ms
PT=1s
(mA)
C
Collector Current-I
1000
100
10
Collector Current (mA)
Safe Operati ng Area
1
0.1 1 10 100
Reverse- Biased Voltage ( V)
1
1 10 100
Forwar d Voltage- VCE (V)
HSA733 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6507
Issued Date : 1992.12.16
Revised Date : 2002.03.26
Page No. : 3/4
300
250
200
150
100
Power Dissipation-PD (mW)
50
0
0 50 100 150 200
Ambient Temperat ure-Ta (oC)
PD-Ta
HSA733 HSMC Product Specification
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HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6507
Issued Date : 1992.12.16
Revised Date : 2002.03.26
Page No. : 4/4
A
α2
B
31
2
Marking:
HA
S
373
Date Code Control Code
Rank
α3
C
D
H
I
α1
G
Style: Pin 1.Emitter 2.Collector 3.Base
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E-*0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem e nt of patents, or applic ati on assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSA733 HSMC Product Specification
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