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HI-SINCERITY
MICROELECTRONICS CORP.
HSA1538S
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HSA1538S is designed for use in high-definition CRT display
video output, wide-band amplifier applications..
Spec. No. : HE6501
Issued Date : 1992.08.25
Revised Date : 2002.02.18
Page No. : 1/4
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 900 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage...................................................................................... -120 V
VCEO Collector to Emitter Voltage................................................................................... -120 V
VEBO Emitter to Base Voltage............................................................................................. -3 V
IC Collector Current ...................................................................................................... -200 mA
Icp Peak Collector Current ........................................................................................... -400 mA
TO-92
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -120 - - V IC=-10uA, IE=0
BVCEO -120 - - V IC=-1mA, IB=0
BVEBO -3 - - V IE=-100uA, IC=0
ICBO - - -0.1 uA VCB=-80V, IE=0
IEBO - - -0.1 uA VEB=-2V, IC=0
*VCE(sat) - - -1 V IC=-30mA, IB=-3mA
*VBE(sat) - - -1 V IC=-30mA, IB=-3mA
*hFE1 60 160 320 VCE=-10V, IC=-10mA
*hFE2 40 - - VCE=-10V, IC=-100mA
fT - 400 - MHz VCE=-10V, IC=-50mA
Cob - 2.8 - pF VCB=-30V, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE1
Rank D E F
Range 60-120 100-200 160-320
HSA1538S HSMC Product Specification
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HI-SINCERITY
)
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6501
Issued Date : 1992.08.25
Revised Date : 2002.02.18
Page No. : 2/4
1000
Current Gain & Collector Current
125oC
100
hFE
10
10000
1000
25oC
75oC
hFE @ VCE=10V
1 10 100 1000
Collector Current-IC (mA)
Sat urati on Voltage & C ollector Cu rrent
75oC
25oC
1000
100
Satur ation Voltag e (mV)
10
1 10 100 1000
125oC
25oC
Collec tor Current-IC (mA)
75oC
CE(sat)
V
@ IC=10I
Cut off Frequ ency & Col l ector Curr ent
1000
VCE=10V
100
Saturation Voltage & Col lector Current
B
Saturation Voltage (mV)
100
125oC
BE(sat)
V
@ VCE=10I
1 10 100 1000
Collec tor Current-IC (mA)
B
Capacitance & Reverse- Biased Voltage
10
Cob
Capacitance (pF)
1
1 10 100
Reverse- Biased Vol t ag e ( V)
10
Cutoff Frequency (MHz)...
1
1 10 100 1000
Collector Current (mA)
Saft Operation Area
10
1
0.1
Collector Curr ent (mA
0.01
0.001
1 10 100
Forwar d Biased Voltage ( V)
PT=1m s
PT=100ms
PT=1s
HSA1538S HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6501
Issued Date : 1992.08.25
Revised Date : 2002.02.18
Page No. : 3/4
1000
Power Derating
900
800
700
600
500
400
300
Power Dis s ip ation-PD (mW)
200
100
0
0 20 40 60 80 100 120 140 160
Ambient Temper atu re-Ta (oC)
HSA1538S HSMC Product Specification
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HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6501
Issued Date : 1992.08.25
Revised Date : 2002.02.18
Page No. : 4/4
A
α2
B
31
2
Marking:
HA
S
513
8S
Date Code Control Code
Rank
α3
C
D
H
I
α1
G
Style: Pin 1.Emitter 2.Collector 3.Base
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSA1538S HSMC Product Specification
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